Cloud computing server active circulation phase change heat dissipation device

Abstract

The utility model provides a kind of cloud computing server initiative circulation phase change heat sink, including heat conduction plate, heat conduction plate is integrally connected with several radiating fins, heat exchange assembly is arranged between radiating fins, the both ends of heat exchange assembly are connected with main connecting pipeline, the one end of main connecting pipeline away from heat exchange assembly is integrally connected with bending anti-flow pipeline, and condensing assembly is detachably installed between bending anti-flow pipeline by mounting assembly, and three groups of semiconductor refrigeration piece are provided on condensing assembly.The utility model has the beneficial effects that the utility model can cooperate with heat exchange assembly when the temperature of radiating fin is higher, reduce the temperature of radiating fin, and can realize the function of initiative self-circulation, improve the heat dissipation effect of cloud computing server, and can avoid gaseous phase change fluid and liquid phase change fluid contact, produce mutual resistance, affect heat dissipation efficiency.

Description

Technical Field

[0001] This utility model is an active circulating phase change heat dissipation device for cloud computing servers, belonging to the field of cloud computing server technology. Background Technology

[0002] Cloud computing servers are virtualization services based on cloud computing technology. They provide users with dynamic, scalable, shared resources by integrating computing and storage resources, with a core focus on reducing enterprise hardware procurement and maintenance costs. Their service model supports pay-as-you-go pricing, elastic scaling, and rapid deployment. Multiple virtual servers across operating systems can be configured in real-time, reducing operating costs through low-energy solutions and enabling centralized management via cloud platform interfaces. Hardware requirements include multi-core processors, large amounts of memory, high-speed storage devices, and network infrastructure.

[0003] The information age requires a large number of servers, but server heat dissipation remains a major challenge. Current technologies generally employ phase change cooling. However, phase change radiators have mutual resistance between the gas and liquid phases. When the two fluid phases come into contact, some gaseous fluid is always pulled back to the liquid surface, while the liquid surface fluid always escapes from the liquid surface, forming a dynamic equilibrium. This creates flow resistance between them, thus affecting heat exchange efficiency. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an active circulating phase change heat dissipation device for cloud computing servers.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0006] A cloud computing server active circulation phase change heat dissipation device includes a heat conduction plate, a plurality of heat dissipation fins integrally connected to the heat conduction plate, a heat exchange component is disposed through the heat dissipation fins, a main connecting pipe is connected to both ends of the heat exchange component, a bent anti-flow pipe is integrally connected to the end of the main connecting pipe away from the heat exchange component, a condensation component is detachably installed between the bent anti-flow pipes through an installation component, and three sets of semiconductor cooling chips are disposed on the condensation component.

[0007] Furthermore, four sets of connecting sleeves are evenly installed at the bottom of the condensing component. The bottom end of the connecting sleeve is detachably connected to a condensing return pipe, and the bottom end of the condensing return pipe is connected to the heat exchange component.

[0008] Furthermore, the heat exchange assembly includes a C-shaped connecting pipe, with heat exchange pipes penetrating the heat dissipation fins connected between both ends of the C-shaped connecting pipe, and the C-shaped connecting pipes are connected to each other through a connecting horizontal pipe. The bottom end of the condensation return pipe is connected to the connecting horizontal pipe, and both sides of the condensation return pipe are connected to the heat exchange pipes through L-shaped connecting pipes, and a heat exchange plate that fits against the heat dissipation fins is provided on the L-shaped connecting pipe.

[0009] Furthermore, the condensation assembly includes a condensation sleeve with mounting holes, and the cold end of the semiconductor cooling chip extends into the condensation sleeve through the mounting holes. A partition plate is fixedly installed inside the condensation sleeve, and several through holes are provided at the center of the partition plate.

[0010] Furthermore, the baffle plate divides the condenser jacket into a lower condensate chamber and an upper cooling chamber. The top of the condensate return pipe is connected to the lower condensate chamber. An inclined baffle is connected to one side of the inner top of the upper cooling chamber through a connecting plate, and baffles are symmetrically provided at the bottom of the inclined baffle.

