A novel PCB-mounted high-temperature-resistant thin film capacitor structure

Abstract

The utility model provides a novel PCB board carries high temperature -resistant film capacitor structure, and its heat dissipation effect is better, and the failure rate is reduced, and production efficiency is higher. It includes the core, the core is installed in the plastic shell, the core and plastic shell between fill in the filling material, the lead of core stretches out from the filling material, the plastic shell is installed in the PCB board, its characterized in that, the plastic shell material is high temperature -resistant PBT or PPS material, the plastic shell mouth portion four around increase the high boss, and the PCB board covers the shell mouth portion and is installed in the high boss, and the core is kept a certain distance with the PCB.

Description

Technical Field

[0001] This utility model relates to the field of thin film capacitor technology, specifically a novel high-temperature resistant thin film capacitor structure on a PCB board. Background Technology

[0002] With the continuous development of electronic technology, film capacitors on PCBs are being used more and more widely in capacitive power supplies. Especially in high-temperature environments of 100℃-110℃, higher requirements are being placed on the high-temperature resistance of film capacitors.

[0003] However, existing technologies suffer from the following problems: limited heat dissipation. Traditional film capacitors for PCBs are typically tightly mounted on the PCB, limiting their own heat dissipation. This design restricts heat dissipation, causing the internal temperature of the capacitor to rise when operating in high-temperature environments, affecting its performance and lifespan. Simultaneously, the failure rate of film capacitors increases significantly with prolonged operation at high temperatures. This is because high temperatures accelerate the aging of the capacitor's internal materials, leading to a decline in insulation performance and increasing the risk of failure. In severe cases, the capacitor may fail due to excessive self-healing caused by insufficient voltage withstand, or due to overheating and breakdown. These problems not only affect the quality of the capacitor but may also damage the entire electronic system. Utility Model Content

[0004] To address the problems of limited heat dissipation, high failure rate, and low production efficiency in existing film capacitors, this invention provides a novel PCB-based high-temperature resistant film capacitor structure, which has better heat dissipation, lower failure rate, and higher production efficiency.

[0005] The technical solution is as follows: A novel PCB board onboard high temperature resistant film capacitor structure, which includes a core, the core is mounted on a plastic shell, a potting compound is filled between the core and the plastic shell, the lead wire of the core extends from the potting compound, and the plastic shell is mounted on a PCB board, characterized in that the plastic shell is made of high temperature resistant PBT or PPS material.

[0006] Raised protrusions are added around the opening of the plastic shell, and the PCB board covers the opening of the shell and is installed on the raised protrusions. A certain distance is left between the core and the PCB.

[0007] The lead wire is designed with a bend, so that when it is placed into the plastic shell after being welded to the core, the bend of the lead wire supports the two sides of the shell, ensuring that the core is placed in the center of the plastic shell.

[0008] The beneficial effects of this utility model are:

[0009] (1) This utility model adds raised protrusions around the top of the plastic shell, maintaining a certain distance between the capacitor and the PCB, effectively preventing the high temperature of the PCB from being conducted to the capacitor, and increasing the heat dissipation of the capacitor. This improves the heat dissipation of the capacitor in high-temperature environments, reduces the aging of the internal materials of the capacitor caused by high temperature, thereby reducing the failure rate and improving the reliability and service life of the capacitor in high-temperature environments; it also reduces the risk of capacitor failure due to excessive self-healing caused by insufficient withstand voltage, and the possibility of failure and breakdown due to overheating.

[0010] (2) By improving the lead wire design, this utility model ensures that the core is placed in the center inside the shell and uses the bent lead wire to fix the core inside the capacitor. This ensures that the core is fixed inside the capacitor and will not shake, while ensuring that the potting material can be evenly filled inside the plastic shell, thus improving the high temperature and high humidity resistance of the capacitor. This allows the potting process to be completed in one go, significantly improving production efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the plastic casing;

[0012] Figure 2 This is a schematic diagram of the lead wire and core being soldered together.

[0013] Figure 3 This is a schematic diagram of the assembly of the lead wire, core, and outer casing.

[0014] Figure 4 for Figure 3 A diagram showing the assembly and sealing process;

[0015] Figure 5 yes Figure 4 A diagram showing the result after the top and bottom directions are reversed. Detailed Implementation

[0016] See Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, this utility model includes a core 2, which is installed on a plastic shell 1. A potting compound 4 is filled between the core 2 and the plastic shell 1. The lead wire 3 of the core 2 extends out from the potting compound 4. The plastic shell 1 is mounted on a PCB board. The plastic shell 1 is made of high-temperature resistant PBT or PPS material.

[0017] Raised protrusions 11 are added around the opening of the plastic shell 1. The PCB board covers the opening of the shell and is installed on the raised protrusions 11. A certain distance is left between the core 2 and the PCB. The lead wire 3 has a bending design. After being soldered to the core 2, when it is put into the plastic shell 1, the bent part of the lead wire 3 supports the two sides of the shell 1, ensuring that the core 2 is placed in the center of the plastic shell 1. The lead wire 3 is bent at the bottom. The lead wire 3 is soldered to the core 2 and put into the shell 1. Finally, potting compound 4 is injected into its interior.

Claims

1. A novel PCB-mounted high-temperature resistant thin-film capacitor structure, comprising a core, the core being mounted on a plastic casing, a potting compound filling the space between the core and the plastic casing, leads of the core extending from the potting compound, and the plastic casing being mounted on a PCB board, characterized in that, The plastic shell is made of high-temperature resistant PBT or PPS material; raised protrusions are added around the opening of the plastic shell, and the PCB board covers the opening of the shell and is installed on the raised protrusions, with a distance left between the core and the PCB.

2. The novel PCB onboard high-temperature resistant thin-film capacitor structure according to claim 1, characterized in that: The lead wire is designed with a bend, so that when it is placed into the plastic shell after being welded to the core, the bend of the lead wire supports the two sides of the shell, ensuring that the core is placed in the center of the plastic shell.

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