Memory bank high and low temperature test box

Abstract

The utility model provides a kind of memory bank high-low temperature test box, including the base for fixing memory bank, the cover plate being cooperated with base, at least one heat dissipation passage is provided in cover plate, each heat dissipation passage includes external air inlet, refrigeration component and heat dissipation area in turn, heat dissipation area is separated into multiple heat dissipation unit cavities by multiple partitions, multiple slots for fixing memory bank are provided on base, heat dissipation unit cavity and slot are one-to-one corresponding;Further including heat dissipation component, heat dissipation component includes suction fan, suction fan is communicated with heat dissipation passage by communicating pipeline, gate assembly is provided between communicating pipeline and heat dissipation passage, further including controller, controller is electrically connected with the drive mechanism of gate assembly and temperature sensor in heat dissipation area respectively, can satisfy high-power inner side strip high-low temperature test demand, and small in size.

Description

Technical Field

[0001] This application relates to the field of memory module testing, and more specifically, to a high and low temperature measurement channel and a high and low temperature test chamber for memory modules. Background Technology

[0002] In existing technologies, memory modules need to be heated and cooled separately during high and low temperature tests to measure their state at high and low temperatures. This requires heating and cooling devices. Current cooling devices typically use cooling fans. Since multiple memory modules need to be cooled simultaneously, and each memory module is small, it is not possible to match each memory module with a fan. Usually, one fan is needed for multiple memory modules. However, due to size limitations, high-power, large-size cooling fans cannot be used, resulting in poor stability during cooling.

[0003] Based on the aforementioned deficiencies, the applicant has developed a high and low temperature measurement channel and device for memory modules, application number 2024230131311. It sets up multiple heat dissipation channels, each corresponding to a heat dissipation fan, and further divides each heat dissipation channel into multiple heat dissipation zones. Each heat dissipation zone is independently temperature controlled by a controller, a gate assembly, and a temperature sensor, thereby ensuring the temperature stability of each heat dissipation zone.

[0004] However, the above solution still has certain shortcomings when conducting high and low temperature tests on high-power memory modules. High-power memory modules require lower heat dissipation temperatures, and relying solely on the airflow drawn in from the outside by the exhaust fan cannot meet the need for rapid cooling.

[0005] Therefore, those skilled in the art need to improve existing high and low temperature test chambers to overcome the aforementioned shortcomings. Utility Model Content

[0006] The main purpose of this application is to provide a high and low temperature test chamber for memory modules that can meet the high and low temperature testing requirements of high-power internal modules, and is small in size.

[0007] To achieve the above objectives, in a first aspect, this application provides a high and low temperature measurement channel for a memory module, including a base for fixing the memory module and a cover plate that cooperates with the base. The cover plate is provided with at least one heat dissipation channel, and each heat dissipation channel sequentially includes an external air inlet, a cooling component, and a heat dissipation area. The heat dissipation area is divided into multiple heat dissipation unit cavities by multiple partitions. The base is provided with multiple slots for fixing the memory module, and the heat dissipation unit cavities correspond one-to-one with the slots.

[0008] It also includes a heat dissipation component, which includes an exhaust fan connected to the heat dissipation channel via a connecting pipe. A gate assembly is provided between the connecting pipe and the heat dissipation channel. It also includes a controller, which is electrically connected to the drive mechanism of the gate assembly and the temperature sensor in the heat dissipation area.

[0009] Optionally, the gate assembly includes a gate that is slidably disposed with the communicating pipe and a power device for driving the gate to slide.

[0010] Optionally, the power device is an electric slide, the cylinder of the electric slide is fixedly mounted on the connecting pipe, and the piston rod of the electric slide is fixedly connected to the upper end of the gate.

[0011] Optionally, the cover plate is rotatably connected to the base, and a flipping power device for driving the cover plate to rotate is provided between the two.

[0012] Optionally, the cover plate and the base are rotatably connected by a rotating shaft, the flipping power device is a motor that drives the rotating shaft to rotate, the rotating shaft is fixedly connected to the cover plate, and both ends of the rotating shaft are connected to the base through rotating bearings.

[0013] Optionally, a booster fan is provided between the cooling component and the heat dissipation area.

[0014] Optionally, the cooling component is a semiconductor refrigeration chip.