[0011] Furthermore, the installation assembly includes an outer support sleeve mounted on the condenser sleeve and communicating with the upper cooling chamber. An inner sliding sleeve is slidably provided inside the outer support sleeve and connected to the bent anti-flow pipe. A sealing ring is provided at the connection between the inner sliding sleeve and the bent anti-flow pipe. A sliding groove is provided on the outer support sleeve. A positioning threaded post penetrating the sliding groove is fixed at the top of the inner sliding sleeve, and a limiting threaded sleeve is threaded on the positioning threaded post.

[0012] The beneficial effects of this utility model are:

[0013] By integrally connecting several heat dissipation fins to a heat-conducting plate, the heat generated by the cloud computing server is transferred to the heat dissipation fins through the heat-conducting plate, achieving a heat dissipation effect. At the same time, the temperature of the heat dissipation fins rises, causing the cooling medium in the heat exchange component to heat up and vaporize. This vaporization carries away a large amount of heat, and the vapor enters the condensation component through the main connecting pipe and the bent anti-flow pipe. The bent anti-flow pipe prevents the gaseous phase change fluid from contacting the liquid phase change fluid, thus avoiding mutual resistance and affecting heat dissipation efficiency. Through the action of three sets of semiconductor cooling chips, the vaporized cooling medium is effectively liquefied and cooled down. Through the connecting sleeve and the condensation return pipe, it returns to the heat exchange component, completing a self-circulation. This invention can work with the heat exchange component to reduce the temperature of the heat dissipation fins when the temperature is high, and can achieve an active self-circulation function, improving the heat dissipation effect of the cloud computing server. At the same time, it can avoid the gaseous phase change fluid from contacting the liquid phase change fluid, thus avoiding mutual resistance and affecting heat dissipation efficiency. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of an active circulating phase change heat dissipation device for a cloud computing server according to the present invention.

[0016] Figure 2 This is a schematic diagram of the heat exchange component in an active circulating phase change heat dissipation device for a cloud computing server according to the present invention.

[0017] Figure 3 This is a schematic diagram of the condensation component in an active circulating phase change heat dissipation device for a cloud computing server according to the present invention.

[0018] Figure 4 This is a schematic diagram of the structure of the components installed in the active circulating phase change heat dissipation device for a cloud computing server according to the present invention.

[0019] In the diagram, 1. Heat-conducting plate; 2. Heat dissipation fins; 3. Heat exchange assembly; 4. Main connecting pipe; 5. Bent anti-flow pipe; 6. Condensation assembly; 7. Semiconductor cooling chip; 8. Mounting assembly; 9. Connecting sleeve; 10. Condensate return pipe; 11. C-shaped connecting pipe; 12. Heat exchange pipe; 13. Connecting horizontal pipe; 14. L-shaped connecting pipe; 15. Heat exchange plate; 16. Condensation sleeve; 17. Dividing baffle; 18. Upper cooling chamber; 19. Lower condensate chamber; 20. Through hole; 21. Inclined baffle; 22. Connecting plate; 23. Baffle; 24. Inner sliding sleeve; 25. Sealing ring; 26. Sliding groove; 27. Positioning threaded post; 28. Outer support sleeve. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4This utility model provides a technical solution for an active circulating phase change heat dissipation device for cloud computing servers, including a heat-conducting plate 1. A plurality of heat dissipation fins 2 are integrally connected to the heat-conducting plate 1. The heat generated by the cloud computing server is transferred to the heat dissipation fins 2 through the heat-conducting plate 1, achieving a heat dissipation effect. A heat exchange component 3 is disposed between the heat dissipation fins 2. Both ends of the heat exchange component 3 are connected to a main connecting pipe 4. A bent anti-flow pipe 5 is integrally connected to the end of the main connecting pipe 4 away from the heat exchange component 3. A condensation component is detachably installed between the bent anti-flow pipes 5 via an installation component 8. 6. The temperature of the heat dissipation fins 2 increases, which heats and vaporizes the cooling medium in the heat exchange assembly 3. The vapor carries away a large amount of heat, and the vapor enters the condensation assembly 6 through the main connecting pipe 4 and the bent anti-flow pipe 5. The bent anti-flow pipe 5 can prevent the gaseous phase change fluid from contacting the liquid phase change fluid, which would create mutual resistance and affect the heat dissipation efficiency. The condensation assembly 6 is equipped with three sets of semiconductor cooling chips 7. Through the action of the three sets of semiconductor cooling chips 7, the vaporized cooling medium is effectively liquefied and cooled down. Through the action of the connecting sleeve 9 and the condensation return pipe 10, it returns to the heat exchange assembly 3, completing the self-circulation.

