Backlight module and display device

Abstract

The utility model provides a kind of backlight module and display device, belong to display technical field.The backlight module includes;Backplate, the backplate includes bottom frame and the bottom opening on the bottom frame;Light source carrier plate and light emitting component, the light source carrier plate is located at the bottom opening, and is connected with the bottom frame, the light source carrier plate has opposite first face and second face, the light emitting component is set to the first face of the light source carrier plate, the bottom frame is away from the second side of the light source carrier plate with bearing station;Light guide structure, the light guide structure is located on the bearing station of the bottom frame.The backlight module is set to the bottom opening of the backplate by light source carrier plate, can not need to set heat-conducting adhesive tape and the structure such as plate material of bearing lamp board, simplifies the structure of backlight module, realizes the effect of reducing the overall thickness of backlight module.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a backlight module and a display device. Background Technology

[0002] A backlight module is a component in a display device used to provide a light source.

[0003] A backlight module includes a back panel, a lamp panel, and a light guide structure. The back panel has a lamp panel mounting surface, and the lamp panel is bonded to the mounting surface by tape. The light guide structure is located above the lamp panel.

[0004] However, the complex structure of the aforementioned backlight module results in a relatively large overall thickness. Utility Model Content

[0005] This utility model provides a backlight module and a display device. The technical solution is as follows:

[0006] According to one aspect of the present invention, a backlight module is provided, the backlight module comprising:

[0007] A back panel, the back panel including a bottom frame and a bottom opening located on the bottom frame;

[0008] The light source carrier plate and the light-emitting component are provided. The light source carrier plate is located at the bottom opening and is connected to the bottom frame. The light source carrier plate has a first side and a second side facing each other. The light-emitting component is disposed on the first side of the light source carrier plate. The bottom frame has a support platform on the side away from the second side of the light source carrier plate.

[0009] A light guide structure is located on the support platform of the bottom frame.

[0010] Optionally, the light source carrier plate and the bottom frame are an integral structure.

[0011] Optionally, the light-emitting component includes a plurality of light-emitting units located on the light source carrier plate and connecting lines, the connecting lines being connected to the light-emitting units.

[0012] Optionally, the backlight module further includes a target pattern layer, the target pattern layer including a plurality of first grooves, and the connecting lines located in the plurality of first grooves.

[0013] Optionally, the backlight module further includes a reflective protective layer that covers the connection lines.

[0014] Optionally, the light source carrier plate is a lamp plate, and the lamp plate is connected to the bottom frame.

[0015] Optionally, the backlight module further includes a plurality of screws, and the bottom frame has a plurality of screw holes corresponding to the plurality of screws on the side away from the light guide structure. The screws pass through the lamp plate and are threadedly connected to the corresponding screw holes to connect the lamp plate to the bottom frame.

[0016] Optionally, the side of the lamp panel away from the light guide structure has multiple lamp panel recesses, and the bottom of the lamp panel recesses has lamp panel through holes;

[0017] The screw is a countersunk screw, which passes through the through hole of the lamp panel and is threaded into the corresponding screw hole on the bottom frame.

[0018] Optionally, the backlight module further includes an adhesive layer located between the lamp panel and the bottom frame, and bonded to both the lamp panel and the bottom frame.

[0019] Optionally, the adhesive layer has an adhesive layer opening, and the screw hole of the bottom frame is located in the orthographic projection of the adhesive layer opening on the bottom frame.

[0020] Optionally, the bottom frame has a second groove on the side away from the light guide structure, and the second groove communicates with the bottom opening;

[0021] The lamp panel is connected to the bottom of the second groove.

[0022] Optionally, the light guide structure includes a diffuser plate and a plurality of films located on the diffuser plate.

[0023] According to another aspect of the present invention, a display device is provided, the display device comprising any of the backlight modules described above.

[0024] The beneficial effects of the technical solution provided by this utility model embodiment include at least the following:

[0025] The bottom frame of the back panel has a bottom opening, and the light-emitting components are set on the light source carrier plate. By setting the light source carrier plate at the bottom opening of the back panel, the structure of the backlight module can be simplified without the need for thermal conductive tape and the board material supporting the light plate, thus achieving the effect of reducing the overall thickness of the backlight module.

