Superconducting wire connecting container and superconducting magnet

Abstract

Embodiments relate to a container for connecting superconducting wires and a superconducting magnet, capable of reducing the generation of voids. The container for connecting superconducting wires according to the embodiments has a superconducting wire, a superconducting solder, a container, and an inner wall. The superconducting wire has a superconducting material. The superconducting solder is used to electrically join two or more of the superconducting wires. The container has an outer wall and a bottom plate that hold the superconducting solder and the superconducting wires. The inner wall is integrated with the bottom plate at least in part in a manner that a hollow is provided from a bottom portion of the container.

Description

[0001] Reference to relevant applications

[0002] This application enjoys the benefit of priority to Japanese Patent Application No. 2024-115553, filed on July 19, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments relate to a container for connecting superconducting wires and a superconducting magnet. Background Technology

[0004] In MRI (Magnetic Resonance Imaging) devices, superconducting magnets, which utilize superconductors, are sometimes used. To fabricate superconducting magnets, the interconnection of superconducting wires becomes crucial. In these interconnections, minimizing power loss is essential.

[0005] Here, in the connection of superconducting wires to each other, there is a method as follows: the superconducting wires are welded using superconducting solder that exhibits superconductivity at low temperature, the welded superconducting wires are sealed in a container to make a container for connecting superconducting wires, and the superconducting wires are connected using the container for connecting superconducting wires.

[0006] However, when the superconducting solder is cooled and solidified in the container, voids sometimes occur. When voids form near the superconducting wire, the connection characteristics of the superconducting wire sometimes deteriorate. Utility Model Content

[0007] The technical problem to be solved by this utility model is to provide a container for connecting superconducting wires and a superconducting magnet that can reduce the generation of voids.

[0008] Technical solution one is a container for connecting superconducting wires, characterized in that it comprises: superconducting wires having a superconducting material; superconducting solder for electrically joining two or more superconducting wires; a container having an outer wall and a bottom plate for holding the superconducting solder and the superconducting wires; and an inner wall that is at least partially integrated with the bottom plate in such a way that it has a cavity in the container.

[0009] Alternatively, in a container for connecting superconducting wires, the inner wall may be made of a conductive material.

[0010] Alternatively, in the container for connecting superconducting wires, the wall structure may differ depending on the location, thereby causing the temperature to decrease at different rates during cooling.

[0011] Alternatively, in a container for connecting superconducting wires, the thickness of the inner wall may differ from the thickness of the outer wall.

[0012] Alternatively, in a container for connecting superconducting wires, the superconducting wires may be positioned at the location where the temperature decreases rapidly.

[0013] Alternatively, in a container for connecting superconducting wires, the thickness of the inner wall may vary depending on the height measured from the base plate.

[0014] Alternatively, in a container for connecting superconducting wires, the wall connecting the inner walls to each other is located on the side of the inner wall opposite to the base plate.

[0015] Alternatively, a heat conductor for cooling may also be provided in the container for connecting superconducting wires.

[0016] Alternatively, in a container for connecting superconducting wires, the superconducting wire may comprise a base material containing copper or a copper compound, and the superconducting material disposed inside the base material.

[0017] Alternatively, in a container for connecting superconducting wires, the bottom plate may include a portion formed on the inner side of the inner wall that seals the lower part of the cavity.

[0018] Technical solution two is a superconducting magnet, characterized in that the superconducting magnet is formed by connecting the superconducting wires contained in the superconducting coil using the superconducting wire connection container described in technical solution one.

[0019] Effect

[0020] The container and superconducting magnet for connecting superconducting wires according to the embodiments can reduce the generation of voids. Attached Figure Description

[0021] Figure 1 This diagram illustrates an example of the fabrication steps for a container used for connecting superconducting wires.

[0022] Figure 2 This diagram illustrates an example of the fabrication steps for a container used for connecting superconducting wires.

[0023] Figure 3 This diagram illustrates the background of the implementation method.

[0024] Figure 4 This is a diagram illustrating the appearance of the container for connecting superconducting wires according to the first embodiment.

[0025] Figure 5 This is a cross-sectional view illustrating the structure of the container for connecting superconducting wires according to the first embodiment.

[0026] Figure 6 This diagram illustrates an example of the configuration of the container for connecting superconducting wires according to the second embodiment.

[0027] Figure 7 This diagram illustrates an example of the configuration of the container for connecting superconducting wires according to the second embodiment.

