Backlight module and display device

Abstract

The utility model discloses an embodiment provides a kind of backlight unit and display device, wherein, backlight unit includes backplate, lamp strip and light guide plate;The side of backplate is equipped with recess;Light guide plate is arranged in recess, and is fixedly connected with the bottom wall of recess;Lamp strip is arranged between the side wall of recess and light guide plate, and extends along side wall, and is fixedly connected with side wall;Side wall includes multiple side wall corners, wherein, the side wall corner of lamp strip is outwardly recessed to form avoidance slot;Lamp strip is bent at avoidance slot, and forms lamp strip bending part;At least one light guide plate corner of light guide plate is outwardly protruding, and forms boss;Boss is correspondingly arranged with avoidance slot, boss corner of boss close to lamp strip bending part is equipped with boss chamfer;The size of boss chamfer is greater than the bending radius of lamp strip bending part, reduces the risk of lamp strip tearing.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a backlight module and display device. Background Technology

[0002] Automotive backlight modules are trending towards larger screens and narrower bezels. The backlight module includes a light guide plate and LED strips around the light guide plate. The heat generated during the operation of the backlight module, along with ambient heat, will place the light guide plate in a high-temperature environment. The light guide plate will expand at high temperatures, and this expansion will impact the bends of the LED strips, posing a risk of tearing the LED strips in the backlight module. Utility Model Content

[0003] The purpose of this utility model embodiment is to provide a backlight module and display device to reduce the risk of LED strip tearing. The specific technical solution is as follows:

[0004] This application provides a backlight module comprising: a back plate, an LED strip, and a light guide plate; a groove is provided on one side of the back plate; the light guide plate is disposed in the groove and fixedly connected to the bottom wall of the groove; the LED strip is disposed between the side wall of the groove and the light guide plate, extends along the side wall, and is fixedly connected to the side wall; the side wall includes multiple side wall corners, wherein the side wall corner where the LED strip is disposed is recessed outward to form a relief groove; the LED strip is bent at the relief groove to form a LED strip bend; at least one light guide plate corner of the light guide plate protrudes outward to form a boss; the boss is correspondingly disposed to the relief groove, and the boss corner near the LED strip bend is provided with a boss chamfer; the size of the boss chamfer is larger than the bending radius of the LED strip bend.

[0005] In some embodiments of this application, the sidewall of the clearance groove is an arc-shaped sidewall with a radius greater than or equal to 1.5 mm.

[0006] In some embodiments of this application, the radius of the bent portion of the light strip is 0.5-1.0 mm.

[0007] In some embodiments of this application, the chamfer of the boss of the light guide plate is a right angle;

[0008] The two ends of the right angle are respectively provided with a rounded corner to make the right angle smoothly transition to the side of the boss.

[0009] In some embodiments of this application, the numerical range of the difference 'a' between the size of the chamfer and the bending radius of the light strip bend is: 0. <a<0.5mm;

[0010] The fillet radius is 0.5-1mm.

[0011] In some embodiments of this application, the light strip is adhered to the sidewall of the groove by a first thermally conductive adhesive, the first thermally conductive adhesive extending into the clearance groove;

[0012] And / or, the light guide plate is attached to the bottom wall of the groove using a second thermally conductive adhesive.

[0013] In some embodiments of this application, the backlight module further includes: a reinforcing plate;

[0014] The reinforcing plate is located between the light strip and the boss, and is fixedly connected to the light strip.

[0015] In some embodiments of this application, a first connecting portion is provided on the side of the back plate away from the light guide plate;

[0016] The back plate has a through hole at a position corresponding to the first connecting part; the through hole is located at the edge of the groove and penetrates part of the bottom wall and side wall of the groove;

[0017] The light strip extends along the sidewall of the groove and passes above the through hole; the side of the light strip away from the light guide plate is spaced apart from the outer sidewall of the through hole.

[0018] The backlight module further includes: a heat dissipation component; the heat dissipation component is disposed between the back plate and the light guide plate, and above the through hole; one end of the heat dissipation component is connected to the side of the light strip away from the light guide plate, and the other end is connected to the bottom wall of the groove.

[0019] In some embodiments of this application, the heat dissipation component includes: a sheet metal part, a third thermally conductive adhesive, and a fourth thermally conductive adhesive;

[0020] The sheet metal part includes a side plate and a bottom plate connected together; the bottom plate of the sheet metal part is connected to the bottom wall of the groove through the third thermally conductive adhesive; the side plate of the sheet metal part extends from the bottom plate away from the bottom plate to between the outer wall of the light strip and the through hole, and is connected to the side of the light strip away from the light guide plate through the fourth thermally conductive adhesive.

[0021] In some embodiments of this application, a portion of the bottom wall of the groove is recessed downwards, and a portion of the side wall is recessed outwards to form a receiving groove;

[0022] The through-hole portion is located within the receiving groove;

[0023] The heat dissipation component is disposed in the receiving groove; the bottom plate of the sheet metal part is disposed below the bottom wall of the groove, or the bottom plate is disposed flush with the bottom wall of the groove; the side plate near the light strip is disposed flush with the side wall of the groove.

[0024] In some embodiments of this application, the distance between the base plate and the side wall of the receiving groove in the length direction of the base plate of the sheet metal part is 0-0.15mm;

[0025] The distance between the bottom plate of the sheet metal part away from the side plate and the side wall of the receiving groove is 0-0.15mm.

[0026] The distance between the side plate of the sheet metal part and the outer wall of the receiving groove is 0.05-0.1mm;

[0027] The minimum distance between the base plate of the heat dissipation component and the bottom wall of the groove is 0-0.2mm.

[0028] In some embodiments of this application, the sheet metal part is made of aluminum alloy;

[0029] And / or, the numerical range of the difference b between the depth of the receiving groove and the thickness of the sheet metal part is: 0 <b≤0.2mm。

[0030] In some embodiments of this application, the light strip has a connecting portion that is connected to the circuit board of the backlight module;

[0031] A silicone strip is provided between the light guide plate and the side wall of the groove. One side of the silicone strip is used to abut against the side wall of the light guide plate, and the other side is connected to the side wall of the groove. In the extension direction of the light strip, the connection part between the silicone strip and the light strip is spaced apart.

