A heat dissipation structure for a server

Abstract

This application relates to the field of server technology, and more specifically to a server heat dissipation structure, comprising: a server body, a liquid storage tank, and a liquid pump. The server body has a host cavity with an air inlet and two air outlet channels, and a fan assembly is mounted thereon. Two first liquid cooling channels are provided on the side walls of the host cavity. Second liquid cooling channels are spirally arranged on the air outlet channels. A third liquid cooling channel is provided between the two second liquid cooling channels, and the third liquid cooling channel is connected to both of the two second liquid cooling channels. One end of each second liquid cooling channel is connected to a first liquid cooling channel. The inlet of the liquid storage tank is connected to one of the first liquid cooling channels, and the liquid storage tank contains refrigerant. The liquid storage tank and the liquid pump are both mounted on the server body. One end of the liquid pump is connected to the outlet of the liquid storage tank, and the other end is connected to another first liquid cooling channel. This utility model achieves the advantage of air cooling participating in liquid cooling by accelerating the cooling of the refrigerant in the second liquid cooling channel while the fan is expelling hot air.

Description

Technical Field

[0001] This application relates to the field of server technology, and more specifically to a heat dissipation structure for servers. Background Technology

[0002] A server is a high-performance computer that can provide services to the outside world through a network. With the significant increase in server capacity and processing power, the heat generated by the server during operation will also increase. When the electronic components inside the server are under heavy load, the internal temperature of the server will rise sharply. If the internal heat dissipation of the server is not timely, the electronic components inside the server can easily be damaged due to overheating.

[0003] Patent document (CN114924631A) discloses a server heat dissipation device, including a server body, a temperature sensor, a cooling fan, and an electric water pump. When the server body is in operation, the temperature sensor monitors the internal temperature of the server body in real time. When the temperature detected by the temperature sensor exceeds a set upper limit, the cooling fan rotates to provide air cooling, and the electric water pump starts to provide water cooling, thereby cooling the server body. However, in the above embodiment, the water cooling channel and air cooling are independent of each other; after absorbing heat, the water cooling channel slowly cools through air.

[0004] Therefore, there is a need for a heat dissipation structure for servers that combines air cooling with liquid cooling. Summary of the Invention

[0005] The main objective of this application is to provide a heat dissipation structure for a server, wherein the heat dissipation structure includes a server body, a liquid storage tank, and a liquid pump. The server body has a host cavity, an air inlet on one side of the host cavity, and two air outlet channels on the top of the host cavity. Fan assemblies are installed on the air outlet channels. Two first liquid cooling channels are respectively provided on the side walls of the host cavity, located on either side of the air inlet. A second liquid cooling channel is spirally arranged on the inner wall of each air outlet channel. A third liquid cooling channel is also provided between the two second liquid cooling channels. The first liquid cooling channel is connected to two second liquid cooling channels at one end, and the end of each second liquid cooling channel opposite to the third liquid cooling channel is connected to the corresponding first liquid cooling channel. The inlet of the liquid storage tank is connected to one of the first liquid cooling channels, and the liquid storage tank contains refrigerant. The liquid storage tank and the liquid pump are both installed on the server body. One end of the liquid pump is connected to the outlet of the liquid storage tank, and the other end of the liquid pump is connected to another first liquid cooling channel. While the fan is exhausting hot air, it is simultaneously cooling the refrigerant in the second liquid cooling channel, accelerating the cooling of the refrigerant. Compared with the prior art, this has the advantage that air cooling participates in liquid cooling.

[0006] Another objective of this application is to provide a heat dissipation structure for a server, wherein both first liquid cooling channels extend in a serpentine manner, and the distance between the serpentine extension portions of the two first liquid cooling channels gradually increases from the end away from the exhaust channel to the end closer to the exhaust channel, so that the first liquid cooling channels are arranged more densely in areas with higher temperatures.

