Alignment structure of touch module

Abstract

The utility model discloses a kind of alignment structure of touch module, including TP module, lower layer conductive film and upper layer conductive film are separately stacked on the TP module;Upper layer silver paste wiring, it is located on the upper layer conductive film;Lower layer silver paste wiring, it is located on the lower layer conductive film;Binding position, it is located on the TP module for with corresponding the upper layer silver paste wiring and lower layer silver paste wiring connection;Wherein, the upper layer conductive film corresponding the two ends of the binding position has upper layer silver paste positioning mark, the lower layer conductive film corresponding the two ends of the binding position has lower layer silver paste positioning mark.The utility model provides a kind of alignment structure of touch module, while silver paste wiring is carried out on conventional upper layer conductive film and lower layer conductive film, respectively through wiring to form upper layer silver paste positioning mark and lower layer silver paste positioning mark, whether deviation is generated by the spacing between upper layer silver paste positioning mark and lower layer silver paste positioning mark can be judged.

Description

Technical Field

[0001] This utility model relates to the field of touch screen technology, and in particular to an alignment structure for a touch module. Background Technology

[0002] A touch screen, also known as a touch panel, is a sensor-type liquid crystal display device that can receive input signals from touch. When a graphic button on the screen is touched, the tactile feedback system on the screen can drive various connected devices according to a pre-programmed program. It can replace mechanical button panels and create vivid audio-visual effects through the liquid crystal display screen.

[0003] Currently, for some narrow-bezel projects, the sensor's bezel is too narrow and the circuitry is dense. There is no extra space reserved during assembly. Therefore, the narrow bezel makes it impossible to accurately judge the alignment by visual inspection, and it is also inconvenient to provide alignment marks. As a result, it is not easy to detect the misalignment after production and attachment, and the defect rate is high. To address this, an alignment structure for touch modules is proposed. Utility Model Content

[0004] Therefore, it is necessary to provide an alignment structure for a touch module to address the aforementioned technical problems. While performing silver paste wiring on conventional upper and lower conductive films, upper and lower silver paste positioning marks are formed through the wiring. After the upper and lower conductive films are bonded together, the spacing between the upper and lower silver paste positioning marks can be used to determine whether an alignment deviation has occurred.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] An alignment structure for a touch module includes:

[0007] A TP module, wherein a lower conductive film and an upper conductive film are respectively stacked on the TP module;

[0008] The upper silver paste trace is disposed on the upper conductive film;

[0009] The lower layer silver paste trace is disposed on the lower layer conductive film;

[0010] A binding bit is provided on the TP module for connection with the corresponding upper and lower silver paste traces;

[0011] The upper conductive film has upper silver paste positioning marks at both ends corresponding to the bonding positions, and the lower conductive film has lower silver paste positioning marks at both ends corresponding to the bonding positions.

[0012] After the lower conductive film and the upper conductive film are aligned and bonded, the upper silver paste positioning mark and the lower silver paste positioning mark can correspond to each other for alignment and bonding.

[0013] Furthermore, the binding position is located at the bottom of the TP module.

[0014] Furthermore, the upper silver paste positioning mark is set at both ends of the upper conductive film corresponding to the binding position, and the upper silver paste trace is integrally connected with the upper silver paste positioning mark.

[0015] Furthermore, the upper silver paste positioning mark is frame-shaped, and the lower silver paste positioning mark is square-shaped;

[0016] The outer dimensions of the lower silver paste positioning mark are smaller than the inner dimensions of the upper silver paste positioning mark.

[0017] Furthermore, after the upper conductive film and the lower conductive film are aligned and bonded, the lower silver paste positioning mark can be accommodated within the upper silver paste positioning mark to assist in alignment.

[0018] Furthermore, the binding position includes a central binding position and side binding positions located on both sides of the central binding position.

[0019] Furthermore, the two ends of the upper silver paste trace are formed with upper silver paste connection portions corresponding to the side bonding positions. After the upper conductive film is attached to the TP module, the upper silver paste connection portions can be aligned and connected with the side bonding positions.

[0020] Furthermore, one end of the lower silver paste trace is formed with a lower silver paste connection portion corresponding to the middle bonding position. After the lower conductive film is attached to the TP module, the lower silver paste connection portion can be connected to the middle bonding position.

