Self-repairing hydrophobic film layer structure, cover plate device and display module

Abstract

The utility model discloses a kind of self-repairing hydrophobic membrane layer structures, comprising: electrically ruptured microcapsule layer;Conductive grid layer, set on the one side surface of the electrically ruptured microcapsule layer;Hydrophobic membrane layer, set on the one side surface of the conductive grid layer away from the conductive grid layer.The self-repairing hydrophobic membrane layer structure can not reduce the hydrophobic performance of hydrophobic membrane layer, and keep the hydrophobic performance consistent everywhere after repair.The utility model further discloses a kind of cover plate device and display module, comprising the self-repairing hydrophobic membrane layer structure described above.

Description

Technical Field

[0001] This utility model relates to membrane repair technology, and more particularly to a self-healing hydrophobic membrane structure, a cover plate device, and a display module. Background Technology

[0002] Hydrophobic films are thin films with hydrophobic properties, allowing water to form droplets and roll off their surfaces, making them less prone to adhesion. They are widely used in the optical field. Coating the surfaces of optical components such as eyeglass lenses, camera lenses, and telescope lenses with hydrophobic films can prevent water vapor condensation and oil contamination, thereby improving the clarity and lifespan of the optical components.

[0003] Self-healing microcapsule technology is a smart material technology that encapsulates a repair agent in microcapsules and automatically releases the repair agent when the hydrophobic film is damaged to achieve damage repair. Its core principle is to encapsulate the repair agent in micron-sized capsules and disperse it evenly in the hydrophobic film. When the hydrophobic film is ruptured, the microcapsule ruptures and releases the repair agent, which reacts with the curing agent to fill the crack and restore the performance of the hydrophobic film.

[0004] However, mixing and dispersing microcapsules within the hydrophobic film reduces the content of hydrophobic materials within the film, which undoubtedly reduces the hydrophobic properties of the film. Furthermore, after local repair, the content of hydrophobic materials differs between the repaired and unrepaired areas, resulting in inconsistent surface hydrophobic properties. Utility Model Content

[0005] To address the shortcomings of the prior art, this invention provides a self-healing hydrophobic film structure, a cover plate device, and a display module, which can maintain the hydrophobic properties of the hydrophobic film without reducing its hydrophobic performance and ensure consistent hydrophobic properties throughout the repaired area.

[0006] The technical problem to be solved by this utility model is achieved through the following technical solution:

[0007] A self-healing hydrophobic film structure, comprising:

[0008] Electrolytically ruptured microcapsule layer;

[0009] A conductive mesh layer is disposed on one side surface of the electrolytically fractured microcapsule layer;

[0010] A hydrophobic film layer is disposed on the surface of the conductive mesh layer away from the conductive mesh layer.

[0011] Furthermore, the hydrophobic film layer is made of fluorine-containing organic compounds or silicon-containing organic compounds, and its thickness is 500-800 nm.

[0012] Furthermore, the conductive mesh layer adopts an ITO mesh, a metal mesh, or a carbon nanotube network, with a thickness of 50-80 nm.

[0013] Furthermore, the electrolytically ruptured microcapsule layer is made of conductive polymer / organic resin composite microcapsules with a thickness of 5-8 μm.

[0014] Furthermore, the thickness ratio between the electrolytically fractured microcapsule layer, the conductive mesh layer, and the hydrophobic film layer is 1:0.1:10.

[0015] Furthermore, the hydrophobic film layer contains a vertically arranged array of silicon dioxide nanowires.

[0016] Furthermore, the hydrophobic film layer has a first hollow area and a second hollow area on its opposite sides, respectively; the conductive mesh layer has a first sensing terminal in the first hollow area and a second sensing terminal in the second hollow area; the hydrophobic film layer and the conductive mesh layer have a third hollow area and a fourth hollow area on their opposite sides, respectively; the electrolytically ruptured microcapsule layer has a first heating terminal in the third hollow area and a second heating terminal in the fourth hollow area.

[0017] A cover plate device includes a glass substrate and the aforementioned self-healing hydrophobic film structure, wherein the self-healing hydrophobic film structure is disposed on one side surface of the glass substrate, and the electrolytically ruptured microcapsule layer is located on the side close to the glass substrate.

[0018] Furthermore, the cover plate device also includes a capacitance detection chip and a control chip. The two input terminals of the capacitance detection chip are electrically connected to the first sensing terminal and the second sensing terminal of the conductive mesh layer, respectively. The output terminal of the capacitance detection chip is electrically connected to the input terminal of the control chip. The two output terminals of the control chip are electrically connected to the first heating terminal and the second heating terminal of the electrolytically ruptured microcapsule layer.