[0032] This application also proposes a display device including the backlight module described in any of the above embodiments.

[0033] Beneficial effects:

[0034] The backlight module of this application embodiment includes a back plate, a light strip, and a light guide plate; a groove is provided on one side of the back plate; the light guide plate is disposed in the groove and fixedly connected to the bottom wall of the groove; the light strip is disposed between the side wall of the groove and the light guide plate, extends along the side wall, and is fixedly connected to the side wall; the side wall includes multiple side wall corners, wherein the side wall corner where the light strip is disposed is recessed outward to form a relief groove; the light strip bends at the relief groove to form a light strip bend; at least one light guide plate corner of the light guide plate protrudes outward to form a boss; the boss is correspondingly disposed with the relief groove, and the boss corner near the light strip bend is provided with a boss chamfer; the size of the boss chamfer is larger than the bending radius of the light strip bend; the backlight module of this application embodiment has a groove at the corner of the groove of the back plate. An avoidance groove is provided, where the LED strip bends to form a bent section. The avoidance groove increases the size of the side wall corner, providing more space for the LED strip to bend, allowing it to bend with a smaller bending radius. Furthermore, a chamfer is provided at the corner of the boss near the bent section, with the chamfer larger than the bending radius of the bent section. This increases the distance between the bent section and the boss on the light guide plate, thus increasing the expansion space of the light guide plate. Even when the light guide plate is at its expansion limit, if the LED strip contacts part of the side wall of the light guide plate, the chamfer will not contact the bent section, reducing the risk of the light guide plate directly impacting the bent section and causing breakage during high-temperature expansion.

[0035] The display device of this application embodiment includes the backlight module of any of the above embodiments. A relief groove is provided at the corner of the groove in the back plate. The LED strip is bent at the relief groove to form a bent portion of the LED strip. The relief groove increases the size of the side wall corner, providing a larger space for the bending of the LED strip, so that the LED strip can be bent with a smaller bending radius to form the bent portion of the LED strip. Furthermore, a boss chamfer is provided at the corner of the boss near the bent portion of the LED strip. The size of the boss chamfer is larger than the bending radius of the bent portion of the LED strip, increasing the distance between the bent portion of the LED strip and the boss of the light guide plate. This increases the expansion space of the light guide plate, so that even when the light guide plate is in the expansion limit state, even if the LED strip contacts part of the side wall of the light guide plate, the boss chamfer will not contact the bent portion of the LED strip. This reduces the risk of the light guide plate expanding directly and hitting the bent portion of the LED strip at high temperature, causing the LED strip to tear. This improves the working stability of the display device and extends the service life of the display device.

[0036] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0038] Figure 1 This is a schematic diagram of the backlight module according to the first embodiment of this application;

[0039] Figure 2 for Figure 1 A magnified view of point A of the backlight module shown;

[0040] Figure 3 for Figure 2 Another structural diagram;

[0041] Figure 4 for Figure 3 The diagram shown is a backlight module without the light guide plate.

[0042] Figure 5 This is a schematic diagram of the backlight module of the first embodiment of this application when the light guide plate is in the expansion limit state;

[0043] Figure 6 for Figure 1 A magnified view of section B of the backlight module shown;

[0044] Figure 7 This is a diagram showing the connection relationship between the light guide plate and the optical film material of the backlight module in the first embodiment of this application;

[0045] Figure 8 for Figure 1 Enlarged view of point C of the backlight module shown;

[0046] Figure 9 for Figure 8 A schematic diagram after removing the light guide plate;

[0047] Figure 10 for Figure 1 A magnified view of point D of the backlight module shown;

[0048] Figure 11 This is a top view of the backlight module according to the second embodiment of this application;

[0049] Figure 12 This is a bottom view of the backlight module according to the second embodiment of this application;

[0050] Figure 13 for Figure 12 Enlarged view of point E;

[0051] Figure 14 This is a schematic diagram of the first connecting portion and the second connecting portion of the backlight module according to the second embodiment of this application;

[0052] Figure 15 for Figure 11 Enlarged view at point F (light guide plate not shown);

[0053] Figure 16 for Figure 15 A schematic diagram after removing the heat dissipation components;

[0054] Figure 17 for Figure 15 A magnified view of a portion of the image;

[0055] Figure 18 This is a schematic diagram showing the connection relationship between the heat dissipation components, the backplate, and the LED strip.

[0056] Figure 19 for Figure 18 A schematic diagram of its breakdown.

[0057] Explanation of reference numerals in the attached figures:

[0058] Back plate 100; Groove 110; Bottom wall 111; Side wall 112; Side wall corner 1121; Clearance groove 113; Arc-shaped side wall 1131; Limiting groove 114; First connecting part 120; Buckle 121; Through hole 130; Outer side wall 131; First reinforcing rib 140; Positioning hole 150; Receiving groove 160; Outer side wall of receiving groove 161; Back plate boss 170; Second connecting part 180; Connecting hole 181; Second reinforcing rib 182; Opening 190;

[0059] LED strip 200; LED strip bending section 210; Flexible circuit board 220; LED chip 230; Connector 240;

[0060] Light guide plate 300; boss 310; boss chamfer 311; right angle chamfer 3111; rounded corner 312; light guide plate body 320; limiting post 330;

[0061] First thermally conductive adhesive 400; optical film material 500; reinforcing plate 700;

[0062] Heat dissipation component 800; sheet metal part 810; side plate 811; base plate 812; third thermal conductive adhesive 820; fourth thermal conductive adhesive 830;

[0063] Silicone strip 900; silicone strip corner 910; first side 920; protrusion 921; second side 930. Detailed Implementation

[0064] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art based on this application are within the protection scope of the present utility model.

