Optical module
By using substrate injection molding and optical guidance structures, the problems of stray reflection and structural complexity in optical modules have been solved, resulting in cost reduction and improved measurement accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KUNSHAN Q TECH CO LTD
- Filing Date
- 2025-07-04
- Publication Date
- 2026-07-14
AI Technical Summary
In existing optical modules, stray reflections cause noise interference, and existing baffle structures are complex, occupy a lot of space, and increase costs.
The optical sensor is injection molded using electronic components on the substrate. The optical transmitter adopts a chip-level packaging structure and is combined with optical guidance structures such as optical channels or optical fibers to avoid stray reflections and simplify the carrier structure.
It effectively avoids stray reflections, simplifies the structure, reduces costs, improves measurement accuracy and stability, and adapts to different environmental conditions.
Smart Images
Figure CN224500984U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of structural design technology of optical modules, and in particular to an optical module. Background Technology
[0002] Some types of optical sensing systems include an optical transmitter that emits a beam of optical radiation toward a target, and an optical receiver that collects and senses the optical radiation reflected from the target. For example, in some depth sensing systems, the transmitter emits a radiation pulse toward the target, and the optical receiver senses the time of flight (TOF) of the pulse, thus measuring the distance to the target. For many sensing applications, including TOF-based depth sensing, the transmitter and receiver are typically packaged together on the same substrate in a compact package.
[0003] Time-of-flight (TOF) based depth sensing devices almost inevitably experience stray reflections, which are reflected from optical surfaces within the device or otherwise scattered back to the receiver. Generally, such stray reflections are considered noise, and device designers make every effort to eliminate them. On the other hand, some stray reflections are intentionally used to calibrate TOF measurements.
[0004] Chinese patent CN 112526479 A discloses an optical module with a stray light baffle, including a substrate and an optical emitter. The optical emitter is mounted on the substrate and includes an optical emitting electrode and a transmission lens assembly. The optical emitting electrode is configured to emit an optical radiation beam. The transmission lens assembly is configured to guide the beam toward a target along a transmission axis. An optical receiver is mounted on the substrate together with the optical emitter and includes an optical sensor and an objective lens assembly. The objective lens assembly is configured to focus the optical radiation reflected from the target onto the optical sensor along a receiving axis. The optical baffle is asymmetrically arranged relative to the transmission axis and has an asymmetrical shape. The asymmetrical shape is configured to preferentially block stray radiation emitted from the optical emitter toward the receiving axis. The optical module with stray light baffle in this patent has the baffle mainly set on the lens barrel, which makes the lens barrel structure more complex, the assembly space occupied, and the size of the shell correspondingly larger, thus increasing the cost. It is also not conducive to the targeted blocking of stray radiation emitted by the optical emitter and cannot effectively control the intensity of stray reflected light used for calibrating TOF measurements. Utility Model Content
[0005] In view of this, the present invention provides an optical module that encapsulates the gold wires of the electronic components and optical sensors on the substrate by injection molding to achieve protection, fixation and sealing. The optical transmitter adopts a chip-level packaging structure, which eliminates the need for a baffle structure in the carrier structure and can effectively avoid optical stray reflections. Therefore, it can effectively simplify the structure of the carrier structure and reduce its size, thereby greatly reducing the cost.
[0006] An optical module includes a carrier structure, a substrate, an optical transmitter, and an optical sensor. The optical transmitter and the optical sensor are respectively disposed on the substrate. The carrier structure is integrally formed on the substrate and encapsulates electronic components and gold wires on the substrate. Both the optical transmitter and the optical sensor are connected to the carrier structure. A first clearance structure is provided in the carrier structure corresponding to the position of the optical transmitter, and a second clearance structure is provided in the carrier structure corresponding to the position of the optical sensor.
[0007] In one embodiment, the optical sensor has a preset photosensitive area, and the optical module further includes an optical guiding structure. The optical guiding structure is connected to the side of the first clearance structure and the preset photosensitive area. The optical guiding structure is used to guide a predefined portion of the light beam emitted by the optical emitter toward the preset photosensitive area of the optical sensor.