[0028] Figure 8 This diagram illustrates an example of the configuration of the container for connecting superconducting wires according to the second embodiment.

[0029] Figure 9 This diagram illustrates an example of the configuration of the container for connecting superconducting wires according to the second embodiment.

[0030] Figure 10 This diagram illustrates an example of the configuration of the container for connecting superconducting wires according to the second embodiment. Detailed Implementation

[0031] One aspect of the embodiment provides a container for connecting superconducting wires, comprising superconducting wires, superconducting solder, a container, and an inner wall. The superconducting wires are made of a superconducting material. The superconducting solder is used to electrically bond two or more of the superconducting wires. The container has an outer wall and a bottom plate for holding the superconducting solder and the superconducting wires. The inner wall is at least partially integrated with the bottom plate in such a way that it has a cavity extending from the bottom plate portion of the container.

[0032] (First Implementation)

[0033] Hereinafter, embodiments of the container for connecting superconducting wires (superelectric wires) and the superconducting (superelectric) magnet will be described in detail with reference to the accompanying drawings. In these embodiments, superconductivity and superelectricity are used interchangeably.

[0034] First, the connection of superconducting wires will be explained. For example, in MRI (Magnetic Resonance Imaging) devices, superconducting magnets utilizing superconductors are used, but in order to create superconducting magnets, the connection of superconducting wires to each other becomes important. In the connection of superconducting wires to each other, suppressing power loss becomes important.

[0035] Here, a method is considered for connecting superconducting wires by soldering them together with superconducting solder that exhibits superconductivity at low temperatures, and then sealing the soldered superconducting wires into a container to create a container for connecting superconducting wires. By connecting superconducting wires using this container, superconducting magnets, for example, used in MRI, can be generated.

[0036] Figure 1 and Figure 2 An example showing the order in which containers are made for connecting superconducting wires. Figure 1 This example illustrates the process of manufacturing containers for superconducting wire connections by welding filaments that have been impregnated with concentrated nitric acid. Figure 2 This example illustrates the process of creating a container for superconducting wire connections by soldering after replacing the tin in the superconducting wire.

[0037] Figure 1 This example illustrates a method for producing a container for superconducting wire connections by welding a filament into which a superconducting wire has been immersed in concentrated nitric acid. First, in step S1, the superconducting wire 9 typically comprises a base material 1 containing copper or a copper compound and a superconducting material 2 disposed inside the base material 1. For example, NbTi or Nb3Sn is used as the superconducting material 2. When the superconducting wire 9 is immersed in concentrated nitric acid 10, the base material 1, composed of copper or a copper compound, dissolves, exposing the internal superconducting material 2, which then forms a filament shape.

[0038] Next, in step S2, the two filaments that expose portions of the superconducting material 2 are twisted together. Specifically, the superconducting wire 9a and the superconducting wire 9b are connected by twisting the filament-shaped superconducting material 2a in the superconducting wire 9a, which is composed of the parent material 1a and the superconducting material 2a, with the filament-shaped superconducting material 2b in the superconducting wire 9b, which is composed of the parent material 1b and the superconducting material 2b.

[0039] Next, in step S3, superconducting wires 9a and 9b are placed in container 3. Container 3 is typically made of a conductive material such as copper.

[0040] Next, in step S4, two or more superconducting wires, namely superconducting wire 9a and superconducting wire 9b, are electrically joined by superconducting solder 4. Superconducting solder 4 is a solder that exhibits superconductivity at low temperatures. As an example, superconducting wire 9a and superconducting wire 9b are soldered using superconducting solder 4, which is liquid at high temperatures (and exhibits superconductivity at low temperatures). The superconducting solder 4 solidifies at low temperatures, thereby electrically joining superconducting wire 9a and superconducting wire 9b through the superconducting solder 4. At a low temperature, such as liquid helium temperature, the superconducting solder 4 becomes superconducting, therefore the resistance at the connection between superconducting wire 9a and superconducting wire 9b becomes zero, and power loss is suppressed.

[0041] Figure 2 This example illustrates a method for generating a container for superconducting wire connections by soldering filaments after tin replacement of superconducting wire 9. First, in step S1, the superconducting wire 9 typically comprises a base material 1 containing copper or a copper compound and a superconducting material disposed inside the base material 1. Examples of superconducting materials used include NbTi and Nb3Sn. If the superconducting wire 9 is immersed in molten tin 11, as in step S2, the base material 1, composed of copper or a copper compound, melts, and the superconducting material 2 is exposed. At this time, the surface of the superconducting material 2 is coated with tin. This tin plating is performed. This operation is performed on both superconducting wires separately.