[0015] Optionally, the temperature sensor is a temperature sensor integrated into the memory module.

[0016] Optionally, a water-cooled heat dissipation component for cooling the refrigeration component is provided on the outer side of the cover plate.

[0017] Optionally, the water-cooled heat dissipation component is provided with a temperature measuring unit, and a temperature monitoring screen electrically connected to the temperature measuring unit is provided on its exterior.

[0018] The present invention provides a high and low temperature test chamber for memory modules. Compared with the prior art, its advantages are as follows: When high and low temperature tests are required for high-power memory modules, lower heat dissipation temperatures are needed. Increasing the length of the heat dissipation channel would not only make the overall volume of the test chamber larger, but also fail to achieve rapid heat dissipation. Therefore, by setting a cooling component on the external air inlet side, the cooling component cools the airflow when the exhaust fan draws in external air, thereby reducing its temperature and enabling rapid heat dissipation for high-power memory modules, meeting their high and low temperature test requirements. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application. In the drawings:

[0020] Figure 1 This is a schematic diagram of the utility model. Figure 1 ;

[0021] Figure 2 This is a schematic diagram of the utility model. Figure 2 ;

[0022] Figure 3 This is a schematic diagram of the utility model. Figure 3 ;

[0023] Figure 4 This is a schematic diagram of the utility model. Figure 4 .

[0024] The components include: 1. base, 2. cover plate, 3. exhaust fan, 4. cooling components, 5. booster fan, 6. external air inlet, 7. heat dissipation area, 8. slot, 9. water cooling components, and 10. temperature monitoring screen. Detailed Implementation

[0025] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0026] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0027] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0028] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0029] In addition, the term "multiple" should mean two or more.

[0030] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0031] like Figures 1-4 As shown, a high and low temperature test chamber for memory modules includes a base 1 for fixing memory modules and a cover plate 2 that cooperates with the base 1. The cover plate 2 is provided with at least one heat dissipation channel. Each heat dissipation channel includes an external air inlet 6, a cooling component 4, and a heat dissipation area 7 in sequence. The heat dissipation area 7 is divided into multiple heat dissipation unit cavities by multiple partitions. The base 1 is provided with multiple slots 8 for fixing memory modules. The heat dissipation unit cavities correspond one-to-one with the slots 8.

[0032] It also includes a heat dissipation component, which includes an exhaust fan 3. The exhaust fan 3 is connected to the heat dissipation channel through a connecting pipe. A gate assembly is provided between the connecting pipe and the heat dissipation channel. It also includes a controller, which is electrically connected to the drive mechanism of the gate assembly and the temperature sensor in the heat dissipation area 7.

[0033] Working principle: First, the memory module is manually inserted into the corresponding slot 8 on the base 1, and then the cover plate 2 is closed for temperature control. When heat dissipation is required, the gate assembly corresponding to the heat dissipation area 7 is opened, and the external airflow is drawn in through the external air inlet 6 by the exhaust fan 3. After being quickly cooled by the cooling component 4, the heat dissipation area 7 is cooled. The memory module has a built-in temperature sensor. The controller compares the temperature measured by the temperature sensor with the preset temperature. When the temperature is high, the gate assembly is opened; when the temperature is low, the gate assembly is closed. This achieves independent temperature control for multiple channels and areas, resulting in good temperature control stability. Moreover, by setting up the cooling component 4, rapid cooling can be achieved. When performing high and low temperature tests on high-power memory modules, there is no need to use a larger temperature measuring chamber.

[0034] Preferably, the gate assembly includes a gate slidably disposed with the connecting pipe and a power device for driving the gate to slide. The power device is an electric slide, the cylinder of which is fixedly disposed on the connecting pipe, and the piston rod of which is fixedly connected to the upper end of the gate. Alternatively, a cylinder can also be used as the power device. When it is necessary to open the corresponding gate assembly, the controller controls the electric slide to pull up the gate, thereby opening the connecting channel, which is convenient to control.