[0026] Furthermore, since the light source carrier plate is connected to the bottom frame of the backplate in this backlight module, no gap is needed between the light source carrier plate and the backplate, thus reducing the bezel of the display device using this backlight module. Also, since there is no need to use thermally conductive adhesive tape to bond the lamp plate and the backplate in the backlight module, the manufacturing cost of the backlight module can be reduced. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a backlight module shown in an embodiment of the present invention;

[0029] Figure 2 This is a schematic diagram of another backlight module provided in this embodiment of the present invention;

[0030] Figure 3 yes Figure 2 A schematic diagram of a cross-sectional structure of the backlight module shown.

[0031] Figure 4 yes Figure 3 A magnified schematic diagram of a portion of the backlight module shown;

[0032] Figure 5 yes Figure 4 A schematic diagram of the manufacturing process of the connecting circuit shown;

[0033] Figure 6 yes Figure 4 The diagram shown illustrates a manufacturing process for a light source carrier plate.

[0034] Figure 7 yes Figure 3 A magnified schematic diagram of a portion of the backlight module shown;

[0035] Figure 8 yes Figure 7 A schematic diagram of a manufacturing process for a portion of the structure on the light source carrier plate is shown.

[0036] Figure 9 yes Figure 2 Another cross-sectional structural diagram of the backlight module shown;

[0037] Figure 10 yes Figure 2 A cross-sectional structural diagram of a portion of the backlight module shown.

[0038] Figure 11 yes Figure 10 A schematic diagram of the structure shown from below;

[0039] Figure 12 yes Figure 2 This is a schematic diagram of another cross-sectional structure of the backlight module.

[0040] The accompanying drawings have illustrated specific embodiments of the present invention, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the present invention in any way, but rather to illustrate the concept of the present invention to those skilled in the art through reference to specific embodiments. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0042] Figure 1 This is a schematic diagram of a backlight module according to an embodiment of the present invention. The backlight module includes a back plate 11, a lamp plate 12, multiple light-emitting units 13, and a light guide structure 14. The back plate 11 has a lamp plate mounting plate 111, and the lamp plate 12 is bonded to the lamp plate mounting plate 111 by adhesive tape 15. The back plate 11 has a support platform, and the light guide structure 14 is located on the support platform. The multiple light-emitting units 13 are located on the lamp plate 12. The lamp plate mounting plate 111 is independently processed and used to set the structure of the lamp plate 12 to improve the flatness of the lamp plate 12. The light emitted by the multiple light-emitting units 13 on the lamp plate 12 is directed to the light guide structure 14. The light guide structure 14 can scatter and homogenize the light, and then direct the light out of the backlight module and provide it to the display panel. The display panel can display based on the light provided by the backlight module to realize the display function.

[0043] However, the inventors discovered that the aforementioned backlight module has at least the following problems:

[0044] On the one hand, the complex structure of the backlight module results in a relatively large overall thickness. In particular, the thickness h1 between the support platform and the back of the backplate 11 is relatively large.

[0045] On the other hand, the backlight module needs to be bonded to the backplate 11 using tape 15. To improve heat dissipation, the tape 15 is a thermally conductive tape, which is expensive, resulting in a high manufacturing cost for the backlight module. Even with the use of thermally conductive tape, the heat dissipation of the backlight module is still poor, causing the light-emitting unit 13 to operate in a high-temperature environment for extended periods. This severely affects the luminous efficiency, lifespan, and color accuracy of the light-emitting unit 13.

[0046] On the other hand, in order to avoid collision between the lamp panel 12 and the back panel 11, a gap d1 needs to be reserved between the side of the lamp panel 12 and the back panel 11. This gap d1 (ranging from 0.2 to 0.8 mm) will increase the width of the bezel of the display device using the backlight module.

[0047] On the other hand, the lamp board mounting plate 111 needs to be processed, which will increase the manufacturing cost of the backlight module.

[0048] The present invention provides another backlight module and display device that can solve some of the problems existing in the above-mentioned backlight module.

