Capacitor group structure, power domain control unit and electric vehicle
By designing a capacitor bank structure in the electric drive controller, using a current sensor to monitor the bus current in real time, and combining thermally conductive silicone and a water cooling system for heat dissipation, the problem of real-time monitoring and heat dissipation of the capacitor bank under high power and high temperature environments is solved, thereby improving the functional safety and stability of the system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HEFEI GUOXUAN HIGH TECH POWER ENERGY
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-14
AI Technical Summary
In existing electric drive controllers, the bus current of the film capacitor cannot be monitored accurately in real time, which leads to a reduction in the system's functional safety level. Furthermore, the capacitor is prone to overheating in high-power and high-temperature environments, affecting its temperature rise capability and lifespan.
A capacitor bank structure was designed, which includes capacitor cells, capacitor base, sensor module and wiring structure. A current sensor is used to monitor the bus current in real time, and heat dissipation is achieved through thermally conductive silicone and water cooling system, including adapter copper bus and heat dissipation aluminum plate to conduct heat.
It achieves compact arrangement and real-time monitoring of current sensors, improves the functional safety level of the system, and maintains the stability and lifespan of the capacitor bank under high power conditions through effective heat dissipation measures.
Smart Images
Figure CN224501699U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electric drive controller technology, and specifically relates to a capacitor bank structure, a power domain control unit, and an electric vehicle. Background Technology
[0002] With the increasing number of 800V platform electric drive controller products, the development of film capacitors, one of the key components, has become particularly important. They provide inverters with stable, smooth, and clean DC bus voltage, absorb transient energy caused by frequent switching of power modules, and also filter high-frequency signals.
[0003] To reduce costs and minimize the space required for individual components, existing capacitors used in electric drive controllers often omit the current sensor connected to the bus terminal of the film capacitor. Instead, they use software estimation to provide feedback control of the bus current connected to the film capacitor. However, software estimation cannot accurately reflect the bus current of the film capacitor in real time, which reduces the functional safety level of the system and indirectly increases the complexity of the algorithm, thereby increasing software development costs. In high-power and high-temperature environments, film capacitors require a strong current carrying capacity, which causes severe heating of the film capacitor and bus structure, thus affecting the temperature rise capability and lifespan of the capacitor and bus.
[0004] To address the above issues, a capacitor bank structure that can monitor bus current in real time and dissipate heat is needed. Utility Model Content
[0005] To address the aforementioned problems, this utility model proposes a capacitor bank structure, including a capacitor cell, a capacitor base, a sensor module, and a wiring structure. The capacitor cell is fixedly installed inside the capacitor base. The wiring structure is fixedly installed on a bracket at the end of the capacitor base and is electrically connected to the capacitor cell via a first connecting copper plate and a second connecting copper plate. A sensor module, including a current sensor, is installed above and electrically connected to the second connecting copper plate.
[0006] Furthermore, the current sensor is fixedly mounted on the bracket by a second screw.
[0007] Furthermore, the capacitor bank structure also includes a controller housing, the bottom of which is provided with thermally conductive silicone. The controller housing is installed on the outside of the capacitor base, sensor module and wiring structure, and the capacitor base and wiring structure are in contact with the upper surface of the thermally conductive silicone.
[0008] Furthermore, the wiring structure also includes a transition copper busbar, which is installed between the current sensor and the second connecting copper plate, and the transition copper busbar is in contact with the second connecting copper plate.
[0009] Furthermore, the current sensor and the adapter copper busbar are fixedly connected by the first screw.
[0010] Furthermore, the adapter copper busbar is provided with a heat dissipation copper busbar connector, which is in contact with the upper surface of the thermally conductive silicone.
[0011] Furthermore, a heat-dissipating aluminum plate is provided on the lower surface of the capacitor base, and the heat-dissipating aluminum plate is in contact with the upper surface of the thermally conductive silicone.
[0012] Furthermore, an output terminal is provided on the side of the capacitor base.
[0013] A power domain control unit includes a control board, a housing, and the aforementioned capacitor bank structure. The control board and the capacitor bank structure are both fixedly installed in the housing and are electrically connected.
[0014] An electric vehicle includes the aforementioned power domain control unit, battery pack, and vehicle body, wherein the power domain control unit and the battery pack are both mounted on the vehicle body and are electrically connected to the battery pack.
[0015] Beneficial effects:
[0016] 1. The capacitor bank structure of this utility model is equipped with a current sensor, which is mounted on a bracket at the end of the capacitor base to achieve a compact arrangement of the current sensor; the wiring structure is electrically connected to the capacitor cell through a second connecting copper plate, and the current sensor is electrically connected to the second connecting copper plate, which can realize real-time monitoring of DC input power supply and improve the functional safety level of the system.