[0065] Automotive display modules are trending towards larger screens and narrower bezels, including light guide plates and LED strips around the light guide plates. The heat generated during the operation of the backlight module, along with ambient heat, will place the backlight module in a high-temperature environment. The light guide plate will expand at high temperatures, and this expansion will impact the bends of the LED strips, posing a risk of tearing the LED strips.

[0066] For example, for automotive narrow-bezel die-cast backlight modules, the space on the top, left, and right sides of the backlight module is limited. In particular, for projects where the backlight strip outlet (i.e., the part where the strip connects to the circuit board) is located on the left or right side of the die-cast backplate, the corner radius of the die-cast backplate is greater than or equal to 1.5mm and the backlight strip occupies part of the space. This can cause the light guide plate boss to expand at high temperatures and impact the turning point of the strip, posing a risk of the strip tearing.

[0067] To reduce the risk of the light strip tearing due to the light guide plate expanding and directly impacting the bend in the LED strip at high temperatures, this application provides a backlight module and display device. Optimized backplate corners, light guide plate boss corners, and reduced LED strip bending radius are employed to lower the risk of LED strip tearing. This is described in detail below:

[0068] like Figures 1 to 4 As shown, Figure 1 This is a schematic diagram of the backlight module according to the first embodiment of this application; Figure 2 for Figure 1 A magnified view of point A of the backlight module shown; Figure 3 for Figure 2 Another structural diagram; Figure 4 for Figure 3The diagram shows a backlight module without the light guide plate 300. This application provides a backlight module including a backplate 100, a light bar 200, and a light guide plate 300. A groove 110 is provided on one side of the backplate 100. The light guide plate 300 is disposed within the groove 110 and fixedly connected to the bottom wall 111 of the groove 110. The light bar 200 is disposed between the side wall 112 of the groove 110 and the light guide plate 300, extends along the side wall 112, and is fixedly connected to the side wall 112. The light guide plate includes multiple side wall corners 1121, wherein the side wall corner 1121 with the light strip 200 is recessed outward to form a relief groove 113; the light strip 200 bends at the relief groove 113 to form a light strip bending portion 210; at least one light guide plate corner of the light guide plate 300 protrudes outward to form a boss 310; the boss 310 is correspondingly provided with the relief groove 113, and the boss corner of the boss 310 near the light strip bending portion 210 is provided with a boss chamfer 311; the size of the boss chamfer 311 is larger than the bending radius of the light strip bending portion 210.

[0069] In the backlight module of this embodiment, a clearance groove 113 is provided at the corner of the groove 110 of the back plate 100. The LED strip 200 is bent at the clearance groove 113 to form a bent portion 210. The clearance groove 113 increases the size of the corner of the side wall 112, providing a larger space for the bending of the LED strip 200, allowing the LED strip 200 to be bent with a smaller bending radius to form the bent portion 210. Furthermore, a chamfer 311 is provided near the corner of the boss 310 of the bent portion 210. The size of the chamfer 311 is larger than the bending radius of the bent portion 210, increasing the distance between the bent portion 210 and the boss 310 of the light guide plate 300, thereby increasing the expansion space of the light guide plate 300. Figure 5 As shown, Figure 5 This is a schematic diagram of the backlight module light guide plate 300 in the first embodiment of this application when it is in the expansion limit state. When the light guide plate 300 is in the expansion limit state, even if the light strip 200 contacts part of the side wall of the light guide plate 300, the chamfer 311 of the boss will not contact the bending part 210 of the light strip. This reduces the risk of the light guide plate 300 expanding and directly hitting the bending part of the light strip when it is in the high temperature, causing the light strip to tear.

[0070] Specifically, in order to make the assembly of the light strip 200 and the back panel side wall 112 more convenient, the back panel side wall 112 can be machined by CNC machine tool. Considering the feasibility and economy of CNC machine tool machining, a cutting tool with a radius greater than or equal to 1.5mm can be selected.

[0071] like Figure 4As shown, the light strip 200 can be an FPC (Flexible Printed Circuit) light strip. Specifically, an FPC light strip refers to a light strip that uses a flexible printed circuit board 220 (FPC) as a carrier and mounts LED beads 230 on the flexible printed circuit board 220. In this embodiment, the risk of FPC tearing is reduced by optimizing the back plate corners, the light guide plate boss corners, and reducing the bending radius of the light strip. The LED beads 230 are mounted on the side of the flexible printed circuit board 220 away from the recessed sidewall 112, and no LED beads 230 are installed at the sidewall corner 1121.

[0072] The backlight module of this application embodiment can be a novel medium-to-large-sized narrow-bezel automotive die-cast backlight module. The die-cast backlight module refers to a backlight module where the backplate 100 is a die-cast part. An anti-collision design is implemented for the FPC LED strip; specifically, a clearance groove 113 is provided at the side wall corner 1121 of the die-cast backplate. The FPC LED strip bends at the clearance groove 113, forming a bend 210. The bend 210 is close to a right angle and has a chamfered boss 311. Optimizing the chamfered boss 311 of the light guide plate 300 and the side wall corner 1121 of the die-cast backplate reduces the radius of the bend 210 while increasing the expansion space on the left and right sides of the light guide plate 300. This prevents the light guide plate 300 from directly impacting the bend 210 during high-temperature expansion, thus avoiding the risk of FPC tearing.

[0073] In some embodiments, the clearance groove 113 may be provided only at the side wall corner 1121 where the light strip 200 is located, to increase the distance between the bend 210 of the light strip and the boss 310. In other embodiments, since different backlight modules cover different positions of the side wall corner 1121, such as... Figure 6 As shown, Figure 6 for Figure 1 The enlarged view of section B of the backlight module shown can also show that a clearance groove 113 can be provided at the corner 1121 of the side wall where the light strip 200 is not provided, so that different backlight modules can share the same back plate 100.

