Fluidized bed repair patch

Abstract

The utility model discloses a kind of fluidization row repair patch, including patch body, the patch body is flaky, the side of the patch body is equipped with stress-relieving groove;Wherein, the patch body (200) is made of insulating material.This fluidization row repair patch, by using high-temperature-resistant insulating single-sided adhesive paper to cover and encapsulate layer defect, it is simpler to operate than using colloid repair, without colloid, without waiting for colloid solidification.Especially when repairing side, there is no repair difficult problem caused by colloid flow.And by setting groove in the side of patch body, when using patch to repair the side of fluidization row, groove can effectively alleviate the stress received by patch, so as to prevent patch body from breaking open, stick more firmly.

Description

Technical Field

[0001] This utility model relates to the technical field of fluidized bed repair, and in particular to a fluidized bed repair patch. Background Technology

[0002] A busbar, also known as a current bus, is usually made of copper. It is commonly used in the electrical field and consists of a long conductor with a rectangular or chamfered (rounded) rectangular cross-section (usually a rounded copper busbar to prevent tip discharge). It serves to transmit current and connect electrical equipment in a circuit.

[0003] However, the encapsulation layer of the copper busbar may develop cracks in some areas during fluidization or be damaged by collisions during movement, leading to breakdown during the withstand voltage test. Current technology for repairing encapsulation layer damage involves first preparing a colloid according to a specific ratio, applying the colloid to the damaged area, and then placing it in an oven for heat curing. However, colloid repair has the following problems: 1. If the area to be repaired is on the side or near the edge of the copper busbar, the colloid will flow downwards along the edge of the copper busbar, causing repair failure; 2. The heating oven used for repair has a small inlet and insufficient depth. If the defect is in the middle of the copper busbar, it cannot be placed in the heating oven for heating, and the colloid must be allowed to cure naturally, which takes too long; 3. When using colloid repair, the thickness of the colloid at the repair site combined with the original encapsulation layer thickness will be too thick, affecting usability. Utility Model Content

[0004] In view of the problem that existing fluidized bed side repair methods have difficulty in repairing the edges, this utility model is proposed.

[0005] Therefore, the purpose of this utility model is to provide a fluidized busbar repair patch, which aims to repair damage to the fluidized busbar encapsulation layer.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: including a patch body, the patch body being sheet-shaped, and the side of the patch body having a stress-relieving groove; wherein, the patch body is made of an insulating material.

[0007] As a preferred embodiment of the fluidized bed repair patch of this utility model, the patch body has a temperature resistance greater than 200°C, and the patch body and the encapsulation layer are fixed by adhesive, the adhesive having a temperature resistance greater than 200°C.

[0008] As a preferred embodiment of the fluidized bed repair patch of this utility model, the patch body is made of soft insulating material, and the thickness of the patch body is greater than 0.1 mm and less than 0.2 mm.

[0009] As a preferred embodiment of the fluidized bed repair patch of this utility model, the patch body is divided into an end portion and a waist portion, both ends of the waist portion are connected to the end portion, and the two sides of the waist portion are provided with grooves symmetrically opposite each other.

[0010] As a preferred embodiment of the fluidized bed repair patch of this utility model, the groove in the waist part is a rounded cone shape; the included angle formed by the two sides of the groove is α1, where 60°>α1>30°, and the radius of the rounded corner of the groove is R1, where 3mm>R1>0.5mm.

[0011] As a preferred embodiment of the fluidized bed repair patch of this utility model, the width W1 of the waist is greater than or equal to the thickness of the encapsulation layer plus the bed body.

[0012] As a preferred embodiment of the fluidized bed repair patch of this utility model, the patch body is waist-shaped, and the groove in the waist is a rounded rectangle; the depth formed by the two sides of the groove is S1, and S1 is less than 1 / 3 of the overall width of the patch body; the radius of the rounded corner of the groove is R2, and 3mm > R2 > 0.5mm.

[0013] As a preferred embodiment of the fluidized bed repair patch of this utility model, the width W2 of the waist portion is greater than or equal to the thickness of the encapsulation layer plus the bed body.

[0014] As a preferred embodiment of the fluidized bed repair patch of this utility model, the patch is made of polyimide material.

[0015] In a preferred embodiment of the fluidized bed repair patch of this utility model, the fixing adhesive is an acrylic adhesive.

