Semiconductor temperature control box
By integrating a double-layer box structure with thermoelectric module group, heat conduction component, heat dissipation component and temperature sensor array, the problem of temperature control accuracy and response speed of traditional temperature control equipment in semiconductor manufacturing is solved, and efficient temperature control and uniformity are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG BOSHENG ELECTRONIC TECH CO LTD
- Filing Date
- 2025-08-29
- Publication Date
- 2026-07-14
AI Technical Summary
Traditional temperature control equipment in semiconductor manufacturing suffers from problems such as low temperature control accuracy, slow thermal response speed, low heat dissipation efficiency of thermoelectric modules, and unreasonable temperature sensor layout, making it difficult to meet the high temperature accuracy requirements of semiconductor processes.
It adopts an integrated design of double-layer box structure, thermoelectric module group, heat conduction component, heat dissipation component, temperature sensor array and control unit, combined with vacuum insulation cavity and heat spreader phase change material to achieve high-precision and fast-response temperature control.
It achieves high-precision and fast-response temperature control, ensuring uniform and stable temperature distribution, and improving the thermal response speed and heat dissipation efficiency of temperature control equipment.
Smart Images
Figure CN224501210U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, specifically to a semiconductor temperature control box. Background Technology
[0002] Semiconductor manufacturing processes require extremely high temperature control, and traditional temperature control equipment suffers from the following problems:
[0003] Low temperature control accuracy makes it difficult to meet the high temperature precision requirements of semiconductor processes.
[0004] It has a slow thermal response and cannot quickly adapt to temperature changes.
[0005] The thermoelectric module has low heat dissipation efficiency, which leads to unstable equipment operation.
[0006] The temperature sensor layout is unreasonable, making it impossible to fully monitor the temperature distribution inside the enclosure.
[0007] Based on the above, this utility model proposes a semiconductor temperature control box, which can effectively solve the above problems. Utility Model Content
[0008] The purpose of this invention is to provide a semiconductor temperature control box. This semiconductor temperature control box integrates a thermoelectric module group, a heat-conducting component, a heat dissipation component, a temperature sensor array, and a control unit, achieving high-precision and rapid-response temperature control. The double-layer box structure and vacuum insulation cavity effectively isolate external heat, improving the insulation effect.
[0009] This utility model is achieved through the following technical solution:
[0010] A semiconductor temperature control box includes a box body, a thermoelectric module assembly, a heat-conducting component, a heat dissipation component, a temperature sensor array, and a control unit. The box body has a double-layer structure, with an inner heat-insulating layer and an outer mechanical support layer. A vacuum insulation cavity is provided between the inner and outer layers. The heat-conducting component includes a heat-conducting plate and heat-conducting fins. The thermoelectric module assembly is installed inside the vacuum insulation cavity. The heat-conducting fins are disposed on the surface of the heat-conducting plate and in contact with the thermoelectric module assembly. The heat dissipation component includes a fan and heat dissipation fins. The fan is fixed to the outside of the box body by bolts and is directly opposite the heat dissipation fins. The temperature sensor array is arranged at different positions inside the box body. The control unit is installed on the outside of the box body and is electrically connected to the thermoelectric module assembly, the fan, and the temperature sensor array.
[0011] The purpose of this invention is to provide a semiconductor temperature control box. This semiconductor temperature control box integrates a thermoelectric module group, a heat-conducting component, a heat dissipation component, a temperature sensor array, and a control unit, achieving high-precision and rapid-response temperature control. The double-layer box structure and vacuum insulation cavity effectively isolate external heat, improving the insulation effect.
[0012] Preferably, the thermoelectric module group is composed of multiple Peltier elements connected in series, with the cold end of each Peltier element in contact with the heat-conducting fins and the hot end of each Peltier element in contact with the heat dissipation fins.
[0013] Preferably, the heat-conducting component further includes a heat-spreading plate, which is embedded in the central area of the heat-conducting plate and fixed by a welding process, and the heat-spreading plate is filled with a phase change material.
[0014] Preferably, the edge of the heat spreader is provided with a plurality of heat-conducting columns, which pass through the heat spreader and contact the inner wall of the box.
[0015] Preferably, the temperature sensor array consists of multiple high-precision digital temperature sensors, which are fixed to different height positions on the inner wall of the box by clips, and the distance between any two adjacent high-precision digital temperature sensors is 10mm.
