Gas flow temperature control device for wafer inspection
By setting up heating branches and insulation pipes in the wafer inspection device, the problem of heat loss of gas from the heating area to the gas-using equipment is solved, achieving precise control of gas temperature and reducing heat loss, ensuring that the gas temperature sent to the gas-using equipment meets the requirements.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN LAIFENG FLUID EQUIP MFG CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-07-14
AI Technical Summary
During the wafer heating process, there is heat loss between the gas and the gas-using equipment, resulting in the gas temperature entering the gas-using equipment not meeting the standard.
A heating branch and an insulation pipe are installed. The gas is heated by the heating branch and the heat loss is reduced by the insulation pipe, ensuring that the gas temperature meets the requirements when it is sent to the gas-using equipment.
It achieves precise control of gas temperature and reduces heat loss, ensuring that the gas temperature supplied to the gas-using equipment meets the usage requirements.
Smart Images
Figure CN224501209U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of gas temperature control devices, and in particular to a gas flow and temperature control device for wafer inspection. Background Technology
[0002] With the continuous development of many technological fields such as aerospace, automotive electronics, and military applications, the application of chips in various extreme temperature environments is becoming more and more widespread. In the research and development and production of chips, high and low temperature testing of wafers has become increasingly important. When high temperature testing is used, the wafer needs to be heated. In related technologies, the following problems exist in the wafer heating process: the gas is sent into the gas-using equipment only after the heating area is heated to the target temperature. However, there is heat loss between the heating area and the gas-using equipment, which often results in the gas temperature sent into the gas-using equipment not meeting the standard. Utility Model Content
[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a gas flow and temperature control device for wafer inspection. By setting up a heating branch, the gas can be heated to meet the different temperature requirements of the gas-using equipment. At the same time, by setting up a heat insulation pipe, the heat loss of the heated gas can be minimized during the process from heating to delivery to the gas-using equipment, ensuring that the temperature of the gas delivered to the gas-using equipment meets the usage requirements.
[0004] The objective of this utility model is achieved through the following technical solution:
[0005] A gas flow and temperature control device for wafer inspection includes a main gas path and a heating branch. The main gas path includes a first solenoid valve, a gas mass flow controller, and a second solenoid valve arranged in sequence. The inlet of the heating branch is located between the gas mass flow controller and the second solenoid valve, and the outlet of the heating branch is located between the second solenoid valve and the gas-using equipment.
[0006] The heating branch includes a third solenoid valve and a heater arranged in sequence.
[0007] Furthermore, the heating branch is also equipped with a temperature sensor for detecting the gas temperature at the outlet of the heating branch, and the temperature sensor is located between the gas-using equipment and the heater.
[0008] Furthermore, the main gas line is also equipped with a first pressure sensor and a second pressure sensor. The first pressure sensor is located between the main gas line inlet and the first solenoid valve, and the second pressure sensor is located at the outlet of the heating branch.
[0009] Furthermore, the first solenoid valve, the gas mass flow controller, the second solenoid valve, and the third solenoid valve and the heater are connected by pipelines.
[0010] Furthermore, an insulation pipe is provided outside the pipeline between the heater and the gas-using equipment.
[0011] Furthermore, the insulation pipe is made of insulation material.
[0012] Furthermore, the insulation material is polyurethane, polyethylene, or rock wool.
[0013] The beneficial effects of this utility model are:
[0014] This invention can heat the gas by setting up a heating branch to meet the different temperature requirements of gas-using equipment. At the same time, by setting up an insulation pipe, it can ensure that the heat loss of the heated gas is small during the process from heating to delivery to the gas-using equipment, and ensure that the temperature of the gas delivered to the gas-using equipment meets the usage requirements. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of the gas flow and temperature control device for wafer inspection in this embodiment of the present invention;
[0016] In the diagram, 1 is the first solenoid valve; 2 is the gas mass flow controller; 3 is the second solenoid valve; 4 is the third solenoid valve; 5 is the heater; 6 is the first pressure sensor; and 7 is the second pressure sensor. Detailed Implementation
[0017] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0018] See Figure 1 This utility model provides a technical solution:
[0019] Example:
[0020] like Figure 1 As shown, a gas flow and temperature control device for wafer inspection includes a main gas path and a heating branch. The main gas path includes a first pressure sensor 6, a first solenoid valve 1, a gas mass flow controller 2, a second solenoid valve 3, and a second pressure sensor 7 arranged sequentially. The gas inlet of the heating branch is located between the gas mass flow controller 2 and the second solenoid valve 3, and the gas outlet of the heating branch is located between the second solenoid valve 3 and the gas-using equipment.