[0019] A display module includes a display panel and the cover plate device described above, wherein the glass substrate of the cover plate device is disposed on the display side of the display panel.

[0020] This invention has the following beneficial effects: The self-healing hydrophobic film structure of this invention is composed of an electrolytically fractured microcapsule layer, a conductive mesh layer, and a hydrophobic film layer stacked sequentially. The hydrophobic film layer does not contain microcapsules, and the content of hydrophobic material in the hydrophobic film layer is not affected by the microcapsules, thus ensuring the hydrophobic properties of the hydrophobic film layer and the consistency of its hydrophobic properties throughout the repaired area. The hydrophobic film layer reduces the surface energy of the film structure, making it difficult for water droplets, grease, or dust to adhere to the surface of the film structure. The conductive mesh layer forms a capacitor layer beneath the hydrophobic film layer, which is affected by the conductive mesh layer. When a localized fracture occurs due to external impact, the hydrophobic film layer fractures along with the fracture, resulting in a significant change in capacitance. The electrolytic fracture microcapsule layer is used to release a repair agent under voltage, allowing the repair agent to permeate through the conductive mesh layer and fill the cracks in the hydrophobic film layer, thereby repairing the hydrophobic film layer. In use, the capacitance value of the conductive mesh layer is monitored. When the capacitance value of the conductive mesh layer changes significantly, a preset voltage value is applied to the electrolytic fracture microcapsule layer to cause it to release the repair agent and repair the hydrophobic film layer. Attached Figure Description

[0021] Figure 1 A schematic diagram of the stacked structure of the self-healing hydrophobic film layer provided by this utility model.

[0022] Figure 2 This is a front view of the self-healing hydrophobic film structure provided by this utility model.

[0023] Figure 3 A schematic diagram of the stacked structure of the cover plate device provided by this utility model.

[0024] Figure 4 A front structural diagram of the cover plate device provided by this utility model.

[0025] Figure 5 This is a schematic diagram of the stacked structure of the display module provided by this utility model. Detailed Implementation

[0026] The present invention will now be described in detail with reference to the accompanying drawings and embodiments, examples of which are shown in the drawings. Throughout the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0027] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "multiple" means two or more, unless otherwise explicitly specified.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," "fixing," and "setting," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] Example 1

[0031] like Figure 1 As shown, a self-healing hydrophobic film structure includes:

[0032] Electrolytically ruptured microcapsule layer 21;

[0033] A conductive mesh layer 22 is disposed on one side surface of the electrolytically fractured microcapsule layer 21;

[0034] A hydrophobic film layer 23 is disposed on the surface of the conductive mesh layer 22 away from the conductive mesh layer 22.

[0035] The self-healing hydrophobic film structure of this invention comprises an electrolytically fractured microcapsule layer 21, a conductive mesh layer 22, and a hydrophobic film layer 23, stacked sequentially. The hydrophobic film layer 23 does not contain microcapsules 213, and the content of hydrophobic material in the hydrophobic film layer 23 is unaffected by the microcapsules 213, ensuring the hydrophobic properties of the hydrophobic film layer 23 and the consistency of its hydrophobic properties throughout the repaired area. The hydrophobic film layer 23 reduces the surface energy of the film structure, making it difficult for water droplets, grease, or dust to adhere to its surface. The conductive mesh layer 22 forms a capacitor layer beneath the hydrophobic film layer 23, which locally reduces the hydrophobic film layer 23 when subjected to external impact. When the membrane breaks, it partially breaks along with the hydrophobic film layer 23, resulting in a significant change in capacitance. The electrolytically ruptured microcapsule layer 21 is used to release a repair agent 214 under voltage, allowing the repair agent 214 to pass through the conductive mesh layer 22 and fill the cracks in the hydrophobic film layer 23, thereby repairing the hydrophobic film layer 23. In use, by monitoring the capacitance value of the conductive mesh layer 22, when the capacitance value of the conductive mesh layer 22 changes significantly, a preset voltage value is applied to the electrolytically ruptured microcapsule layer 21 to release the repair agent 214 to repair the hydrophobic film layer 23.

