FT test aid for chips

Abstract

The utility model discloses a FT test auxiliary device for chip relates to a chip test technical field, including test platform, fixed film, fixed ring and fixing piece, the first side of fixed film has adhesion, the fixed surface of chip group is stuck in the first side of fixed film, and the test surface of chip group is located the other side of fixed surface, and the fixing piece is used for fixing fixed film on the test platform, through fixed film to chip group is bonded, then through fixing piece and chip group are fixed in test platform, can adapt to different size chip group, and the minimum package size also can correspond 1x1mm, avoids the problem of flying material and material blockage in the conveying process, and the damage ratio is far less than 1 / 5000, and is not affected by the number of sorting machine station, and the same test can reach 64 sites above, and the test cost is reduced by more than 50%.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and more particularly to an auxiliary device for FT testing of chips. Background Technology

[0002] FT testing, also known as final testing or functional testing, is a crucial step in the chip manufacturing process. FT testing is performed after chip packaging and utilizes a sorting machine and a testing machine to test the chip's functional and electrical performance parameters, ensuring that each chip meets design specifications before leaving the factory. Additionally, FT testing can also refer to power-on testing, used to verify the proper functioning of electrical components. A problem with existing FT testing technologies is their inability to handle single-chip or multi-site FT testing of small-sized products (below 2x2mm), frequently resulting in component loss and jamming. Utility Model Content

[0003] The purpose of this invention is to design an FT test auxiliary device for chips in order to solve the above problems.

[0004] This utility model achieves the above objectives through the following technical solutions:

[0005] FT test auxiliary device for chips, including:

[0006] Test platform;

[0007] The fixing film has an adhesive side, the fixing surface of the chipset is attached to the first side of the fixing film, and the test surface of the chipset is located on the other side of the fixing surface.

[0008] The retaining ring; the retaining membrane is fixed to the retaining ring;

[0009] Fixtures; Fixtures are used to secure the membrane to the test platform.

[0010] The advantages of this invention are as follows: the chipset is bonded by a fixing film, and then the fixing film and chipset are fixed on the test platform by a fixing component. It can adapt to chipsets of different sizes, and the smallest package size can also correspond to 1x1mm. It avoids the problem of flying and jamming during the transportation process, and the damage ratio is much less than 1 / 5000. Moreover, it is not affected by the number of sorting machine stations, and can perform more than 64 sites at the same time, reducing the testing cost by more than 50%. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of the FT test auxiliary device for chips according to this utility model;

[0012] Figure 2 This is a schematic diagram of the test platform of the FT test auxiliary device for chips according to this utility model;

[0013] Figure 3 This is a schematic diagram of the flattening component in the FT test auxiliary device for chips according to this utility model;

[0014] Figure 4 This is a schematic diagram of the accordion-type suction nozzle in the FT test auxiliary device for chips of this utility model;

[0015] The corresponding figure labels are:

[0016] 1-Test platform, 2-Fixed membrane, 3-Fixed ring, 4-Pressure frame, 5-Pressure strip, 6-First mounting hole, 7-First moving part, 8-Blowing pipe, 9-Vacuum tube, 10-Belcher nozzle, 11-Nose opening, 12-Connection end, 13-Vacuum hole. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0019] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0020] In the description of this utility model, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0022] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0024] like Figure 1 , Figure 2 , Figure 3 As shown, the FT test auxiliary device for chips includes:

[0025] Test platform 1;

[0026] Fixing film 2; The first side of fixing film 2 is adhesive, the fixing surface of the chip group is attached to the first side of fixing film 2, the test surface of the chip group is located on the other side of the fixing surface, and fixing film 2 is a UV film.

[0027] Fixture; The fixture is used to fix the membrane 2 onto the test platform 1.

[0028] The fixture includes a vacuum pump and multiple vacuum nozzles. The vacuum nozzles are fixed on the test platform 1. The first end of the vacuum nozzle is pressed against the lower end face of the fixing ring 3. The air inlet of the vacuum pump is fixedly connected to the second end of the multiple vacuum nozzles respectively.

[0029] The FT test auxiliary device also includes a flattening component and a first moving component 7. The flattening component is used to press the edge of the test surface of the chipset. The moving end of the first moving component 7 acts on the flattening component. The first moving component 7 is used to move the flattening component closer to or away from the test platform 1.

[0030] The flattening component includes a pressure frame 4 and a pressure strip 5. The pressure strip 5 is fixed to the lower end face of the pressure frame 4. When the test surface of the chip group is pressed, the pressure strip 5 is pressed and contacted with the edge of the chip group. The pressure frame 4 is fixedly installed on the moving end of the first moving component 7, which can effectively assist in adsorbing large board products with warping in order to test warped products.

[0031] The FT test auxiliary device also includes a set of bolts. The pressure frame 4 is provided with multiple sets of first mounting holes 6. The moving end of the first moving part 7 is provided with a set of second mounting holes. A bolt passes through a first mounting hole 6 and a second mounting hole.

[0032] The FT test auxiliary device also includes an air compressor and an air blowing pipe 8. The first end of the air blowing pipe 8 is connected to the outlet of the air compressor, and the second end of the air blowing pipe 8 is located directly above the test surface of the chipset.

[0033] The vacuum nozzle includes a vacuum tube 9 and an accordion-type nozzle 10. The first end of the vacuum tube 9 is fixedly connected to the inlet 12 of the accordion-type nozzle 10, and the second end of the vacuum tube 9 is fixedly connected to the air inlet of the vacuum pump. The lower end face of the nozzle port 11 fixing ring of the accordion-type nozzle 10 is in contact with the nozzle.