[0035] Preferably, the cover plate 2 is rotatably connected to the base 1, and a flipping power device for driving the cover plate 2 to rotate is provided between them. The cover plate 2 and the base 1 are rotatably connected via a rotating shaft. The flipping power device is a motor that drives the rotating shaft to rotate. The rotating shaft is fixedly connected to the cover plate 2, and both ends of the rotating shaft are connected to the base 1 via rotating bearings. Before testing, the cover plate 2 is first flipped open by the motor, and then the operator inserts the memory modules one by one into the corresponding slots 8 on the base 1. After the memory modules are installed, the motor closes the cover plate 2 onto the base 1, and then the temperature measurement operation is performed. This method has a high degree of automation. Of course, in addition to rotation, the sliding method of opening the cover plate 2 is also within the scope of protection of this application. The sliding drive mechanism can be an electric slide table drive. Compared with the two, the sliding method requires more space, so the flipping method is preferred.

[0036] In order to improve the rapid cooling effect, a booster fan 5 is provided between the cooling component 4 and the heat dissipation area 7. The booster fan 5 can quickly draw external airflow into the heat dissipation area 7, and can quickly control the temperature of high-power memory modules.

[0037] In this embodiment, preferably, the cooling component 4 is a semiconductor cooling chip, and the temperature sensor is a temperature sensor built into the memory module. In addition, in order to cool the semiconductor cooling chip, a water-cooled heat dissipation component 9 for cooling the cooling component 4 is provided on the outside of the cover plate 2. The water-cooled heat dissipation component 9 stores a cooling medium for heat dissipation, such as coolant. In order to regulate its temperature in a timely manner, preferably, a temperature measuring unit is provided inside the water-cooled heat dissipation component 9, and a temperature monitoring screen 10 electrically connected to the temperature measuring unit is provided outside it. The operator can observe the temperature of the heat dissipation medium inside the water-cooled heat dissipation component 9 at any time by observing the temperature monitoring screen 10, which facilitates subsequent operations.

[0038] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A high and low temperature testing chamber for memory modules, characterized in that, The device includes a base for fixing memory modules and a cover plate that cooperates with the base. The cover plate has at least one heat dissipation channel. Each heat dissipation channel includes an external air inlet, a cooling component, and a heat dissipation area. The heat dissipation area is divided into multiple heat dissipation unit cavities by multiple partitions. The base has multiple slots for fixing memory modules. The heat dissipation unit cavities correspond one-to-one with the slots. It also includes a heat dissipation component, which includes an exhaust fan connected to the heat dissipation channel via a connecting pipe. A gate assembly is provided between the connecting pipe and the heat dissipation channel. It also includes a controller, which is electrically connected to the drive mechanism of the gate assembly and the temperature sensor in the heat dissipation area.

2. The high and low temperature test chamber for memory modules as described in claim 1, characterized in that: The gate assembly includes a gate that is slidably disposed with the connecting pipe and a power device for driving the gate to slide.

3. The high and low temperature test chamber for memory modules as described in claim 2, characterized in that: The power unit is an electric slide table, the cylinder of which is fixedly mounted on the connecting pipe, and the piston rod of which is fixedly connected to the upper end of the gate plate.

4. The high and low temperature test chamber for memory modules as described in claim 1, characterized in that: The cover plate is rotatably connected to the base, and a flipping power device for driving the cover plate to rotate is provided between the two.

5. A high and low temperature test chamber for memory modules as described in claim 4, characterized in that: The cover plate and the base are rotatably connected by a rotating shaft. The flipping power device is a motor that drives the rotating shaft to rotate. The rotating shaft is fixedly connected to the cover plate, and both ends of the rotating shaft are connected to the base through rotating bearings.

6. The high and low temperature test chamber for memory modules as described in claim 1, characterized in that: A booster fan is provided between the cooling component and the heat dissipation area.

7. A high and low temperature test chamber for memory modules as described in claim 1, characterized in that: The cooling component is a semiconductor refrigeration chip.

8. A high and low temperature test chamber for memory modules as described in claim 1, characterized in that: The temperature sensor is the temperature sensor that comes with the memory module.

9. A high and low temperature test chamber for memory modules as described in claim 1, characterized in that: A water-cooled heat dissipation component for cooling the refrigeration component is provided on the outer side of the cover plate.

10. A high and low temperature test chamber for memory modules as described in claim 9, characterized in that: The water-cooled heat dissipation component is equipped with a temperature measuring unit, and an external temperature monitoring screen is electrically connected to the temperature measuring unit.

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