Non-inductive resistance load

Abstract

The utility model provides a kind of non-inductive resistance load, it includes shell and the non-inductive resistance module, temperature measurement module, heat dissipation module and control module being arranged in shell, the non-inductive resistance module is connected with the load connection terminal being worn on the shell, the temperature measurement module can detect the temperature of the non-inductive resistance module, the heat dissipation module can heat dissipation to the non-inductive resistance module, the control module can be according to the temperature measured by the temperature measurement module to control the operating state of the heat dissipation module, and / or control the on-off state between the non-inductive resistance module and the load connection terminal.The non-inductive resistance module of the utility model can provide stable impedance characteristics, ensure the accuracy and reliability of test result;By temperature measurement module, heat dissipation module, control module etc., real-time temperature measurement, timely cooling, timely cut off and external test circuit connection to non-inductive resistance module are carried out, to protect non-inductive resistance module, improve the service life of the non-inductive resistance load.

Description

Technical Field

[0001] This utility model relates to the field of test load device technology, and in particular to a non-inductive resistive load. Background Technology

[0002] When testing medical electrical equipment, especially when testing the high-frequency power of a high-frequency electrosurgical unit, the following standard requirements must be met: the rated value of the resistor used for high-frequency testing should not be less than 50% of the given test power consumption; the accuracy of the resistive component of the impedance should preferably be within 3% of the specified value; and the impedance phase angle between 10kHz and 5 times the fundamental frequency of the high-frequency surgical mode being tested should not be greater than 8.5°.

[0003] The significance of the former lies in the fact that the rated output power of the high-frequency electrosurgical unit is between 300 and 400W, and the rated value of the high-frequency test resistor is greater than or equal to 50% of the test power consumption. This ensures the safety of the high-frequency test resistor itself when assisting in testing at high power, preventing overheating and damage. However, for high-frequency electrosurgical unit tests with long operating times (such as over-temperature tests where the high-frequency electrosurgical unit needs to run continuously under rated load for 1 hour), relying solely on the withstand capability of the high-frequency test resistor itself cannot completely prevent damage that may be caused by over-temperature.

[0004] The significance of the latter lies in ensuring the accuracy and reliability of testing the actual output power of a high-frequency electrosurgical unit by leveraging the inherent superior properties of the high-frequency test resistor. However, conventional resistive loads currently fail to meet the aforementioned test standards due to significant inductive effects, low accuracy of resistive components, and high impedance phase angles. Utility Model Content

[0005] The purpose of this invention is to provide a non-inductive resistive load to overcome the shortcomings of the aforementioned background technology.

[0006] The technical solution of this utility model is: a non-inductive resistive load, comprising:

[0007] case;

[0008] A non-inductive resistor module is housed within the housing and connected to a load connection terminal passing through the housing;

[0009] A temperature sensing module, which is housed within the housing, is capable of detecting the temperature of the non-inductive resistor module;

[0010] A heat dissipation module, which is housed within the housing, is used to dissipate heat from the non-inductive resistor module.

[0011] The control module, which is housed within the housing, can control the operating state of the heat dissipation module and / or control the on / off state between the non-inductive resistor module and the load connection terminal based on the temperature measured by the temperature measuring module.

[0012] Furthermore, the load connection terminal includes a first load connection terminal and a second load connection terminal, and the non-inductive resistor module includes a plurality of film non-inductive resistors connected in series between the first load connection terminal and the second load connection terminal.

[0013] Furthermore, the control module includes an MCU and a solid-state relay. The input terminal of the solid-state relay is connected to the MCU and is controlled by the MCU to change the on / off state between the non-inductive resistor module and the load connection terminal.

[0014] Furthermore, the heat dissipation module includes a first heat dissipation fan and a second heat dissipation fan respectively disposed on both sides of the non-inductive resistor module. The side wall of the housing is provided with heat dissipation holes corresponding to the first heat dissipation fan and the second heat dissipation fan. The MCU can perform frequency conversion control on the first heat dissipation fan and the second heat dissipation fan according to the temperature measured by the temperature measuring module.

[0015] Furthermore, the heat dissipation module includes a metal heat-conducting plate disposed below the non-inductive resistor module. The metal heat-conducting plate is located between the first heat dissipation fan and the second heat dissipation fan, and its top-view projection area is larger than that of the non-inductive resistor module.

