Mini-itx motherboard with high anti-seismic performance and double memory structure thereof

Abstract

The utility model discloses a kind of Mini-ITX mainboard of high anti-seismic performance and its double memory structure, it is related to mainboard technical field.The Mini-ITX mainboard of high anti-seismic performance and its double memory structure, include: main body;Support frame, fixedly set in main body bottom end, the support frame is hollow;Buffer frame, slidingly set in support frame side, the buffer frame is symmetrically set;Sliding rod, fixedly set in support frame inside bottom surface, the sliding rod outer surface is equipped with first buffer spring.The Mini-ITX mainboard of high anti-seismic performance and its double memory structure, by the effect of connecting rod, push block, first buffer spring, when main body is impacted by outside, it will slide on buffer frame, in the process of sliding, push block is under the action of connecting rod and slides on sliding rod and promotes first buffer spring to contract, so that first buffer spring will inertia be absorbed and stored, realize the buffering effect to main body, improve the anti-seismic performance of mainboard.

Description

Technical Field

[0001] This utility model relates to the field of motherboard technology, specifically to a Mini-ITX motherboard with high shock resistance and its dual memory structure. Background Technology

[0002] Mini-ITX motherboards are miniaturized computer motherboards characterized by low power consumption, small size, and high integration. They are mainly used in home theater computers, small office computers, portable computers, and embedded systems.

[0003] Currently, traditional shockproof methods simply use a casing to protect the motherboard. However, the casing cannot adequately protect the motherboard, and the shockproof effect is not good. When the device is bumped or dropped, the resulting impact can easily damage the motherboard, rendering it unusable, thus resulting in poor shockproof performance of the motherboard. Utility Model Content

[0004] The purpose of this invention is to provide a Mini-ITX motherboard with high shock resistance and its dual memory structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a Mini-ITX motherboard with high shock resistance and its dual memory structure, comprising: a main body; a support frame, fixedly disposed at the bottom of the main body, the support frame being hollow; a buffer frame, slidably disposed on the side of the support frame, the buffer frames being symmetrically arranged; a sliding rod, fixedly disposed on the inner bottom surface of the support frame, the outer surface of the sliding rod being sleeved with a first buffer spring; a push block, slidably disposed on the surface of the sliding rod, one side of the push block being fixedly disposed at one end of the first buffer spring; and a connecting rod, rotatably connected to the bottom end of the push block, the other end of the connecting rod being rotatably disposed on the inner bottom surface of the buffer frame.

[0006] Preferably, it further includes: a positioning rod, fixedly mounted on the buffer frame, the outer surface of the positioning rod being slidably mounted inside the main body and the support frame respectively; a second buffer spring, sleeved on the positioning rod; and a limiting cover, fixedly mounted on the top of the positioning rod, the two ends of the second buffer spring abutting against the surface of the limiting cover and the surface of the main body respectively.

[0007] Preferably, it further includes: an isolation pad, which is fixedly disposed on the main body, and one end of the second buffer spring is in contact with the surface of the isolation pad.

[0008] Preferably, it further includes: a square through hole, which is opened through the side of the buffer frame; and a slider, which is fixedly disposed on the side of the support frame, wherein the outer surface of the slider is slidably disposed with respect to the inside of the square through hole.

[0009] Preferably, it further includes: a rubber pad, fixedly disposed on the top of the support frame, the top of the rubber pad being fixedly disposed with the bottom of the main body; and a buffer through hole, which is formed through the rubber pad and is elliptical in shape.

[0010] A dual-memory structure, including the Mini-ITX motherboard described in any of the above claims, further includes: two card slots fixedly disposed on the main body, the card slots being electrically connected to the main body; a memory module inserted into the card slots; and a fixing clip rotatably disposed on the card slots, wherein the fixing clip is configured to fix the memory module when it is engaged with the memory module.

[0011] This invention provides a Mini-ITX motherboard with high shock resistance and its dual-memory structure, which has the following advantages:

[0012] This invention utilizes the linkage, push block, and first buffer spring to allow the main body to slide on the buffer frame when subjected to external impact. During the sliding process, the push block slides on the sliding rod under the action of the linkage and pushes the first buffer spring to contract, so that the first buffer spring absorbs and stores the inertia, thereby achieving a buffering effect on the main body and improving the shock resistance of the main body. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram showing the overall structure of this utility model.

[0015] Figure 3 This is an exploded view of the structure on the buffer frame of this utility model;

[0016] Figure 4 This is an exploded view of the structure between the card slot and the memory module in this utility model.

[0017] In the diagram: 1. Main body; 2. Support frame; 3. Buffer frame; 4. Sliding rod; 5. First buffer spring; 6. Push block; 7. Connecting rod; 8. Positioning rod; 9. Second buffer spring; 10. Isolation pad; 11. Rubber pad; 12. Buffer through hole; 13. Square through hole; 14. Slider; 15. Limiting cover; 16. Card seat; 17. Fixing buckle; 18. Memory module. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0019] This utility model provides a technical solution: Referring to 1-4, in this embodiment, a Mini-ITX motherboard with high shock resistance includes: a main body 1; a support frame 2, fixedly disposed at the bottom of the main body 1, the support frame 2 being hollow; a buffer frame 3, slidably disposed on the side of the support frame 2, the buffer frames 3 being symmetrically arranged; a sliding rod 4, fixedly disposed on the inner bottom surface of the support frame 2, the outer surface of the sliding rod 4 being sleeved with a first buffer spring 5; a push block 6, slidably disposed on the surface of the sliding rod 4, one side of the push block 6 being fixedly disposed at one end of the first buffer spring 5; and a connecting rod 7, rotatably connected to the bottom end of the push block 6, the other end of the connecting rod 7 being rotatably disposed on the inner bottom surface of the buffer frame 3. The buffer frame 3 provides flexible support for the main body 1, the support frame 2 protects the main body 1 from impact damage, and the connecting rod 7 adjusts the position of the first buffer spring 5 according to the positions of the buffer frame 3 and the main body 1, thereby achieving a buffering effect.