[0049] Figure 2 This is a schematic diagram of another backlight module provided in this embodiment of the utility model. Figure 3 yes Figure 2 A cross-sectional structural diagram of the backlight module shown is presented. Figure 3 It can be Figure 2 (The diagram shows a cross-sectional view of the backlight module at point AA. Please refer to the diagram.) Figure 2 and Figure 3 The backlight module includes:

[0050] The back panel 21 includes a bottom frame 211 and a bottom opening k1 located on the bottom frame 211.

[0051] The light source carrier plate 22 and the light-emitting component 23 are included. The light source carrier plate 22 is located at the bottom opening k1 and is connected to the bottom frame 211. The light source carrier plate 22 has a first surface m1 and a second surface m2 facing each other. The light-emitting component 23 is disposed on the first surface m1 of the light source carrier plate 22. The bottom frame 211 has a support platform 211a on the side away from the second surface m2 of the light source carrier plate 22. The light-emitting component 23 being disposed on the first surface m1 of the light source carrier plate 22 can mean that the light-emitting component 23 is directly disposed on the first surface m1 of the light source carrier plate 22, that is, the light-emitting component 23 is at least partially in direct contact with the first surface m1 of the light source carrier plate 22.

[0052] Light guide structure 24 is located on the support platform 211a of the bottom frame 211.

[0053] In summary, in the backlight module provided by this utility model embodiment, the bottom frame of the back plate has a bottom opening, and the light-emitting component is provided on the light source carrier plate. By setting the light source carrier plate at the bottom opening of the back plate, it is not necessary to set the thermal conductive tape and the plate material supporting the light plate, etc., which simplifies the structure of the backlight module and achieves the effect of reducing the overall thickness of the backlight module.

[0054] In addition, since the light source carrier plate is connected to the bottom frame of the back plate in this backlight module, there is no need to set a gap between the light source carrier plate and the back plate, thus achieving the effect of reducing the bezel of the display device using this backlight module.

[0055] Furthermore, since there is no need to use thermally conductive adhesive tape to bond the lamp plate and back plate in the backlight module, the manufacturing cost of the backlight module can be reduced.

[0056] Depend on Figure 3 It can be seen that, since there is no need to set up independent light panels, tape (the thickness of the tape ranges from 0.05 mm to 0.25 mm), and a mounting plate for supporting the light panels (the thickness of the mounting plate ranges from 0.8 mm to 2.5 mm), the thickness h2 between the support platform 211a and the back side of the back plate 21 (the back side can be the side away from the light guide structure 24) is obviously smaller than that of the back side of the back plate 21. Figure 1 The thickness h1 between the middle h1 support platform and the back side of the back plate 11. In addition, in related technologies, the surface of the mounting plate for supporting the lamp plate needs to be processed independently, while the backlight module provided in this embodiment of the utility model also saves the process of processing the mounting plate, thus achieving the effect of saving processes and reducing manufacturing costs.

[0057] Optionally, the backlight module further includes a mid-frame 28, and the back panel 21 further includes a support portion 212 extending from the bottom frame 211. The mid-frame 28 is located on the support portion 212 and can be used to support the display panel. For example, the mid-frame 28 may include a panel support portion 281, on which the display panel can be disposed. In this structure, the light emitted by the light-emitting component 23 can be directed to the light guide structure 24. After processing by the light guide structure 24, the light is directed to the display panel on the panel support portion 281 of the mid-frame 28, thereby providing a light source to the display panel. The display panel can then perform a display function based on the light source provided by the backlight module.

[0058] Optionally, the material of the backplate 21 includes aluminum. Aluminum has strong thermal conductivity, is easy to process, and has a low cost. Using aluminum to manufacture the backplate 21 can improve the heat dissipation capacity of the backlight module and reduce the manufacturing cost of the backlight film.

[0059] In one exemplary embodiment, please refer to Figure 3 The light source carrier plate 22 and the bottom frame 211 are an integral structure. That is, the light source carrier plate 22 and the bottom frame 211 are different parts of a single component. With this structure, the light-emitting component 23 is essentially directly set at the bottom of the back plate 21. This simplifies the structure of the backlight module and allows the back plate 21 to directly absorb the heat generated by the light-emitting component 23 during operation, improving the heat dissipation capacity of the light-emitting component 23. This enables the backlight module to operate stably for a long time, thereby improving the stability of the backlight module.