[0034] The FT test auxiliary device also includes a second moving part, the moving end of which acts on the test platform, and the moving directions of the first moving part and the second moving part are perpendicular to each other.

[0035] The first moving part 7 and the second moving part are any one of linear modules, linear motors, cylinders and hydraulic cylinders.

[0036] The working principle of this utility model's FT test auxiliary device for chips is as follows:

[0037] Pre-test installation and fixation: Place the fixing surface of the chipset on the fixing film 2, and attach the fixing film 2 to the fixing ring 3. Then, use a vacuum pump and vacuum nozzle to adhere the fixing film 2 and fixing ring 3 to the test platform 1. Next, select a suitable pressure frame 4 and fix it to the moving end of the first moving part 7 with bolts. Then, start the first moving part 7 to move the pressure frame 4 until it reaches directly above the chipset and stops. Subsequently, the second moving part drives the test platform and the vacuum nozzle carrying the chipset to rise slowly and synchronously, so that the pressure strip 5 makes contact with the edge of the chipset, and the chipset rises. Once the product reaches the designated position, the air compressor starts, blowing compressed air through the air blowing pipe 8 to the center area of ​​the product group. At the same time, by increasing the vacuum pressure of the vacuum nozzle of the adsorption fixing ring, the accordion-type nozzle 10 folds, further tightening the fixing ring downwards, making the fixing film taut. The lower surface of the fixing film carrying the chip group effectively establishes a vacuum with the vacuum hole 13 on the test platform. Then, the test platform and the vacuum nozzle carrying the chip group descend, the air compressor stops blowing air, and the first moving part 7 drives the pressure frame 4 and the air blowing pipe 8 back to the initial position. Then, the subsequent FT test process can be carried out.

[0038] The structure of this utility model for the FT testing auxiliary device for chips can handle FT testing of chips with a minimum package size of 1x1mm, avoiding the problem of flying and jamming during the transportation process, and the damage ratio is much less than 1 / 5000; and it is not affected by the number of sorting machine stations, and can perform more than 64 sites at the same time, reducing the testing cost by more than 50%.

[0039] The structure of the FT test auxiliary device for chips of this utility model optimizes the traditional FT test process, which not only meets the needs of FT testing of small-sized chips, but also solves the warping problem that may exist in square plate products through the flattening component. The structure of this utility model reduces the cost by more than 50% compared with the traditional FT test solution.

[0040] The technical solution of this utility model is not limited to the specific embodiments described above. All technical modifications made based on the technical solution of this utility model shall fall within the protection scope of this utility model.

Claims

1. An auxiliary device for FT testing of chips, characterized in that, include: Test platform; The fixing film has an adhesive side, the fixing surface of the chipset is attached to the first side of the fixing film, and the test surface of the chipset is located on the other side of the fixing surface. The retaining ring; the retaining membrane is fixed to the retaining ring; Fixtures; Fixtures are used to secure the membrane to the test platform.

2. The FT test auxiliary device for chips according to claim 1, characterized in that, The fixture includes a vacuum pump and multiple vacuum nozzles. The vacuum nozzles are fixed on the test platform. The first end of the vacuum nozzle is pressed against the lower end face of the fixing ring. The air inlet of the vacuum pump is fixedly connected to the second end of the multiple vacuum nozzles respectively.

3. The FT test auxiliary device for chips according to claim 1, characterized in that, The FT test auxiliary device also includes a flattening component and a first moving component. The flattening component is used to press the edge of the test surface of the chipset, and the moving end of the first moving component acts on the flattening component. The first moving component is used to move the flattening component closer to or away from the test platform.

4. The FT test auxiliary device for chips according to claim 3, characterized in that, The flattening component includes a pressure frame and a pressure strip. The pressure strip is fixed to the lower end face of the pressure frame. When the test surface of the chipset is pressed, the pressure strip is pressed and contacted with the edge of the chipset. The pressure frame is fixedly installed on the moving end of the first moving component.

5. The FT test auxiliary device for chips according to claim 4, characterized in that, The FT test auxiliary device also includes a set of bolts, and the pressure frame is provided with multiple sets of first mounting holes. The moving end of the first moving part is provided with a set of second mounting holes, and a bolt passes through one first mounting hole and one second mounting hole.

6. The FT test auxiliary device for chips according to claim 1, characterized in that, The FT test auxiliary device also includes an air compressor and an air blowing pipe. The first end of the air blowing pipe is connected to the outlet of the air compressor, and the second end of the air blowing pipe is located directly above the test surface of the chipset.

7. The FT test auxiliary device for chips according to claim 2, characterized in that, The vacuum nozzle includes a vacuum tube and an accordion-type nozzle. The first end of the vacuum tube is fixedly connected to the inlet of the accordion-type nozzle, and the second end of the vacuum tube is fixedly connected to the air inlet of the vacuum pump. The lower end face of the nozzle port fixing ring of the accordion-type nozzle is in contact with the nozzle.

8. The FT test auxiliary device for chips according to claim 3, characterized in that, The FT test auxiliary device also includes a second moving part, the moving end of which acts on the test platform, and the moving directions of the first moving part and the second moving part are perpendicular to each other.

9. The FT test auxiliary device for chips according to claim 8, characterized in that, Both the first and second moving parts can be any one of a linear module, a linear motor, a pneumatic cylinder, and a hydraulic cylinder.

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