A high-temperature testing device for an integrated circuit board

Abstract

The utility model relates to the field of integrated circuit board production technology discloses an integrated circuit board high temperature testing device, including high temperature box main part, and high temperature box main part includes the box, and the high temperature test bin is established in the box front end one side, and the high temperature test bin rear end is provided with high temperature test subassembly, and the inboard wall fixed connection of high temperature test bin has T type heat insulating plate, and T type heat insulating plate divides high temperature test bin into three independent temperature control area, and every temperature control area is provided with integrated circuit board placing mechanism. The utility model discloses a multi -area independent temperature control mechanism, and the high temperature test bin in high temperature box is divided into multiple temperature control areas through T type heat insulating plate, and each area is equipped with independent heating element and airflow circulation system, and the built -in control component of high temperature box can control independent heating element and airflow circulation system, and the high temperature control of different high temperature areas can be realized, and single can carry out three integrated circuit board's different temperature condition test work.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit board manufacturing technology, specifically to a high-temperature testing device for integrated circuit boards. Background Technology

[0002] The high-temperature testing device for integrated circuit boards (PCBs) is a specialized device used to simulate high-temperature environments and test the electrical, mechanical, and reliability properties of circuit boards under high-temperature conditions. It can simulate high-temperature environments and provide a stable and controllable high-temperature environment (typically ranging from 50°C to 260°C, with some high-end devices reaching over 300°C) to test the circuit board's tolerance to high temperatures.

[0003] Existing high-temperature testing equipment for integrated circuit boards still has the following problems when in use: its functionality is poor. Its high-temperature chamber is usually designed with a single high-temperature testing structure, which only has one high-temperature testing area. It can only perform single-temperature condition testing on the integrated circuit board at a time. Moreover, the single high-temperature area is limited by the large space, resulting in large temperature differences in different locations (especially in large equipment). The temperature in the edge area may be more than 5°C lower than that in the center, which leads to inconsistent test results for PCBs in the same batch. As a result, the reliability of the test data is reduced, and it is difficult to accurately assess the consistency performance of PCBs under extreme high temperatures. Utility Model Content

[0004] (a) Technical problems to be solved.

[0005] To address the shortcomings of existing technologies, this invention provides a high-temperature testing device for integrated circuit boards, solving the problems mentioned in the background section.

[0006] (ii) Technical solution.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a high-temperature testing device for integrated circuit boards, comprising a high-temperature chamber body, the high-temperature chamber body including a box body, a high-temperature testing chamber opened on one side of the front end of the box body, a high-temperature testing component configured at the rear end of the high-temperature testing chamber, a T-shaped heat insulation plate fixedly connected to the inner side wall of the high-temperature testing chamber, the T-shaped heat insulation plate dividing the high-temperature testing chamber into three independent temperature control zones, and an integrated circuit board placement mechanism provided in each temperature control zone, an installation groove opened above the rear end of the inner side wall of the high-temperature testing chamber, and two installation grooves symmetrically opened below the rear end of the inner side wall of the high-temperature testing chamber, the high-temperature testing component including a circulating hot air mechanism fixedly installed in the installation groove.

[0008] As a further embodiment of this utility model: a support is fixedly connected to each of the four corners of the bottom of the box, two hinges are fixedly installed at one end of the box in a symmetrical manner, the rotating ends of the two hinges are fixedly connected to the same box cover, a through groove is opened between the front and rear side walls of the box cover, and an observation window is fixedly installed in the through groove, and a handle is fixedly connected to the other side of the front end of the box cover.

[0009] As a further embodiment of this utility model: the integrated circuit board placement mechanism includes two symmetrically arranged card holders, the four outer card holders are fixedly connected to the inner wall of the high-temperature test chamber, and the two inner card holders are fixedly connected to the outer wall of the T-shaped heat insulation plate. An infrared radiation heater is provided at each card holder. The circulating hot air mechanism includes a circulating fan fixedly installed in the mounting slot. The circulating fan is connected to a controller inside the box via a connecting line. A connector is provided at the rear end of the circulating fan, and a gas heater is provided at the rear end of the connector.

[0010] As a further improvement of this utility model: the same placement rack is slidably engaged in the two card holders in each temperature control area, and the front end of the placement rack has two symmetrically formed gripping grooves.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. In this utility model, by adopting a multi-zone independent temperature control mechanism, the high-temperature test chamber inside the high-temperature chamber is divided into multiple temperature control zones by a T-shaped heat insulation plate. Each zone is equipped with an independent heating element and an airflow circulation system. The independent heating element and airflow circulation system can be controlled by the built-in control component of the high-temperature chamber, which can realize high-temperature control of different high-temperature zones. Three integrated circuit boards can be tested under different temperature conditions at one time.

