A probe card apparatus with improved efficiency

Abstract

The application relates to the technical field of probe card devices, in particular to a probe card device capable of improving efficiency, which comprises a carrier disc, a buffering mechanism with a spring one buffering function is arranged on the carrier disc, the buffering mechanism comprises a sleeve rod, a spring one is sleeved on the sleeve rod, the spring one is sleeved into a sleeve, a clamping mechanism with a locking block clamping function is arranged on the carrier disc, the clamping mechanism comprises a sliding bar and a spring two, the sliding bar is slidingly connected into a sliding groove, and the sliding bar is fixedly connected with a locking block. The supporting mechanism in the probe card device is arranged as the spring one, the sleeve rod can be driven to slide up and down in the sleeve, the buffering effect of the spring one can reduce the impact force between the probe and the surface of the chip, the risk of damage of the probe due to excessive extrusion is reduced, the probe can be uniformly stressed when contacting the chip, the stability and accuracy of the test are improved, and the test error and probe damage caused by the uneven surface of the chip are reduced.

Description

Technical Field

[0001] This application relates to the field of probe card device technology, and in particular to a probe card device that can improve efficiency. Background Technology

[0002] A probe card device is a key piece of equipment used for semiconductor wafer testing. Its core function is to establish an electrical connection between probes and the pads or bumps on the chip on the wafer. The probe card device consists of a probe assembly, a circuit board probe assembly, a support structure, and a calibration and positioning structure. The probe assembly directly contacts the chip pads / pins to transmit test signals. The circuit board is used to connect the probes to the test machine and transmit test signals and power. The support structure fixes the probes and the circuit board to achieve precise alignment with the chip. The calibration and positioning structure ensures that the probes are precisely aligned with the chip pads.

[0003] A search revealed Chinese Patent Publication No. CN208984679U, which discloses a probe card device for use with a probe station. The device includes a probe worktable with a placement groove at the top. The probe worktable holds the probe card device body within the groove. A first sliding groove is formed on the inner bottom wall of the placement groove. A first slider is fixedly mounted on the bottom of the probe card device body and slidably connected to the first sliding groove. A rotating groove is formed on one side of the inner wall of the first sliding groove. A threaded through hole is formed on the first slider. A first through hole is formed on one side of the probe worktable. A single lead screw is rotatably mounted within the first through hole, the first sliding groove, and the rotating groove. One end of the lead screw passes through the threaded through hole and is threadedly connected to it. This invention features a simple structure and convenient operation, allowing for quick and easy movement of the probe card device body, improving detection efficiency, enabling more comprehensive detection, and meeting various needs.

[0004] Regarding the aforementioned technologies, the inventors have discovered the following defects in this patent:

[0005] Probe cards often adopt an integrated probe layout, with all probes fixed to the same substrate and connected to the circuit board through soldering or bonding processes. In high-frequency testing scenarios, damage to a single probe (such as wear or breakage) will lead to the scrapping of the entire probe card or complex repairs. The support structure of the probe card device usually adopts a rigid connection design, and some probes may cause signal open circuits or short circuits due to excessive compression or suspension.

[0006] Therefore, in response to the above problems, the applicant provides a probe card device that can improve efficiency. Utility Model Content

[0007] To address the problems mentioned in the background section, this application provides a probe card device that can improve efficiency.

[0008] This application provides a probe card device that can improve efficiency, and adopts the following technical solution:

[0009] A probe card device that can improve efficiency includes a carrier tray, on which a buffer mechanism with a spring buffer function is provided. The buffer mechanism includes a sleeve rod, on which a spring is sleeved, and the spring is sleeved into a sleeve.

[0010] The carrier is provided with a locking mechanism with a locking block function. The locking mechanism includes a slide bar and a second spring. The slide bar is slidably connected to the slide groove. The slide bar is fixedly connected to a locking block. One end of the locking block is fixedly connected to the second spring.

[0011] Optionally, the top surface of the carrier plate is fixedly connected to multiple sleeve rods in a ring array, and springs are correspondingly sleeved on the multiple sleeve rods. The springs are located between the top of the carrier plate and the sleeves. A cross-shaped connecting frame is fixedly connected to the top surface of the multiple sleeves. The output end of an electric push rod is fixedly connected to the center of the cross-shaped connecting frame. The sleeve rods, springs, and sleeves are combined to form a buffer assembly.

[0012] Optionally, the bottom surface of the carrier disk is fixedly connected to multiple insert blocks in a ring array, and each of the multiple insert blocks has a slot, with a sliding groove connected to the top of the slot.

[0013] Optionally, a spring is fixedly connected to one side of the slot one, the locking block is located in the slot one, and one side of the locking block is set as an inclined surface.