[0036] During repair, the duration of voltage application to the electro-ruptured microcapsule layer 21 can be controlled by a preset repair time, or by monitoring the capacitance change of the conductive mesh layer 22. Although the repair agent 214 released by the electro-ruptured microcapsule layer 21 cannot restore the conductivity of the conductive mesh layer 22 at the local rupture site, it can change the dielectric material in the crack (from air to repair agent 214) after filling the crack in the conductive mesh layer 22, which will also cause a change in the capacitance of the conductive mesh layer 22.

[0037] It should be noted that the self-healing hydrophobic film structure of this invention can only repair cracks at the same location once. This is because when the conductive mesh layer 22 breaks a second time at the same location along with the hydrophobic film layer 23, its capacitance change is small and cannot reach the preset change threshold, which is insufficient to trigger the control chip to apply voltage to the electro-ruptured microcapsule layer 21.

[0038] In this embodiment, the hydrophobic film layer 23 may be, but is not limited to, using fluorinated organic compounds or silicon-containing organic compounds, such as fluoroalkylsilanes, with a thickness of 500-800 nm; the conductive mesh layer 22 may be, but is not limited to, using ITO mesh, metal mesh or carbon nanotube network, with a thickness of 50-80 nm; the electrolytically ruptured microcapsule layer 21 may be, but is not limited to, using conductive polymer / organic resin composite microcapsules 213, such as conductive polyaniline / acrylic acid composite microcapsules 213, with a thickness of 5-8 μm.

[0039] Preferably, the thickness ratio of the electrolytically ruptured microcapsule layer 21, the conductive mesh layer 22, and the hydrophobic film layer 23 is 1:0.1:10.

[0040] The conductive mesh layer 22 has a line width of 2-5 μm, a mesh side length of 200-300 μm, and an aperture ratio of not less than 98%, so as to ensure that the light transmittance meets the requirements while allowing the repair agent 214 to penetrate, so as to be applied in the optical field.

[0041] A vertically arranged array of silica nanowires 231 is placed within the hydrophobic film layer 23. The silica nanowire array 231 serves as the microstructural framework of the hydrophobic film layer 23, improving its mechanical properties and mitigating the risk of localized breakage under external impact. Preferably, the linear density of the silica nanowire array 231 is 3-6 wires / μm. 2 This is to ensure the hydrophobic properties of the hydrophobic film layer 23.

[0042] After sequentially fabricating the electrolytically fractured microcapsule layer 21 and the conductive mesh layer 22 on a substrate (such as a glass substrate), a 0.1 mol / L SnCl2 ethanol solution is sprayed onto the surface of the conductive mesh layer 22 as a seed crystal, and reacted in a mixed solution of tetraethyl orthosilicate, ethanol and ammonia at 120°C for 6 hours to generate a vertically arranged silica nanowire array 231, wherein the molar ratio between tetraethyl orthosilicate, ethanol and ammonia is 1:50:0.5. Then, a fluorine-containing organic compound or a silicon-containing compound is deposited and filled into the gaps of the silica nanowire array 231 by vapor deposition to finally form the hydrophobic film layer 23.

[0043] The electrolytically ruptured microcapsule layer 21 uses a two-component polyurethane as the substrate, wherein component A is an isocyanate prepolymer and component B is a polyol chain extender. A conductive polymer / organic resin composite serves as the shell of the microcapsule 213. The microcapsule 213 encapsulates a fluorinated or silicone-containing repair agent 214, such as a siloxane repair agent. Preferably, the repair agent 214 may contain a certain amount of platinum catalyst (e.g., 5%) to accelerate the crosslinking and curing speed of the repair agent 214 during the repair of the hydrophobic film layer 23. A certain amount of dispersant (e.g., 0.5%) may also be added to the substrate to ensure uniform distribution of the microcapsules 213 within the substrate. The particle size of the microcapsules 213 is 4.8-5.2 μm (CV < 3%), with an encapsulation efficiency ≥ 92%.

[0044] The conductive polymer enables the electrolytically ruptured microcapsule layer 21 to be conductive, and when the electrolytically ruptured microcapsule layer 21 is energized, Joule heating is generated to heat the organic resin, ultimately causing the capsule wall of the microcapsule 213 to melt and rupture, releasing the repair agent 214.

[0045] like Figure 2 As shown, the hydrophobic film layer 23 has a first hollow area 232 and a second hollow area 233 on its opposite sides, respectively; the conductive mesh layer 22 has a first sensing terminal 221 in the first hollow area 232 and a second sensing terminal 222 in the second hollow area 233; the hydrophobic film layer 23 and the conductive mesh layer 22 have a third hollow area 234 and a fourth hollow area 235 on their opposite sides, respectively; the electrolytically ruptured microcapsule layer 21 has a first heating terminal 211 in the third hollow area 234 and a second heating terminal 212 in the fourth hollow area 235.