[0007] To achieve at least one of the above-mentioned objectives, this application provides a heat dissipation structure for a server, wherein the heat dissipation structure for the server includes:

[0008] The server body has a host cavity, an air inlet on one side of the host cavity, two air outlet channels on the top of the host cavity, a fan assembly on the air outlet channel, two first liquid cooling channels on the two side walls of the host cavity, the two first liquid cooling channels are respectively located on both sides of the air inlet, a second liquid cooling channel is spirally arranged on the inner wall of each air outlet channel, a third liquid cooling channel is provided between the two second liquid cooling channels, the two ends of the third liquid cooling channel are respectively connected to the two second liquid cooling channels, and the end of each second liquid cooling channel opposite to the third liquid cooling channel is connected to the corresponding first liquid cooling channel;

[0009] A liquid storage tank, the inlet of which is connected to a first liquid cooling channel, and the liquid storage tank contains refrigerant;

[0010] The liquid pump is installed on the server body, with one end of the liquid pump connected to the outlet of the liquid tank and the other end of the liquid pump connected to another first liquid cooling channel.

[0011] In one or more embodiments of this application, both first liquid cooling channels extend in a serpentine manner.

[0012] In one or more embodiments of this application, the distance between the serpentine extensions of the two first liquid cooling channels gradually increases from the end away from the air outlet channel to the end closer to the air outlet channel.

[0013] In one or more embodiments of this application, the server body further includes a receiving cavity, the liquid storage tank and the liquid pump are both disposed in the receiving cavity, the receiving cavity is located directly below the host cavity, and the air outlet channel is located at one end of the host cavity away from the receiving cavity.

[0014] In one or more embodiments of this application, the spiral directions of the two second liquid cooling channels are opposite.

[0015] In one or more embodiments of this application, the server body further includes two extension cylinders, a connecting beam, and a cover plate. The extension cylinders are located at the end of the host cavity away from the receiving cavity. Each extension cylinder is provided with an air outlet channel. The two ends of the connecting beam are respectively connected to the two extension cylinders. The third liquid cooling channel passes through the two extension cylinders and is located below the connecting beam. The cover plate is connected to the connecting beam and covers the third liquid cooling channel.

[0016] In one or more embodiments of this application, the air inlet is provided with a perforated plate, and the perforated plate is detachably connected to the server body.

[0017] In this embodiment, the heat dissipation structure for the server includes a server body, a liquid storage tank, and a liquid pump. The server body has a host cavity with an air inlet on one side and two air outlet channels on the top. Fan assemblies are installed on the air outlet channels. Two first liquid cooling channels are respectively provided on the side walls of the host cavity, located on both sides of the air inlet. A second liquid cooling channel is spirally arranged on the inner wall of each air outlet channel. A third liquid cooling channel is also provided between the two second liquid cooling channels, with both ends of the third liquid cooling channel connected to the two first liquid cooling channels. The two liquid cooling channels are connected, and the end of each second liquid cooling channel opposite to the third liquid cooling channel is connected to the corresponding first liquid cooling channel; the inlet of the liquid storage tank is connected to one of the first liquid cooling channels, and the liquid storage tank contains refrigerant; the liquid storage tank and the liquid pump are both installed on the server body, one end of the liquid pump is connected to the outlet of the liquid storage tank, and the other end of the liquid pump is connected to another first liquid cooling channel. When the fan exhausts hot air, it simultaneously cools the refrigerant in the second liquid cooling channel, accelerating the cooling of the refrigerant. Compared with the existing technology, it has the advantage of air cooling participating in liquid cooling. Attached Figure Description

[0018] These and / or other aspects and advantages of this application will become clearer and more readily understood from the following detailed description of embodiments of this application taken in conjunction with the accompanying drawings, wherein:

[0019] Figure 1 The figure shows a schematic diagram of a heat dissipation structure for a server according to this application from a certain perspective;

[0020] Figure 2 The illustration shows a schematic diagram of a heat dissipation structure for a server from another perspective. Detailed Implementation

[0021] The terms and words used in the following specification and claims are not limited to their literal meaning, but are used solely by the inventors to enable a clear and consistent understanding of this application. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this application is provided for illustrative purposes only and not for the purpose of limiting the application as defined in the appended claims and their equivalents.

[0022] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0023] While ordinal numbers such as "first," "second," etc., will be used to describe various components, there is no limitation on which components are used herein. The term is used only to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the teachings of the utility model concept. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0024] The terminology used herein is for the purpose of describing various embodiments only and is not intended to be limiting. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. It will also be understood that the terms “comprising” and / or “having” as used in this specification specify the presence of the described features, numbers, steps, operations, components, elements or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements or groups thereof.