[0017] 2. To effectively solve the heat generation problem of capacitor modules under high-power application conditions, the capacitor bank structure of this utility model is designed with a transition copper busbar at the current input end (i.e., the second connecting copper plate) and the current sensor placement position. The heat dissipation copper busbar contacts on the transition copper busbar are in contact with the thermally conductive silicone, and the thermally conductive silicone is in contact with the water-coolable controller housing for effective heat dissipation. A heat dissipation aluminum plate is designed at the bottom of the capacitor cell. The heat dissipation aluminum plate is in contact with the water-coolable controller housing through the thermally conductive silicone for effective heat dissipation.
[0018] 3. The capacitor bank structure of this utility model effectively achieves the assembly and fixation of the current sensor. Through customized development of the current sensor's shape, the current sensor and the adapter copper busbar are connected via a second screw, with the current sensor's signal interface facing upwards (see reference). Figure 3 (At point A in the middle), to facilitate wiring and signal transmission.
[0019] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This illustration shows an overall schematic diagram of the capacitor module, sensor module, and wiring structure of the capacitor bank structure in an embodiment of the present invention.
[0022] Figure 2 A top view schematic diagram of the capacitor module, sensor module, and wiring structure of the capacitor bank structure in an embodiment of this utility model is shown.
[0023] Figure 3 An exploded view of the capacitor module, sensor module, and wiring structure of the capacitor bank structure in an embodiment of this utility model is shown.
[0024] Figure 4 A cross-sectional schematic diagram of the capacitor bank structure in an embodiment of this utility model is shown.
[0025] Figure 5 A partial structural schematic diagram of the capacitor bank structure in an embodiment of this utility model is shown.
[0026] Figure 6 The diagram shows a bottom view of the capacitor module, sensor module, and wiring structure of the capacitor bank structure in an embodiment of this utility model.
[0027] In the diagram, 10 is the capacitor module; 11 is the heat sink aluminum plate; 12 is the capacitor cell; 13 is the capacitor base; 131 is the bracket; 20 is the sensor module; 21 is the current sensor; 22 is the first screw; 23 is the second screw; 25 is the third screw; 30 is the controller housing; 31 is the thermally conductive silicone; 40 is the wiring structure; 41 is the first connecting copper plate; 42 is the second connecting copper plate; 43 is the adapter copper busbar; 431 is the heat sink copper busbar connector; and 50 is the output terminal. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0029] Example 1,
[0030] refer to Figure 1 A capacitor bank structure includes a capacitor cell 12, a capacitor base 13, a sensor module 20, and a wiring structure 40. The wiring structure 40 is fixedly mounted on a bracket 131 at the end of the capacitor base 13 and is electrically connected to the capacitor module 10. The capacitor cell 12 is fixedly mounted inside the capacitor base 13. The sensor module 20 is mounted on the upper surface of the bracket 131 and is electrically connected to the wiring structure 40. The wiring structure 40 includes a first connecting copper plate 41 and a second connecting copper plate 42, and is electrically connected to the capacitor cell 12 through the first connecting copper plate 41 and the second connecting copper plate 42. The sensor module 20 includes a current sensor 21, which is mounted above the second connecting copper plate 42 and is electrically connected to the second connecting copper plate 42.
[0031] Furthermore, the capacitor module 10 includes a heat dissipation aluminum plate 11, a capacitor cell 12, and a capacitor base 13. The capacitor cell 12 is fixedly installed inside the capacitor base 13, and a heat dissipation aluminum plate 11 is provided at the bottom of the capacitor base 13. The heat dissipation aluminum plate 11 is in close contact with the capacitor cell 12. A bracket 131 is provided at one end of the capacitor base 13. The capacitor base 13 is made of plastic. When one or more of the capacitor cell 12, the first connecting copper plate 41, the second connecting copper plate 42, and the current sensor 21 generate excessive heat, the capacitor base 13 will melt, causing structural damage or even a fire. Therefore, it is necessary to dissipate heat from the capacitor cell 12, the first connecting copper plate 41, the second connecting copper plate 42, and the current sensor 21.
[0032] Specifically, in order to achieve a compact arrangement of the current sensor 21, an adapter copper busbar 43 is designed at the input end of the capacitor cell 12 as the negative input terminal of the multiplexed capacitor. The adapter copper busbar 43 is fixed to the capacitor base 13 by a third screw 25, which is the fixing screw of the adapter copper busbar 43.
[0033] Furthermore, to effectively assemble and fix the current sensor 21, the shape of the current sensor 21 is customized. The current sensor 21 is connected to the adapter copper busbar 43 by the second screw 23, with the signal interface of the current sensor 21 facing upwards (see reference). Figure 3 (At point A in the middle), to facilitate wiring and signal transmission.
[0034] refer to Figure 4 The current sensor 21 is fixedly mounted on the bracket 131 by the second screw 23. Specifically, the current sensor 21 is fixed to the capacitor base 13 by two second screws 23, thereby realizing the integration of the current sensor 21 and the capacitor base 13 and improving space utilization.