[0008] In one embodiment, the optical guiding structure is an optical channel disposed within the carrier structure. One end of the optical channel is connected to the side of the first air-proof structure, and the other end of the optical channel extends to a position within the carrier structure corresponding to a preset photosensitive area and surrounds the adjacent three outer sides of the preset photosensitive area.
[0009] In one embodiment, an integrated optical device is provided in the optical channel. The integrated optical device includes a light shield, an aperture, a prism, and a collimating lens arranged in sequence, as well as an anti-reflection element wrapped around the light shield, aperture, prism, and collimating lens. The light shield is close to the optical emitter, the prism is located above the collimating lens, and the collimating lens corresponds to a preset photosensitive area, so that a predefined portion of the light beam emitted by the optical emitter is perpendicularly irradiated onto the preset photosensitive area of the optical sensor.
[0010] In one embodiment, the optical guiding structure is an optical fiber, one end of which is connected to the side of the first air-proof structure, and the other end of which is connected to the periphery of the preset photosensitive area.
[0011] In one embodiment, the other end of the optical fiber is provided with an optical path guide, which is attached to the periphery of a preset photosensitive area.
[0012] In one embodiment, the optical path guide is horn-shaped, with an opening at the top for light to enter, and the horn opening of the optical path guide is attached to the periphery of a preset photosensitive area.
[0013] In one embodiment, the inner surface of the carrier structure is a mirror structure.
[0014] In one embodiment, the optical module further includes an objective lens assembly and a filter. The objective lens assembly is fixedly connected to the carrier structure. The second clearance structure is provided with support portions around its perimeter. The support portions are used to support the filter. The outer side of the support portions is provided with anti-collision portions for protecting the objective lens assembly.
[0015] In one embodiment, the support portion is provided with an air outlet structure that connects to the second venting structure.
[0016] The optical module provided by this utility model has a carrier structure integrally formed on a substrate. The optical transmitter and optical sensor are respectively protected by a first and a second clearance structure. The electronic components, optical transmitter, and optical sensor gold wires on the substrate are injection molded and encapsulated, effectively protecting the electronic components and gold wires from mechanical damage, humidity, oxidation, and other adverse effects. It can fix the electronic components and gold wires, reducing their movement and misalignment, lowering the defect rate. It can seal the electronic components, giving them waterproof and dustproof capabilities, and increasing their insulation performance, ensuring safe and reliable operation. The injection molding process is simple and has high production efficiency, resulting in lower costs. The optical transmitter uses a chip-level packaging structure, eliminating the need for a baffle structure within the carrier structure, effectively preventing optical stray reflections. Therefore, it can effectively simplify the carrier structure and reduce its size compared to existing... The technology can save on materials, processes, and personnel, thereby significantly reducing costs. A partial beam of light emitted by the optical transmitter can be guided to the preset photosensitive area of the optical sensor via an optical guiding structure connected to the side of the first clearance structure on the carrier structure and the preset photosensitive area of the optical sensor. The optical guiding structure can be configured as an optical channel or fiber optic structure, resulting in a simple and compact structure with easy manufacturing. Integrated optical devices are placed within the optical channel, effectively reflecting the light source to the secondary photosensitive area while avoiding reflection to the main photosensitive area of the optical sensor. The light intensity of the secondary photosensitive area can be easily controlled and adjusted by changing the structure of the optical guiding structure to ensure that the optical sensor's ability to receive light is not affected even in dim environments. This high stability improves the optical module's ability to operate under different temperature and lighting conditions, providing a stable light source and enhancing measurement accuracy. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 The schematic diagram illustrates the split structure of the optical module of the first embodiment of this utility model.
[0019] Figure 2 The diagram schematically shows the first cross-sectional structure of the optical module and the light source transmission path of the first embodiment of the present invention.
[0020] Figure 3 The diagram schematically shows the second cross-sectional structure of the optical module of the first embodiment of the present invention and the light source transmission path.
[0021] Figures 4 to 7 The third cross-sectional view of the optical module and the light source transmission path of the first embodiment of the present invention are schematically shown.
[0022] Figure 8a and Figure 8b The overall structure of the optical transmitter in each embodiment of this utility model is schematically shown.