[0060] Alternatively, please refer to Figure 4 , Figure 4 yes Figure 3 The diagram shows an enlarged view of a portion of the backlight module. Figure 4 It can be Figure 3(A magnified structural schematic diagram of region q1) shows that the light-emitting component 23 includes multiple light-emitting units 231 located on the light source carrier plate 22 and connecting lines 232 connected to the light-emitting units 231. In this structure, the connecting lines 232 are directly disposed on the light source carrier plate 22. Unlike disposing of the connecting lines 232 on the lamp board, in this structure, the connecting lines 232 are actually located on the back plate 21. In the backlight module provided by this embodiment, the connecting lines 232 can be disposed on the back plate 21 through various structures. For example, in one structure, the connecting lines 232 can be formed by a patterning process. Please refer to... Figure 5 , Figure 5 yes Figure 4 The diagram shows a manufacturing process of a connection line. In step s1, a trace material layer u1 and a photoresist layer u2 are sequentially stacked on the light source carrier plate 22. The photoresist layer u2 is exposed using a mask u3 as a mask. Then, in step s2, the exposed photoresist layer u2 is developed to obtain a photoresist pattern u21. In step s3, the exposed portion of the trace material layer u1 is etched using the photoresist pattern u21 as a protective layer. In step s4, the photoresist pattern is peeled off to obtain the connection line 232.

[0061] The connection line 232 can be used to establish an electrical connection between the light-emitting unit 231 and the power supply component in the display device, and cooperate with the power supply component to drive the structure of the light-emitting unit 231. Since the connection line 232 is located at the bottom of the backplate 21, the heat generated by the connection line 232 when driving the light-emitting unit 231 can be directly transferred to the backplate 21 and dissipated into the air by the backplate 21. This achieves timely cooling of the connection line 232, avoiding the problem of excessive resistance due to excessive temperature of the connection line 232, which would lead to excessive power consumption of the backlight module. This improves the heat dissipation capacity of the backlight module and reduces its power consumption. Similarly, the heat generated by the light-emitting unit 231 during the light-emitting process can also be transferred to the backplate 21 in a timely manner and dissipated into the air by the backplate 21. This achieves timely cooling of the light-emitting unit 231, avoiding damage or reduced lifespan caused by prolonged operation under high temperatures, preventing reduced light efficiency due to high temperatures, and preventing color shift caused by high temperatures. The backlight module provided in this embodiment of the invention improves the heat dissipation capacity of the light-emitting unit 231, thereby increasing the lifespan, luminous efficiency, and color accuracy of the light-emitting unit 231. When this backlight module is applied to a display device, it can improve the lifespan of the display device, reduce its power consumption, and enhance its display effect.

[0062] Optionally, the light-emitting unit 231 can be a light-emitting diode (LED), a widely used light-emitting device that emits light through the recombination of electrons and holes. For example, the light-emitting unit 231 can be a sub-millimeter LED, which is an LED chip with a die size of approximately 100 micrometers. This type of LED features high contrast, high brightness, high dynamic range, and long lifespan.

[0063] Optionally, the backlight module further includes a reflective protective layer 25, which covers the connection lines 232. This reflective protective layer 25 serves two purposes: firstly, it protects the connection lines 232; secondly, it reflects the light emitted by the light-emitting unit 231, thereby improving the light utilization rate of the backlight module. For example, the reflective protective layer 25 can be a white oil layer.

[0064] Please refer to Figure 6 , Figure 6 yes Figure 4 The diagram shown illustrates a manufacturing process for a light source carrier plate, wherein... Figure 5 After step s4 shown, in step s5, a reflective protective layer 25 can be formed on the light source carrier plate 22, and in step s6, a plurality of light-emitting units 231 can be provided on the light source carrier plate 22 on which the reflective protective layer 25 is provided. The plurality of light-emitting units 231 can pass through the reflective protective layer 25 and be connected to the connection line below.