[0013] 2. In this utility model, a new heating method is adopted, which adopts a composite heating mode of infrared radiation heating combined with gas heater. The gas heater is equipped with a circulating fan, which can circulate hot air in independent temperature control areas. Infrared radiation heaters are set at the two side brackets of each temperature control area. Infrared heating increases the surface heating rate (suitable for rapid temperature change testing). Hot air circulation ensures uniform internal temperature, reduces "temperature dead zones", and avoids large temperature differences in different positions. Attached Figure Description

[0014] Figure 1 This is a perspective view of the entire utility model;

[0015] Figure 2 This is a perspective view of the high-temperature chamber body and high-temperature testing components of this utility model.

[0016] Figure 3 This is a perspective view of the main body of the high-temperature chamber of this utility model;

[0017] Figure 4 This is a perspective view of the integrated circuit board placement rack and high-temperature testing component of this utility model.

[0018] In the diagram: 1. High-temperature chamber body; 2. High-temperature testing components; 3. Hinge; 4. Chamber lid; 5. Observation window; 6. Handle; 11. Chamber body; 12. High-temperature testing chamber; 13. T-shaped heat insulation plate; 14. Support; 15. Card holder; 16. Placement rack; 17. Grip groove; 18. Mounting groove; 21. Circulating fan; 22. Connector; 23. Gas heater. Detailed Implementation

[0019] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0020] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] Please see Figures 1-4In this embodiment of the present invention, a high-temperature testing device for integrated circuit boards includes a high-temperature chamber body 1, which includes a chamber 11. A high-temperature testing chamber 12 is provided on one side of the front end of the chamber 11. A high-temperature testing component 2 is provided at the rear end of the high-temperature testing chamber 12. A T-shaped heat insulation plate 13 is fixedly connected to the inner wall of the high-temperature testing chamber 12. The T-shaped heat insulation plate 13 divides the high-temperature testing chamber 12 into three independent temperature control zones, and an integrated circuit board placement mechanism is provided in each temperature control zone. An installation groove 18 is provided above the rear end of the inner wall of the high-temperature testing chamber 12, and two installation grooves 18 are also symmetrically provided below the rear end of the inner wall of the high-temperature testing chamber 12. The high-temperature testing component 2 includes a circulating hot air mechanism fixedly installed in the installation groove 18. The whole adopts a multi-zone independent temperature control mechanism. The high-temperature testing chamber 12 inside the high-temperature chamber is divided into multiple temperature control zones by the T-shaped heat insulation plate 13. Each zone is equipped with an independent heating element and an airflow circulation system. The independent heating element and airflow circulation system can be controlled by the built-in control component of the high-temperature chamber, which can realize high-temperature control of different high-temperature zones. Three integrated circuit boards can be tested under different temperature conditions at one time.

[0023] Each of the four corners of the bottom of the box 11 is fixedly connected to a support 14, which can be used to support and place the overall high temperature testing device. Two hinges 3 are fixedly installed at one end of the box 11 in a symmetrical manner. The rotating ends of the two hinges 3 are fixedly connected to the same box cover 4. A through groove is opened between the front and rear side walls of the box cover 4, and an observation window 5 is fixedly installed in the through groove. A handle 6 is fixedly connected to the other side of the front end of the box cover 4. The handle 6 can be held to rotate the box cover 4 to close or open the opening of the high temperature testing chamber 12 at the front end of the box 11.

[0024] The integrated circuit board placement mechanism includes two symmetrically arranged card holders 15. The four outer card holders 15 are fixedly connected to the inner wall of the high-temperature test chamber 12, and the two inner card holders 15 are fixedly connected to the outer wall of the T-shaped heat insulation plate 13. Infrared radiation heaters are installed at the card holders 15. The circulating hot air mechanism includes a circulating fan 21 fixedly installed in the mounting slot 18. The circulating fan 21 is connected to the controller inside the housing 11 via a connecting line. A connector 22 is installed at the rear end of the circulating fan 21, and a gas heater 23 is installed at the rear end of the connector 22. The whole system adopts a new heating method, which uses a composite heating mode of infrared radiation heating combined with gas heater 23. The gas heater 23 is equipped with a circulating fan 21, which can circulate hot air in an independent temperature control area. Infrared radiation heaters are installed at the card holders 15 on both sides of each temperature control area. Infrared heating increases the surface heating rate (suitable for rapid temperature change testing). Hot air circulation ensures uniform internal temperature, reduces "temperature dead zones", and avoids large temperature differences in different locations.

