An integrated circuit chip testing positioning device
By designing a clamping mechanism and an array of elastic limiting posts, the problem of universality in integrated circuit chip testing and positioning devices is solved, enabling effective positioning and fixing of chips of different specifications and improving the applicability of the testing device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG UNIV
- Filing Date
- 2025-07-03
- Publication Date
- 2026-07-14
AI Technical Summary
Existing integrated circuit chip testing and positioning devices are usually only suitable for specific sizes and shapes, making it difficult to adapt to the testing and positioning needs of integrated circuit chips of different specifications, and thus have poor versatility.
It employs a clamping mechanism and two elastic limiting post arrays. The elastic limiting post array is an array structure formed by multiple elastic limiting posts, which can contract and reset under pressure. Combined with the clamping mechanism, it can achieve the positioning and fixation of chips of different specifications.
It enables universal positioning and fixing of integrated circuit chips of different specifications, improving the applicability and reliability of the test positioning device.
Smart Images
Figure CN224500837U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a positioning device, and more particularly to a positioning device for testing integrated circuit chips. Background Technology
[0002] Before integrated circuit chips leave the factory, their functional logic and other aspects must be comprehensively tested to ensure their practicality and reliability. However, in actual testing, integrated circuit chips come in a wide variety of specifications and shapes. Existing integrated circuit chip testing and positioning devices are usually designed only for integrated circuit chips of specific sizes and shapes, resulting in poor versatility and difficulty in adapting to the testing and positioning needs of integrated circuit chips of different specifications. Summary of the Invention
[0003] The technical problem to be solved by this utility model is to provide an integrated circuit chip testing and positioning device that can adapt to integrated circuit chips of different specifications and has strong versatility.
[0004] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows: an integrated circuit chip testing and positioning device, including a support base and a positioning component installed on the support base. The positioning component includes a clamping mechanism and two elastic limiting post arrays. The two elastic limiting post arrays are distributed at intervals. Each elastic limiting post array is realized by an array structure formed by multiple elastic limiting posts evenly distributed in multiple rows and columns. Each elastic limiting post can retract downward when subjected to downward pressure and can extend upward to reset when the downward pressure disappears. The clamping mechanism is used to clamp and fix the integrated circuit chip located on the two elastic limiting post arrays.
[0005] Compared with the prior art, the advantages of this utility model are that the positioning component is realized through a clamping mechanism and two elastic limiting post arrays. The two elastic limiting post arrays are distributed at intervals, and each elastic limiting post array adopts an array structure formed by multiple elastic limiting posts evenly distributed in multiple rows and columns. Each elastic limiting post can retract downward when subjected to downward pressure, and can extend upward to reset when the downward pressure is removed. The clamping mechanism is used to clamp and fix the integrated circuit chip located on the two elastic limiting post arrays. When the integrated circuit chip testing and positioning device is in the initial state, the elastic limiting posts of each elastic limiting post array are in a naturally extended state. In actual use, the integrated circuit chip is selected from the two elastic limiting post arrays according to the specifications of the integrated circuit chip. The integrated circuit chip is placed on the elastic limiting post located in the matching area, and then pressed down. At this time, the elastic limiting post in the area will compress downward to form a concave area. The elastic limiting post around the concave area positions the integrated circuit chip, thus achieving the positioning of the integrated circuit chip. Then, the integrated circuit chip is fixed by the clamping mechanism, completing the test positioning of the integrated circuit chip. After the integrated circuit chip test is completed, the clamping mechanism releases the integrated circuit chip, and the elastic limiting post in the area extends upward to reset. The integrated circuit chip is then removed, and the integrated circuit chip test positioning device returns to its initial state. Therefore, this utility model can adapt to integrated circuit chips of different specifications and has strong versatility.
[0006] Furthermore, each elastic limiting post includes a limiting steel pin, a first guide rod, and a return spring. The limiting steel pin and the first guide rod are both vertically arranged. The first guide rod is inserted into the support base, and its bottom is fixed on the support base. The return spring is sleeved on the lower outer side of the first guide rod, and its lower end is connected to the support base. The limiting steel pin is provided with a channel extending upward from its bottom. The upper part of the first guide rod is inserted into the channel, and the upper end of the return spring is connected to the limiting steel pin.