[0016] Compared with the prior art, this utility model has the following advantages and beneficial effects:
[0017] This novel semiconductor temperature control box integrates a thermoelectric module group, a heat-conducting component, a heat dissipation component, a temperature sensor array, and a control unit, achieving high-precision and rapid-response temperature control. The double-layered box structure and vacuum insulation cavity effectively isolate external heat, improving insulation performance. The thermoelectric module group contacts the heat-conducting plate through heat-conducting fins, ensuring rapid heat transfer. The design of the heat spreader and phase change material further improves heat conduction efficiency, and the placement of heat-conducting pillars enhances the uniformity of heat conduction. The rational layout of the temperature sensor array enables comprehensive monitoring of the box's internal temperature, and the intelligent design of the control unit achieves precise temperature control. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of this utility model. Detailed Implementation
[0019] To enable those skilled in the art to better understand the technical solution of this utility model, the preferred embodiments of this utility model are described below in conjunction with specific examples. However, it should be understood that the accompanying drawings are for illustrative purposes only and should not be construed as limiting this patent. For better illustration of this embodiment, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual product dimensions. It is understandable that some well-known structures and their descriptions may be omitted in the drawings for those skilled in the art. The positional relationships described in the drawings are for illustrative purposes only and should not be construed as limiting this patent.
[0020] Example 1:
[0021] like Figure 1 As shown, this utility model provides a semiconductor temperature control box, including a box body, a thermoelectric module group, a heat-conducting component, a heat dissipation component, a temperature sensor array, and a control unit. The box body has a double-layer structure, with an inner heat insulation layer and an outer mechanical support layer. A vacuum insulation cavity is provided between the inner and outer layers. The heat-conducting component includes a heat-conducting plate and heat-conducting fins. The thermoelectric module group is installed in the vacuum insulation cavity. The heat-conducting fins are disposed on the surface of the heat-conducting plate and in contact with the thermoelectric module group. The heat dissipation component includes a fan and heat dissipation fins. The fan is fixed to the outside of the box body by bolts and is directly opposite the heat dissipation fins. The temperature sensor array is arranged in different positions inside the box body. The control unit is installed on the outside of the box body and is electrically connected to the thermoelectric module group, the fan, and the temperature sensor array respectively.
[0022] Example 2:
[0023] like Figure 1 As shown, this utility model provides a semiconductor temperature control box, including a box body 1, a thermoelectric module group 2, a heat-conducting component 3, a heat dissipation component 4, a temperature sensor array, and a control unit 6. The box body 1 has a double-layer structure, with an inner heat insulation layer 7 and an outer mechanical support layer 8. A vacuum insulation cavity 9 is provided between the inner and outer layers. The heat-conducting component 3 includes a heat-conducting plate 10 and heat-conducting fins 11. The thermoelectric module group 2 is installed in the vacuum insulation cavity 9. The heat-conducting fins 11 are disposed on the surface of the heat-conducting plate 10 and are in contact with the thermoelectric module group 2. The heat dissipation component 4 includes a fan 12 and heat dissipation fins 13. The fan 12 is fixed to the outside of the box body 1 by bolts, and the fan 12 is directly opposite the heat dissipation fins 13. The temperature sensor array 5 is arranged in different positions inside the box body 1. The control unit 6 is installed on the outside of the box body 1 and is electrically connected to the thermoelectric module group 2, the fan 12, and the temperature sensor array 5 respectively.
[0024] By integrating the thermoelectric module group 2, the heat-conducting component 3, the heat dissipation component 4, the temperature sensor array 5, and the control unit 6 into a double-layered enclosure 1, a highly efficient and compact temperature control system is formed. The double-layered structure and the vacuum insulation cavity 9 effectively isolate external heat, improve insulation performance, and reduce energy loss. The rational design of the heat-conducting component 3 and the heat dissipation component 4 ensures rapid heat transfer and dissipation, improving temperature control efficiency. The combination of the temperature sensor array 5 and the control unit 6 enables precise monitoring and control of the internal temperature of the enclosure 1, ensuring temperature stability.
[0025] The thermoelectric module group 2 is composed of multiple Peltier elements connected in series. The cold end of each Peltier element is in contact with the heat-conducting fin 11, and the hot end of each Peltier element is in contact with the heat dissipation fin 13.