[0023] Figures 9 to 17 The different optical channel structures within the carrier structure in the first embodiment of this utility model are schematically shown.
[0024] Figure 18 The schematic diagram illustrates the light source transmission path within the carrier structure in this embodiment of the invention.
[0025] Figure 19 The schematic diagram illustrates the overall frame structure of the integrated optical device in the first embodiment of this utility model.
[0026] Figure 20 The schematic diagram illustrates the overall mounting structure of the optical guide structure in the second embodiment of this utility model.
[0027] Figure 21 The schematic diagram shows the overall structure of the optical guidance structure in the second embodiment of this utility model.
[0028] Figure 22 The schematic diagram illustrates the overall structure of the optical fiber in the second embodiment of this utility model.
[0029] Figure 23 The schematic diagram illustrates the overall structure of the single-mode optical fiber in the second embodiment of this utility model.
[0030] Figure 24 The schematic diagram illustrates the overall structure of the multimode optical fiber in the second embodiment of this utility model. Detailed Implementation
[0031] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Based on the description of this utility model, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this utility model.
[0032] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "set up," "equipped with," "located in," "installed," and "connected," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.
[0033] The terms “upper,” “inner,” “outer,” “side,” “bottom,” “above,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this utility model is usually placed when in use. They are only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0034] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.
[0035] The terms “first,” “second,” “third,” “fourth,” etc., are used merely to distinguish elements with similar attributes, not to indicate or imply relative importance or a specific order.
[0036] First Embodiment
[0037] like Figures 1 to 4As shown, the optical module of this embodiment includes a carrier structure 11, a substrate 12, an optical emitter 13, and an optical sensor 14. The optical emitter 13 and the optical sensor 14 are respectively disposed on the substrate 12. The carrier structure 11 is integrally formed on the substrate 12 and wraps the electronic components and gold wires (the gold wires connecting the optical emitter 13 and the optical sensor 14 to the substrate 12) on the substrate. The edges of the optical emitter and the edges of the optical sensor are both connected to the carrier structure. In this embodiment, the molding process (MOC) is applied to the carrier structure of the optical module. The electronic components soldered to the substrate 12 are wrapped by the MOC process, which can significantly reduce the increase in the size of the optical module caused by avoiding the components, thereby reducing the overall size of the optical module. The optical emitter 13 is connected to the substrate 12 using both a COB (Chip on Board) and CSP (Chip Scale Package) chip-level packaging structure. In the COB structure, the optical emitter 13 is attached to the substrate 12 with adhesive and then electrically connected using gold wire bonding. In the CSP structure, the pads of the optical emitter 13 are electrically connected to the pads on the substrate 12 using solder paste via SMT (Surface Mount Technology). A first clearance structure 111 is provided within the carrier structure 11 corresponding to the position of the optical emitter 13 on the substrate 12; a second clearance structure 112 is provided within the carrier structure 11 corresponding to the position of the optical sensor 14; and multiple third clearance structures 113 are provided within the carrier structure 11 corresponding to the positions of electronic components on the substrate 12. The clearance structure on the carrier structure 11 changes according to the position of the gold wires of the optical emitter 13 and optical sensor 14 on the substrate 12, as well as the position of the electronic components, to meet the electrical connection assembly requirements of the optical module. Specifically, as shown... Figure 8a and Figure 8b As shown, the optical transmitter 13 uses a CSP (Chip Scale Package) chip-level packaging structure, which can reduce the interference of gold wires on the light source emitted by the optical transmitter 13. The optical transmitter 13 can have various sizes and shapes, which are determined according to the actual selection of the optical module.
[0038] The optical module of the first embodiment of this utility model encapsulates the gold wires and electronic components of the optical transmitter 13 and optical sensor 14 on the substrate 12 through injection molding. This effectively protects the gold wires and electronic components of the optical transmitter 13 and optical sensor 14 from mechanical damage, humidity, oxidation, and other adverse effects. It can fix the electronic components and gold wires, reduce their movement and misalignment, and lower the defect rate. It can seal the electronic components, giving them waterproof and dustproof capabilities. It can increase the insulation performance of the electronic components, ensuring their safe and reliable operation. The injection molding process is simple and has high production efficiency, thus resulting in lower costs. The optical transmitter 13 adopts a chip-level packaging structure, eliminating the need for a baffle structure within the carrier structure 11, which effectively avoids optical stray reflections. Therefore, it can effectively simplify the structure and reduce the size of the carrier structure 11. Compared with the prior art, it can save on materials, processes, and personnel, thereby greatly reducing costs.