[0014] Optionally, multiple locking blocks are inserted into a fixed frame, and a second slot is provided on one side of the fixed frame, with the inclined surface engaging in the second slot.

[0015] Optionally, the four fixing frames are jointly fixedly connected to a probe carrier disk, on which multiple probes are distributed.

[0016] In summary, this application includes the following beneficial technical effects:

[0017] 1. This utility model sets the support mechanism in the probe card device as a spring that can drive the sleeve rod to slide up and down in the sleeve. The buffering effect of the spring can reduce the impact force between the probe and the chip surface, reduce the risk of the probe being damaged due to excessive compression, so that the probe can be evenly stressed when contacting the chip, thereby improving the stability and accuracy of the test, while reducing the test error and probe damage caused by uneven chip surface.

[0018] 2. This utility model allows the insertion block and the fixing frame to be separated by pressing the locking block on a single probe card carrier into slot one. The probe card carrier is designed to be independently detachable. When a probe or module fails, it is not necessary to disassemble the entire probe card. Only the faulty module needs to be replaced or repaired, rather than the entire probe card. This reduces equipment downtime. At the same time, other spare modules can be prepared while replacing the faulty module, so that maintenance work can be carried out in parallel, further improving equipment utilization. Attached Figure Description

[0019] Figure 1 This is a bottom view of the probe and carrier disk structure in an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of the buffer mechanism structure in the embodiments of this application;

[0021] Figure 3 This is a schematic diagram of the overall structure in an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of the disassembled structure of the carrier disk and probe card carrier disk in an embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the disassembled structure of the snap-fit ​​mechanism in an embodiment of this application;

[0024] Figure 6 This is a cross-sectional view of the disassembled structure of the snap-fit ​​mechanism in an embodiment of this application;

[0025] Figure 7 This is a cross-sectional view of the snap-fit ​​mechanism in an embodiment of this application.

[0026] Reference numerals: 1. Carrier tray; 2. Buffer assembly; 20. Sleeve rod; 21. Spring 1; 22. Sleeve; 3. Cross-shaped connecting frame; 4. Insert block; 40. Slot 1; 400. Slide groove; 5. Locking block; 50. Inclined surface; 6. Slide bar; 7. Spring 2; 8. Fixing frame; 80. Slot 2; 9. Probe holding carrier tray; 90. Probe. Detailed Implementation

[0027] The following is in conjunction with the appendix Figure 1-7 This application will be described in further detail.

[0028] This application discloses a probe card device that can improve efficiency.

[0029] like Figure 1-7 As shown, a probe card device that can improve efficiency includes a carrier plate 1. The carrier plate 1 is provided with a buffer mechanism with a spring-21 buffer function. The buffer mechanism includes a sleeve rod 20, on which a spring-21 is sleeved. The spring-21 is sleeved into a sleeve 22.

[0030] The carrier plate 1 is provided with a locking mechanism with locking block 5. The locking mechanism includes a slide bar 6 and a spring 7. The slide bar 6 is slidably connected to the slide groove 400. The slide bar 6 is fixedly connected to the locking block 5. One end of the locking block 5 is fixedly connected to the spring 7.

[0031] Please see Figure 3 The top surface of the carrier 1 is fixedly connected in a ring array with multiple sleeve rods 20. A spring 21 is correspondingly sleeved on each of the multiple sleeve rods 20. The spring 21 is located between the top of the carrier 1 and the sleeve 22. A cross-shaped connecting frame 3 is fixedly connected to the top surface of the multiple sleeves 22. The output end of an electric push rod is fixedly connected to the center of the cross-shaped connecting frame 3. The sleeve rods 20, spring 21 and sleeve 22 are combined to form a buffer assembly 2. The electric push rod is externally powered and is not shown in this application document. The function of the electric push rod is to drive the device to move downward, thereby performing wafer testing and chip packaging testing on the items to be tested.

[0032] Please see Figure 4 The bottom surface of the carrier plate 1 is fixedly connected in a ring array with multiple insert blocks 4. Each insert block 4 has a slot 40, and the top of each slot 40 is connected to a sliding groove 400.

[0033] Please see Figure 3 A spring 7 is fixedly connected to one side of the slot 40, and the locking block 5 is located in the slot 40. One side of the locking block 5 is set as an inclined surface 50.

[0034] Please see Figure 4 Multiple locking blocks 5 are inserted into the fixing frame 8. The fixing frame 8 has a slot 2 80 on one side. The inclined surface 50 is engaged in the slot 2 80. When the probe 90 is damaged, the operator only needs to press the inclined surface 50 into the slot 1 40. At this time, the probe carrier 9 is moved downward, and the probe carrier 9 can drive the fixing frame 8 to disengage from the insertion block 4.