[0007] Furthermore, the clamping mechanism includes two clamping components, which are spaced apart to the left and right. The clamping component on the left is referred to as the first clamping component, and the clamping component on the right is referred to as the second clamping component. The first clamping component includes a fixed plate, a clamping block, an elastic compression mechanism, a second guide rod, and a top rod. The fixed plate is mounted on the support base and is located to the left of the two elastic limiting column arrays. The elastic compression mechanism is located to the left of the fixed plate and is mounted on the fixed plate. The second guide rod passes laterally through the fixed plate and can move relative to the fixed plate under force. The top rod is located below the second guide rod and extends laterally through the fixed plate. The left end of the top rod is connected to the elastic compression mechanism. The clamping block is located to the right of the top rod and the second guide rod, and its lower part is located at the interval between the two elastic limiting column arrays. The clamping block is fixedly connected to the top rod and the second guide rod respectively. When the first clamping assembly is in the initial state, the clamping block is located at its rightmost position. If the clamping block moves to the left, the elastic compression mechanism will be compressed. The first clamping assembly and the second clamping assembly have a left-right symmetrical structure.
[0008] Furthermore, in the first clamping assembly, the elastic compression mechanism includes a U-shaped bend, a slider, and a compression spring. The U-shaped bend is located on the left side of the fixed plate, and its two ends are respectively fixed to the fixed plate. The compression spring is U-shaped and disposed inside the U-shaped bend. One end of the compression spring is connected to the fixed plate. The slider is disposed inside the U-shaped bend and located to the right of the other end of the compression spring. The slider and the other end of the compression spring are connected. The left end of the push rod enters the U-shaped bend and connects to the slider. When the clamping block is located at its rightmost position, the slider is blocked by the fixed plate 9.
[0009] Furthermore, in the first clamping assembly, a first magnet is mounted on the left side of the clamping block, and a second magnet is mounted on the right side of the fixing plate. When the first magnet and the second magnet are close together, they can attract each other through magnetic force. Thus, through the attraction of the first magnet and the second magnet, the clamping block can be fixed near the fixing plate, thereby facilitating the positioning operation of the integrated circuit chip.
[0010] Furthermore, in the first clamping assembly, the clamping block has a wedge-shaped structure, with its right side inclined from top to bottom and to the left, and has multiple anti-slip grooves spaced apart from top to bottom. Thus, by providing the anti-slip grooves, the edge of the integrated circuit chip can be embedded into the corresponding anti-slip groove, thereby improving the reliability of fixing the integrated circuit chip.
[0011] Furthermore, in the first clamping assembly, a worm gear is fixed to the upper end of the clamping block. The clamping block can be moved by operating the worm gear, which can improve the convenience of operation. Attached Figure Description
[0012] Figure 1 This is the three-dimensional structure of the integrated circuit chip testing and positioning device of this utility model. Figure 1 ;
[0013] Figure 2 This is the three-dimensional structure of the integrated circuit chip testing and positioning device of this utility model. Figure 2 ;
[0014] Figure 3 This is a side view of the integrated circuit chip testing and positioning device of this utility model;
[0015] Figure 4 This is a half-sectional view of the integrated circuit chip testing and positioning device of this utility model;
[0016] Figure 5 for Figure 4 Enlarged structural diagram at point A in the middle. Detailed Implementation
[0017] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
[0018] Example 1: As Figure 1 and Figure 2 As shown, an integrated circuit chip testing and positioning device includes a support base 1 and a positioning component mounted on the support base 1. The positioning component includes a clamping mechanism and two elastic limiting post arrays 2. The two elastic limiting post arrays 2 are distributed at intervals. Each elastic limiting post array 2 is formed by an array structure consisting of multiple elastic limiting posts 3 evenly distributed in multiple rows and columns. Each elastic limiting post 3 can retract downward when subjected to downward pressure and can extend upward to reset when the downward pressure disappears. The clamping mechanism is used to clamp and fix the integrated circuit chip located on the two elastic limiting post arrays 2.