[0016] The beneficial effects of this invention are as follows: By using high-temperature resistant insulating single-sided adhesive stickers to cover defects in the encapsulation layer, the operation is simplified compared to using adhesive for repair, eliminating the need for adhesive mixing and waiting for the adhesive to cure. Especially when repairing sides, the problem of repair difficulties caused by adhesive flow is avoided. Furthermore, by providing grooves on the sides of the patch body, when using the patch to repair the fluidized bed sides, the grooves effectively alleviate the stress on the patch, thereby preventing the patch body from cracking and resulting in a more secure adhesion. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of the fluidized bed repair patch of this utility model.

[0019] Figure 2 This is a schematic diagram of the rectangular patch structure of the fluidized bed repair patch of this utility model.

[0020] Figure 3 This is a schematic diagram of the waist-shaped patch of the fluidized bed repair patch of this utility model.

[0021] Figure 4 This is a schematic diagram of the fluidized bed repair patch of this utility model being attached to the side of the fluidized bed. Detailed Implementation

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0025] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0026] Example 1

[0027] Reference Figure 1 The first embodiment of this utility model provides a fluidized bed repair patch body 200. This device includes a patch body 200, which is sheet-shaped, and the side of the patch body 200 is provided with a stress-relieving groove 203.

[0028] The patch body 200 is made of insulating material. The busbar 100 is the main body of the fluidized busbar, used for conducting current. The surface of the busbar 100 is covered with an encapsulation layer 101, which is made of insulating material and is used to protect the busbar 100 and provide insulation. The patch body 200 is also made of insulating material and can be attached to the damaged area of ​​the encapsulation layer 101 using adhesives or other methods to repair the damaged part of the encapsulation layer 101. The adhesives or other media used for fixing do not need to have insulating properties, as long as they can fix the patch body 200.

[0029] During use, first check the damaged location of the encapsulation layer 101. Apply adhesive or other fixing medium evenly to one side of the patch body 200 to form a single-sided adhesive-like form. Then, directly attach the patch body 200 to the damaged location of the encapsulation layer 101. Since the patch body 200 uses insulating material, it can directly repair the damaged location of the encapsulation layer 101. Furthermore, the patch body 200 can be made into a larger size product. During use, the patch body 200 can be cut to the corresponding size and shape as needed according to the shape and size of the damage, thus adapting to various types of damage to the encapsulation layer 101.

[0030] Example 2

[0031] Reference Figure 2 and Figure 3 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the patch body 200 has a temperature resistance greater than 200°C. The patch body 200 and the encapsulation layer 101 are fixed together by adhesive, which has a temperature resistance greater than 200°C. By using a soft insulating material and adhesive that can withstand high temperatures of 200°C, the patch body 200 can withstand the heat generated by the operation of the copper busbar during use, and the adhesive strength and insulation performance will not decrease due to high temperature.

[0032] The patch body 200 is made of soft insulating material, with a thickness greater than 0.1 mm and less than 0.2 mm. To meet withstand voltage testing requirements, a patch body 200 thickness of 0.15 mm is preferred. When the thickness of the patch body 200 exceeds 0.2 mm, the excessive thickness can easily lead to uneven local electric field distribution within the patch body 200, causing it to break down. The principle is that the breakdown strength of insulating materials is a fixed value. When the patch body 200 is too thick, if there are micro-bubbles, impurities, or delamination within the material, the electric field at these defects will concentrate sharply. For example, if a 0.1 mm bubble exists in a 0.5 mm thick patch, the electric field at the bubble may reach 10 times that of the surrounding area, far exceeding the material's breakdown strength, leading to local breakdown and ultimately overall failure. As the thickness of the patch body 200 increases, such material defects become more likely to occur. Furthermore, an excessively thick patch body 200 protrudes too much from the surface of the encapsulation layer 101 during transportation, making it very easy to scrape off. The mechanical strength of a thin patch body 200 decreases as the thickness decreases, making it very easy for the patch body 200 to be physically damaged. When the thickness of the patch body 200 is less than 0.1mm, the patch is too thin, resulting in insufficient mechanical properties of the patch body 200 itself, making it very easy to be scratched and damaged, causing defects in the patch body 200 and affecting the insulation effect.

[0033] The patch body 200 is divided into an end 201 and a waist 202. Both ends of the waist 202 are connected to the end 201. The waist 202 has symmetrical grooves 203 on both sides. By setting the waist 202 with grooves 203, the surface area of ​​the two ends 201 of the patch body 200 is larger than the surface area of ​​the waist 202. The end 201 mainly plays the role of adhesion and fixation, resulting in better fixation effect.