[0074] In some embodiments, such as Figure 5 As shown, the sidewall of the clearance groove 113 is an arc-shaped sidewall 1131, and the radius of the arc-shaped sidewall 1131 is greater than or equal to 1.5mm. By setting the values ​​within the above range, the distance between the bend of the light strip 210 and the boss 310 can be effectively increased.

[0075] The radius of the arc-shaped side wall 1131 is generally determined by the radius of the cutting tool of the numerical control machine tool and the processing method. If the tool radius is too small, the tool is prone to breakage, resulting in a shortened tool life, so it is not suitable for use in mass production. In this embodiment, a numerical control machine tool cutting tool with a radius greater than or equal to 1.5 mm can be selected to process an arc-shaped side wall 1131 with a radius greater than or equal to 1.5 mm, thereby improving the service life of the tool and preventing the production efficiency from being reduced due to the need to frequently replace the tool during mass production.

[0076] In some embodiments, the radius of the light strip bending portion 210 is 0.5 - 1.0 mm. The light strip 200 is assembled at the avoidance groove 113 such that the radius of the light strip bending portion 210 is 0.5 - 1.0 mm. The radius of the light strip bending portion 210 is relatively small and close to a right angle. Compared with the related art, the distance between the boss 310 of the light guide plate 300 and the light strip bending portion 210 can be further increased, thereby increasing the expansion space of the boss 310 of the light guide plate 300 and preventing the light guide plate 300 from expanding and directly hitting the turning point of the light strip at high temperature, thus avoiding the risk of tearing the light strip 200.

[0077] In some embodiments, as Figure 5 shown, the boss chamfer 311 of the light guide plate 300 is a chamfer 3111; two fillets 312 are respectively provided at both ends of the chamfer 3111 to make the chamfer 3111 smoothly transition with the side surface of the boss 310.

[0078] The boss chamfer 311 of the light guide plate 300 is a chamfer 3111. Compared with a fillet, the distance between the light strip bending portion 210 and the boss 310 can be further increased, thereby increasing the left and right expansion spaces of the light guide plate 300.

[0079] In some embodiments, the numerical range of the difference a between the size of the chamfer 3111 and the bending radius of the light strip bending portion 210 is: 0 < a < 0.5 mm; the size of the fillet 312 is 0.5 - 1 mm.

[0080] The size of the chamfer 3111 of the boss 310 is greater than the bending radius of the light strip bending portion 210, and the numerical range of the difference a between the size of the chamfer 3111 and the bending radius of the light strip bending portion 210 is: 0 < a < 0.5 mm. With such a setting, the distance between the light strip bending portion 210 and the boss of the light guide plate 310 is increased, thereby increasing the expansion space of the light guide plate 300. When the light guide plate 300 is in the expansion limit state, even if the light strip 200 contacts a part of the side wall of the light guide plate 300, the boss chamfer 3111 still will not contact the light strip bending portion 210, thereby reducing the risk of tearing the light strip 200 caused by the light guide plate 300 directly hitting the light strip bending portion 210 in the expansion limit state at high temperature.

[0081] In some embodiments, as Figure 5 As shown, the light strip 200 is attached to the side wall 112 of the groove 110 by the first thermally conductive adhesive 400, which extends into the relief groove 113; and / or, the light guide plate 300 is attached to the bottom wall 111 of the groove 110 by the second thermally conductive adhesive (not shown in the figure).

[0082] The light strip 200 is attached to the side wall 112 of the groove 110 by the first thermally conductive adhesive 400, thereby fixing the light strip 200 to the back plate 100; and the light strip 200 generates heat when it emits light, and the heat generated can be transferred to the side wall 112 of the groove of the back plate through the first thermally conductive adhesive 400, thereby dissipating the heat generated by the light strip 200.

[0083] The first thermally conductive adhesive 400 extends into the relief groove 113, isolating the light strip 200 from the arc-shaped sidewall 1131 of the relief groove 113, thereby preventing any burrs on the arc-shaped sidewall 1131 of the relief groove 113 from damaging the light strip 200. Specifically, the first thermally conductive adhesive 400 extends into the relief groove 113 but does not contact the arc-shaped sidewall 1131 of the relief groove 113.

[0084] The light guide plate 300 is attached to the bottom wall of the groove 110 by the second thermally conductive adhesive, thereby fixing the light guide plate 300 to the back plate 100.

[0085] In some embodiments, such as Figure 7 As shown, Figure 7 This diagram illustrates the connection relationship between the light guide plate 300 and the optical film 500 in the backlight module of the first embodiment of this application. The top of the light guide plate 300 is covered with the optical film 500, which optimizes light distribution and improves display performance. Specifically, the light guide plate 300 and the optical film 500 can be fixed together using double-sided adhesive. As mentioned earlier, by providing an avoidance groove 113 at the side wall corner 1121, the radius of the LED strip bend 210 is made smaller, close to a right angle. This reduces the radius of the LED strip bend 210 while increasing the expansion space on the left and right sides of the light guide plate 300. At high temperatures, the light guide plate 300 will not directly impact the LED strip bend 210 under its expansion limit. Therefore, the light guide plate 300 will not be compressed and deformed due to impact with the LED strip bend 210. As a result, the optical film 500 on the light guide plate 300 will not wrinkle, reducing the risk of wrinkling of the optical film 500 during reliability testing.

[0086] like Figure 5 and Figure 7 As shown, the light guide plate 300 includes a light guide plate body 320, a boss 310 is provided at the corner of the light guide plate body 320 near the side wall corner 1121, and a limiting post 330 is provided on the side of the light guide plate body 320 away from the back plate 100. The limiting post 330 can limit the optical film material 500.

[0087] In some embodiments, such as Figure 3 As shown, the backlight module also includes a reinforcing plate 700; the reinforcing plate 700 is located between the light strip 200 and the boss 310, and is fixedly connected to the light strip 200. The reinforcing plate 700 can prevent the boss 310 from directly colliding with the light strip 200 when it expands, thus preventing damage to the light strip 200. The reinforcing plate 700 can also protect the wiring on the light strip 200. Specifically, the reinforcing plate 700 can be attached to the light strip 200.