[0022] See Figure 1 Four sets of connecting sleeves 9 are evenly installed at the bottom of the condensing component 6. The bottom end of the connecting sleeve 9 is detachably connected to a condensate return pipe 10, and the bottom end of the condensate return pipe 10 is connected to the heat exchange component 3. Through the action of the connecting sleeves 9 and the condensate return pipe 10, the condensate returns to the heat exchange component 3, completing the self-circulation.

[0023] See Figure 2 The heat exchange assembly 3 includes a C-shaped connecting pipe 11, with heat exchange pipes 12 penetrating the heat dissipation fins 2 connected to both ends of the C-shaped connecting pipe 11. The C-shaped connecting pipes 11 are connected to each other via a horizontal connecting pipe 13. The bottom end of the condensate return pipe 10 is connected to the horizontal connecting pipe 13. Both sides of the condensate return pipe 10 are connected to the heat exchange pipes 12 via L-shaped connecting pipes 14, and heat exchange plates 15 that are in contact with the heat dissipation fins 2 are provided on the L-shaped connecting pipes 14. The C-shaped connecting pipes 11 are connected via the horizontal connecting pipes 13, and a liquid cooling medium is added to them. The liquid cooling medium vaporizes when heated and carries away a large amount of heat. The heat exchange plates 15 on the L-shaped connecting pipes 14 that are in contact with the heat dissipation fins 2 can further improve the heat exchange effect of the heat dissipation fins 2.

[0024] See Figure 3The condensing assembly 6 includes a condensing sleeve 16, which has mounting holes. The cold end of the semiconductor cooling chip 7 extends into the condensing sleeve 16 through the mounting holes. A partition baffle 17 is fixedly installed inside the condensing sleeve 16, and several through holes 20 are provided at the center of the partition baffle 17. The partition baffle 17 divides the condensing sleeve 16 into a lower condensate chamber 19 and an upper cooling chamber 18. The top end of the condensate return pipe 10 is connected to the lower condensate chamber 19. An inclined baffle 21 is connected to one side of the inner top of the upper cooling chamber 18 through a connecting plate 22, and a baffle 23 is symmetrically provided at the bottom of the inclined baffle 21. The condenser jacket 16 is divided into a lower condensate chamber 19 and an upper cooling chamber 18 by the partition baffle 17. The heated and evaporated gas enters the upper cooling chamber 18 and is first slowed down by the inclined baffle 21 and the baffle 23, so that it can be quickly cooled by the semiconductor cooling chip 7. It then flows into the lower condensate chamber 19 through several through holes 20 on the partition baffle 17, and returns to the heat exchange assembly 3 through the connecting sleeve 9 and the condensate return pipe 10, completing the self-circulation.

[0025] See Figure 4 The installation assembly 8 includes an outer support sleeve 28 mounted on the condenser sleeve 16 and communicating with the upper cooling chamber 18. An inner sliding sleeve 24, which is slidably disposed within the outer support sleeve 28 and connected to the bent anti-flow pipe 5, is provided with a sealing ring 25 at the connection between the inner sliding sleeve 24 and the bent anti-flow pipe 5. A sliding groove 26 is formed on the outer support sleeve 28. A positioning threaded post 27, penetrating the sliding groove 26, is fixed to the top of the inner sliding sleeve 24, and a limiting threaded sleeve is threaded onto the positioning threaded post 27. During connection, the limiting threaded sleeve is loosened, and the inner sliding sleeve 24 is pushed out of the outer support sleeve 28 by pushing the positioning threaded post 27, connecting with one end of the bent anti-flow pipe 5. The sealing ring 25 provides a sealing effect. After completion, the limiting threaded sleeve is tightened.