[0034] During operation, the copper busbar expands and contracts due to heat generated by the current and changes in ambient temperature. Since the patch body 200 and the copper busbar are made of different materials, their coefficients of thermal expansion differ, leading to mutual tensile stress. By providing symmetrical grooves 203 in the waist 202 of the patch body 200, the contact area between the patch body 200 and the copper busbar is reduced. When the entire structure is under stress, the stress is dispersed to the contact areas on both sides of the groove, avoiding concentration at a single edge point and reducing the probability of localized stress overload. Furthermore, the sides of the copper busbar are not perfectly flat; they may have slight curvature, sharp edges, or irregular contours of the encapsulation layer 101. The grooves 203 avoid these protrusions or sharp edges, allowing the effective contact area of ​​the patch body 200 to more closely match the contours of the copper busbar side, reducing loose connections.

[0035] The remaining structure is the same as that in Example 1.

[0036] Example 3

[0037] Reference Figure 2 This is the third embodiment of the present invention. Unlike the second embodiment, in this embodiment, due to the continuous stress caused by thermal expansion and contraction of the pad body 100, vibration, or external impact during use, the adhesive portion between the pad body 200 and the encapsulation layer 101 may suddenly tear or detach. This manifests as localized cracking, edge lifting, or even complete detachment of the pad body 200 from the encapsulation layer, rendering it ineffective for repair. Therefore, the pad body 200 is rectangular, and the groove 203 in the waist 202 is a rounded cone. In this case, the pad body 200 is used as a single piece. During use, the waist 202 of the pad body 200 is used as the primary repair location, and the two ends 201 are used as the primary bonding portions.

[0038] Furthermore, the included angle formed by the two sides of the groove 203 is α1, where 60° > α1 > 30°, and the radius of the fillet of the groove 203 is R1, where 3mm > R1 > 0.5mm. When the included angle is between 30° and 60°, the inclined surface formed by the two sides of the groove 203 can guide the stress to transition smoothly along the "inclined surface → plane", resulting in a smaller stress concentration factor. At this time, the tensile and shear forces generated by thermal expansion and contraction or vibration of the copper busbar will be dispersed to a larger area of ​​the patch, rather than concentrated at the apex or edge of the groove 203. When the included angle is too small (e.g., 20°), the apex of the groove 203 is close to a "sharp corner". According to the stress concentration theory, the stress concentration factor at the sharp corner will increase sharply. At this time, even if subjected to a small external force (e.g., slight deformation of the copper busbar), the stress at the apex may exceed the tear resistance of the patch material, leading to cracking. When the included angle is too large (such as 70°), the recess depth is insufficient, the ability of the two sides to guide stress is weakened, the contact shape between the patch body 200 and the side of the copper busbar is close to a plane, and the stress will be directly applied to the edge (similar to the stress distribution of a rectangular patch), which cannot be dispersed through the recess structure, and edge lifting or tearing may still occur.

[0039] The fillet radius and the included angle must match: if the included angle is 30° to 45°, the fillet radius should be 0.2mm to 0.5mm (too small and the sharp corner cannot be eliminated, too large and the groove 203 will become shallow); if the included angle is 45° to 60°, the fillet radius should be 0.5mm to 0.8mm (to adapt to a gentler slope and avoid the fillet from forming a new stress concentration point with the two sides).

[0040] Furthermore, the width W1 of the waist portion 202 is greater than or equal to the thickness of the encapsulation layer 101 plus the thickness of the pad body 100, so that the waist portion 202 of the patch body 200 can completely cover the side of the encapsulation layer 101, and can cover the damaged area when damage occurs at the side.

[0041] In use, when the side of the copper busbar is damaged, the waist 202 of the patch body 200 is placed over the damaged area, and the two ends 201 are respectively attached to the encapsulation layer 101 on both sides of the copper busbar to repair the side of the encapsulation layer 101. At the same time, in order to prevent the groove 203 from breaking open, all the corners of the groove 203 are modified to be rounded, and the right angle edges are changed to rounded edges. By eliminating sudden angles and shape transitions, when external force is applied, the stress will be evenly distributed along the tangent direction of the arc across the entire edge of the arc, eliminating stress concentration points and extending the path of force application. This allows the patch body 200 to bear external force more evenly, thereby significantly improving the tear resistance of the patch body 200 and avoiding tearing due to excessive local stress, as is the case with rectangles or circles.

[0042] The remaining structure is the same as that in Example 2.

[0043] Example 4

[0044] Reference Figure 3 This is the fourth embodiment of the present invention. The difference between this embodiment and the second embodiment is that the patch body 200 is waist-shaped and the groove 203 of the waist 202 is a rounded rectangle. In this case, the patch body 200 is used as a single piece. When in use, the waist 202 position of the patch body 200 is used as the main repair position, and the two ends 201 are used as the main bonding parts.