[0025] This is an illustrative diagram of a server's heat dissipation structure. (For reference only) Figures 1 to 2 A preferred embodiment of the present invention provides a heat dissipation structure for a server, comprising a server body 10, a liquid storage tank 20, and a liquid pump 30.

[0026] Specifically, the server body 10 has a host cavity 101, an air inlet 1011 on one side of the host cavity 101, and two air outlet channels 1012 on the top of the host cavity 101. A fan assembly 40 is provided at one end of each air outlet channel 1012 near the host cavity 101. Two first liquid cooling channels 501 are respectively provided on the two side walls of the host cavity 101, and the two first liquid cooling channels 501 are respectively located on both sides of the air inlet 1011. A second liquid cooling channel 502 is spirally arranged on the inner wall of each air outlet channel 1012, and a third liquid cooling channel is provided between the two second liquid cooling channels 502. The third liquid cooling channel 503 has two ends connected to two second liquid cooling channels 502 respectively, and the end of each second liquid cooling channel 502 facing away from the third liquid cooling channel 503 is connected to the corresponding first liquid cooling channel 501; in addition, the inlet of the liquid storage tank 20 is connected to one of the first liquid cooling channels 501, and the liquid storage tank 20 contains refrigerant; furthermore, the liquid storage tank 20 and the liquid pump 30 are both installed on the server body 10, one end of the liquid pump 30 is connected to the outlet of the liquid storage tank 20, and the other end of the liquid pump 30 is connected to another first liquid cooling channel 501.

[0027] It should be noted that the host cavity 101 is used to house the server's hardware components, such as the processor and memory. Furthermore, the fan assembly 40's airflow direction is towards the air outlet channel 1012. When the fan blades of the fan assembly 40 rotate, external air flows into the host cavity 101 from the air inlet 1011 and is discharged from the air outlet channel 1012. Additionally, when the server body 10 is running, the liquid pump 30 operates, causing the refrigerant in the liquid storage tank 20 to flow along the first liquid cooling channel 501, the second liquid cooling channel 502, the third liquid cooling channel 503, and the liquid storage tank 20. It should be noted that when the refrigerant flows within the first liquid cooling channel 501, since the first liquid cooling channel 501 is located on both sides of the hardware component, the refrigerant within the first liquid cooling channel 501 will absorb heat and flow to the second liquid cooling channel 502. It should also be noted that since the second liquid cooling channel 502 is distributed on the inner wall of the air outlet channel 1012, the fan assembly 40, while driving the airflow, will also carry away heat from the refrigerant in the second liquid cooling channel 502. Furthermore, by setting the second liquid cooling channel 502 in a spiral shape, more heat can be carried away from the refrigerant by the flowing air. It is evident that, compared to the prior art where air cooling and liquid cooling are independent, this application, through the rotation of the fan assembly 40, simultaneously carries away some of the heat from the refrigerant flowing into the second liquid cooling channel 502, accelerating the cooling of the second liquid cooling channel 502. Compared to the prior art, this application has the advantage that air cooling participates in liquid cooling.

[0028] Furthermore, in this application, in order to ensure that the refrigerant can effectively absorb the heat dissipated by the hardware components under different widths and heights on both sides of the host cavity 101, both first liquid cooling channels 501 extend in a serpentine shape.

[0029] Furthermore, since the heat emitted by the hardware components at the end of the host cavity 101 near the air outlet channel 1012 is dissipated more quickly due to their proximity to the air outlet channel 1012, in this embodiment, to make the first liquid cooling channels 501 more densely arranged along the heat-dense areas and more loosely arranged in the moderate heat areas, the distance between the serpentine extensions of the two first liquid cooling channels 501 gradually increases from the end away from the air outlet channel 1012 to the end closer to the air outlet channel 1012. That is, in this embodiment, the first liquid cooling channels 501 located at the end of the host cavity 101 near the air outlet channel 1012 are arranged more loosely, while the first liquid cooling channels 501 located at the end of the host cavity 101 away from the air outlet channel 1012 are arranged more densely.