[0065] In addition, in this embodiment of the present invention, the connection line 232 can also be disposed on the back plate 21 in other ways, please refer to Figure 7 , Figure 7 yes Figure 3 The diagram shows an enlarged view of a portion of the backlight module. Figure 7 It can be Figure 3 (Another enlarged structural schematic diagram of the central region q1) shows that the backlight module also includes a target pattern layer 26, which includes multiple first grooves w, and the connecting lines 232 are located in the multiple first grooves w. The target pattern layer 26 can be obtained by processing a preset film layer using a nanoimprinting process to form multiple first grooves w on the preset film layer. Then, the pre-formed connecting lines 232 can be pressed into the target pattern layer 26, that is, the connecting lines 232 can be placed on the light source carrier plate 22.

[0066] For example, please refer to Figure 8 , Figure 8 yes Figure 7The diagram shows a manufacturing process for a portion of the structure on the light source carrier plate. In step s21, a nanoimprinting process is performed on a preset film layer 32 (the material of the preset film layer 32 may include photoresist) disposed on the light source carrier plate 22 using module 31 to form multiple first grooves w on the preset film layer 32. After the nanoimprinting process in step s22, a target pattern layer 26 including multiple first grooves w is obtained. In step s23, pre-formed connecting lines 232 are pressed into the first grooves w of the target pattern layer 26 to set the connecting lines 232 on the light source carrier plate 22. This setting method is an additive process. A reflective protective layer can then be formed on the light source carrier plate 22 with the connecting lines 232, and multiple light-emitting units can be set on the reflective protective layer. For details, please refer to [reference needed]. Figure 6 The contents shown are not limited in this embodiment of the present invention. Additionally, before step s21, the material to be processed can be obtained first, and then the material can be processed into the shape of the light source carrier plate 22 based on the design. Alternatively, steps s21 to s23 can be performed on the material to be processed, and then the material can be processed into the shape of the light source carrier plate 22 based on the design.

[0067] Furthermore, in the backlight module provided in this embodiment of the present invention, the light source carrier plate can also be other structures. In one exemplary embodiment, please refer to... Figure 9 , Figure 9 yes Figure 2 Another cross-sectional view of the backlight module shown is illustrated. Figure 9 It can be Figure 2The diagram shows another cross-sectional structure of the backlight module at point AA, where the light source carrier plate 22 is a lamp plate 221, which is connected to the bottom frame 211. In this structure, the bottom of the back plate 21 is hollowed out to form a bottom opening k1, and the lamp plate 221 is placed at the bottom opening k1. The light emitted by the light-emitting component 23 on the lamp plate 221 can pass through the bottom opening k1 of the back plate 21 and be directed to the light guide structure 24. The light guide structure 24 processes the light and then emits it out of the backlight module to provide it to the display panel. This structure allows for the installation plate for supporting the lamp plate 221 to be set in the back plate 21, and eliminates the need to bond the lamp plate 221 and the installation plate with thermally conductive tape. Furthermore, there is no need to create a gap between the lamp plate 221 and the back plate 21. This not only reduces the thickness of the backlight module but also reduces the bezel width of the display device using this backlight module and lowers the manufacturing cost of the backlight module. The lamp board 221 can be a structure used to realize the electrical connection between the light-emitting component 23 and the power supply component in the display device, and cooperate with the power supply component to drive the light-emitting component 23. The lamp board 221 can include a substrate and wiring located in the substrate. The substrate can have one or more layers of wiring to realize the electrical connection between multiple light-emitting components 23 and the power supply component.

[0068] Furthermore, due to this structure, the lamp board 221 is located outside the back plate 21 and is in direct contact with the external air, which greatly improves the heat dissipation capacity of the lamp board 221 and alleviates the problem of excessive temperature in the backlight module. In addition, the heat generated by the light-emitting component 23 and the lamp board 221 during the operation of the backlight module can also be dissipated into the air in a timely manner through the lamp board 221, achieving timely cooling of the light-emitting component 23 and the lamp board 221. This avoids damage or reduced lifespan of the light-emitting component 23 caused by prolonged operation under high temperatures, and also prevents reduced luminous efficiency and color shift caused by high temperatures. In other words, the backlight module provided by this embodiment of the invention, by improving the heat dissipation capacity of the light-emitting component 23, can improve the lifespan, luminous efficiency, and color accuracy of the light-emitting component 23. When this backlight module is applied to a display device, it can improve the lifespan of the display device, reduce its power consumption, and enhance its display effect.