[0020] It also includes: a positioning rod 8, which is fixedly mounted on the buffer frame 3, with its outer surface slidingly disposed inside the main body 1 and the support frame 2 respectively; a second buffer spring 9, which is sleeved on the positioning rod 8; and a limiting cover 15, which is fixedly mounted on the top of the positioning rod 8, with the two ends of the second buffer spring 9 abutting against the surface of the limiting cover 15 and the surface of the main body 1 respectively. By setting the positioning rod 8, the buffer frame 3 can be positioned to prevent tilting. By setting the second buffer spring 9, pressure can be applied to the main body 1, so that the main body 1 can maintain balance under the action of the first buffer spring 5 and the second buffer spring 9, thereby improving the stability of the main body 1 under normal conditions.

[0021] It also includes: an isolation pad 10, which is fixedly installed on the main body 1, and one end of the second buffer spring 9 is in contact with the surface of the isolation pad 10, which can protect the main body 1 and prevent the pressure applied by the second buffer spring 9 from damaging the main body 1.

[0022] It also includes: a square through hole 13, which is opened through the side of the buffer frame 3; and a slider 14, which is fixedly installed on the side of the support frame 2. The outer surface of the slider 14 is slidably installed inside the square through hole 13, which can limit the range of motion of the main body 1 and prevent it from falling off.

[0023] It also includes: a rubber pad 11, which is fixedly installed on the top of the support frame 2, with the top of the rubber pad 11 fixedly installed to the bottom of the main body 1; and a buffer through hole 12, which is opened through the rubber pad 11. The buffer through hole 12 is elliptical in shape and can provide flexible buffering to improve the buffering effect.

[0024] In this embodiment, a dual memory structure includes: two card slots 16, which are fixedly disposed on the main body 1 and electrically connected to the main body 1; a memory module 18, which is inserted into the card slot 16; and a fixing buckle 17, which is rotatably disposed on the card slot 16, and when the fixing buckle 17 is configured to engage with the memory module 18, the memory module 18 is fixed.

[0025] This invention provides a Mini-ITX motherboard with high shock resistance and its dual-memory structure. The specific working principle is as follows:

[0026] When the main body 1 is subjected to external impact, it will slide on the buffer frame 3. During the sliding process, the push block 6 slides on the sliding rod 4 under the action of the connecting rod 7 and pushes the first buffer spring 5 to contract, so that the first buffer spring 5 absorbs and stores the inertia and buffers the main body 1.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A Mini-ITX motherboard with high shock resistance, characterized in that: include: Main body (1); The support frame (2) is fixedly installed at the bottom of the main body (1), and the support frame (2) is hollow; The buffer frame (3) is slidably disposed on the side of the support frame (2), and the buffer frame (3) is symmetrically disposed; A sliding rod (4) is fixedly installed on the bottom surface inside the support frame (2), and a first buffer spring (5) is sleeved on the outer surface of the sliding rod (4). Push block (6) is slidably disposed on the surface of sliding rod (4), and one side of push block (6) is fixedly disposed at one end of first buffer spring (5); The connecting rod (7) is rotatably connected to the bottom end of the push block (6), and the other end of the connecting rod (7) is rotatably set on the bottom surface inside the buffer frame (3).

2. The Mini-ITX motherboard with high shock resistance according to claim 1, characterized in that: Also includes: The positioning rod (8) is fixedly installed on the buffer frame (3), and the outer surface of the positioning rod (8) is slidably installed inside the main body (1) and the support frame (2); The second buffer spring (9) is sleeved on the positioning rod (8); The limiting cover (15) is fixedly installed at the top of the positioning rod (8), and the two ends of the second buffer spring (9) abut against the surface of the limiting cover (15) and the surface of the main body (1), respectively.

3. A Mini-ITX motherboard with high shock resistance according to claim 2, characterized in that: Also includes: An isolation pad (10) is fixedly mounted on the main body (1), and one end of the second buffer spring (9) is in contact with the surface of the isolation pad (10).

4. A Mini-ITX motherboard with high shock resistance according to claim 3, characterized in that: Also includes: A square through hole (13) is opened through the side of the buffer frame (3); The slider (14) is fixedly installed on the side of the support frame (2), and the outer surface of the slider (14) slides inside the square through hole (13).

5. A Mini-ITX motherboard with high shock resistance according to claim 1, characterized in that: Also includes: A rubber pad (11) is fixedly installed at the top of the support frame (2), and the top of the rubber pad (11) is fixedly installed at the bottom of the main body (1); A buffer through hole (12) is formed through the rubber pad (11), and the buffer through hole (12) is elliptical in shape.

6. A dual-memory structure, characterized in that, Including the Mini-ITX motherboard according to any one of claims 1-5, further comprising: Two card holders (16) are fixedly mounted on the main body (1), and the card holders (16) are electrically connected to the main body (1); The memory module (18) is inserted into the card slot (16); The fixing buckle (17) is rotatably set on the card holder (16). When the fixing buckle (17) is set to engage with the memory stick (18), the memory stick (18) is fixed.

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