[0021] The heating branch includes a third solenoid valve 4 and a heater 5 arranged in sequence.
[0022] The heating branch is also equipped with a temperature sensor for detecting the gas temperature at the outlet of the heating branch. The temperature sensor is located between the gas-using equipment and the heater 5.
[0023] The first solenoid valve 1, the gas mass flow controller 2, the second solenoid valve 3, the third solenoid valve 4, and the heater 5 are connected by pipelines.
[0024] The pipeline between the heater 5 and the gas-using equipment is externally insulated with a heat-insulating pipe made of one of the following materials: polyurethane, polyethylene, or rock wool.
[0025] In use, the gas mass flow controller 2 is used to precisely control the gas intake to ensure the gas supply to the gas-using equipment. When the second solenoid valve 3 is open and the third solenoid valve 4 is closed, the gas is directly supplied to the gas-using equipment, which can be used for purging or supplying room temperature gas.
[0026] When the third solenoid valve 4 is open and the second solenoid valve 3 is closed, the gas is heated to the target temperature by the heater 5 on the heating branch before being sent to the gas-using equipment. As the heated gas is sent out, the temperature sensor collects the temperature of the heated gas in real time. If the temperature after heating does not reach the target value, the heater 5 is controlled to increase its power, thereby increasing the gas heating temperature. Due to the insulation pipe, the heated gas experiences minimal heat loss during the process from heating to delivery to the gas-using equipment, ensuring that the temperature of the gas delivered to the equipment meets the usage requirements.
[0027] This invention can heat the gas by setting up a heating branch to meet the different temperature requirements of gas-using equipment. At the same time, by setting up an insulation pipe, it can ensure that the heat loss of the heated gas is small during the process from heating to delivery to the gas-using equipment, and ensure that the temperature of the gas delivered to the gas-using equipment meets the usage requirements.
[0028] The above description is merely a preferred embodiment of this utility model. It should be understood that this utility model is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of this utility model should fall within the protection scope of the appended claims.
Claims
1. A gas flow and temperature control device for wafer inspection, characterized in that: It includes a main gas path and a heating branch. The main gas path includes a first solenoid valve, a gas mass flow controller, and a second solenoid valve arranged in sequence. The inlet of the heating branch is located between the gas mass flow controller and the second solenoid valve. The outlet of the heating branch is located between the second solenoid valve and the gas-using equipment. The heating branch includes a third solenoid valve and a heater arranged in sequence.
2. The gas flow and temperature control device for wafer inspection according to claim 1, characterized in that: The heating branch is also equipped with a temperature sensor for detecting the gas temperature at the outlet of the heating branch. The temperature sensor is located between the gas-using equipment and the heater.
3. The gas flow and temperature control device for wafer inspection according to claim 1, characterized in that: The main gas line is also equipped with a first pressure sensor and a second pressure sensor. The first pressure sensor is located between the main gas line inlet and the first solenoid valve, and the second pressure sensor is located at the outlet of the heating branch.
4. The gas flow and temperature control device for wafer inspection according to claim 1, characterized in that: The first solenoid valve, the gas mass flow controller, the second solenoid valve, and the third solenoid valve and the heater are connected by pipelines.
5. The gas flow and temperature control device for wafer inspection according to claim 4, characterized in that: The pipeline between the heater and the gas-using equipment is externally insulated.
6. The gas flow and temperature control device for wafer inspection according to claim 5, characterized in that: The insulation pipe is made of insulation material.
7. The gas flow and temperature control device for wafer inspection according to claim 6, characterized in that: The insulation material is polyurethane, polyethylene, or rock wool.