[0042] Next, in step S3, tin-plated superconducting wires 9a and 9b are placed in container 3. Container 3 is typically made of a conductive material such as copper.

[0043] Next, in step S4, two or more superconducting wires, namely superconducting wire 9a and superconducting wire 9b, are electrically joined by superconducting solder 4. Specifically, the superconducting solder 4 is, for example, a solder that exhibits superconductivity at low temperatures. As an example, superconducting wire 9a and superconducting wire 9b are soldered using superconducting solder 4, which is liquid at high temperatures (and superconducting at low temperatures). The superconducting solder 4 solidifies at low temperatures, thereby electrically joining superconducting wire 9a and superconducting wire 9b by superconducting solder 4. For example, at a low temperature after further cooling, such as at liquid helium temperature, the superconducting solder 4 becomes superconducting, therefore the resistance at the connection between superconducting wire 9a and superconducting wire 9b becomes zero, and power loss is suppressed.

[0044] As described above, the method for manufacturing a container for superconducting wire connections has been described as follows: the container is manufactured by welding a filament impregnated with concentrated nitric acid, and the container is manufactured by welding a superconducting wire after tin replacement. However, the embodiments are not limited to these methods; in other embodiments, superconducting wire connections can also be performed by crimp bonding or solid-state bonding.

[0045] Here, crimp bonding refers to a method of joining multiple superconducting wires by crimping. In the case of crimp bonding, firstly, the same process is performed... Figure 1 The processing steps S1 and S2 are as follows. In the case of crimping, in step S3, superconducting wires 9a and 9b are inserted into the metal sleeve. In step S4, the metal sleeve is pressurized to crimp-join the superconducting wires 9a and 9b. Finally, the inlet of the metal sleeve is welded.

[0046] Furthermore, the same process is performed in the case of solid-phase bonding. Figure 1 The processing in steps S1 and S2. In the case of solid-state bonding, in step S3, superconducting wires 9a and 9b are inserted into a compression jig. In step S4, the compression jig is pressurized and heated, and superconducting wires 9a and 9b are solid-state bonded.

[0047] Next, the background of the implementation method will be explained.

[0048] So far, the fabrication of the container for connecting superconducting wires has been explained. However, when the superconducting solder 4, which will become liquid in step S4, cools and solidifies inside the container 3, voids or gaps may sometimes occur.

[0049] Regarding this, use Figure 3 Please provide an explanation. Figure 3 This diagram illustrates the structure of the superconducting wire connection container, i.e., container 3, involved in the comparative example. Container 3 has an outer wall 21 and a bottom plate 22, holding the superconducting material 2 and the superconducting solder 4. The superconducting solder 4 is a solder that exhibits superconducting properties at low temperatures. Here, when the superconducting solder is cooled and solidified inside the container, voids 20 may sometimes be generated. If voids 20 are generated near the superconducting material 2, the connection characteristics of the superconducting wire may deteriorate. Therefore, it is preferable to control the formation of voids 20 near the superconducting material 2.

[0050] In view of this background, the container for connecting superconducting wires according to the embodiment includes: a superconducting wire having a superconducting material 2; a superconducting solder 4 for electrically joining two or more superconducting wires; and a container 3 having an outer wall 21 and a bottom plate 22 for holding the superconducting solder 4 and the superconducting wire, the container 3 having an inner wall that is at least partially integral with the bottom plate 22 in a manner that provides a cavity. Specifically, the container 3 has an inner wall that is at least partially integral with the bottom plate 22 in a manner that provides a cavity from the bottom plate portion.

[0051] Here, by creating cavities from the bottom plate of container 3, a cooling rate difference is generated between the inner and outer walls, and the generation of cavities can be controlled. This will be described later. Furthermore, by creating cavities, for example when assembled and operated as part of a superconducting magnet, a structure is formed that can effectively cool container 3.

[0052] use Figure 4 and Figure 5 The configuration of the first embodiment will be described in detail. Figure 4 This is an external view of the container for connecting superconducting wires according to the first embodiment. Figure 5 This is a cross-sectional view of the container for connecting superconducting wires according to the first embodiment.

