A liquid crystal screen for a heat distortion preventing projector

Abstract

The utility model discloses a kind of liquid crystal screens of heat deformation prevention projector, it is related to projection display technical field, including oppositely arranged upper glass substrate and lower glass substrate, liquid crystal layer and TFT drive circuit are arranged between the upper glass substrate and lower glass substrate, the side of the lower glass substrate away from liquid crystal layer is provided with composite heat dissipation support layer, the composite heat dissipation support layer includes heat conducting layer, stress buffer layer and rigid support layer sequentially arranged from inside to outside.The utility model is provided with composite heat dissipation support layer, heat conducting layer is quickly and evenly heated, stress buffer layer absorbs thermal stress, rigid support layer provides strong support, the synergistic effect of three, significantly reduce the warping and deformation of liquid crystal screen under high temperature working environment, reduce the pixel shift and optical distortion caused by thermal deformation, ensure the definition of image, chromatic accuracy and stability, reduce the damage risk of thermal stress to liquid crystal layer and TFT circuit, improve the long-term working reliability of liquid crystal screen.

Description

Technical Field

[0001] This utility model relates to the field of projection display technology, specifically to a liquid crystal screen for a heat-resistant projector. Background Technology

[0002] In projectors based on a single full-color TFT LCD screen, strong light emitted from a light source (such as an LED or UHP lamp) is uniformly projected onto the LCD screen via a Kohler illumination system (including a condenser lens, front / rear Fresnel lenses, etc.). The LCD screen acts as a light valve, modulating the light by controlling the transmittance of each pixel, and then the light is magnified and imaged onto the screen by the projection lens.

[0003] However, due to the high power of the light source, a large amount of heat is conducted to the LCD screen through the illumination path. The glass substrate of the LCD screen is prone to thermal expansion when heated. If the expansion is uneven or constrained, thermal stress will be generated, causing the screen to warp and deform. This thermal deformation will seriously affect the precise alignment of pixels, causing optical defects such as image blurring, ghosting, and chromatic aberration. In severe cases, it may even lead to damage to the liquid crystal layer or failure of the driving circuit, affecting the imaging quality and lifespan of the projector.

[0004] In existing technologies, external heat dissipation methods such as heat sinks and fans are typically used to cool the entire LCD screen. However, these methods are slow to respond, difficult to quickly eliminate local thermal stress, and have limited effect on improving the structural deformation resistance of the LCD screen itself. Therefore, this utility model proposes an LCD screen for a projector that is resistant to thermal deformation. Utility Model Content

[0005] Technical problems to be solved

[0006] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a liquid crystal screen for a projector that is resistant to heat deformation.

[0007] Technical solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a liquid crystal screen for a heat-resistant projector, comprising an upper glass substrate and a lower glass substrate disposed opposite to each other, with a liquid crystal layer and a TFT driving circuit disposed between the upper and lower glass substrates, and a composite heat dissipation support layer disposed on the side of the lower glass substrate away from the liquid crystal layer, the composite heat dissipation support layer comprising a thermally conductive layer, a stress buffer layer, and a rigid support layer disposed sequentially from the inside to the outside, the thermally conductive layer being attached to the surface of the lower glass substrate away from the liquid crystal layer, the stress buffer layer being disposed on the outside of the thermally conductive layer, and the rigid support layer being disposed on the outside of the stress buffer layer. By setting the composite heat dissipation support layer, the thermally conductive layer rapidly heats up, the stress buffer layer absorbs thermal stress, and the rigid support layer provides strong support. The three work together to significantly reduce the warping and deformation of the liquid crystal screen under high-temperature operating conditions, reduce pixel shift and optical distortion caused by thermal deformation, ensure image clarity, color accuracy and stability, reduce the risk of damage to the liquid crystal layer and TFT circuit by thermal stress, and improve the long-term operational reliability of the liquid crystal screen. In addition, the micron-level texture structure increases the heat dissipation area, which helps dissipate heat and further improves thermal management.

[0009] Preferably, the thermally conductive layer is one of a graphene film, a boron nitride film, or a metal sputtering layer.

[0010] Preferably, the stress buffer layer is made of one of silicone rubber, polydimethylsiloxane, or epoxy resin modified material.