[0019] In this embodiment, when the integrated circuit chip testing and positioning device is in its initial state, the elastic limiting posts 3 of each elastic limiting post array 2 are in a naturally extended state. In actual use, an area matching the specifications of the integrated circuit chip is selected from the two elastic limiting post arrays 2, and the integrated circuit chip U1 is placed on the elastic limiting post 3 located in that area. Then, it is pressed down, and the elastic limiting post 3 in that area will compress downward to form a recessed area. The elastic limiting posts 3 around the recessed area position the integrated circuit chip U1, thus achieving the positioning of the integrated circuit chip U1. Then, the integrated circuit chip U1 is fixed by the clamping mechanism, thus completing the testing and positioning of the integrated circuit chip U1. After the testing of the integrated circuit chip U1 is completed, the clamping mechanism releases the fixing of the integrated circuit chip U1. At this time, the elastic limiting post 3 in that area extends upward to reset, and the integrated circuit chip U1 is removed. The integrated circuit chip testing and positioning device returns to its initial state. Therefore, this utility model can adapt to integrated circuit chips of different specifications and has strong versatility.
[0020] Example 2: This example is basically the same as Example 1, except that: in this example, as Figure 3 and Figure 4 As shown, each elastic limiting post 3 includes a limiting steel needle 4, a first guide rod 5, and a return spring 6. The limiting steel needle 4 and the first guide rod 5 are both vertically arranged. The first guide rod 5 is inserted into the support base 1 and its bottom is fixed on the support base 1. The return spring 6 is sleeved on the lower outer side of the first guide rod 5 and its lower end is connected to the support base 1. The limiting steel needle 4 is provided with a channel extending upward from its bottom. The upper part of the first guide rod 5 is inserted into the channel, and the upper end of the return spring 6 is connected to the limiting steel needle 4.
[0021] In this embodiment, when the integrated circuit chip testing and positioning device is in its initial state, the reset spring 6 of each elastic limiting post 3 is in a naturally stretched state, and the limiting steel pin 4 of each elastic limiting post 3 is in its highest position. When it is necessary to test and position the integrated circuit chip, an area matching the size of the integrated circuit chip is selected from the two elastic limiting post arrays 2, and the integrated circuit chip is placed on the elastic limiting post 3 located in that area. Then, the integrated circuit chip is pressed down. At this time, each elastic limiting post 3 located in that area is subjected to downward pressure. The limiting steel pins 4 of these elastic limiting posts 3 move downward and act on the reset spring 6, causing the reset spring 6 to be compressed. These elastic limiting posts 3 form a recessed area. At this time, the elastic limiting posts 3 around the recessed area position the integrated circuit chip, thereby achieving the positioning of the integrated circuit chip. Then, the integrated circuit chip is fixed by the clamping mechanism, thus completing the test positioning of the integrated circuit chip. After the test of the integrated circuit chip is completed, the clamping mechanism releases the fixing of the integrated circuit chip. At this time, the return spring 6 of each elastic limiting post 3 in this area extends upward and resets, driving the limiting steel pin 4 to move upward. When the return spring 6 returns to its natural extended state, the limiting steel pin 4 returns to its highest position, and the integrated circuit chip test positioning device returns to its initial state.
[0022] Example 3: This example is basically the same as Example 2, except that: in this example, as Figure 5 As shown, the clamping mechanism includes two clamping components, which are spaced apart to the left and right. The clamping component on the left is referred to as the first clamping component 7, and the clamping component on the right is referred to as the second clamping component 8. The first clamping component 7 includes a fixed plate 9, a clamping block 10, an elastic compression mechanism 11, a second guide rod 12, and a top rod 13. The fixed plate 9 is mounted on the support base 1 and is located to the left of the two elastic limiting column arrays 2. The elastic compression mechanism 11 is located to the left of the fixed plate 9 and is mounted on the fixed plate 9. The second guide rod 12 passes through the fixed plate 9 laterally and the force energy is relative to the fixed plate. 9. The top rod 13 is located below the second guide rod 12 and extends laterally through the fixed plate 9. The left end of the top rod 13 is connected to the elastic compression mechanism 11. The clamping block 10 is located to the right of the top rod 13 and the second guide rod 12, and its lower part is located at the interval between the two elastic limiting column arrays 2. The clamping block 10 is fixedly connected to the top rod 13 and the second guide rod 12 respectively. When the first clamping assembly 7 is in the initial state, the clamping block 10 is located at its rightmost position. If the clamping block 10 moves to the left, the elastic compression mechanism 11 will be compressed. The first clamping assembly 7 and the second clamping assembly 8 have a left-right symmetrical structure.