[0088] In some embodiments, such as Figure 1 , Figures 8 to 10 As shown, Figure 8 for Figure 1 Enlarged view of point C of the backlight module shown; Figure 9 for Figure 8 A schematic diagram after removing the light guide plate 300; Figure 10 for Figure 1 The enlarged view of section D of the backlight module shows that the LED strip 200 has a connecting portion 240, which is connected to the circuit board (not shown) of the backlight module. A silicone strip 900 is provided between the light guide plate 300 and the side wall 112 of the groove 110. One side of the silicone strip 900 abuts against the side wall of the light guide plate 300, and the other side is connected to the side wall 112 of the groove 110. The silicone strip 900 and the connecting portion 240 of the LED strip 200 are spaced apart along the extension direction of the LED strip 200. The connecting portion 240 of the LED strip 200 is connected to the circuit board of the backlight module to control whether the LED strip 200 emits light. The silicone strip 900 can also serve as an auxiliary limiter to ensure that the light guide plate 300 is centrally assembled in the groove 110. It should be noted that the silicone strip 900 and the connecting portion 240 of the light strip 200 are spaced apart in the extending direction of the light strip 200 to avoid interference between the silicone strip 900 and the connecting portion 240 of the light strip 200. If the silicone strip 900 and the connecting portion 240 of the light strip 200 overlap, it will cause the connecting portion 240 of the light strip 200 to tear. Therefore, the silicone strip 900 needs to avoid the connecting portion 240 of the light strip 200.

[0089] Specifically, the light strip 200 extends horizontally from the side wall 112 to the center of the bottom wall 111 of the groove 110 to form the connecting portion 240 of the light strip 200. An opening 190 is provided in the bottom wall 111 of the groove of the back plate 100. The connecting portion 240 of the light strip 200 extends through the opening 190 to the side of the back plate 100 away from the light guide plate 300 and is connected to the circuit board of the backlight module.

[0090] In some embodiments, such as Figure 1 and Figure 10As shown, the silicone strip 900 is L-shaped like the Great Wall, with the corner 910 being an arc-shaped corner that matches the shape of the side wall corner 1121 of the groove 110. The silicone strip 900 is located at the side wall corner 1121 where the light strip 200 is not located. Specifically, there are two silicone strips 900, which can be respectively located at the side wall corners 1121 of the side wall 112 of the groove 110 on the side of the back plate 100 away from the reinforcing plate 700. The first side 920 of the silicone strip 900 has multiple protrusions 921 of equal size and regularly arranged, while the second side 930 has a smooth structure, making the silicone strip 900 resemble the Great Wall. The first side 920 abuts against the side wall of the light guide plate 300, and the second side 930 connects to the side wall 112 of the groove 110, so that the light guide plate 300 is centrally located in the groove 110 of the back plate 100. Among them, the silicone strip 900 is in direct contact with the light guide plate 300 without compression. The silicone strip 900 is designed in the shape of the Great Wall to prevent the light guide plate 300 from expanding at high temperature and squeezing the silicone strip 900 too much, causing the silicone strip 900 to push up the light guide plate 300.

[0091] In some embodiments, the back plate 100 is provided with a side wall corner 1121 of the silicone strip 900 recessed outward to form a limiting groove 114, and the silicone strip 900 is disposed in the limiting groove 114 to limit the silicone strip 900.

[0092] In related technologies, taking automotive die-cast backlight modules as an example, car manufacturers and Tier 1 (first-tier suppliers) generally need to integrate the brackets, clips, and screw posts used to fix the backlight module to the vehicle onto the backplate. This makes the structure and process of the die-cast backplate increasingly complex. To ensure product dimensional stability and mold life, and to improve production efficiency, it is not recommended to use a mold side-pull method for the clips of the die-cast backplate. Therefore, the clip forming process of the die-cast backplate needs to use conventional top and bottom demolding. Due to the limitations of this demolding process, through holes are formed on the die-cast backplate corresponding to the clip positions. The groove sidewall 112 of the die-cast backplate for local heat dissipation on the back of the LED strip 200 is completely hollowed out. This results in a lack of heat dissipation metal parts in some areas of the LED strip 200. Conventional heat dissipation solutions can no longer meet the requirements of high-performance and high-reliability testing. Therefore, how to meet the requirements of high-performance and high-reliability testing is a technical challenge that automotive displays need to solve.

[0093] This embodiment proposes a heat dissipation solution that involves locally adding heat dissipation components. This increases the heat dissipation area and improves heat dissipation efficiency, preventing the LED strip from failing due to excessively high PN junction temperatures caused by insufficient heat dissipation during operation or reliability testing. The specific solution is as follows:

[0094] like Figures 11 to 16 As shown, Figure 11 This is a top view of the backlight module according to the second embodiment of this application. Figure 12This is a bottom view of the backlight module according to the second embodiment of this application. Figure 13 for Figure 12 Enlarged view at point E, Figure 14 This is a schematic diagram of the first connecting portion 120 and the second connecting portion 180 of the backlight module according to the second embodiment of this application. Figure 15 for Figure 11 Enlarged view at point F (light guide plate 300 not shown), Figure 16 for Figure 15 The schematic diagram after removing the heat dissipation component 800 shows that, in this embodiment, the back plate 100 has a first connecting portion 120 on the side away from the light guide plate 300; the back plate 100 has a through hole 130 at a position corresponding to the first connecting portion 120; the through hole 130 is located at the edge of the groove 110 and penetrates part of the bottom wall 111 and side wall 112 of the groove 110; the light strip 200 extends along the side wall 112 of the groove 110 and passes above the through hole 130; the side of the light strip 200 away from the light guide plate 300 is spaced apart from the outer side wall 131 of the through hole 130; the backlight module also includes a heat dissipation component 800; the heat dissipation component 800 is disposed between the back plate 100 and the light guide plate 300 and above the through hole 130; one end of the heat dissipation component 800 is connected to the side of the light strip 200 away from the light guide plate 300, and the other end is connected to the bottom wall 111 of the groove 110.