[0045] The depth formed by the two sides of the groove 203 is S1, which is less than 1 / 3 of the overall width of the patch body 200. The radius of the rounded corner of the groove 203 is R2, and the radius R2 is in the range of 0.8mm≤R2≤3mm. The depth S1 of the groove 203 is in the range of 0.5mm≤S1<1 / 3 of the overall width of the patch body 200.

[0046] When repairing the side of the encapsulation layer 101, the patch body 200 with a waist shape is used. The two ends of the patch body 200 are directly attached to the upper and lower surfaces of the encapsulation layer 101, and the waist 202 is attached to the side. This reduces the contact area between the patch body 200 and the side of the encapsulation layer 101, reducing the stress caused by the bonding. Compared with the contact between the patch body 200 without the groove 203 and the encapsulation layer 101, the patch body 200 has a smaller bending area on the side of the encapsulation layer 101 in this embodiment, making it less prone to warping.

[0047] Furthermore, the width W2 of the waist portion 202 is greater than or equal to the thickness of the encapsulation layer 101 plus the thickness of the pad body 100, so that the waist portion 202 of the patch body 200 can completely cover the side of the encapsulation layer 101, and can cover the damaged area when damage occurs at the side.

[0048] In use, when the side of the copper busbar is damaged, the waist 202 of the patch body 200 is placed over the damaged area, and the two ends 201 are respectively attached to the encapsulation layer 101 on both sides of the copper busbar to repair the side of the encapsulation layer 101. At the same time, in order to prevent the groove 203 from breaking open, all the corners of the groove 203 are modified to be rounded, and the right angle edges are changed to rounded edges. By eliminating sudden angles and shape transitions, when external force is applied, the stress will be evenly distributed along the tangent direction of the arc across the entire edge of the arc, eliminating stress concentration points and extending the path of force application. This allows the patch body 200 to bear external force more evenly, thereby significantly improving the tear resistance of the patch body 200 and avoiding tearing due to excessive local stress, as is the case with rectangles or circles.

[0049] The remaining structure is the same as that in Example 3.

[0050] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise changed, and the nature or number or position of discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of this invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. Therefore, this invention is not limited to the particular embodiments but extends to a variety of modifications that still fall within the scope of the appended claims.

[0051] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to the implementation of the present invention) may be omitted.

[0052] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A fluidized bed repair patch, characterized in that: include, The patch body (200) is sheet-shaped, and the side of the patch body (200) is provided with stress-relieving grooves (203); The patch body (200) is made of insulating material.

2. The fluidized bed repair patch according to claim 1, characterized in that: The patch body (200) has a temperature resistance greater than 200°C. The patch body (200) and the encapsulation layer (101) are fixed together by adhesive, which has a temperature resistance greater than 200°C.

3. The fluidized bed repair patch according to claim 2, characterized in that: The patch body (200) is made of soft insulating material, and the thickness of the patch body (200) is greater than 0.1 mm and less than 0.2 mm.

4. The fluidized bed repair patch according to any one of claims 1, 2, and 3, characterized in that: The patch body (200) is divided into an end (201) and a waist (202). The waist (202) is connected to the end (201) at both ends, and the waist (202) is provided with grooves (203) symmetrically on both sides.

5. The fluidized bed repair patch according to claim 4, characterized in that: The groove (203) of the waist (202) is a rounded cone shape; The included angle formed by the two sides of the groove (203) is α1, and the range of the included angle α1 is 30° < α1 < 60°. The radius of the rounded corner of the groove (203) is R1, and the range of the radius R1 is 0.5mm < R1 < 3mm.

6. The fluidized bed repair patch according to claim 5, characterized in that: The width W1 of the waist (202) is greater than or equal to the thickness of the encapsulation layer (101) plus the row body (100).

7. The fluidized bed repair patch according to claim 4, characterized in that: The patch body (200) is waist-shaped, and the groove (203) of the waist (202) is a rounded rectangle; The depth formed by the two sides of the groove (203) is S1, the depth S1 is less than 1 / 3 of the overall width of the patch body (200), the radius of the rounded corner of the groove (203) is R2, and the radius R2 is in the range of 0.8mm≤R2≤3mm.

8. The fluidized bed repair patch according to claim 7, characterized in that: The width W2 of the waist (202) is greater than or equal to the thickness of the encapsulation layer (101) plus the row body (100).

9. The fluidized bed repair patch according to any one of claims 1, 2, 3, 5, 6, 7, and 8, characterized in that: The patch body (200) is made of polyimide material.

10. The fluidized bed repair patch according to claim 2 or 3, characterized in that: The fixing adhesive is an acrylic adhesive.

Images