[0021] Furthermore, the TP module is connected to the FPC via the binding bit, and the bound FPC is connected to the upper and lower silver paste traces via the binding bit.

[0022] Furthermore, the single-sided distance between the lower silver paste positioning mark and the upper silver paste positioning mark is between 0.1 mm and 0.2 mm.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The alignment structure of the touch module provided by this utility model, while performing silver paste wiring on conventional upper and lower conductive films, forms upper and lower silver paste positioning marks through the wiring respectively. In this way, after the upper and lower conductive films are bonded together, the spacing between the upper and lower silver paste positioning marks can be used to determine whether there is an alignment deviation, thus avoiding the problem of abnormal touch effect due to deviation.

[0025] Furthermore, for the upper and lower silver paste positioning marks, since they are formed synchronously during the silver paste routing process, no additional steps are required, making operation convenient. At the same time, it can also be applied to large-sized modules with wider widths, offering high flexibility. Attached Figure Description

[0026] Figure 1 A schematic diagram of the alignment structure of the touch module provided by this utility model;

[0027] Figure 2 The alignment structure of the touch module provided by this utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0028] Figure 3 A schematic diagram of the upper conductive film structure of the alignment structure of the touch module provided by this utility model;

[0029] Figure 4 A schematic diagram of the lower conductive film structure of the alignment structure of the touch module provided by this utility model;

[0030] Figure 5 The alignment structure of the touch module provided by this utility model Figure 3 Enlarged structural diagram at point B;

[0031] Figure 6 The alignment structure of the touch module provided by this utility model Figure 4 Enlarged structural diagram at point C;

[0032] Figure 7 A schematic diagram of the FPC structure for the alignment structure of the touch module provided by this utility model.

[0033] The markings in the diagram are explained as follows:

[0034] TP module 1;

[0035] 2. Lower conductive film; 21. Lower silver paste trace; 22. Lower silver paste positioning mark; 23. Lower silver paste connector;

[0036] Upper conductive film 3, upper silver paste trace 31, upper silver paste positioning mark 32, upper silver paste connector 33;

[0037] Binding point 4, middle binding point 41, side binding point 42;

[0038] FPC5. Detailed Implementation

[0039] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0040] As described in the background section, for some narrow-edge projects, the sensor width is too narrow and the lines are dense. There is no extra space reserved during assembly. Therefore, the narrow width makes it impossible to effectively judge the alignment accuracy by visual inspection, and it is also inconvenient to provide alignment marks. As a result, the misalignment after production and attachment is not easy to detect, and the defect rate is high.

[0041] To solve this technical problem, this utility model provides an alignment structure for a touch module, which is applied to a touch module.

[0042] For details, please refer to Figures 1-7 As shown, the alignment structure of the touch module specifically includes:

[0043] TP module 1, on which a lower conductive film 2 and an upper conductive film 3 are respectively stacked;

[0044] Upper silver paste trace 31 is disposed on the upper conductive film 3;

[0045] The lower silver paste trace 21 is disposed on the lower conductive film 2;

[0046] Binding bit 4 is located on the TP module 1 and is used to connect with the corresponding upper silver paste trace 31 and lower silver paste trace 21.

[0047] The upper conductive film 3 has upper silver paste positioning marks 32 at both ends corresponding to the binding position 4, and the lower conductive film 2 has lower silver paste positioning marks 22 at both ends corresponding to the binding position 4.

[0048] After the lower conductive film 2 and the upper conductive film 3 are aligned and bonded, the upper silver paste positioning mark 32 and the lower silver paste positioning mark 22 can correspond to each other for alignment and bonding.

[0049] The alignment structure of the touch module provided by this utility model, while performing silver paste wiring on the conventional upper conductive film 3 and lower conductive film 2, forms upper silver paste positioning marks 32 and lower silver paste positioning marks 22 respectively through the wiring. In this way, after the upper conductive film 3 and lower conductive film 2 are bonded together, the spacing between the upper silver paste positioning marks 32 and lower silver paste positioning marks 22 can be used to determine whether there is an alignment deviation, thus avoiding the problem of abnormal touch effect caused by deviation.