[0053] like Figure 4 and Figure 5 As shown, the superconducting wire connection container according to the embodiment includes: superconducting wires 9a and 9b, having superconducting materials 2a and 2b; superconducting solder 4 for electrically bonding two or more superconducting wires 9a and 9b; and a container 3 having an outer wall 21 and a bottom plate 22 for holding the superconducting solder 4 and the superconducting wires 9a and 9b. Here, the superconducting wires 9a and 9b include a base material 1a and 1b containing copper or a copper compound and superconducting materials 2a and 2b disposed inside the base material 1a and 1b. The superconducting solder 4 is, for example, a solder that exhibits superconductivity at low temperatures. Using the superconducting wire connection container according to the embodiment, superconducting wires included in a superconducting coil of a superconducting magnet, for example, are connected to each other.

[0054] Here, a hole 5 is provided in the bottom plate of container 3, and container 3 has at least a portion of an inner wall 31 integral with the bottom plate 22. In addition, the superconducting wire connection container of the embodiment includes, in addition to container 3, superconducting wires 9a and 9b disposed in container 3 and superconducting solder 4 filling container 3.

[0055] In addition, to improve thermal conductivity, the inner wall 31 can also be made of a conductive material.

[0056] Next, the effects obtained by using the superconducting wire connection container according to the embodiment will be described. Since the container 3 of the embodiment has a cavity 5, a difference in cooling rate can be made between the inner wall 31 and the outer wall 21. As an example, the inner wall 31 and the outer wall 21 can be designed such that the cooling rate near the inner wall 31 is greater than the cooling rate near the outer wall 21.

[0057] Here, it is known that the cooling rate during the cooling and solidification of the superconducting solder 4 is negatively correlated with the number of voids generated. That is, when the superconducting solder 4 is cooled and solidified rapidly, fewer voids are generated compared to when it is cooled and solidified slowly. Furthermore, the probability of void generation is lower in areas where the superconducting solder 4 is cooled and solidified rapidly compared to areas where it is cooled and solidified slowly. Therefore, the generation of voids can be controlled.

[0058] As an example, the container for superconducting wire connections according to the embodiment has different wall structures depending on the location, thereby enabling different rates of temperature reduction during cooling. For example, by making the thickness of the inner wall 31 different from the thickness of the outer wall 21, different rates of temperature reduction can be achieved. Furthermore, as another example, by making the materials of the inner wall 31 and the outer wall 21 different, different thermal conductivity can be achieved, thereby enabling different rates of temperature reduction during cooling.

[0059] Here, superconducting wires 9a and 9b are placed in areas where the temperature drops rapidly during cooling.

[0060] As an example, when the cooling rate near the inner wall 31 is designed to be greater than that near the outer wall 21, the probability of voids forming near the inner wall 31 is lower than that near the outer wall 21. Therefore, superconducting wires 9a and 9b are positioned near the inner wall 31, where the temperature decreases rapidly during cooling. In this case, with superconducting wires 9a and 9b positioned near the inner wall 31, the probability of voids forming in the region 81 where superconducting wires 9a and 9b are located is lower than in other regions. As a result, the probability of voids forming in the region where superconducting wires 9a and 9b are located is lower than that in other regions, thereby improving the connection characteristics of the superconducting wires.

[0061] Conversely, when the cooling rate near the inner wall 31 is designed to be lower than that near the outer wall 21, the probability of voids forming near the inner wall 31 is higher than that near the outer wall 21. In this case, superconducting wires 9a and 9b are positioned near the outer wall 21, where the temperature decreases rapidly during cooling. Even in this case, the probability of voids forming in the area where superconducting wires 9a and 9b are located is lower than that in other areas, thereby improving the connection characteristics of the superconducting wires.

[0062] Returning to the description of the embodiments, if we list other effects obtained by using the superconducting wire connection container according to the embodiments, the container 3 according to the embodiments has improved cooling efficiency because it has a cavity 5 in its center. Specifically, compared with the case where there is no cavity 5, the area near the inner wall 31 can be cooled in a short time. The superconducting wire connection container according to the embodiments is a container used to cool the superconducting solder 4 to a temperature that becomes superconducting, which enables efficient cooling of the container 3 at this time. In addition, by making the inner wall 31 into a conductive material, the thermal conductivity of the inner wall 31 can be improved, which can further improve the cooling rate of the container 3.