[0025] Within each temperature control zone, two card holders 15 are slidably connected to the same placement rack 16. The front end of the placement rack 16 has two symmetrically arranged gripping slots 17, on which integrated circuit boards to be tested at high temperatures can be installed and placed. The placement rack 16 can be pulled out of the card holder 15 by holding the gripping slots 17.

[0026] The working principle of this utility model is as follows: Integrated circuit boards to be tested at high temperatures can be installed on the placement rack 16. The whole adopts a multi-zone independent temperature control mechanism. The high temperature test chamber 12 inside the high temperature chamber is divided into multiple temperature control zones by the T-shaped heat insulation plate 13. Each zone is equipped with an independent heating element and airflow circulation system. The independent heating element and airflow circulation system can be controlled by the built-in control component of the high temperature chamber, so as to realize the high temperature control of different high temperature zones. Three integrated circuit boards can be tested under different temperature conditions at one time. Since the whole adopts a new heating method, it adopts a composite heating mode of infrared radiation heating combined with gas heater 23. The gas heater 23 is equipped with a circulating fan 21, which can circulate hot air in the independent temperature control zone. Infrared radiation heaters are set at the two side brackets 15 of each temperature control zone. Infrared heating increases the surface heating rate (suitable for rapid temperature change testing). Hot air circulation ensures uniform internal temperature, reduces "temperature dead zones", and avoids large temperature differences in different positions.

[0027] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high temperature testing device for integrated circuit boards, comprising a high temperature chamber body (1), the high temperature chamber body (1) comprising a chamber (11), a high temperature testing chamber (12) being provided on one side of the front end of the chamber (11), and a high temperature testing component (2) being provided at the rear end of the high temperature testing chamber (12). Its features are: The high-temperature test chamber (12) is fixedly connected to a T-shaped heat insulation plate (13) on its inner side wall. The T-shaped heat insulation plate (13) divides the high-temperature test chamber (12) into three independent temperature control areas, and each temperature control area is provided with an integrated circuit board placement mechanism. An installation slot (18) is provided above the rear end of the inner side wall of the high temperature test chamber (12), and two installation slots (18) are also provided symmetrically below the rear end of the inner side wall of the high temperature test chamber (12). The integrated circuit board placement mechanism includes two card holders (15) arranged symmetrically. The four outer card holders (15) are fixedly connected to the inner wall of the high temperature test chamber (12), and the two inner card holders (15) are fixedly connected to the outer wall of the T-shaped heat insulation plate (13). An infrared radiation heater is provided at each card holder (15). The high-temperature test component (2) includes a circulating hot air mechanism that is fixedly installed in the mounting slot (18).

2. The high-temperature testing device for integrated circuit boards according to claim 1, characterized in that: At each of the four corners of the bottom of the box (11), a support (14) is fixedly connected, and two hinges (3) are fixedly installed at one end of the box (11) in a symmetrical manner.

3. The high-temperature testing device for integrated circuit boards according to claim 2, characterized in that: The rotating ends of the two hinges (3) are fixedly connected to the same box cover (4).

4. The high-temperature testing device for integrated circuit boards according to claim 3, characterized in that: A through groove is provided between the front and rear side walls of the box cover (4), and an observation window (5) is fixedly installed in the through groove. A handle (6) is fixedly connected to the other side of the front end of the box cover (4).

5. The high-temperature testing device for integrated circuit boards according to claim 1, characterized in that: The circulating hot air mechanism includes a circulating fan (21) fixedly installed in the mounting slot (18), and the circulating fan (21) is connected to the controller inside the housing (11) via a connecting line.

6. The high-temperature testing device for integrated circuit boards according to claim 5, characterized in that: The circulating fan (21) is provided with a connector (22) at its rear end, and a gas heater (23) is provided at its rear end.

7. The high-temperature testing device for integrated circuit boards according to claim 1, characterized in that: The same placement rack (16) is slidably engaged in the two card holders (15) within each temperature control area, and the front end of the placement rack (16) has two symmetrically arranged gripping grooves (17).

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