[0050] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0051] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0052] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0053] Example 1

[0054] Please refer to Figures 1-7 As shown, a positioning structure for a touch module includes:

[0055] TP module 1, on which a lower conductive film 2 and an upper conductive film 3 are respectively stacked;

[0056] Upper silver paste trace 31 is disposed on the upper conductive film 3;

[0057] The lower silver paste trace 21 is disposed on the lower conductive film 2;

[0058] Binding bit 4 is located on the TP module 1 and is used to connect with the corresponding upper silver paste trace 31 and lower silver paste trace 21.

[0059] The upper conductive film 3 has upper silver paste positioning marks 32 at both ends corresponding to the binding position 4, and the lower conductive film 2 has lower silver paste positioning marks 22 at both ends corresponding to the binding position 4.

[0060] After the lower conductive film 2 and the upper conductive film 3 are aligned and bonded, the upper silver paste positioning mark 32 and the lower silver paste positioning mark 22 can correspond to each other for alignment and bonding.

[0061] In this embodiment, during the silver paste routing process, an upper silver paste positioning mark 32 and a lower silver paste positioning mark 22 can be formed. This allows for the setting of positioning structures at the silver paste routing points within a narrow bezel module. Furthermore, when the upper conductive film 3 and the lower conductive film 2 are aligned and bonded, the relative positions of the upper silver paste positioning mark 32 and the lower silver paste positioning mark 22 can be visually observed to determine any misalignment, thus avoiding issues such as incomplete bonding affecting subsequent touch accuracy.

[0062] Example 2

[0063] The alignment structure of the touch module provided in Embodiment 1 is further optimized, specifically, as follows: Figure 7 As shown, the binding position 4 is located at the bottom of the TP module 1. In this embodiment, the binding position 4 is designed at the bottom of the TP module 1. However, in actual applications, the binding position 4 can be designed on the left, right, or top depending on the actual application.

[0064] The upper silver paste positioning mark 32 is set at both ends of the upper conductive film 3 corresponding to the binding position 4, and the upper silver paste trace 31 is integrally connected with the upper silver paste positioning mark 32.

[0065] The upper silver paste positioning mark 32 is frame-shaped, and the lower silver paste positioning mark 22 is square-shaped;

[0066] like Figure 2 As shown, after the lower conductive film 2 and the upper conductive film 3 are aligned and bonded, the lower silver paste positioning mark 22 can be located inside the upper silver paste positioning mark 32. Thus, by judging whether the distance between the inner side of the upper silver paste positioning mark 32 and the edge of the lower silver paste positioning mark 22 is uniform, it can be determined whether the bonding between the lower conductive film 2 and the upper conductive film 3 is accurate.

[0067] If the size of the frame allows, the upper silver paste positioning mark 32 can be made as large as possible to facilitate visual inspection. In this embodiment, when applied to a narrower frame module, the upper silver paste positioning mark 32 is appropriately reduced according to the frame margin, so that it can meet the application of narrow frame and also be applied to a larger frame module, making it more adaptable.

[0068] Furthermore, the outer dimensions of the lower silver paste positioning mark 22 are smaller than the inner dimensions of the upper silver paste positioning mark 32. This allows a blank area to be formed between the edge of the lower silver paste positioning mark 22 and the inner side of the upper silver paste positioning mark 32. By judging the gap in this area, the alignment accuracy can be judged.

[0069] After the upper conductive film 3 and the lower conductive film 2 are aligned and bonded, the lower silver paste positioning mark 22 can be accommodated in the upper silver paste positioning mark 32 to assist in alignment.

[0070] Furthermore, the single-sided distance between the lower silver paste positioning mark 22 and the upper silver paste positioning mark 32 is between 0.1 mm and 0.2 mm. Specifically, the distance needs to be designed according to the size of the upper silver paste positioning mark 32. For example, when the overall frame size of the module is large, the size of the upper silver paste positioning mark 32 can be appropriately increased, and the single-sided distance between the upper silver paste positioning mark 32 and the lower silver paste positioning mark 22 can be reasonably increased to facilitate better visual inspection.

