An adaptive graphics card cooling fin structure

Abstract

The utility model relates to a display card heat dissipation technical field, concretely discloses a kind of self-adapting display card heat dissipation fin structure, including heat-conducting plate and PLC controller, the upper surface of the heat-conducting plate is fixedly connected with fixed frame, the upper surface of the heat-conducting plate is fixedly connected with the fin main body of equidistance arrangement, the upper surface of the fixed frame is fixedly connected with protection frame, display card temperature is monitored in real time by temperature sensor, PLC controller is automatically started exhaust fan and semiconductor refrigeration piece according to preset temperature threshold, realize intelligent heat dissipation, when temperature is far more than limit value, PLC controller can quickly start semiconductor refrigeration piece and carry out rapid cooling, display card temperature and heat dissipation state can be shown in real time by real-time monitoring module, ensure that according to the actual heat output of display card automatically adjust heat dissipation efficiency, adapt to different environmental temperature and display card load condition, ensure that display card is always within limited temperature, guarantee the normal operation and performance of display card play.

Description

TECHNICAL FIELD

[0001] The utility model relates to a display card heat dissipation technical field especially a self -adaptation display card heat dissipation fin structure. BACKGROUND

[0002] The display card heat dissipation is due to the display card core operating frequency and the display memory operating frequency's unceasingly climbing, and the display card chip's heat release quantity is also in the rapid promotion, and the transistor quantity of display chip has reached, even more than the quantity in CPU, such high integration degree inevitably brought the increase of heat release quantity, in order to solve these problems, the display card will adopt the necessary heat dissipation mode, especially for the overclocking hobbyist and the user needing long time work, and the excellent heat dissipation mode is the optional item of the selection display card.

[0003] With the rapid development of computer technology, as the core component of computer graphics processing, the performance of the display card is continuously improved, and the application scenarios are increasingly widespread, from simple office drawing to complex 3D games, professional graphic design, video rendering and artificial intelligence computing, the computing power and power consumption of the display card are rapidly increasing, however, although the traditional heat dissipation fin structure can meet the heat dissipation demand to a certain extent, when facing different environmental temperatures, different load conditions and changes in the heat release quantity of the display card chip, the heat dissipation efficiency is not optimized, which easily leads to performance degradation of the display card, and even causes such faults as freezing, thereby failing to meet the needs of users, therefore, we propose a self-adaptive display card heat dissipation fin structure to solve the above problems. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of self-adaptive display card heat dissipation fin structure, solve the problem that when facing different environmental temperatures, different load conditions and changes in the heat release quantity of the display card chip, the heat dissipation efficiency is not optimized, which easily leads to performance degradation of the display card, and even causes such faults as freezing.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of self-adaptive display card heat dissipation fin structure, including heat conduction plate and PLC controller, the upper surface of the heat conduction plate is fixedly connected with fixed frame, the upper surface of the heat conduction plate is fixedly connected with the fin main body of equidistance arrangement, the upper surface of the fixed frame is fixedly connected with protection frame, the upper surface of the fixed frame is equipped with two heat dissipation openings, the inside of each heat dissipation opening is mounted with exhaust fan, the upper surface of the fixed frame is fixedly connected with two groups of support card, the top of two groups of support card is fixedly connected with semiconductor refrigeration piece, the refrigeration end of the semiconductor refrigeration piece is fixedly connected with cooling rod, and cooling rod is fixedly connected with fin main body, the inner bottom wall of the fixed frame is fixedly connected with reinforcing block, and reinforcing block is fixedly connected with cooling rod.

[0007] As a preferred embodiment of the adaptive graphics card heatsink structure of this utility model, the upper surface of the heat-conducting plate is provided with two sets of mounting holes, and the inner ring of each mounting hole is provided with threads.

[0008] As a preferred embodiment of the adaptive graphics card heat dissipation fin structure of this utility model, the fixed frame is provided with two sets of protective plates inside, and the left and right sides of each protective plate are fixedly connected to the inner sidewall of the fixed frame.

[0009] As a preferred embodiment of the adaptive graphics card heatsink structure of this utility model, the protective frame is provided with a fine iron mesh inside, and the outer surface of the fine iron mesh is fixedly connected to the inner sidewall of the protective frame.

[0010] As a preferred embodiment of the adaptive graphics card heat dissipation fin structure of this utility model, two snap-fit ​​plates are fixedly connected to the upper surface of the heat-conducting plate, and the sides of the two snap-fit ​​plates that are close to each other are fixedly connected to the outer surface of the fixing frame.