[0011] Preferably, the rigid support layer is one of a ceramic substrate, a carbon fiber reinforced composite material, or an Invar alloy sheet.

[0012] Preferably, the edge of the composite heat dissipation support layer extends beyond the edge of the lower glass substrate and is connected to the projector's mounting bracket via a flexible adhesive to allow for minor thermal expansion and contraction displacements and prevent stress from being transmitted to the LCD screen body.

[0013] Preferably, the upper glass substrate facing the liquid crystal layer and / or the lower glass substrate facing the liquid crystal layer have a micron-level textured structure. The textured structure is distributed in a regular array to increase the surface area of ​​the glass substrate, promote the dissipation of heat through convection and radiation, and enhance the structural rigidity of the substrate to a certain extent.

[0014] Preferably, the depth of the textured structure is 1-10 micrometers and the pitch is 5-50 micrometers.

[0015] Beneficial effects:

[0016] Compared with existing technologies, the LCD screen of this heat-resistant projector has the following advantages:

[0017] This invention utilizes a composite heat dissipation support layer, a heat-conducting layer for rapid heat equalization, a stress buffer layer to absorb thermal stress, and a rigid support layer to provide strong support. The synergistic effect of these three elements significantly reduces warping and deformation of the LCD screen under high-temperature operating conditions, reduces pixel shift and optical distortion caused by thermal deformation, ensures image clarity, color accuracy, and stability, reduces the risk of thermal stress damage to the liquid crystal layer and TFT circuitry, and improves the long-term reliability of the LCD screen. In addition, the micron-level textured structure increases the heat dissipation area, which helps dissipate heat and further improves thermal management. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of the glass substrate of this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the glass substrate of this utility model.

[0023] In the picture:

[0024] 1. Upper glass substrate; 2. Lower glass substrate; 3. Liquid crystal layer; 4. Composite heat dissipation support layer; 5. Flexible adhesive; 6. Fixing bracket; 7. Textured structure; 401. Thermally conductive layer; 402. Stress buffer layer; 403. Rigid support layer. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figures 1-4As shown, this utility model provides a technical solution: a liquid crystal screen for a heat-resistant projector, comprising an upper glass substrate 1 and a lower glass substrate 2 disposed opposite to each other, a liquid crystal layer 3 and a TFT driving circuit disposed between the upper glass substrate 1 and the lower glass substrate 2, and a composite heat dissipation support layer 4 disposed on the side of the lower glass substrate 1 away from the liquid crystal layer 3. The composite heat dissipation support layer 4 comprises a thermally conductive layer 401, a stress buffer layer 402 and a rigid support layer 403 disposed sequentially from the inside to the outside. The thermally conductive layer 401 is attached to the surface of the lower glass substrate 2 away from the liquid crystal layer 3, the stress buffer layer 402 is disposed on the outside of the thermally conductive layer 401, and the rigid support layer 403 is disposed on the outside of the thermally conductive layer 401. Placed on the outside of the stress buffer layer 402, the composite heat dissipation support layer 4 is provided. The heat conduction layer 401 heats up quickly and evenly, the stress buffer layer 402 absorbs thermal stress, and the rigid support layer 403 provides strong support. The three work together to significantly reduce the warping and deformation of the LCD screen under high-temperature working environment, reduce pixel shift and optical distortion caused by thermal deformation, ensure image clarity, color accuracy and stability, reduce the risk of thermal stress damage to the liquid crystal layer and TFT circuit, and improve the long-term working reliability of the LCD screen. In addition, the micron-level texture structure 7 increases the heat dissipation area, which helps to dissipate heat and further improves thermal management.

[0027] The thermally conductive layer 401 in this application is one of graphene film, boron nitride film or metal sputtering layer, the stress buffer layer 402 is one of silicone rubber, polydimethylsiloxane or epoxy resin modified material, and the rigid support layer 403 is one of ceramic substrate, carbon fiber reinforced composite material or Invar alloy sheet.

[0028] Please refer to the following carefully. Figure 1 and Figure 2 The edge of the composite heat dissipation support layer 4 extends beyond the edge of the lower glass substrate 2 and is connected to the projector's mounting bracket 6 via flexible adhesive 5. This flexible connection allows for slight relative displacement between the composite heat dissipation support layer and the mounting bracket, thereby adapting to the dimensional changes of the overall component during thermal expansion and contraction. This avoids the possibility that a rigid connection might transmit external constraint stress in the opposite direction to the LCD screen body, causing secondary stress damage.