[0063] The implementation methods are not limited to the examples described above. As an example, the cooling rate can be controlled by controlling the diameter 32 of the cavity 5. Specifically, by increasing the diameter 32 of the cavity 5, the contact surface area with air or heat conduction bands near the inner wall 31 can be increased, thereby increasing the cooling rate. Therefore, the area where voids are concentrated can be located outside the vicinity of the inner wall 31. Thus, the generation of voids can be controlled. Furthermore, by varying the size, shape, thickness, angle, and shape of the cavity 5, the cooling rate near the inner wall 31 can be controlled, thereby controlling the probability of void generation. Additionally, the cross-sectional shape of the cavity 5 (inner wall 31) can be various shapes such as a circle, ellipse, triangle, quadrilateral, or polygon. Furthermore, the cross-sectional shapes of the outer wall 21 and the base plate 22 can also be various shapes such as a circle, ellipse, triangle, quadrilateral, or polygon.

[0064] In addition, the implementation method is not limited to the above example. The cooling efficiency near the inner wall 31 can also be further improved by filling the cavity 5 with a heat conduction strip.

[0065] In addition, Figure 4 and Figure 5 In the embodiments shown, a method for connecting superconducting wires is described. Figure 1 The example shown illustrates the bonding of superconducting wires after immersion in concentrated nitric acid using superconducting solder 4, and... Figure 2The example shown uses tin plating. However, the connection methods for superconducting wires are not limited to this; for example, crimp bonding or solid-state bonding can also be used to connect superconducting wires.

[0066] In the first embodiment described above, the container for connecting superconducting wires includes: superconducting wires having a superconducting material 2; superconducting solder 4 for electrically joining two or more superconducting wires; and a container 3 having an outer wall 21 and a bottom plate 22 for holding the superconducting solder 4 and the superconducting wires. The container 3 has an inner wall that is at least partially integral with the bottom plate 22 such that a cavity 5 is provided from the bottom plate portion of the container 3. By providing the cavity 5 from the bottom plate portion of the container 3, the generation of voids can be controlled. Furthermore, the cooling efficiency of the container 3 can be improved.

[0067] (Second Implementation)

[0068] The implementation methods are not limited to the examples described above. In the second embodiment, various variations in the shape of the inner wall 31 will be described.

[0069] As an example, such as Figure 6 As shown, the container for connecting superconducting wires according to the second embodiment includes: superconducting wires 9a and 9b; superconducting solder 4 for electrically bonding two or more superconducting wires 9a and 9b; and a container 3 having an outer wall 21 and a bottom plate 22 for holding the superconducting solder 4 and the superconducting wires 9a and 9b. Here, a cavity 5 is provided in the bottom plate portion of the container 3, and the container 3 has an inner wall 40 that is at least partially integrated with the bottom plate 22, such that the wall thickness of the upper portion (the portion away from the bottom plate 22) of the inner wall 40 is thicker than the portion of the inner wall 40 closer to the bottom plate 22. That is, the thickness of the inner wall 50 and the outer wall 21 varies depending on the height set from the bottom plate 22. As a result, the cooling rate near the bottom plate 22 of the inner wall 40 becomes greater than the cooling rate near the upper portion of the inner wall 40. Therefore, for example, the probability of voids being generated near region 82 is reduced, and thus the influence of voids can be mitigated by arranging superconducting wires in its vicinity.

[0070] As another implementation method, such as Figure 7As shown, the container for connecting superconducting wires according to the embodiment includes: superconducting wires 9a and 9b; superconducting solder 4 for electrically joining two or more superconducting wires 9a and 9b; and a container 3 having an outer wall 21 and a bottom plate 22, inner walls 50a and 50b, and a wall 51 to hold the superconducting solder 4 and the superconducting wires 9a and 9b. Here, a hole 5 is provided in the bottom plate portion of the container 3, but the upper part of the hole 5 is blocked by the wall 51. That is, the wall 51 connecting the inner walls 50a and 50b to each other is provided in the inner walls 50a and 50b on the side opposite to the bottom plate 22. As a result, the cooling rate near the bottom plate 22 of the inner walls 50a and 50b becomes greater than the cooling rate near the upper part of the inner walls 50a and 50b. Therefore, for example, the probability of voids being generated near region 83 is reduced, and thus the influence of voids can be mitigated by arranging superconducting wires in its vicinity.