[0011] In a preferred embodiment of the adaptive graphics card heatsink structure of this utility model, the PLC controller is electrically connected to a temperature sensor via wires, and the temperature sensor is electrically connected to a real-time monitoring module via wires.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This adaptive graphics card heatsink structure conducts heat from the graphics card to the fin body through a heatsink plate, and utilizes an exhaust fan inside the heatsink to accelerate airflow. Combined with the cooling effect of the thermoelectric cooler and cooling rods, it further reduces the temperature of the fin body, thereby enhancing heat dissipation. A temperature sensor monitors the graphics card temperature in real time, and the PLC controller automatically activates the exhaust fan and thermoelectric cooler based on preset temperature thresholds for intelligent heat dissipation. When the temperature far exceeds the limit, the PLC controller can quickly activate the thermoelectric cooler for rapid cooling. A real-time monitoring module displays the graphics card temperature and heat dissipation status, ensuring that the heat dissipation efficiency is automatically adjusted according to the actual heat output of the graphics card, adapting to different ambient temperatures and graphics card loads, ensuring that the graphics card always remains within the specified temperature range, guaranteeing normal operation and performance. Attached Figure Description

[0014] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0015] Figure 1This is a three-dimensional structural diagram of a heat-conducting plate with an adaptive graphics card heat dissipation fin structure according to the present invention.

[0016] Figure 2 This is a top view of the fixing frame of the adaptive graphics card heat dissipation fin structure of this utility model;

[0017] Figure 3 This is a front cross-sectional view of the protective frame of the adaptive graphics card heat sink structure according to this utility model.

[0018] Figure 4 This is a system diagram of an adaptive graphics card heatsink structure according to the present invention.

[0019] In the diagram: 1. Heat-conducting plate; 2. Fixing frame; 3. Mounting hole; 4. Protective plate; 5. Fin body; 6. Protective frame; 7. Clip plate; 8. Heat dissipation port; 9. Exhaust fan; 10. Fine iron mesh; 11. Semiconductor cooling chip; 12. Support plate; 13. Cooling rod; 14. Reinforcing block; 15. PLC controller; 16. Temperature sensor; 17. Real-time monitoring module. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model. Unless otherwise specified, the methods used in the present utility model are conventional methods; unless otherwise specified, the raw materials and apparatus used are conventional commercially available products.

[0021] The PLC controller, temperature sensor, and real-time monitoring module in this utility model are all common electrical devices and sensors in the prior art. This application will not elaborate on their models or internal structures.

[0022] Please see Figures 1-4In this utility model, an adaptive graphics card heat dissipation fin structure includes a heat-conducting plate 1 and a PLC controller 15. A fixing frame 2 is fixedly connected to the upper surface of the heat-conducting plate 1, and fin bodies 5 arranged at equal intervals are fixedly connected to the upper surface of the heat-conducting plate 1. A protective frame 6 is fixedly connected to the upper surface of the fixing frame 2. Two heat dissipation vents 8 are opened on the upper surface of the fixing frame 2, and an exhaust fan 9 is installed inside each heat dissipation vent 8. Two sets of support plates 12 are fixedly connected to the upper surface of the fixing frame 2. A semiconductor cooling chip 11 is fixedly connected to the top of the two sets of support plates 12. A cooling rod 13 is fixedly connected to the cooling end of the semiconductor cooling chip 11, and the cooling rod 13 is fixedly connected to the fin body 5. A reinforcing block 14 is fixedly connected to the inner bottom wall of the fixing frame 2, and the reinforcing block 14 is fixedly connected to the cooling rod 13.

[0023] As a technical optimization of this utility model, the upper surface of the heat-conducting plate 1 is provided with two sets of mounting holes 3, and the inner ring of each mounting hole 3 is provided with threads. The inside of the fixing frame 2 is provided with two sets of protective plates 4, and the left and right sides of each protective plate 4 are fixedly connected to the inner sidewall of the fixing frame 2.

[0024] In this embodiment, the heat-conducting plate 1 can be fixed through the provided mounting holes 3, ensuring that the heat-conducting plate 1 is in close contact with the graphics card.

[0025] As a technical optimization of this utility model, the interior of the protective frame 6 is provided with a fine iron grid 10, the outer surface of the fine iron grid 10 is fixedly connected to the inner side wall of the protective frame 6, and two snap-fit ​​plates 7 are fixedly connected to the upper surface of the heat-conducting plate 1. The sides of the two snap-fit ​​plates 7 that are close to each other are fixedly connected to the outer surface of the fixed frame 2.

[0026] In this embodiment: the fine iron mesh 10 facilitates the blocking of debris, while also enabling the heat dissipation end of the semiconductor cooling chip 11 to quickly dissipate heat, and the snap-fit ​​plate 7 can fix the fixing frame 2.