[0039] like Figures 4 to 7 As shown, specifically, in this embodiment, the optical sensor 14 is provided with a preset photosensitive area 141, and the optical module also includes an optical guiding structure 15. The optical guiding structure 15 is connected to the side of the first clearance structure 111 and the preset photosensitive area 141 respectively. The optical guiding structure 15 is used to guide a predefined portion of the light beam emitted by the optical emitter 13 toward the preset photosensitive area 141 of the optical sensor 14.
[0040] Specifically, the optical guiding structure 15 can be used to guide a predefined portion of the light beam emitted by the optical emitter 13 to directly hit the preset photosensitive area 141 of the optical sensor 14, i.e., the secondary photosensitive area. This allows the light source to be effectively reflected to the secondary photosensitive area while avoiding reflection to the main photosensitive area 142 of the optical sensor. The light intensity of the secondary photosensitive area can be controlled and adjusted by changing the structure of the optical guiding structure 15 to ensure that the light source received by the optical sensor is not affected in dim environments. Therefore, the optical module has a stable light source when working under different temperature and lighting conditions, thus improving the accuracy of the measurement.
[0041] like Figure 9 and Figure 10 As shown, specifically in this embodiment, the optical guiding structure 15 is an optical channel disposed within the carrier structure 11. One end of the optical channel is connected to the side of the first clearance structure 111, and the other end of the optical channel extends to the position within the carrier structure 11 corresponding to the preset photosensitive area 141 and surrounds the adjacent three outer sides of the preset photosensitive area 141. Specifically, by providing an integrally formed optical channel within the carrier structure 11, the structure is simple and compact, the process is simple, and it is convenient to control and adjust the light intensity of the secondary photosensitive area.
[0042] like Figure 2 , Figure 3 and Figure 10 As shown, specifically in this embodiment, the optical module further includes an objective lens assembly 17, which is fixedly connected to the carrier structure 11. A support portion 1121 is provided around the second clearance structure 112, supporting the narrow-band filter. An anti-collision portion 1122 is provided on the outer side of the support portion 1121, protecting the objective lens assembly 17. Specifically, in this embodiment, the support portion 1121 is provided with an air outlet structure 1123 communicating with the second clearance structure 112. The air outlet structure 1123 can be an air outlet groove or an air outlet, etc.
[0043] like Figures 9 to 17 As shown, specifically in this embodiment, the optical channel structure within the carrier structure 11 includes various types to accommodate different light source intensity requirements of the secondary photosensitive area.
[0044] like Figure 18 As shown, specifically in this embodiment, the inner surface of the carrier structure 11 is a mirror structure. By making the inner surface of the carrier structure 11 a mirror, the reflective surface can be ensured to be flat and smooth, thereby reducing the scattering and diffuse reflection of the light source and reducing the impact of stray radiation on the measurement accuracy of the optical module. Specifically, in this embodiment, a nanoprinted photolithography structure is used on the substrate 12, and a nanogroove structure is provided at the bottom of the collimating lens 164.
[0045] like Figure 19 As shown, specifically in this embodiment, an integrated optical device 16 is provided in the optical channel 15. The integrated optical device 16 includes a light shield 161, an aperture 162, a prism 163, and a nano-transfer collimating lens 164 arranged sequentially, as well as an anti-reflection element 165 wrapped around the light shield 161, the aperture 162, the prism 163, and the nano-transfer collimating lens 164. The light shield 161 is close to the optical emitter 13, the prism 163 is located above the nano-transfer collimating lens 164, and the nano-transfer collimating lens 164 corresponds to a preset photosensitive area 141, so that a predefined portion of the light beam emitted by the optical emitter 13 is perpendicularly irradiated onto the preset photosensitive area 141 of the optical sensor 14. Specifically, in this embodiment, the light-shielding member 161 is a light-shielding plate, which can filter out stray reflected light of a preset wavelength, such as stray light in the wavelength range below 930nm. The aperture 162 can control the amount of light entering through the aperture. The prism 163 is used to refract light to the image plane. The nano-transfer collimating lens 164 is used to collimate the light. The anti-reflection member 165 is an anti-reflection coating, which can reduce the loss of light source energy due to reflection of optical elements.