[0069] Alternatively, the light panel 221 can be connected to the base frame 211 by various structures, such as welding, bonding, snap-fitting, and threaded connection.

[0070] Optionally, the backlight module further includes a mid-frame 28, and the back panel 21 further includes a support portion 212 extending from the bottom frame 211. The mid-frame 28 is located on the support portion 212 and can be used to support the display panel. For example, the mid-frame 28 may include a panel support portion 281 and a mid-frame side plate 282. The panel support portion 281 can be a structure extending from the mid-frame side plate 282. The display panel can be disposed on the panel support portion 281, with the side of the panel support portion 281 near the light guide structure 24 abutting against the support portion 212 extending from the bottom frame 211. In this structure, the light emitted by the light-emitting component 23 can be directed to the light guide structure 24. After processing by the light guide structure 24, the light is guided to the display panel on the panel support portion 281 of the mid-frame 28, thereby providing a light source to the display panel. The display panel can realize its display function based on the light source provided by the backlight module.

[0071] In one exemplary embodiment, please refer to Figure 9 , Figure 10 and Figure 11 , Figure 10 yes Figure 2 A cross-sectional structural diagram of a portion of the backlight module shown. Figure 10 It can be Figure 2 The diagram shows a cross-sectional view of a portion of the backlight module at the BB position. Figure 11 yes Figure 10 The diagram shows a bottom view of the structure. The backlight module includes multiple screws 29. The bottom frame 211, on the side away from the light guide structure 24, has multiple screw holes k2 corresponding to the screws. The screws 29 pass through the lamp panel 221 and are threadedly connected to the corresponding screw holes k2 to connect the lamp panel 221 to the bottom frame 211. This connection structure is a threaded connection structure. Compared to the related technology where the lamp panel is glued to the back panel using thermally conductive tape, the structure provided in this embodiment facilitates the disassembly and installation of the lamp panel 221 without damaging it, thus improving the reworkability and utilization rate of the lamp panel 221.

[0072] In one exemplary embodiment, the back plate 21 is rectangular, and its four corners may have four screw holes k2. Correspondingly, the light source carrier plate 22 includes four screws 29, which pass through the lamp plate 221 and are threaded into the corresponding four screw holes k2 to fix the four corners of the light source carrier plate 22 to the four corners of the back plate 21, thus achieving a stable and robust connection structure. Of course, the back plate 21 can also be in various shapes such as circular, triangular, elliptical, and pentagonal. These shapes of back plates 21 can also be connected to the light source carrier plate 22 by four or other numbers of screws 29. This embodiment does not limit this.

[0073] In one exemplary embodiment, please refer to Figure 12 , Figure 12 yes Figure 2 Another cross-sectional view of the backlight module shown is illustrated. Figure 12 It can be Figure 2 (The diagram shows another cross-sectional structure of the backlight module at AA), wherein the side of the lamp panel 221 away from the light guide structure 24 has multiple lamp panel recesses k3, and the bottom of the lamp panel recesses k3 has lamp panel through holes k4.

[0074] Screw 29 is a countersunk screw, which passes through the through hole k4 in the lamp plate and is threaded into the corresponding screw hole k2 on the bottom frame 211. This structure can reduce the thickness of the light source carrier plate 22, thereby reducing the overall thickness of the backlight module and the display device using the backlight module.

[0075] Optionally, the bottom frame 211 has a second groove j on the side away from the light guide structure 24, and the second groove j communicates with the bottom opening k1; the lamp plate 221 is connected to the bottom of the second groove j. That is, at least a portion of the lamp plate 221 can be disposed in the second groove j on the side of the back plate 21 away from the light guide structure 24, thereby reducing the overall thickness of the structure formed by the back plate 21 and the lamp plate 221, and thus achieving the effect of reducing the overall thickness of the backlight module and the display device using the backlight module.