[0027] As a technical optimization of this utility model, the PLC controller 15 is electrically connected to the temperature sensor 16 via wires, and the temperature sensor 16 is electrically connected to the real-time monitoring module 17 via wires.

[0028] In this embodiment: the PLC controller 15 can quickly activate the semiconductor cooling chip 11 for rapid cooling, and the real-time monitoring module 17 can display the graphics card temperature and heat dissipation status in real time, ensuring that the heat dissipation efficiency is automatically adjusted according to the actual heat output of the graphics card, adapting to different ambient temperatures and graphics card load conditions, and ensuring that the graphics card is always within the limited temperature range.

[0029] The working principle of this utility model is as follows: In use, the heat-conducting plate 1 is first installed on the graphics card. The heat generated by the graphics card is conducted through the heat-conducting plate 1 to the fin body 5 inside the fixed frame 2. An exhaust fan 9 is installed inside the heat dissipation vent 8. The semiconductor cooling chip 11 is installed inside the protective frame 6, and its cooling end is connected to the fin body 5 through a cooling rod 13. Through the cooling action of the cooling rod 13 and the semiconductor cooling chip 11, the temperature of the fin body 5 is reduced. The temperature sensor 16 monitors the graphics card temperature in real time and transmits the data to the PLC controller 15. The PLC controller 15 automatically starts the exhaust fan 9 according to a preset temperature threshold. When the temperature threshold far exceeds the limit, the semiconductor cooling chip 11 is automatically activated, and the cooling rod 13 is used to quickly cool the fin body 5, thus adapting to the heat dissipation requirements under different ambient temperatures and graphics card loads. The real-time monitoring module 17 displays the graphics card temperature and heat dissipation status in real time for user monitoring. It can automatically adjust the heat dissipation efficiency according to the actual heat generated by the graphics card, ensuring that the graphics card is always within the limit and that it operates normally.

[0030] However, the above description is merely a specific embodiment of this utility model and should not be construed as limiting the scope of implementation of this utility model. Therefore, any substitution of equivalent components or equivalent changes and modifications made in accordance with the scope of protection of this utility model should still fall within the scope of the claims of this utility model. For those skilled in the art, it is obvious that this utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model.

Claims

1. An adaptive graphics card heatsink fin structure, characterized in that: The device includes a heat-conducting plate (1) and a PLC controller (15). A fixed frame (2) is fixedly connected to the upper surface of the heat-conducting plate (1). Fin bodies (5) arranged at equal intervals are fixedly connected to the upper surface of the heat-conducting plate (1). A protective frame (6) is fixedly connected to the upper surface of the fixed frame (2). Two heat dissipation ports (8) are opened on the upper surface of the fixed frame (2). An exhaust fan (9) is installed inside each heat dissipation port (8). Two sets of support plates (12) are fixedly connected to the upper surface of the fixed frame (2). A semiconductor cooling chip (11) is fixedly connected to the top of the two sets of support plates (12). A cooling rod (13) is fixedly connected to the cooling end of the semiconductor cooling chip (11). The cooling rod (13) is fixedly connected to the fin body (5). A reinforcing block (14) is fixedly connected to the inner bottom wall of the fixed frame (2). The reinforcing block (14) is fixedly connected to the cooling rod (13).

2. The adaptive graphics card heatsink structure according to claim 1, characterized in that: The upper surface of the heat-conducting plate (1) is provided with two sets of mounting holes (3), and the inner ring of each mounting hole (3) is provided with threads.

3. The adaptive graphics card heatsink structure according to claim 1, characterized in that: The fixed frame (2) is provided with two sets of protective plates (4) inside, and the left and right sides of each protective plate (4) are fixedly connected to the inner sidewall of the fixed frame (2).

4. The adaptive graphics card heatsink structure according to claim 1, characterized in that: The protective frame (6) is provided with a fine iron grid (10) inside, and the outer surface of the fine iron grid (10) is fixedly connected to the inner wall of the protective frame (6).

5. The adaptive graphics card heatsink structure according to claim 1, characterized in that: Two snap-fit ​​plates (7) are fixedly connected to the upper surface of the heat-conducting plate (1), and the two snap-fit ​​plates (7) are fixedly connected to the outer surface of the fixing frame (2) on the side that is close to each other.

6. The adaptive graphics card heatsink structure according to claim 1, characterized in that: The PLC controller (15) is electrically connected to a temperature sensor (16) via a wire, and the temperature sensor (16) is electrically connected to a real-time monitoring module (17) via a wire.

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