[0071] Example 3

[0072] The alignment structure of the touch module provided in Embodiment 1 or 2 is further optimized, such as... Figure 1-3 As shown, the binding position 4 includes a central binding position 41 and side binding positions 42 located on both sides of the central binding position 41;

[0073] The upper silver paste trace 31 has upper silver paste connection parts 33 formed at both ends, which correspond to the side bonding positions 42. After the upper conductive film 3 is attached to the TP module 1, the upper silver paste connection parts 33 can be aligned and connected with the side bonding positions 42.

[0074] One end of the lower silver paste trace 21 is formed with a lower silver paste connection part 23 corresponding to the middle binding position 41. After the lower conductive film 2 is attached to the TP module 1, the lower silver paste connection part 23 can be connected to the middle binding position 41.

[0075] The TP module 7 is connected to the FPC5 via the binding bit 4. After binding, the FPC5 is connected to the upper silver paste trace 31 and the lower silver paste trace 21 via the binding bit 4.

[0076] In actual bonding, soldering can be used. After placing the FPC5 on the bonding position 4, it is aligned with the middle bonding position 41 and the side bonding position 42 within the bonding position 4 and then soldered. After soldering, the FPC5 can be connected to the upper conductive film 3 and the lower conductive film 2 to complete the performance control of the TP module.

[0077] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0078] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. An alignment structure for a touch module, characterized in that, It includes: A TP module (1) has a lower conductive film (2) and an upper conductive film (3) stacked on it. Upper silver paste traces (31) are disposed on the upper conductive film (3); The lower silver paste trace (21) is disposed on the lower conductive film (2); Binding bit (4), which is located on the TP module (1) for connection with the corresponding upper silver paste trace (31) and lower silver paste trace (21); The upper conductive film (3) has upper silver paste positioning marks (32) at both ends corresponding to the binding position (4), and the lower conductive film (2) has lower silver paste positioning marks (22) at both ends corresponding to the binding position (4). After the lower conductive film (2) and the upper conductive film (3) are aligned and bonded, the upper silver paste positioning mark (32) and the lower silver paste positioning mark (22) can correspond to each other for alignment and bonding.

2. The alignment structure of the touch module according to claim 1, characterized in that, The binding position (4) is located at the bottom of the TP module (1).

3. The alignment structure of the touch module according to claim 1, characterized in that, The upper silver paste positioning mark (32) is set on the upper conductive film (3) at both ends corresponding to the binding position (4), and the upper silver paste trace (31) is integrally connected with the upper silver paste positioning mark (32).

4. The alignment structure of the touch module according to claim 1, characterized in that, The upper silver paste positioning mark (32) is frame-shaped, and the lower silver paste positioning mark (22) is square-shaped; The outer dimensions of the lower silver paste positioning mark (22) are smaller than the inner dimensions of the upper silver paste positioning mark (32).

5. The alignment structure of the touch module according to claim 4, characterized in that, After the upper conductive film (3) and the lower conductive film (2) are aligned and bonded, the lower silver paste positioning mark (22) can be accommodated in the upper silver paste positioning mark (32) for auxiliary alignment.

6. The alignment structure of the touch module according to claim 1, characterized in that, The binding position (4) includes a central binding position (41) and side binding positions (42) located on both sides of the central binding position (41).

7. The alignment structure of the touch module according to claim 6, characterized in that, The upper silver paste trace (31) has upper silver paste connection parts (33) at both ends that correspond to the side bonding positions (42). After the upper conductive film (3) is attached to the TP module (1), the upper silver paste connection parts (33) can be aligned and connected with the side bonding positions (42).

8. The alignment structure of the touch module according to claim 6, characterized in that, One end of the lower silver paste trace (21) is formed with a lower silver paste connection part (23) corresponding to the middle binding position (41). After the lower conductive film (2) is attached to the TP module (1), the lower silver paste connection part (23) can be connected to the middle binding position (41).

9. The alignment structure of the touch module according to claim 8, characterized in that, The TP module (1) is connected to the FPC (5) by the binding bit (4). The FPC (5) after binding is connected to the upper silver paste trace (31) and the lower silver paste trace (21) by the binding bit (4).

10. The alignment structure of the touch module according to claim 9, characterized in that, The single-sided distance between the lower silver paste positioning mark (22) and the upper silver paste positioning mark (32) is between 0.1 mm and 0.2 mm.

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