[0076] It should be noted that the above embodiments provide a first structure for reducing the thickness of the backlight module by forming a countersunk screw and a recess k3 on the lamp board, and a second structure for reducing the thickness of the backlight module by forming a second groove j on the bottom frame 211. The backlight module provided by this utility model embodiment can use the first structure and / or the second structure to reduce the thickness of the backlight module.

[0077] Optionally, the backlight module also includes an adhesive layer 27, which is located between the lamp panel 221 and the bottom frame 211, and is bonded to both the lamp panel 221 and the bottom frame 211. This adhesive layer 27 enables surface connection between the lamp panel 221 and the bottom frame 211, thereby improving the stability of the connection between the lamp panel 221 and the bottom frame 211.

[0078] Optionally, the adhesive layer 27 has an adhesive opening k5, and the screw hole k2 of the bottom frame 211 is located in the orthographic projection of the adhesive opening k5 onto the bottom frame 211. With this structure, the screw 29 can pass through the lamp panel 221 and the adhesive layer 27, and be threadedly connected to the screw hole k2 of the bottom frame 211. This improves the correlation between the threaded connection and the adhesion achieved by the adhesive layer 27, thereby enhancing the stability and robustness of the connection between the bottom frame 211 and the lamp panel 221.

[0079] In addition, the side of the adhesive layer 27 near the bottom opening k1 is flush with the edge of the bottom opening k1, and the side away from the bottom opening k1 is flush with the edge away from the bottom opening k1 on the side of the bottom frame 211 away from the light guide structure 24. This can increase the area of ​​the adhesive layer 27, thereby improving the stability and strength of the bonding between the adhesive layer 27 and the bottom frame 211 and the light panel 221 respectively.

[0080] Optionally, the light guide structure 24 includes a diffuser plate 241 and a plurality of films 242 located on the diffuser plate 241. The plurality of films 242 may include at least one layer selected from quantum dot films, light-diffusing films, and diffuser films. The light guide structure 24 can be used to diffuse and homogenize the light emitted by the light-emitting component 23, and provide the processed light to the display panel.

[0081] In summary, in the backlight module provided by this utility model embodiment, the bottom frame of the back plate has a bottom opening, and the light-emitting component is provided on the light source carrier plate. By setting the light source carrier plate at the bottom opening of the back plate, it is not necessary to set the thermal conductive tape and the plate material supporting the light plate, etc., which simplifies the structure of the backlight module and achieves the effect of reducing the overall thickness of the backlight module.

[0082] Furthermore, since the light source carrier plate is connected to the bottom frame of the backplate in this backlight module, no gap is needed between the light source carrier plate and the backplate, thus reducing the bezel of the display device using this backlight module. Also, since there is no need to use thermally conductive adhesive tape to bond the lamp plate and the backplate in the backlight module, the manufacturing cost of the backlight module can be reduced.

[0083] Furthermore, this embodiment of the present invention also provides a display device, which includes any of the backlight modules provided in the above embodiments. Additionally, the display device may also include components such as a display panel, control components, a power supply component, and a housing; this embodiment of the present invention does not impose limitations on these components. Optionally, the display panel may be a liquid crystal display (LCD) panel.

[0084] This display device can be applied to various devices with display functions, such as various means of transportation (such as vehicles, aircraft and ships), smartphones, smart wearable devices, laptops, desktop computers, tablets, vertical monitors, outdoor advertising screens and digital cameras, etc., and this utility model embodiment does not limit it in this regard.

[0085] Since the display device is applied to the backlight module provided in the above-described embodiments of the present invention, the display device also possesses the effects of the aforementioned backlight module. For example, by applying this backlight module, the heat dissipation capacity of the display device can be improved, as well as the lifespan and display effect of the display device can be enhanced.

[0086] In summary, in the backlight module of the display device provided by this utility model embodiment, the bottom frame of the back plate has a bottom opening, and a light-emitting component is provided on the light source carrier plate. By setting the light source carrier plate at the bottom opening of the back plate, it is not necessary to set up structures such as lamp board, heat-conducting tape and board material for supporting lamp board, which simplifies the structure of the backlight module and achieves the effect of reducing the overall thickness of the backlight module.