[0016] Furthermore, the heat dissipation module includes a liquid cooling pipeline, a circulating pump, and a coolant tank. The liquid cooling pipeline is located between the non-inductive resistor module and the metal heat-conducting plate. The circulating pump is connected to the liquid cooling pipeline and the coolant tank. The MCU can perform frequency conversion control on the circulating pump based on the temperature measured by the temperature measuring module.

[0017] Furthermore, the non-inductive resistive load includes a temperature threshold potentiometer, which is connected to the temperature measuring module and can control the operating status of the audible and visual alarm based on the temperature measured by the temperature measuring module.

[0018] Furthermore, the temperature threshold potentiometer is connected to the MCU, and the MCU can control the operating state of the solid-state relay based on the temperature threshold input by the temperature threshold potentiometer and the temperature measured by the temperature measurement module.

[0019] Furthermore, the temperature measurement module includes one or more platinum resistance temperature sensors connected to the non-inductive resistance module.

[0020] Furthermore, the non-inductive resistive load includes an AC-DC power supply and a power switch, which are connected to supply power to the non-inductive resistive module, the heat dissipation module, and the control module.

[0021] The beneficial effects of this utility model are as follows: This technical solution adopts a non-inductive resistor module with low inductance effect, high-precision resistance component and low impedance phase angle characteristics, so that the non-inductive resistor load exhibits almost pure resistance characteristics in the high-frequency electrosurgical test, and can provide stable impedance characteristics, thereby ensuring the accuracy and reliability of the test results; This technical solution also uses a temperature measurement module and a heat dissipation module to perform real-time temperature measurement and timely cooling of the non-inductive resistor module, and uses a control module to disconnect the connection between the non-inductive resistor module and the load connection terminal when the temperature exceeds the limit, so as to protect the non-inductive resistor module and improve the service life of the non-inductive resistor load. Attached Figure Description

[0022] Fig. 1 This is a connection logic diagram of an embodiment of the present utility model;

[0023] Fig. 2 This is a top view of an embodiment of the present utility model;

[0024] Fig. 3 This is a side view of an embodiment of the present utility model.

[0025] In the picture:

[0026] 1. Housing; 1.1. Heat dissipation holes;

[0027] 2. Non-inductive resistor module; 2.1. Film-type non-inductive resistor; 2.2. Mounting plate;

[0028] 3. Temperature measurement module;

[0029] 4. Heat dissipation module; 4.1 First cooling fan; 4.2 Second cooling fan; 4.3 Liquid cooling piping; 4.4 Circulation pump; 4.5 Coolant tank; 4.6 Metal heat-conducting plate;

[0030] 5. Control Module; 5.1 MCU; 5.2 Solid State Relay;

[0031] 6. First load connection terminal;

[0032] 7. Second load connection terminal;

[0033] 8. Temperature threshold potentiometer;

[0034] 9. Audible and visual alarm;

[0035] 10. AC-DC power supply;

[0036] 11. Power switch. Detailed Implementation

[0037] The technical solutions of the embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0038] In the description of the embodiments of this utility model, it should be understood that the terms "top," "bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, it should be noted that unless otherwise expressly specified and limited, the terms "set" and "connected" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two elements. Those skilled in the art can understand the specific meaning of the above terms in this utility model through specific circumstances.

[0039] Reference Appendix Figs. 1-3 This utility model provides a non-inductive resistive load, which includes a housing 1 and a non-inductive resistive module 2, a temperature measuring module 3, a heat dissipation module 4, and a control module 5 disposed within the housing 1. The housing 1 is provided with a load connection terminal for connecting to an external test circuit (i.e., the test circuit of a high-frequency electrosurgical unit). The non-inductive resistive module 2 is connected to the load connection terminal and can be connected to the external test circuit through the load connection terminal. The temperature measuring module 3 can detect the temperature of the non-inductive resistive module 2, the heat dissipation module 4 can dissipate heat from the non-inductive resistive module 2, and the control module 5 can control the operating state of the heat dissipation module 4 and the on / off state between the non-inductive resistive module 2 and the load connection terminal based on the temperature measured by the temperature measuring module 3.

[0040] This technical solution employs a non-inductive resistor module 2 with low inductance effect, high-precision resistance component, and low impedance phase angle characteristics. This enables the non-inductive resistor load to exhibit almost pure resistance characteristics during high-frequency electrosurgical testing, providing stable impedance characteristics and ensuring the accuracy and reliability of test results. Furthermore, this solution utilizes a temperature measurement module 3 and a heat dissipation module 4 to perform real-time temperature measurement and timely cooling of the non-inductive resistor module 2. In case of overheating, a control module 5 disconnects the connection between the non-inductive resistor module 2 and the load connection terminals to protect the non-inductive resistor module 2 and extend the service life of the non-inductive resistor load.