[0023] In this embodiment, when testing and positioning the integrated positioning chip, after selecting an area matching the specifications of the integrated circuit chip in the two elastic limiting column arrays 2, the first clamping component 7 is in its initial state, with the clamping block 10 located at its rightmost position, and the second clamping component 8 is also in its initial state. The operation of the first clamping component 7 is as follows: the clamping block 10 is moved to the left, causing the clamping block 10 to leave the area. After the integrated positioning chip is placed in the area and positioned, the clamping block 10 is moved to the right until it contacts the left side of the integrated positioning chip. At this time, due to the action of the elastic compression mechanism 11, the clamping block 10 rests against the left side of the integrated positioning chip. The second guide rod 12 guides the clamping block 10 during its movement to prevent offset. Similarly, the second clamping component 8 is operated to rest against the right side of the integrated positioning chip, thereby fixing the integrated positioning chip.
[0024] Example 4: This example is basically the same as Example 3, except that: In this example, the elastic compression mechanism 11 in the first clamping assembly 7 includes a "U"-shaped bend 14, a slider 15 and a compression spring 16. The "U"-shaped bend 14 is located on the left side of the fixed plate 9 and its two ends are fixed to the fixed plate 9 respectively. The compression spring 16 is bent in a "U" shape and is arranged inside the "U"-shaped bend 14. One end of the compression spring 16 is connected to the fixed plate 9. The slider 15 is arranged inside the "U"-shaped bend 14 and is located to the right of the other end of the compression spring 16. The other end of the slider 15 and the compression spring 16 are connected. The left end of the push rod 13 enters the "U"-shaped bend 14 and is connected to the slider 15. When the clamping block 10 is located at its rightmost position, the slider 15 is blocked by the fixed plate 9.
[0025] In this embodiment, when the first clamping assembly 7 is in its initial state, if the clamping block 10 is moved to the left by the force, it will drive the top rod 13 and the second guide rod 12 to move to the left synchronously. At this time, the slider 15 also moves to the left and away from the fixed plate 9 under the action of the top rod 13. The compression spring 16 is compressed by the slider 15. When the force that caused the clamping block 10 to move to the left disappears, the compression spring 16 extends to the right and pushes the slider to the right. The clamping block 10, the top rod 13 and the second guide rod 12 move to the right synchronously until the slider 15 is blocked by the fixed plate 9.
[0026] Example 5: This example is basically the same as Example 4, except that: In this example, in the first clamping assembly 7, a first magnet 17 is installed on the left side of the clamping block 10, and a second magnet 18 is installed on the right side of the fixing plate 9. When the first magnet 17 and the second magnet 18 are close to each other, they can attract each other through magnetic force.
[0027] In this embodiment, the clamping block 10 can be fixed near the fixing plate 9 by the attraction of the first magnet 17 and the second magnet 18 in the first clamping component 7. Thus, before positioning the integrated circuit chip, the clamping block 10 can be moved to make the first magnet 17 and the second magnet 18 attract and fix it. Similarly, the second clamping component 8 can also be fixed, which facilitates the positioning operation of the integrated circuit chip.
[0028] Example 6: This example is basically the same as Example 4, except that: In this example, the clamping block 10 in the first clamping component 7 is a wedge-shaped structure, its right side is inclined from top to bottom to left, and has multiple anti-slip grooves 19 spaced from top to bottom.
[0029] In this embodiment, when fixing the integrated circuit chip, the edge of the integrated circuit chip can be embedded in the anti-slip groove 19, thereby improving the reliability of fixing the integrated circuit chip.