[0095] Since the light strip 200 extends along the side wall 112 of the groove 110 and passes above the through hole 130, and the side of the light strip 200 away from the light guide plate 300 is spaced apart from the outer side wall 131 of the through hole 130, the light strip 200 above the through hole 130 cannot directly transfer heat to the outside through the back plate 100. In this embodiment, a heat dissipation component 800 is provided between the back plate 100 and the light guide plate 300. The heat dissipation component 800 is positioned above the through hole 130. One end of the heat dissipation component 800 is connected to the side of the light strip 200 away from the light guide plate 300, and the other end is connected to the bottom wall 111 of the groove 110. In this way, the heat generated by the light strip 200 can be transferred to the groove 110 of the back plate 100 through the heat dissipation component 800, and the light strip 200 above the through hole 130 can be dissipated through the groove 110.

[0096] In some embodiments, such as Figures 17 to 19 As shown, Figure 17 for Figure 15 A partially enlarged schematic diagram, Figure 18 This diagram illustrates the connection relationship between the heat dissipation component 800, the backplate 100, and the LED strip 200. Figure 19 for Figure 18The exploded view shows that the heat dissipation component 800 includes a sheet metal part 810, a third thermally conductive adhesive 820, and a fourth thermally conductive adhesive 830. The sheet metal part 810 includes a side plate 811 and a bottom plate 812 connected together. The bottom plate 812 of the sheet metal part 810 is connected to the bottom wall 111 of the groove 110 through the third thermally conductive adhesive 820. The side plate 811 of the sheet metal part 810 extends from the bottom plate 812 in a direction away from the bottom plate 812 to between the outer side wall 131 of the light strip 200 and the through hole 130, and is connected to the side of the light strip 200 away from the light guide plate 300 through the fourth thermally conductive adhesive 830.

[0097] This results in the following heat dissipation path: the heat generated by the LED strip 200 above the through hole 130 is transferred to the side plate 811 of the sheet metal part 810 through the fourth thermal conductive adhesive 830, then transferred from the side plate 811 of the sheet metal part 810 to the bottom plate 812 of the sheet metal part 810, and then transferred from the bottom plate 812 of the sheet metal part 810 to the bottom wall 111 of the groove 110 of the back plate 100 through the third thermal conductive adhesive 820, and then transferred to the outside through the back plate 100. The contact area between the bottom plate 812 of the sheet metal part 810 and the bottom wall 111 of the groove 110 is large, which can better dissipate heat.

[0098] Compared to related technologies where the LED strip directly uses side heat dissipation, the backlight module in this embodiment is equipped with a heat dissipation component 800. Heat dissipation is achieved through the heat dissipation component 800, increasing the heat dissipation area of ​​the thermally conductive adhesive and improving heat dissipation efficiency. Simultaneously, the through-hole 130 of the backplate 100 is partially covered by the sheet metal part 810, preventing foreign objects from entering the backlight module through the through-hole 130 and improving the dustproof level of the backlight module.

[0099] By adding sheet metal parts and thermally conductive adhesive to localized areas, the heat dissipation area is increased and the heat dissipation efficiency is improved. This avoids the risk of the LED strip PN junction temperature becoming too high due to insufficient heat dissipation during operation or reliability testing, which could cause the LED strip to malfunction.

[0100] In some embodiments, the materials of the first thermally conductive adhesive 400, the second thermally conductive adhesive, the third thermally conductive adhesive 820, and the fourth thermally conductive adhesive 830 all include ceramic, acrylic, and silicone-filled plastic, so that the thermally conductive adhesives can conduct heat.

[0101] The thickness of the first thermally conductive adhesive 400, the second thermally conductive adhesive, the third thermally conductive adhesive 820, and the fourth thermally conductive adhesive 830 is 0.2mm to improve the thermal conductivity of the thermally conductive adhesive.

[0102] In some embodiments, such as Figure 18 and Figure 19As shown, part of the bottom wall 111 of the groove 110 is recessed downwards, and part of the side wall 112 is recessed outwards to form a receiving groove 160; part of the through hole 130 is located in the receiving groove 160; the heat dissipation component 800 is disposed in the receiving groove 160; the bottom plate 812 of the sheet metal part 810 is set lower than the bottom wall 111 of the groove 110, or the bottom plate 812 is flush with the bottom wall 111 of the groove 110; the side plate 811 near the light strip 200 is flush with the side wall 112 of the groove 110.

[0103] In this embodiment, the heat dissipation component 800 is placed inside the receiving groove 160, so that the bottom plate 812 of the heat dissipation component 800 is lower than the bottom wall 111 of the groove 110, or the bottom plate 812 is flush with the bottom wall 111 of the groove 110. This can prevent the light guide plate 300 from being pushed up by the bottom plate 812 of the heat dissipation component 800 when it covers the bottom plate 812, thus preventing the light guide plate 300 from becoming uneven. This embodiment can make the light refracted by the light guide plate 300 evenly distributed, thereby improving the display effect of the display panel.

[0104] Specifically, the first thermally conductive adhesive 400 is evenly adhered to the side of the light strip 200 away from the light guide plate 300, so that the first thermally conductive adhesive 400 located between the light strip 200 and the side plate 811 of the sheet metal part 810 can be used as the fourth thermally conductive adhesive 830. At this time, the side of the side plate 811 near the light strip 200 is flush with the side wall 112 of the groove 110, so that the light strip 200 smoothly transitions from the side wall 112 of the groove 110 to the side plate 811, without bulging towards the light guide plate 300 or sinking away from the light guide plate 300. This helps to ensure the flatness of the light strip 200 and prevent circuit failures caused by deformation of the light strip 200.

[0105] In this embodiment, it is only necessary to evenly attach the first thermally conductive adhesive 400 to the side of the light strip 200 away from the light guide plate 300, without having to separately set the fourth thermally conductive adhesive 830 between the side plate 811 and the light strip 200. This method is more efficient in production.