[0029] Please refer to the following carefully. Figure 2 , Figure 3 and Figure 4 The upper glass substrate 1 and / or the lower glass substrate 2 have micron-sized raised and recessed texture structures 7 on the side facing the liquid crystal layer 3. The raised and recessed texture structures 7 are arranged in a regular array. The depth of the raised and recessed texture structures is 1-10 microns and the pitch is 5-50 microns. The micron-sized raised and recessed texture structures on the side facing the liquid crystal layer 3 of the upper glass substrate 1 and / or the lower glass substrate 2 increase the effective surface area of ​​the glass substrate, enhance the efficiency of heat dissipation to the surrounding environment through convection and radiation, and assist in the overall thermal management.

[0030] Working Principle: When the projector light source is working, the strong light and accompanying heat are conducted to the LCD screen through the Kohler lighting system. The heat first acts on the upper glass substrate 1 and the lower glass substrate, causing the temperature of the glass substrate to rise and generate a tendency for thermal expansion. During this process, the composite heat dissipation support layer 4, located on the backlight side of the lower glass substrate, and the heat-conducting layer, with their high thermal conductivity (such as graphene, boron nitride, or metal materials), can quickly conduct and diffuse the heat locally accumulated on the lower glass substrate laterally along the plane, achieving rapid and uniform heat distribution and reducing temperature gradients and uneven expansion caused by local overheating. The stress buffer layer 402 is composed of elastic and flexible polymer materials such as silicone rubber and polydimethylsiloxane, which can deform to absorb and dissipate the thermal stress generated by the difference in thermal expansion coefficients between the glass substrate and the outer support structure, preventing stress from accumulating in the glass substrate. The rigid support layer 403 provides strong mechanical support for the entire LCD screen assembly. Its high bending stiffness effectively suppresses the bending and warping deformation of the lower glass substrate after heating, maintaining the overall flatness of the LCD screen.

[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A liquid crystal screen for a heat-resistant projector, comprising an upper glass substrate (1) and a lower glass substrate (2) disposed opposite to each other, characterized in that: A liquid crystal layer (3) and a TFT driving circuit are disposed between the upper glass substrate (1) and the lower glass substrate (2). A composite heat dissipation support layer (4) is disposed on the side of the lower glass substrate (2) away from the liquid crystal layer (3). The composite heat dissipation support layer (4) includes a heat-conducting layer (401), a stress buffer layer (402) and a rigid support layer (403) disposed sequentially from the inside to the outside. The heat-conducting layer (401) is attached to the surface of the lower glass substrate (2) away from the liquid crystal layer (3). The stress buffer layer (402) is disposed on the outside of the heat-conducting layer (401). The rigid support layer (403) is disposed on the outside of the stress buffer layer (402).

2. The LCD screen of a heat-resistant projector according to claim 1, characterized in that: The thermally conductive layer (401) is one of a graphene film, a boron nitride film, or a metal sputtering layer.

3. The LCD screen of a heat-resistant projector according to claim 1, characterized in that: The stress buffer layer (402) is made of one of the following materials: silicone rubber, polydimethylsiloxane, or epoxy resin modified material.

4. The LCD screen of a heat-resistant projector according to claim 1, characterized in that: The rigid support layer (403) is one of a ceramic substrate, a carbon fiber reinforced composite material, or an Invar alloy sheet.

5. The LCD screen of a heat-resistant projector according to claim 1, characterized in that: The edge of the composite heat dissipation support layer (4) extends beyond the edge of the lower glass substrate (2) and is connected to the projector's mounting bracket (6) by a flexible adhesive (5).

6. The LCD screen of a heat-resistant projector according to claim 1, characterized in that: The upper glass substrate (1) has a micron-sized textured structure (7) on the side facing the liquid crystal layer (3) and / or the lower glass substrate (2) has a micron-sized textured structure (7) on the side facing the liquid crystal layer (3), and the textured structure (7) is distributed in a regular array.

7. The LCD screen of a heat-resistant projector according to claim 6, characterized in that: The depth of the textured structure is 1-10 micrometers, and the pitch is 5-50 micrometers.

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