[0026] The cold and hot ends of the Peltier element are in contact with the heat-conducting fins 11 and the heat dissipation fins 13, respectively, forming an efficient heat conduction path to ensure uniform temperature distribution inside the housing 1.
[0027] Furthermore, in another embodiment, the heat-conducting component 3 further includes a heat-spreading plate 14, which is embedded in the central region of the heat-conducting plate 10 and fixed by a welding process, and the heat-spreading plate 14 is filled with a phase change material.
[0028] The heat spreader 14 is embedded in the central area of the heat conduction plate 10 and fixed by welding. Its interior is filled with phase change material, further improving heat transfer efficiency and ensuring uniform heat distribution. The embedded design and welding process of the heat spreader 14 ensure the structural stability of the heat conduction component 3, preventing a decrease in heat transfer efficiency due to vibration.
[0029] Furthermore, in another embodiment, the edge of the heat spreader 14 is provided with a plurality of heat-conducting columns 15, which pass through the heat spreader 10 and contact the inner wall of the housing 1.
[0030] The heat-conducting pillars 15 at the edge of the heat spreader 14 pass through the heat-conducting plate 10 and contact the inner wall of the housing 1, further enhancing the uniformity of heat conduction and ensuring a more uniform temperature distribution inside the housing 1. The design of the heat-conducting pillars 15 not only improves heat conduction efficiency but also enhances heat dissipation, ensuring the stability of the equipment under high load operation.
[0031] Furthermore, in another embodiment, the temperature sensor array 5 is composed of multiple high-precision digital temperature sensors 5, which are fixed to different height positions on the inner wall of the housing 1 by clips, and the distance between any two adjacent high-precision digital temperature sensors 5 is 10mm.
[0032] The temperature sensor array 5 consists of multiple high-precision digital temperature sensors 5, which are fixed to different height positions on the inner wall of the enclosure 1 by clips to ensure comprehensive monitoring of the internal temperature of the enclosure 1.
[0033] Based on the description and drawings of this utility model, those skilled in the art can easily manufacture or use the semiconductor temperature control box of this utility model, and can produce the positive effects described in this utility model.
[0034] Unless otherwise specified, in this utility model, terms such as "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe orientation or positional relationships in this utility model are for illustrative purposes only and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood in conjunction with the accompanying drawings and according to the specific circumstances.
[0035] Unless otherwise expressly specified and limited, the terms "set up," "connected," and "linked" in this utility model should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0036] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any simple modifications or equivalent changes made to the above embodiments based on the technical essence of the present utility model shall fall within the protection scope of the present utility model.
Claims
1. A semiconductor temperature control box, characterized in that: The device includes a housing, a thermoelectric module assembly, a heat-conducting component, a heat dissipation component, a temperature sensor array, and a control unit. The housing has a double-layer structure, with an inner thermal insulation layer and an outer mechanical support layer. A vacuum insulation cavity is provided between the inner and outer layers. The heat-conducting component includes a heat-conducting plate and heat-conducting fins. The thermoelectric module assembly is installed inside the vacuum insulation cavity. The heat-conducting fins are disposed on the surface of the heat-conducting plate and in contact with the thermoelectric module assembly. The heat dissipation component includes a fan and heat dissipation fins. The fan is fixed to the outside of the housing with bolts and is directly opposite the heat dissipation fins. The temperature sensor array is arranged in different positions inside the housing. The control unit is installed on the outside of the housing and is electrically connected to the thermoelectric module assembly, the fan, and the temperature sensor array.
2. The semiconductor temperature control box according to claim 1, characterized in that: The thermoelectric module group is composed of multiple Peltier elements connected in series. The cold end of each Peltier element is in contact with the heat-conducting fins, and the hot end of each Peltier element is in contact with the heat dissipation fins.
3. The semiconductor temperature control box according to claim 1, characterized in that: The heat-conducting component also includes a heat-spreading plate, which is embedded in the central area of the heat-conducting plate and fixed by welding. The heat-spreading plate is filled with a phase change material.
4. The semiconductor temperature control box according to claim 3, characterized in that: The edge of the heat spreader is provided with several heat-conducting columns, which pass through the heat spreader and contact the inner wall of the box.
5. The semiconductor temperature control box according to claim 1, characterized in that: The temperature sensor array consists of multiple high-precision digital temperature sensors, which are fixed to different height positions on the inner wall of the box by clips, and the distance between any two adjacent high-precision digital temperature sensors is 10mm.