[0071] As another implementation method, such as Figure 8 As shown, the container for connecting superconducting wires according to the embodiment includes: superconducting wires 9a and 9b; superconducting solder 4 for electrically joining two or more superconducting wires 9a and 9b; and a container 3 having an outer wall 21 and a bottom plate 22 for holding the superconducting solder 4 and the superconducting wires 9a and 9b, and inner walls 60 and 61 inclined relative to the bottom plate. Therefore, the cooling rate near regions 84 and 85 becomes higher than the cooling rate in other areas. Consequently, the probability of voids occurring near regions 84 and 85 is reduced, and the impact of voids can be mitigated by arranging superconducting wires in their vicinity.

[0072] As another implementation method, such as Figure 9 As shown, the container for connecting superconducting wires according to the embodiment includes: superconducting wires 9a and 9b; superconducting solder 4 for electrically joining two or more superconducting wires 9a and 9b; and a container 3 having an outer wall 21, a bottom plate 22, and an inner wall 31 for holding the superconducting solder 4 and the superconducting wires 9a and 9b. A heat conductor 70 for cooling is also provided here. Therefore, the cooling rate near region 86, for example, becomes higher than the cooling rate of other areas. Thus, the probability of voids occurring near region 86 is reduced, and by arranging superconducting wires in its vicinity, the influence of voids can be mitigated.

[0073] As another implementation, the upper part of the cavity 5 can also be sealed using the wall 51. Figure 7 The implementation methods shown are different, for example, Figure 10As shown, the lower part of the cavity 5 is sealed by the base plate 71, and the base plate 71 and the base plate 22 constitute the base plate of the superconducting wire connection container. In this case, the base plate includes a portion formed on the inner side of the inner walls 50a and 50b that seals the lower part of the cavity 5. That is, the superconducting wire connection container of the embodiment includes: superconducting wires 9a and 9b; superconducting solder 4 for electrically bonding two or more superconducting wires 9a and 9b; and a container 3 having an outer wall 21 and a base plate 22 for holding the superconducting solder 4 and the superconducting wires 9a and 9b, and a base plate 71 formed on the inner side of the inner walls 50a and 50b that seals the lower part of the cavity 5. In this embodiment, the area of ​​the base plate can be designed to be large, which can efficiently cool the superconducting wire connection container.

[0074] According to at least one embodiment described above, the generation of voids can be reduced in the container for connecting superconducting wires.

[0075] Several embodiments of this utility model have been described, but these embodiments are provided as examples and are not intended to limit the scope of the utility model. These embodiments can be implemented in various other ways, and various omissions, substitutions, modifications, and combinations of embodiments are possible without departing from the spirit of the utility model. These embodiments and their variations are included in the scope and spirit of the utility model, and likewise included in the scope of the invention described in the claims and its equivalents.

Claims

1. A container for connecting superconducting wires, characterized in that, have: Superconducting wires, which contain superconducting materials; Superconducting solder for electrically joining two or more superconducting wires; The container has an outer wall and a bottom plate for holding the superconducting solder and the superconducting wire; as well as The inner wall, at least a portion of which is integrated with the bottom plate in such a way that it has a cavity in the container.

2. The container for connecting superconducting wires according to claim 1, characterized in that, The inner wall is made of a conductive material.

3. The container for connecting superconducting wires according to claim 1, characterized in that, The wall structure varies depending on the location, which in turn affects the rate at which the temperature decreases during cooling.

4. The container for connecting superconducting wires according to claim 1, characterized in that, The thickness of the inner wall is different from the thickness of the outer wall.

5. The container for connecting superconducting wires according to claim 3, characterized in that, The superconducting wire is positioned at the location where the temperature drops rapidly.

6. The container for connecting superconducting wires according to claim 1, characterized in that, The thickness of the inner wall and the outer wall varies depending on the height set from the base plate.

7. The container for connecting superconducting wires according to claim 1, characterized in that, The wall connecting the inner walls to each other is located on the side of the inner wall opposite to the base plate.

8. The container for connecting superconducting wires according to claim 1, characterized in that, It is also equipped with a heat conductor for cooling.

9. The container for connecting superconducting wires according to claim 1, characterized in that, The superconducting wire comprises a base material containing copper or a copper compound, and the superconducting material disposed on the inner side of the base material.

10. The container for connecting superconducting wires according to claim 1, characterized in that, The base plate includes a portion formed on the inner side of the inner wall that seals the lower part of the cavity.

11. A superconducting magnet, characterized in that, The superconducting magnet is formed by connecting the superconducting wires contained in the superconducting coil using the superconducting wire connection container as described in claim 1.

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