[0035] Please see Figure 4 The four fixed frames 8 are jointly fixedly connected to a probe card carrier 9. Multiple probes 90 are distributed on the probe card carrier 9. The probes 90 are grouped and set on the probe card carrier 9 according to the test signal type, such as high frequency, low frequency, high voltage, low current, etc., or they can be grouped according to mechanical parameters such as the elasticity, stroke, and wear resistance of the probes 90. This ensures that the contact pressure between the probes and the chip in the same module is consistent, avoiding local overpressure or poor contact. When the probes 90 on the probe card carrier 9 are damaged, only the probe card carrier 9 needs to be removed, avoiding the trouble of removing the carrier 1.

[0036] The implementation principle of the probe card device that can improve efficiency according to the embodiments of this application is as follows:

[0037] The downward movement of this device allows the probe 90 to slide up and down within the sleeve 22 during wafer testing and packaged chip testing. The spring 21 can drive the sleeve rod 20 to slide up and down. The buffering effect of the spring 21 can reduce the impact force between the probe and the chip surface, thereby reducing the risk of probe damage due to excessive compression. This ensures that the probe 90 can be evenly stressed when contacting the chip, thus improving the stability and accuracy of the test, while reducing test errors and probe damage caused by uneven chip surfaces.

[0038] When it is necessary to install the probe card carrier 9 on the carrier 1, simply align the fixing frame 8 on the probe card carrier 9 with the insert block 4 and lift it upwards. As the fixing frame 8 is located in the insert block 4, the upward force of the fixing frame 8 will cause the locking block 5 to retract into the slot 40. At the same time, the slider 6 slides horizontally in the slide groove 400, and the spring 7 is compressed. When the slot 80 and the slot 40 coincide, the spring 7 rebounds and drives the slider 6 to slide in the slide groove 400, causing the locking block 5 to extend out of the slot 80, thereby achieving the locking of the probe card carrier 9 and the carrier 1.

[0039] When a probe 90 on a single probe card carrier 9 is damaged and needs to be replaced, simply press the locking block 5 on the single probe card carrier 9 into the slot 40 to separate the insert block 4 from the fixing frame 8, thereby allowing the single probe card carrier 9 to be disassembled for easy replacement of the damaged probe 90 by the operator.

[0040] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A probe card device that can improve efficiency, characterized in that: Includes a carrier plate (1), on which a buffer mechanism with a spring-1 (21) buffer function is provided. The buffer mechanism includes a sleeve rod (20), on which a spring-1 (21) is sleeved, and the spring-1 (21) is sleeved into a sleeve (22). The carrier plate (1) is provided with a locking mechanism with locking block (5) locking function. The locking mechanism includes a slide bar (6) and a second spring (7). The slide bar (6) is slidably connected to the slide groove (400). The slide bar (6) is fixedly connected to the locking block (5). One end of the locking block (5) is fixedly connected to the second spring (7).

2. The probe card device with improved efficiency according to claim 1, characterized in that: The top surface of the carrier plate (1) is fixedly connected to multiple sleeve rods (20) in a ring array. A spring (21) is correspondingly sleeved on each of the multiple sleeve rods (20). The spring (21) is located between the top of the carrier plate (1) and the sleeve (22). A cross-shaped connecting frame (3) is fixedly connected to the top surface of the multiple sleeves (22). The output end of an electric push rod is fixedly connected to the center of the cross-shaped connecting frame (3). The sleeve rods (20), spring (21) and sleeve (22) are combined to form a buffer assembly (2).

3. The probe card device with improved efficiency according to claim 1, characterized in that: The bottom surface of the carrier plate (1) is fixedly connected to multiple insert blocks (4) in a ring array. Each of the insert blocks (4) has a slot (40), and the top of each slot (40) is connected to a sliding groove (400).

4. The probe card device with improved efficiency according to claim 3, characterized in that: A spring 2 (7) is fixedly connected to one side of the slot 1 (40), and the locking block (5) is located in the slot 1 (40). One side of the locking block (5) is set as an inclined surface (50).

5. The probe card device with improved efficiency according to claim 4, characterized in that: Multiple locking blocks (5) are inserted into the fixing frame (8). The fixing frame (8) has a slot two (80) on one side, and the inclined surface (50) is engaged in the slot two (80).

6. The probe card device with improved efficiency according to claim 5, characterized in that: The four fixed frames (8) are fixedly connected to a probe card tray (9), on which multiple probes (90) are distributed.

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