[0030] Example 7: This example is basically the same as Example 4, except that: in this example, the upper end of the clamping block 10 in the first clamping assembly 7 is fixed with a worm gear 20.
[0031] In this embodiment, the ease of operation can be improved by moving the clamping block 10 by operating the worm gear 20.
[0032] In summary, the integrated circuit chip testing and positioning device of this utility model can form multiple recessed areas of different sizes by the local contraction of two elastic limiting column arrays, which serve as positioning areas respectively, thereby adapting to integrated circuit chips of different specifications and having strong versatility.
Claims
1. An integrated circuit chip testing and positioning device, comprising a support base and a positioning component mounted on the support base, characterized in that... The positioning component includes a clamping mechanism and two elastic limiting post arrays. The two elastic limiting post arrays are distributed at intervals. Each elastic limiting post array is formed by an array structure consisting of multiple elastic limiting posts evenly distributed in multiple rows and columns. Each elastic limiting post can retract downward when subjected to downward pressure and can extend upward to reset when the downward pressure disappears. The clamping mechanism is used to clamp and fix the integrated circuit chip located on the two elastic limiting post arrays.
2. The integrated circuit chip testing and positioning device according to claim 1, characterized in that... Each elastic limiting post includes a limiting steel pin, a first guide rod, and a return spring. The limiting steel pin and the first guide rod are both vertically arranged. The first guide rod is inserted into the support base, and its bottom is fixed on the support base. The return spring is sleeved on the lower outer side of the first guide rod, and its lower end is connected to the support base. The limiting steel pin is provided with a channel extending upward from its bottom. The upper part of the first guide rod is inserted into the channel, and the upper end of the return spring is connected to the limiting steel pin.
3. The integrated circuit chip testing and positioning device according to claim 1, characterized in that... The clamping mechanism includes two clamping components, spaced apart horizontally. The clamping component on the left is referred to as the first clamping component, and the clamping component on the right is referred to as the second clamping component. The first clamping component includes a fixed plate, a clamping block, an elastic compression mechanism, a second guide rod, and a top rod. The fixed plate is mounted on the support base and located to the left of the two elastic limiting column arrays. The elastic compression mechanism is located to the left of the fixed plate and mounted on the fixed plate. The second guide rod extends laterally through the fixed plate and can move relative to the fixed plate under force. The top rod... The rod is located below the second guide rod and extends laterally through the fixed plate. The left end of the top rod is connected to the elastic compression mechanism. The clamping block is located to the right of the top rod and the second guide rod, and its lower part is located at the interval between the two elastic limiting column arrays. The clamping block is fixedly connected to the top rod and the second guide rod respectively. When the first clamping assembly is in the initial state, the clamping block is located at its rightmost position. If the clamping block moves to the left, the elastic compression mechanism will be compressed. The first clamping assembly and the second clamping assembly have a left-right symmetrical structure.
4. The integrated circuit chip testing and positioning device according to claim 3, characterized in that... In the first clamping assembly, the elastic compression mechanism includes a U-shaped bend, a slider, and a compression spring. The U-shaped bend is located on the left side of the fixed plate, and its two ends are fixed to the fixed plate. The compression spring is U-shaped and disposed inside the U-shaped bend, with one end connected to the fixed plate. The slider is disposed inside the U-shaped bend and located to the right of the other end of the compression spring. The slider and the other end of the compression spring are connected. The left end of the push rod enters the U-shaped bend and connects to the slider. When the clamping block is located at its rightmost position, the slider is blocked by the fixed plate.
5. The integrated circuit chip testing and positioning device according to claim 3, characterized in that... In the first clamping assembly, a first magnet is installed on the left side of the clamping block, and a second magnet is installed on the right side of the fixing plate. When the first magnet and the second magnet are close to each other, they can attract each other through magnetic force.
6. The integrated circuit chip testing and positioning device according to claim 3, characterized in that... In the first clamping assembly, the clamping block has a wedge-shaped structure, with its right side inclined from top to bottom to left, and has multiple anti-slip grooves spaced apart from top to bottom.
7. The integrated circuit chip testing and positioning device according to claim 3, characterized in that... In the first clamping assembly, a worm gear is fixed to the upper end of the clamping block.