[0041] In this embodiment, the load connection terminals include a first load connection terminal 6 and a second load connection terminal 7. The non-inductive resistor module 2 includes a plurality of film-type non-inductive resistors 2.1 connected in series between the first load connection terminal 6 and the second load connection terminal 7. Compared with the double-wire wound type non-inductive resistor, the film-type non-inductive resistor 2.1 has a smaller volume and a lower temperature coefficient, and can maintain a stable resistance value at various temperatures. Furthermore, the film-type non-inductive resistor 2.1 has better high-frequency performance, with less parasitic inductance and capacitance effect, and can better meet the requirements of high-frequency circuits. Although the double-wire wound type non-inductive resistor reduces inductance through a special winding method, it may still have a certain inductance effect when used in high-frequency circuits, which may affect the test performance and test accuracy.

[0042] In practice, several series-connected non-inductive film resistors 2.1 can be placed on a fixed plate 2.2 to improve stability; even better, a semiconductor cooling chip can be used as the fixed plate 2.2 to provide both support and cooling.

[0043] Reference Appendix Fig. 2 The control module 5 includes an MCU 5.1 and a solid-state relay 5.2. The signal input terminal of the solid-state relay 5.2 is connected to the MCU 5.1, and the signal output terminal is connected to the non-inductive resistor module 2 and the load connection terminal. When the temperature sensing module 3 transmits the detected temperature signal to the MCU 5.1, the MCU 5.1 analyzes and determines whether the non-inductive resistor module 2 is overheating. If it is overheating, the MCU 5.1 will send a control signal to the solid-state relay 5.2, causing the solid-state relay 5.2 to disconnect the connection between the non-inductive resistor module 2 and the load connection terminal, thereby disconnecting the non-inductive resistor module 2 from the external test circuit and preventing the non-inductive resistor module 2 from continuing to work and overheating, thus preventing damage.

[0044] This technical solution isolates the control terminal of MCU5.1 from the test terminal of the non-inductive resistor module 2 through the isolation circuit in the solid-state relay 5.2, eliminating signal interference between the two circuits, avoiding the problem of inaccurate resistance values ​​at high frequencies caused by signal interference, and ensuring the accuracy of high-frequency electrosurgical power testing.

[0045] The heat dissipation module 4 in this embodiment includes an air cooling system and a liquid cooling system. The air cooling system includes a first heat dissipation fan 4.1 and a second heat dissipation fan 4.2 respectively disposed on both sides of the non-inductive resistor module 2. The side wall of the housing 1 is provided with heat dissipation holes 1.1 corresponding to the first heat dissipation fan 4.1 and the second heat dissipation fan 4.2. The MCU 5.1 can perform frequency conversion control of the first heat dissipation fan 4.1 and the second heat dissipation fan 4.2 according to the temperature measured by the temperature measuring module 3. In this technical solution, one of the first heat dissipation fan 4.1 and the second heat dissipation fan 4.2 serves as the air intake end and the other end serves as the air outlet end, so as to quickly transfer the hot air inside the housing 1 to the outside of the housing 1 and improve the cooling effect. When the non-inductive resistor module 2 heats up rapidly, the MCU 5.1 controls the first heat dissipation fan 4.1 and the second heat dissipation fan 4.2 to operate at high frequency to accelerate the cooling speed. When the temperature rise of the non-inductive resistor module 2 is slow, the MCU 5.1 controls the first heat dissipation fan 4.1 and the second heat dissipation fan 4.2 to operate at low frequency to save power.