[0106] In some other embodiments of this application, a fourth thermally conductive adhesive 830 can also be provided separately. That is, the first thermally conductive adhesive 400 may not be provided between the light strip 200 and the side plate 811 of the sheet metal part 810. In the thickness direction of the side plate 811, the side of the side plate 811 near the light strip 200 may be set lower than the side wall 112 of the groove 110. The fourth thermally conductive adhesive 830 is provided between the light strip 200 and the side plate 811 to connect the side plate 811 and the light strip 200. At this time, the thickness of the fourth thermally conductive adhesive 830 is greater than the thickness of the first thermally conductive adhesive 400 to ensure the flatness of the light strip 200. The greater thickness of the thermally conductive adhesive results in better heat conduction.

[0107] In some other embodiments of the present application, the first thermal conductive adhesive 400 may not be provided between the light strip 200 and the side plate 811 of the sheet metal part 810. However, in the thickness direction of the side plate 811, the side of the side plate 811 close to the light strip 200 may be set higher than the side wall 112 of the groove 110. A fourth thermal conductive adhesive 830 is provided between the light strip 200 and the side plate 811 to connect the side plate 811 and the light strip 200. At this time, the thickness of the fourth thermal conductive adhesive 830 is less than the thickness of the first thermal conductive adhesive 400 to ensure the flatness of the light strip 200.

[0108] In some embodiments, as Figure 17 shown, in the length direction of the bottom plate 812 of the sheet metal part 810, the distance d1 between the bottom plate 812 and the side wall of the receiving groove 160 is 0 - 0.15 mm; on the side of the bottom plate 812 of the sheet metal part 810 away from the side plate 811, the distance d2 between the bottom plate 812 and the side wall of the receiving groove 160 is 0 - 0.15 mm; the distance d3 between the side plate 811 of the sheet metal part 810 and the outer side wall 161 of the receiving groove is 0.05 - 0.1 mm; the minimum distance between the bottom plate 812 of the heat dissipation component 800 and the bottom wall 111 of the groove 110 is 0 - 0.2 mm. With such settings, the receiving groove 160 reserves sufficient installation space for the sheet metal part 810, enabling the sheet metal part 810 to be more conveniently installed in the receiving groove 160.

[0109] Among them, the minimum distance between the bottom plate 812 of the heat dissipation component 800 and the bottom wall 111 of the groove 110 is 0 - 0.2 mm, which can prevent the light guide plate 300 from being lifted by the bottom plate 812 of the heat dissipation component 800 when the light guide plate 300 covers the bottom plate 812, causing unevenness of the light guide plate 300. This embodiment can make the light refracted by the light guide plate 300 evenly distributed, thereby improving the display effect of the display panel.

[0110] In some embodiments, the material of the sheet metal part 810 is aluminum alloy; and / or, the numerical range of the difference b between the depth of the receiving groove 160 and the thickness of the sheet metal part 810 is: 0 < b ≤ 0.2 mm. The material of the sheet metal part 810 is aluminum alloy, and aluminum alloy has excellent processing performance, good corrosion resistance and thermal conductivity. The numerical range of the difference b between the depth of the receiving groove 160 and the thickness of the sheet metal part 810 is 0 < b ≤ 0.2 mm to reserve space for the setting of the third thermal conductive adhesive 820. Optionally, the thickness of the sheet metal part 810 is set to 1.2 mm, which can better conduct heat. The depth of the receiving groove 160 can be set according to the thickness of the sheet metal part 810. Specifically, it can be set to 1.4 mm. At this time, the difference b between the depth of the receiving groove 16o and the thickness of the sheet metal part 810 is 0.2 mm, reserving sufficient space for the setting of the third thermal conductive adhesive 820 and preventing the heat conduction effect from being不理想 due to insufficient space resulting in an overly thin thickness of the sheet metal part 810.

[0111] Specifically, the sheet metal parts can be made of Al5052 series aluminum alloy, which has good rust prevention and corrosion resistance.

[0112] In some embodiments, the backlight module can be fixedly mounted on a backlight module mounting bracket (not shown) of the vehicle via a first connecting portion 120 and a second connecting portion 180. Specifically, as Figure 11 and Figure 13 As shown, two first connecting portions 120 are provided on the side of the back plate 100 away from the light guide plate 300. Each first connecting portion 120 is an L-shaped buckle 121 extending from the back plate 100 away from the light guide plate 300. The two buckles 121 are symmetrically arranged to ensure a more stable installation of the backlight module on the vehicle's backlight module mounting bracket. Correspondingly, through holes 130 are provided at positions corresponding to the two buckles 121. A heat dissipation component 800 is provided above each through hole 130 to dissipate heat from the corresponding LED strip 200. The two buckles 121 can be integrally formed with the back plate 100.

[0113] The back plate 100 is also provided with multiple first reinforcing ribs 140 on the side near the buckle 121 to enhance the rigidity of the back plate 100; the back plate 100 is also provided with positioning holes 150 on the side near the buckle 121, which can cooperate with the positioning posts on the backlight module mounting bracket of the whole vehicle to position the backlight module.

[0114] In some embodiments, such as Figure 14 and Figure 15 As shown, the first connecting part 120 is located on the side of the second connecting part 180 away from the groove 110. The second connecting part 180 can be a back plate boss 170, which is formed by extending from the back plate 100 to the side away from the light guide plate 300. The through hole 130 passes through the back plate boss 170. The side of the second connecting part 180 away from the groove 110 is provided with two connecting holes 181. The backlight module can be connected to the connecting hole screw of the backlight module mounting bracket on the vehicle through the two connecting holes 181 to further fix the backlight module to the backlight module mounting bracket on the vehicle.

[0115] The second connecting part 180 is provided with multiple second reinforcing ribs 182 on the side away from the buckle 121 to enhance the rigidity of the second connecting part 180.

[0116] This application also provides a display device, including the backlight module in any of the above embodiments.