[0026] In use, several heat dissipation fins 2 are integrally connected to the heat conduction plate 1. The heat generated by the cloud computing server is transferred to the heat dissipation fins 2 through the heat conduction plate 1 to achieve a heat dissipation effect. At the same time, the temperature of the heat dissipation fins 2 increases, which heats and vaporizes the cooling medium in the heat exchange component 3. The vaporization carries away a large amount of heat, and the vapor enters the condensation component 6 through the main connecting pipe 4 and the bent anti-flow pipe 5. The bent anti-flow pipe 5 can prevent the gaseous phase change fluid from contacting the liquid phase change fluid, which would generate mutual resistance and affect the heat dissipation efficiency. Through the action of three sets of semiconductor cooling chips 7, the vaporized cooling medium is effectively liquefied and cooled down. Through the action of the connecting sleeve 9 and the condensation return pipe 10, it returns to the heat exchange component 3 to complete the self-circulation. This utility model can work with the heat exchange component 3 to reduce the temperature of the heat dissipation fins 2 when the temperature is high, and can achieve an active self-circulation function, improving the heat dissipation effect of the cloud computing server. At the same time, it can prevent the gaseous phase change fluid from contacting the liquid phase change fluid, which would generate mutual resistance and affect the heat dissipation efficiency.

[0027] Although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A cloud computing server active circulating phase change heat dissipation device, characterized in that, It includes a heat-conducting plate (1), a number of heat dissipation fins (2) are integrally connected to the heat-conducting plate (1), a heat exchange component (3) is provided through the heat dissipation fins (2), a main connecting pipe (4) is connected to both ends of the heat exchange component (3), a bent anti-flow pipe (5) is integrally connected to the end of the main connecting pipe (4) away from the heat exchange component (3), a condensing component (6) is detachably installed between the bent anti-flow pipes (5) through the mounting component (8), and three sets of semiconductor cooling chips (7) are provided on the condensing component (6).

2. The cloud computing server active circulating phase change heat dissipation device according to claim 1, characterized in that, Four sets of connecting sleeves (9) are evenly installed at the bottom of the condensing component (6). The bottom end of the connecting sleeve (9) is detachably connected to the condensing return pipe (10), and the bottom end of the condensing return pipe (10) is connected to the heat exchange component (3).

3. The cloud computing server active circulating phase change heat dissipation device according to claim 2, characterized in that, The heat exchange assembly (3) includes a C-shaped connecting pipe (11), and heat exchange pipes (12) that penetrate the heat dissipation fins (2) are connected between both ends of the C-shaped connecting pipe (11). The C-shaped connecting pipes (11) are connected to each other through a horizontal connecting pipe (13). The bottom end of the condensation return pipe (10) is connected to the horizontal connecting pipe (13). The two sides of the condensation return pipe (10) are connected to the heat exchange pipes (12) through an L-shaped connecting pipe (14). The L-shaped connecting pipe (14) is provided with a heat exchange plate (15) that fits against the heat dissipation fins (2).

4. The cloud computing server active circulating phase change heat dissipation device according to claim 3, characterized in that, The condensing assembly (6) includes a condensing sleeve (16), which has mounting holes. The cold end of the semiconductor cooling chip (7) extends into the condensing sleeve (16) through the mounting holes. A partition baffle (17) is fixedly installed inside the condensing sleeve (16), and several through holes (20) are provided at the center of the partition baffle (17).

5. The cloud computing server active circulating phase change heat dissipation device according to claim 4, characterized in that, The partition baffle (17) divides the condenser jacket (16) into a lower condensate chamber (19) and an upper cooling chamber (18). The top of the condensate return pipe (10) is connected to the lower condensate chamber (19). An inclined baffle (21) is connected to the inner top side of the upper cooling chamber (18) through a connecting plate (22), and a baffle (23) is symmetrically provided at the bottom of the inclined baffle (21).

6. The cloud computing server active circulating phase change heat dissipation device according to claim 5, characterized in that, The mounting assembly (8) includes an outer support sleeve (28) mounted on the condenser sleeve (16) and communicating with the upper cooling chamber (18). An inner sliding sleeve (24) connected to the bent anti-flow pipe (5) is slidably provided inside the outer support sleeve (28), and a sealing ring (25) is provided at the connection between the inner sliding sleeve (24) and the bent anti-flow pipe (5). A sliding groove (26) is provided on the outer support sleeve (28), and a positioning threaded post (27) penetrating the sliding groove (26) is fixed at the top of the inner sliding sleeve (24), and a limiting threaded sleeve is threaded on the positioning threaded post (27).

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