[0046] The liquid cooling system includes a liquid cooling pipe 4.3, a circulating pump 4.4, and a coolant tank 4.5. The liquid cooling pipe 4.2 is located below the non-inductive resistor module 2. The circulating pump 4.4 connects the liquid cooling pipe 4.3 and the coolant tank 4.5. A liquid replenishment port can be set on the coolant tank 4.5. The MCU 5.1 can perform frequency conversion control on the circulating pump 4.4 based on the temperature measured by the temperature measuring module 3. In this technical solution, the circulating pump 4.4, the liquid cooling pipeline 4.3, and the coolant tank 4.5 are connected to form a loop. The circulating pump 4.4 can be located between the inlet end of the liquid cooling pipeline 4.3 and the coolant tank 4.5, or between the outlet end of the liquid cooling pipeline 4.3 and the coolant tank 4.5, to accelerate the flow of coolant in the above loop and improve the cooling effect. When the temperature of the non-inductive resistor module 2 rises rapidly, the MCU 5.1 controls the circulating pump 4.4 to run at a high frequency to cool down quickly. When the temperature rise of the non-inductive resistor module 2 is slow, the MCU 5.1 controls the circulating pump 4.4 to run at a low frequency to save energy.

[0047] In addition, the heat dissipation module 4 also includes a metal heat-conducting plate 4.6 located below the liquid cooling pipes 4.3. The metal heat-conducting plate 4.6 is situated between the first cooling fan 4.1 and the second cooling fan 4.2, and its top-view projection area is larger than that of the non-inductive resistor module 2. In some preferred embodiments, the metal heat-conducting plate 4.6 is made of copper, which has high thermal conductivity. The liquid cooling pipes 4.3 are evenly distributed across the entire surface of the metal heat-conducting plate 4.6. The non-inductive resistor module 2 is located in the center of the liquid cooling pipes 4.3. The heat dissipated by the non-inductive resistor module 2 during operation is carried by the coolant in the liquid cooling pipes 4.3 to the parts of the module that are not shielded by the non-inductive resistor module 2, and then rapidly exchanges heat with the air inside the casing 1 through the metal heat-conducting plate 4.6, thereby expanding the heat dissipation area and improving the heat dissipation efficiency.

[0048] In practice, the liquid cooling pipe 4.3 can be partially or completely embedded in the metal heat-conducting plate 4.6, which saves space and increases the contact area between the liquid cooling pipe 4.3 and the metal heat-conducting plate 4.6, thereby improving heat exchange efficiency.

[0049] This technical solution improves the cooling efficiency of the non-inductive resistor module 2 through the synergy of the air cooling system, liquid cooling system and metal heat-conducting plate 4.6, and uses the control module 5 to perform frequency conversion control on the first heat dissipation fan 4.1, the second heat dissipation fan 4.2 and the circulation pump 4.4 to coordinate cooling efficiency and energy consumption according to the temperature rise of the non-inductive resistor module 2.

[0050] In addition, this embodiment also includes a temperature threshold potentiometer 8 and an audible and visual alarm 9. The temperature threshold potentiometer 8 is connected to the temperature measuring module 3 and can control the operation of the audible and visual alarm 9 based on the temperature measured by the temperature measuring module 3. The temperature threshold potentiometer 8 has functions for setting the temperature threshold, displaying the temperature, controlling the on / off state of the control circuit, and transmitting signals. Testers can set the temperature threshold using the potentiometer 8 according to the specifications of the non-inductive resistor module 2. The potentiometer 8 then determines whether the non-inductive resistor module 2 is overheating based on this threshold and the temperature measured by the temperature sensing module 3. If overheating occurs, an audible and visual alarm 9 is activated. The potentiometer 8 can also transmit the temperature threshold information to the MCU 5.1 via electrical signals. The MCU 5.1 can control the operation of the solid-state relay 5.2 based on the temperature threshold input from the potentiometer 8 and the temperature measured by the temperature sensing module 3. If the temperature measured by the temperature sensing module 3 is greater than the temperature threshold, the MCU 5.1 determines that the non-inductive resistor module 2 is overheating. The MCU 5.1 will send a control signal to the solid-state relay 5.2, causing it to disconnect the non-inductive resistor module 2 from the load connection terminal, thus disconnecting the non-inductive resistor module 2 from the external test circuit and preventing it from continuing to operate and overheating, which could cause damage.

[0051] The temperature measurement module 3 of this technical solution includes one or more platinum resistance temperature sensors connected to the non-inductive resistor module 2. The platinum resistance temperature sensors have high accuracy and can work in conjunction with the control module to effectively ensure that the non-inductive resistor module 2 is not damaged by high temperature.

[0052] To ensure the smooth operation of the test, the non-inductive resistor load in this technical solution should be powered by DC. Therefore, an AC-DC power supply 10 and a power switch 11 need to be installed in the housing 1 to connect the AC-DC power supply 10 to the external AC power supply. The power switch 11 is used to control the start and stop of the AC-DC power supply 10. The AC-DC power supply 10 converts the external AC power into DC power to supply the non-inductive resistor module 2, the heat dissipation module 4, and the control module 5, etc.