[0046] Obviously, by setting the aforementioned integrated optical device 16, the reflectivity can be effectively enhanced, the light reflection characteristics can be easily adjusted and controlled, and the path and reflection characteristics of the light can be easily adjusted. Through the cooperation of the right-angle prism 163, the nano-transfer collimating lens 164 and the anti-reflection element 165, high reflectivity in a specific direction can be achieved. This further ensures that the predefined portion of the light beam emitted by the optical emitter 13 is stably and reliably reflected in the sub-photosensitive area of the optical sensor 14, thereby facilitating the control and adjustment of the light intensity in the sub-photosensitive area and greatly improving the measurement accuracy of the optical module.
[0047] Second Embodiment
[0048] like Figure 20 As shown, the optical module of this embodiment differs from the first embodiment in that the optical guiding structure 15 is an optical fiber 151, one end of which is connected to the side of the first clearance structure 111, and the other end of which is connected to the periphery of the preset photosensitive area 141.
[0049] like Figure 21 As shown, specifically in this embodiment, the other end of the optical fiber 151 is provided with an optical path guide 18, which is attached to the periphery of the preset photosensitive area 141.
[0050] In one embodiment, the optical path guide 18 is horn-shaped, with an opening at the top and connected to an optical fiber to allow light to enter, and the horn opening of the optical path guide 18 is attached to the periphery of the preset photosensitive area 141.
[0051] Specifically, in this embodiment, the optical path guide 18 is horn-shaped and made of soft rubber. The upper part of the optical path guide 18 has an opening for light to enter, and the horn-shaped opening of the optical path guide 18 is attached to the periphery of the preset photosensitive area 141. The structure of the aforementioned connector 18 is simple and compact, occupies little space, is easy to install and arrange, and has low cost. It can effectively guide the light within the optical fiber 151 and block stray light from the outside. The horn-shaped optical path guide 18 made of soft rubber can generate strong adsorption force, effectively adsorbing the surface of the optical sensor 14 and keeping it stably in the desired position. Due to its softness, the horn-shaped optical path guide 18 made of soft rubber can adapt to preset photosensitive areas 141 of various shapes and sizes, i.e., secondary photosensitive areas, providing better fit. The horn-shaped optical path guide made of soft rubber has excellent buffering function, preventing excessive stress on the optical sensor 14 and avoiding scratches or damage to the surface of the optical sensor 14, thus better protecting the chip surface. High-quality soft rubber material has good durability and fatigue resistance, and can maintain excellent performance for a long time.
[0052] like Figure 22As shown, specifically, the optical fiber 151 includes a core 1511, a cladding 1512, and a coating 1513 made of transparent optical material. The core 1511 is the core part of the optical fiber 151, which transmits optical signals. The main body of the core 151 is silicon dioxide, which is doped with trace amounts of other materials to improve the optical refractive index of the material. The cladding 1512 has a different optical refractive index from the core 1511, ensuring that the optical signal is mainly transmitted in the core 1511. The coating 1513 is mainly used to increase the mechanical strength of the optical fiber 151 so that the optical fiber 151 is not damaged by external factors. The outermost layer of the optical fiber 151 is also provided with a jacket 1514, which can also play a protective role.
[0053] like Figure 23 and Figure 24 As shown, specifically, the optical path modes in fiber 151 are mainly divided into single-mode mode and multi-mode mode. For example... Figure 23 As shown, single-mode refers to an optical signal with only one propagation mode in fiber 151. In single-mode fiber, the optical signal can only propagate along the central axis, and the beam diameter is small, resulting in a straight-line propagation path. Due to the concentrated propagation path, single-mode fiber has lower transmission loss and higher bandwidth, making it suitable for long-distance optical communication and data transmission. Multimode refers to an optical signal with multiple propagation modes in fiber 151. In multimode fiber, the optical signal can propagate along different paths, the beam diameter is larger, and the propagation path is curved. Due to the more dispersed propagation paths, multimode fiber has higher transmission loss and lower bandwidth, making it suitable for short-distance optical communication and data transmission. Furthermore, the modes in fiber 151 can also be classified into basic modes and higher-order modes, linearly polarized modes, and non-linearly polarized modes, etc., according to other classification methods. In general, different optical path modes determine the performance and applicable scenarios of fiber 151 during transmission, thus increasing the applicability of optical modules.