[0117] The display device of this application embodiment includes the backlight module of any of the above embodiments. An avoidance groove 113 is provided at the corner of the groove 110 of the back plate 100. The LED strip 200 is bent at the avoidance groove 113 to form an LED strip bending portion 210. The avoidance groove 113 increases the size of the corner of the side wall 112, providing a larger space for the bending of the LED strip 200, allowing the LED strip 200 to be bent with a smaller bending radius to form the LED strip bending portion 210. Furthermore, a boss chamfer 311 is provided at the corner of the boss 310 near the LED strip bending portion 210. The size of the boss chamfer 311... The bending radius of the light strip bend 210 is greater than that of the light strip bend 210, which increases the distance between the light strip bend 210 and the boss 310 of the light guide plate 300. This increases the expansion space of the light guide plate 300, so that even when the light guide plate 300 is in its expansion limit state, even if the light strip 200 contacts part of the side wall of the light guide plate 300, the boss chamfer 311 will not contact the light strip bend 210. This reduces the risk of the light guide plate 300 expanding and directly impacting the light strip bend at high temperatures, causing the light strip to tear. This improves the working stability of the display device and extends its service life.

[0118] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are included within the scope of protection of this utility model.

Claims

1. A backlight module, characterized in that, include: Back panel, LED strip, and light guide plate; A groove is provided on one side of the back plate; The light guide plate is disposed in the groove and is fixedly connected to the bottom wall of the groove; The light strip is disposed between the sidewall of the groove and the light guide plate, extends along the sidewall, and is fixedly connected to the sidewall; The sidewall includes multiple sidewall corners, wherein the sidewall corner where the light strip is located is recessed outward to form a clearance groove; The light strip is bent at the clearance groove to form a bent portion of the light strip; At least one corner of the light guide plate protrudes outward to form a boss; the boss is correspondingly provided with the clearance groove, and the corner of the boss near the bend of the light strip is provided with a boss chamfer; the size of the boss chamfer is larger than the bending radius of the bend of the light strip.

2. The backlight module according to claim 1, characterized in that, The sidewall of the clearance groove is an arc-shaped sidewall with a radius greater than or equal to 1.5 mm.

3. The backlight module according to claim 1, characterized in that, The radius of the bent portion of the light strip is 0.5-1.0 mm.

4. The backlight module according to claim 1, characterized in that, The boss of the light guide plate has a right-angled chamfer. The two ends of the right angle are respectively provided with a rounded corner to make the right angle smoothly transition to the side of the boss.

5. The backlight module according to claim 4, characterized in that, The value range of the difference 'a' between the size of the right angle and the bending radius of the bent portion of the light strip is:

0. <a<0.5mm; The fillet radius is 0.5-1mm.

6. The backlight module according to claim 1, characterized in that, The light strip is attached to the side wall of the groove by a first thermally conductive adhesive, which extends into the clearance groove. And / or, the light guide plate is attached to the bottom wall of the groove using a second thermally conductive adhesive.

7. The backlight module according to claim 1, characterized in that, The backlight module also includes: a reinforcing plate; The reinforcing plate is located between the light strip and the boss, and is fixedly connected to the light strip.

8. The backlight module according to claim 1, characterized in that, The back plate has a first connecting part on the side away from the light guide plate; The back plate has a through hole at a position corresponding to the first connecting part; the through hole is located at the edge of the groove and penetrates part of the bottom wall and side wall of the groove; The light strip extends along the sidewall of the groove and passes above the through hole; The side of the light strip away from the light guide plate is spaced apart from the outer wall of the through hole; The backlight module further includes: a heat dissipation component; the heat dissipation component is disposed between the back plate and the light guide plate, and above the through hole; one end of the heat dissipation component is connected to the side of the light strip away from the light guide plate, and the other end is connected to the bottom wall of the groove.

9. The backlight module according to claim 8, characterized in that, The heat dissipation component includes: sheet metal parts, a third thermally conductive adhesive, and a fourth thermally conductive adhesive; The sheet metal part includes a side plate and a bottom plate connected together; the bottom plate of the sheet metal part is connected to the bottom wall of the groove through the third thermally conductive adhesive; the side plate of the sheet metal part extends from the bottom plate away from the bottom plate to between the outer wall of the light strip and the through hole, and is connected to the side of the light strip away from the light guide plate through the fourth thermally conductive adhesive.

10. The backlight module according to claim 9, characterized in that, The bottom wall of the groove is recessed downwards, and the side wall is recessed outwards to form a receiving groove. The through-hole portion is located within the receiving groove; The heat dissipation component is disposed in the receiving groove; the bottom plate of the sheet metal part is disposed below the bottom wall of the groove, or the bottom plate is disposed flush with the bottom wall of the groove; the side plate near the light strip is disposed flush with the side wall of the groove.

11. The backlight module according to claim 10, characterized in that, In the length direction of the base plate of the sheet metal part, the distance between the base plate and the side wall of the receiving groove is 0-0.15mm; The distance between the bottom plate of the sheet metal part away from the side plate and the side wall of the receiving groove is 0-0.15mm. The distance between the side plate of the sheet metal part and the outer wall of the receiving groove is 0.05-0.1mm; The minimum distance between the base plate of the heat dissipation component and the bottom wall of the groove is 0-0.2mm.

12. The backlight module according to claim 10, characterized in that, The sheet metal part is made of aluminum alloy; And / or, the numerical range of the difference b between the depth of the receiving groove and the thickness of the sheet metal part is: 0 <b≤0.2mm。 13. The backlight module according to claim 1, characterized in that, The light strip has a connecting part, which is connected to the circuit board of the backlight module; A silicone strip is provided between the light guide plate and the side wall of the groove. One side of the silicone strip is used to abut against the side wall of the light guide plate, and the other side is connected to the side wall of the groove. In the extension direction of the light strip, the connection part between the silicone strip and the light strip is spaced apart.

14. A display device, characterized in that, Includes the backlight module as described in any one of claims 1-13.

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