[0053] The aforementioned MCU5.1, solid-state relay5.2, temperature threshold potentiometer8, and audible and visual alarm9 are all existing technologies. Their wiring and assembly methods can be carried out according to the instruction manuals of the relevant equipment, and will not be elaborated here.

[0054] Compared with the prior art, the beneficial effects of this utility model include: This technical solution uses a non-inductive resistor module with low inductance effect, high-precision resistance component and low impedance phase angle characteristics, so that the non-inductive resistor load exhibits almost pure resistance characteristics in the high-frequency electrosurgical test, and can provide stable impedance characteristics, thereby ensuring the accuracy and reliability of the test results; This technical solution also uses a temperature measurement module and a heat dissipation module to perform real-time temperature measurement and timely cooling of the non-inductive resistor module, and uses a control module to disconnect the connection between the non-inductive resistor module and the load connection terminal when the temperature exceeds the limit, so as to protect the non-inductive resistor module and improve the service life of the non-inductive resistor load.

[0055] The above are preferred embodiments of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A non-inductive resistive load, characterized in that, include: case; A non-inductive resistor module is housed within the housing and connected to a load connection terminal passing through the housing; A temperature sensing module, which is housed within the housing, is capable of detecting the temperature of the non-inductive resistor module; A heat dissipation module, which is housed within the housing, is used to dissipate heat from the non-inductive resistor module. The control module, which is housed within the housing, can control the operating state of the heat dissipation module and / or control the on / off state between the non-inductive resistor module and the load connection terminal based on the temperature measured by the temperature measuring module.

2. The non-inductive resistive load according to claim 1, characterized in that, The load connection terminal includes a first load connection terminal and a second load connection terminal, and the non-inductive resistor module includes a plurality of film non-inductive resistors connected in series between the first load connection terminal and the second load connection terminal.

3. The non-inductive resistive load according to claim 1 or 2, characterized in that, The control module includes an MCU and a solid-state relay. The input terminal of the solid-state relay is connected to the MCU and is controlled by the MCU to change the on / off state between the non-inductive resistor module and the load connection terminal.

4. The non-inductive resistive load according to claim 3, characterized in that, The heat dissipation module includes a first heat dissipation fan and a second heat dissipation fan respectively disposed on both sides of the non-inductive resistor module. The side wall of the housing is provided with heat dissipation holes corresponding to the first heat dissipation fan and the second heat dissipation fan. The MCU can perform frequency conversion control on the first heat dissipation fan and the second heat dissipation fan according to the temperature measured by the temperature measuring module.

5. The non-inductive resistive load according to claim 4, characterized in that, The heat dissipation module includes a metal heat-conducting plate disposed below the non-inductive resistor module. The metal heat-conducting plate is located between the first cooling fan and the second cooling fan, and its top-view projection area is larger than that of the non-inductive resistor module.

6. The non-inductive resistive load according to claim 5, characterized in that, The heat dissipation module includes a liquid cooling pipeline, a circulating pump, and a coolant tank. The liquid cooling pipeline is located between the non-inductive resistor module and the metal heat-conducting plate. The circulating pump is connected to the liquid cooling pipeline and the coolant tank. The MCU can perform frequency conversion control on the circulating pump based on the temperature measured by the temperature measuring module.

7. The non-inductive resistive load according to any one of claims 4-6, characterized in that, The non-inductive resistive load includes a temperature threshold potentiometer and an audible and visual alarm. The temperature threshold potentiometer is connected to the temperature measurement module and can control the operating status of the audible and visual alarm based on the temperature measured by the temperature measurement module.

8. The non-inductive resistive load according to claim 7, characterized in that, The temperature threshold potentiometer is connected to the MCU, and the MCU can control the operating state of the solid-state relay based on the temperature threshold input by the temperature threshold potentiometer and the temperature measured by the temperature measurement module.

9. The non-inductive resistive load according to any one of claims 1-2, 4-6, and 8, characterized in that, The temperature measurement module includes one or more platinum resistance temperature sensors connected to the non-inductive resistance module.

10. The non-inductive resistive load according to claim 9, characterized in that, The non-inductive resistive load includes an AC-DC power supply and a power switch, which are connected to supply power to the non-inductive resistive module, the heat dissipation module, and the control module.

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