[0030] Furthermore, to prevent leakage and dripping of liquid from the connection between the liquid storage tank 20 and the liquid pump 30 into the hardware components inside the host cavity 101, the server body 10 also has a receiving cavity 102. The liquid storage tank 20 and the liquid pump 30 are both located in the receiving cavity 102. The receiving cavity 102 is located directly below the host cavity 101, and the air outlet channel 1012 is located at the end of the host cavity 101 away from the receiving cavity 102.

[0031] In addition, in this embodiment, the spiral directions of the two second liquid cooling channels 502 are opposite.

[0032] In addition, in this application, to provide protection for the third liquid cooling channel 503, the server body 10 further includes two extension cylinders 103, a connecting beam 104, and a cover plate 105. The extension cylinders 103 are located at the end of the host cavity 101 away from the receiving cavity 102. Each extension cylinder 103 is provided with an air outlet channel 1012. The two ends of the connecting beam 104 are respectively connected to the two extension cylinders 103. The third liquid cooling channel 503 passes through the two extension cylinders 103 and is located below the connecting beam 104. The cover plate 105 is connected to the connecting beam 104 and covers the third liquid cooling channel 503.

[0033] In addition, to prevent large foreign objects from entering the host cavity 101, a perforated plate 106 is provided on the air inlet 1011, and the perforated plate 106 is detachably connected to the server body 10.

[0034] In addition, the fan assembly 40 includes a fan frame 401, a fan group 402, and a rotary motor 403. The fan group 402 is rotatably mounted on the fan frame 401. The fan frame 401 is mounted on one end of the main unit cavity 101 near the air outlet channel 1012. The rotary motor 403 is mounted on the cavity wall of the main unit cavity 101, and the rotating shaft of the rotary motor 403 is powered by the fan group 402 through a belt drive.

[0035] In summary, the heat dissipation structure for servers described in the embodiments of this application has been clarified, which provides advantages such as air cooling and liquid cooling.

[0036] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and explained in the embodiments, and any modifications or variations may be made to the implementation of the present invention without departing from these principles.

Claims

1. A heat dissipation structure for a server, characterized in that: The heat dissipation structure for the server includes The server body has a host cavity, an air inlet on one side of the host cavity, two air outlet channels on the top of the host cavity, a fan assembly on the air outlet channel, two first liquid cooling channels on the two side walls of the host cavity, the two first liquid cooling channels are respectively located on both sides of the air inlet, a second liquid cooling channel is spirally arranged on the inner wall of each air outlet channel, a third liquid cooling channel is provided between the two second liquid cooling channels, the two ends of the third liquid cooling channel are respectively connected to the two second liquid cooling channels, and the end of each second liquid cooling channel opposite to the third liquid cooling channel is connected to the corresponding first liquid cooling channel; A liquid storage tank, the inlet of which is connected to a first liquid cooling channel, and the liquid storage tank contains refrigerant; The liquid pump is installed on the server body, with one end of the liquid pump connected to the outlet of the liquid tank and the other end of the liquid pump connected to another first liquid cooling channel.

2. The heat dissipation structure for a server according to claim 1, characterized in that: Both of the first liquid cooling channels extend in a serpentine shape.

3. The heat dissipation structure for a server according to claim 2, characterized in that: The distance between the serpentine extensions of the two first liquid cooling channels gradually increases from the end furthest from the outlet channel to the end closest to the outlet channel.

4. The heat dissipation structure for a server according to claim 3, characterized in that: The server body also has a accommodating cavity, in which the liquid storage tank and the liquid pump are both located. The accommodating cavity is located directly below the host cavity, and the air outlet is located at the end of the host cavity away from the accommodating cavity.

5. The heat dissipation structure for a server according to claim 4, characterized in that: The spirals of the two second liquid cooling channels rotate in opposite directions.

6. The heat dissipation structure for a server according to claim 5, characterized in that: The server body also includes two extension cylinders, a connecting beam, and a cover plate. The extension cylinders are located at the end of the host cavity away from the receiving cavity. Each extension cylinder is provided with an air outlet channel. The two ends of the connecting beam are respectively connected to the two extension cylinders. The third liquid cooling channel passes through the two extension cylinders and is located below the connecting beam. The cover plate is connected to the connecting beam and covers the third liquid cooling channel.

7. The heat dissipation structure for a server according to claim 6, characterized in that: The air inlet is equipped with a perforated plate, which is detachably connected to the server body.

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