[0087] In addition, since the light source carrier plate is connected to the bottom frame of the back plate in this display device, there is no need to set a gap between the light source carrier plate and the back plate, thus achieving the effect of reducing the bezel of the display device.

[0088] Furthermore, since there is no need to use thermally conductive adhesive tape in the backlight module to bond the lamp plate and the back plate, the manufacturing cost of the display device can be reduced.

[0089] In this utility model, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0090] In this utility model, the term "at least one of A and B" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, "at least one of A and B" can represent: A existing alone, A and B existing simultaneously, and B existing alone. Similarly, "at least one of A, B, and C" can represent seven relationships, including: A existing alone, B existing alone, C existing alone, A and B existing simultaneously, A and C existing simultaneously, C and B existing simultaneously, and A, B, and C existing simultaneously. Likewise, "at least one of A, B, C, and D" can represent fifteen relationships, including: A existing alone, B existing alone, C existing alone, D existing alone, A and B existing simultaneously, A and C existing simultaneously, A and D existing simultaneously, C and B existing simultaneously, D and B existing simultaneously, C and D existing simultaneously, A, B, and C existing simultaneously, A, B, and D existing simultaneously, A, C, and D existing simultaneously, and B, C, and D existing simultaneously.

[0091] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0092] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0093] The above description is only an optional embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A backlight module, characterized in that, The backlight module includes; A back panel, the back panel including a bottom frame and a bottom opening located on the bottom frame; The light source carrier plate and the light-emitting component are provided. The light source carrier plate is located at the bottom opening and is connected to the bottom frame. The light source carrier plate has a first side and a second side facing each other. The light-emitting component is disposed on the first side of the light source carrier plate. The bottom frame has a support platform on the side away from the second side of the light source carrier plate. A light guide structure is located on the support platform of the bottom frame.

2. The backlight module according to claim 1, characterized in that, The light source carrier plate and the bottom frame are an integral structure.

3. The backlight module according to claim 2, characterized in that, The light-emitting component includes multiple light-emitting units located on the light source carrier plate and connecting lines, the connecting lines being connected to the light-emitting units.

4. The backlight module according to claim 3, characterized in that, The backlight module further includes a target pattern layer, which includes a plurality of first grooves, and the connecting lines are located in the plurality of first grooves.

5. The backlight module according to claim 3, characterized in that, The backlight module also includes a reflective protective layer, which covers the connection lines.

6. The backlight module according to claim 1, characterized in that, The light source carrier plate is a lamp plate, and the lamp plate is connected to the bottom frame.

7. The backlight module according to claim 6, characterized in that, The backlight module also includes multiple screws. The bottom frame has multiple screw holes corresponding to the screws on the side away from the light guide structure. The screws pass through the lamp plate and are threaded into the corresponding screw holes to connect the lamp plate to the bottom frame.

8. The backlight module according to claim 7, characterized in that, The lamp panel has multiple lamp panel recesses on the side away from the light guide structure, and the bottom of the lamp panel recesses has lamp panel through holes; The screw is a countersunk screw, which passes through the through hole of the lamp panel and is threaded into the corresponding screw hole on the bottom frame.

9. The backlight module according to claim 7, characterized in that, The backlight module also includes an adhesive layer, which is located between the lamp panel and the bottom frame and is bonded to both the lamp panel and the bottom frame.

10. The backlight module according to claim 9, characterized in that, The adhesive layer has an adhesive layer opening, and the screw hole of the bottom frame is located in the orthographic projection of the adhesive layer opening on the bottom frame.

11. The backlight module according to claim 6, characterized in that, The bottom frame has a second groove on the side away from the light guide structure, and the second groove communicates with the bottom opening; The lamp panel is connected to the bottom of the second groove.

12. The backlight module according to any one of claims 1 to 11, characterized in that, The light guide structure includes a diffuser plate and multiple films located on the diffuser plate.

13. A display device, characterized in that, The display device includes the backlight module as described in any one of claims 1 to 12.

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