[0054] Obviously, by setting optical fiber 151 in the carrier structure 11 for optical guidance, it also has the advantages of simple and compact structure, simple process, low cost, and more convenient and reliable control and adjustment of light intensity of sub-photosensitive area.
[0055] As can be seen from the above embodiments, the optical module involved in this utility model encapsulates the gold wires of the electronic components and optical sensors on the substrate through injection molding to achieve protection, fixation and sealing. The optical transmitter adopts a chip-level packaging structure, which can effectively avoid the generation of optical stray reflections without setting a baffle structure in the carrier structure. Therefore, it can effectively simplify the structure of the carrier structure and reduce its size, thereby greatly reducing the cost.
[0056] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.
Claims
1. An optical module, comprising a carrier structure, a substrate, an optical transmitter, and an optical sensor, wherein the optical transmitter and the optical sensor are respectively disposed on the substrate, characterized in that, The carrier structure is integrally formed on the substrate and encapsulates the electronic components and gold wires on the substrate. Both the optical transmitter and the optical sensor are connected to the carrier structure. A first clearance structure is provided in the carrier structure corresponding to the position of the optical transmitter, and a second clearance structure is provided in the carrier structure corresponding to the position of the optical sensor.
2. The optical module as described in claim 1, characterized in that, The optical sensor has a preset photosensitive area, and the optical module also includes an optical guiding structure. The optical guiding structure is connected to the side of the first clearance structure and the preset photosensitive area. The optical guiding structure is used to guide a predefined portion of the light beam emitted by the optical emitter toward the preset photosensitive area of the optical sensor.
3. The optical module as described in claim 2, characterized in that, The optical guiding structure is an optical channel located within the carrier structure. One end of the optical channel is connected to the side of the first air-proof structure, and the other end of the optical channel extends to the position within the carrier structure corresponding to the preset photosensitive area and surrounds the adjacent three outer sides of the preset photosensitive area.
4. The optical module as described in claim 3, characterized in that, The optical channel is equipped with integrated optical components, including a light-shielding element, an aperture, a prism, and a collimating lens arranged sequentially, as well as an anti-reflective element surrounding the light-shielding element, the aperture, the prism, and the collimating lens; wherein... The light-shielding member is close to the optical emitter, the prism is disposed above the collimating lens, and the collimating lens corresponds to the preset photosensitive area, so that a predefined portion of the light beam emitted by the optical emitter is perpendicularly irradiated into the preset photosensitive area of the optical sensor.
5. The optical module as described in claim 2, characterized in that, The optical guiding structure is an optical fiber, one end of which is connected to the side of the first air-proof structure, and the other end of which is connected to the periphery of the preset photosensitive area.
6. The optical module as described in claim 5, characterized in that, The other end of the optical fiber is provided with an optical path guide, which is attached to the periphery of the preset photosensitive area.
7. The optical module as described in claim 6, characterized in that, The optical path guide is horn-shaped, with an opening at the top for light to enter, and the horn opening of the optical path guide is attached to the periphery of the preset photosensitive area.
8. The optical module as described in any one of claims 1 to 7, characterized in that, The inner surface of the carrier structure is a mirror structure.
9. The optical module as described in any one of claims 1 to 7, characterized in that, The optical module also includes an objective lens assembly and a filter. The objective lens assembly is fixedly connected to the carrier structure. The second clearance structure has support portions around its perimeter, which are used to support the filter. The outer side of the support portions has anti-collision portions, which are used to protect the objective lens assembly.
10. The optical module as described in claim 9, characterized in that, The support portion is provided with an air outlet structure that connects to the second air-proof structure.