[0046] Preferably, the first sensing terminal 221 and the second sensing terminal 222 are arranged opposite to each other along a first direction, and the first heating terminal 211 and the second heating terminal 212 are arranged opposite to each other along a second direction, wherein the first direction is perpendicular to the second direction.

[0047] Example 2

[0048] like Figure 3 and 4As shown, a cover plate device includes a glass substrate 1, a self-healing hydrophobic film layer structure 2 as described in Embodiment 1, a capacitance detection chip 3, and a control chip 4. The self-healing hydrophobic film layer structure 2 is disposed on one side surface of the glass substrate 1, and the electrolytically ruptured microcapsule layer 21 is located on the side close to the glass substrate 1. The two input terminals of the capacitance detection chip 3 are electrically connected to the first sensing terminal 221 and the second sensing terminal 222 of the conductive mesh layer 22, respectively. The output terminal of the capacitance detection chip 3 is electrically connected to the input terminal of the control chip 4, and the two output terminals of the control chip 4 are electrically connected to the first heating terminal 211 and the second heating terminal 212 of the electrolytically ruptured microcapsule layer 21.

[0049] Example 3

[0050] like Figure 5 As shown, a display module includes a display panel 5 and a cover plate device as described in Embodiment 2, wherein the glass substrate 1 of the cover plate device is disposed on the display side of the display panel 5.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model and not to limit them. Although the present utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of the present utility model, and these modifications or equivalent substitutions cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the present utility model.

Claims

1. A self-healing hydrophobic film structure, characterized in that, include: Electrolytically ruptured microcapsule layer; A conductive mesh layer is disposed on one side surface of the electrolytically fractured microcapsule layer; A hydrophobic film layer is disposed on the surface of the conductive mesh layer away from the conductive mesh layer.

2. The self-healing hydrophobic film structure according to claim 1, characterized in that, The hydrophobic film layer is made of fluorine-containing organic compounds or silicon-containing organic compounds, and its thickness is 500-800 nm.

3. The self-healing hydrophobic film structure according to claim 1, characterized in that, The conductive mesh layer is made of ITO mesh, metal mesh or carbon nanotube network, and its thickness is 50-80nm.

4. The self-healing hydrophobic film structure according to claim 1, characterized in that, The electrolytically ruptured microcapsule layer is made of conductive polymer / organic resin composite microcapsules with a thickness of 5-8 μm.

5. The self-healing hydrophobic film structure according to any one of claims 1-4, characterized in that, The thickness ratio of the electrolytically fractured microcapsule layer, the conductive mesh layer, and the hydrophobic film layer is 1:0.1:

10.

6. The self-healing hydrophobic film structure according to claim 1, characterized in that, The hydrophobic film layer contains a vertically arranged array of silicon dioxide nanowires.

7. The self-healing hydrophobic film structure according to claim 1, characterized in that, The hydrophobic film layer has a first hollow area and a second hollow area on its opposite sides, respectively; the conductive mesh layer has a first sensing terminal in the first hollow area and a second sensing terminal in the second hollow area; the hydrophobic film layer and the conductive mesh layer have a third hollow area and a fourth hollow area on their opposite sides, respectively; the electrolytically ruptured microcapsule layer has a first heating terminal in the third hollow area and a second heating terminal in the fourth hollow area.

8. A cover plate device, characterized in that, The invention includes a glass substrate and the self-healing hydrophobic film structure as described in any one of claims 1-7, wherein the self-healing hydrophobic film structure is disposed on one side surface of the glass substrate, and the electrolytically ruptured microcapsule layer is located on the side close to the glass substrate.

9. The cover plate device according to claim 8, characterized in that, The cover plate device further includes a capacitance detection chip and a control chip. The two input terminals of the capacitance detection chip are electrically connected to the first sensing terminal and the second sensing terminal of the conductive mesh layer, respectively. The output terminal of the capacitance detection chip is electrically connected to the input terminal of the control chip. The two output terminals of the control chip are electrically connected to the first heating terminal and the second heating terminal of the electrolytically ruptured microcapsule layer.

10. A display module, characterized in that, The device includes a display panel and a cover plate device as described in claim 8 or 9, wherein the glass substrate of the cover plate device is disposed on the display side of the display panel.

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