[0035] refer to Figure 5 The capacitor bank structure also includes a controller housing 30. A thermally conductive silicone 31 is provided on the bottom of the controller housing 30. The capacitor base 13, sensor module 20, and wiring structure 40 are installed inside the controller housing 30, and both the capacitor base 13 and wiring structure 40 are in contact with the upper surface of the thermally conductive silicone 31. Specifically, by providing thermally conductive silicone 31 on the surface of the bottom of the sensor module 20, heat transfer is achieved, thereby improving the heat dissipation effect. Since the controller housing 30 has a water cooling system, heat dissipation is faster, improving heat dissipation efficiency.
[0036] Furthermore, the wiring structure 40 also includes a connecting copper busbar 43, which is installed between the current sensor 21 and the second connecting copper plate 42, and is in contact with the second connecting copper plate 42. Specifically, the connecting copper busbar 43 is used for heat dissipation. The connecting copper busbar 43 is in contact with the second connecting copper plate 42 and the current sensor 21, thereby dissipating the heat generated by the second connecting copper plate 42 and the heat generated by the current sensor 21 during operation. The heat is transferred to the controller housing 30 through the thermally conductive silicone 31. Heat dissipation is achieved through the water cooling and heat dissipation of the controller housing 30 itself, thereby improving the heat dissipation efficiency and preventing damage to the current sensor 21 or the capacitor base 13 due to excessive temperature of the current sensor 21 or the second connecting copper plate 42.
[0037] In the above embodiments, another optional implementation is that the current sensor 21 and the adapter copper busbar 43 are fixedly connected by the first screw 22. Specifically, the current sensor 21 and the adapter copper busbar 43 are fixed together by the first screw 22 and fixedly connected to the bracket 131 of the capacitor base 13, which improves the sturdiness and prevents damage to the current sensor 21 due to vehicle bumps.
[0038] refer to Figure 6 The adapter copper busbar 43 is provided with a heat dissipation copper busbar connector 431, which is in contact with the upper surface of the thermally conductive silicone 31.
[0039] Specifically, in order to effectively solve the heat generation problem of capacitor module 10 under high power application conditions, heat dissipation copper busbar 431 is designed at the current input end (i.e. on the second connecting copper plate 42) and the location where current sensor 21 is arranged; heat dissipation aluminum plate 11 is designed at the bottom of capacitor cell 12. Both heat dissipation copper busbar 431 and heat dissipation aluminum plate 11 are in contact with water-coolable controller housing 30 through thermally conductive silicone 31 for effective heat dissipation.
[0040] Specifically, the access end of the wiring structure 40 is connected to the access circuit, and the output port of the wiring structure 40 is connected to the capacitor cell 12 of the capacitor module 10 through the first connecting copper plate 41 and the second connecting copper plate 42. When current is input to the capacitor cell 12, the first connecting copper plate 41 and the second connecting copper plate 42 will generate heat. The heat dissipation copper busbar 431 on the adapter copper busbar 43 contacts the thermal conductive silicone 31, and the thermal conductive silicone 31 contacts the controller housing 30, thereby transferring some heat to ensure the stable operation of the first connecting copper plate 41, the second connecting copper plate 42, and the current sensor 21.
[0041] refer to Figure 2 A heat dissipation aluminum plate 11 is provided on the lower surface of the capacitor base 13, and the heat dissipation aluminum plate 11 is in contact with the upper surface of the thermally conductive silicone 31. Specifically, the heat dissipation aluminum plate 11 is the main heat dissipation point of the capacitor cell 12. When the capacitor cell 12 is working, it generates a lot of heat. The heat dissipation aluminum plate 11 at its bottom can transfer most of the heat to the controller housing 30 through the thermally conductive silicone 31, thereby ensuring the stable operation of the capacitor cell 12.
[0042] refer to Figure 4 The capacitor base 13 has an output terminal 50 on its side. Specifically, the output terminal 50 is electrically connected to the capacitor cell 12, and the output terminal 50 is fixedly installed on the side of the capacitor base 13. The electrical equipment is connected to the output terminal 50, thereby realizing the driving of the electrical equipment.
[0043] Working principle: The input power is connected through the input terminal of the wiring structure 40. The wiring structure 40 is then connected to the capacitor cell 12 through the first connecting copper plate 41 and the second connecting copper plate 42. A current sensor 21 is provided on the second connecting copper plate 42 to monitor the input current of the capacitor cell 12 in real time. At the same time, a transition copper busbar 43 is provided on the first connecting copper plate 41 and the second connecting copper plate 42. The heat dissipation copper busbar 431 of the transition copper busbar 43 contacts the controller housing 30 through thermally conductive silicone 31, thereby achieving heat dissipation. Meanwhile, a heat dissipation aluminum plate 11 is provided under the capacitor cell 12. The heat dissipation aluminum plate 11 is connected to the controller housing 30 through thermally conductive silicone 31, thereby achieving heat dissipation of the capacitor cell 12.
[0044] Example 2,
[0045] This invention realizes a thin-film capacitor suitable for an 800V platform electrical controller. It integrates a current sensor 21 to realize real-time monitoring of DC input power, improve the functional safety level of the system, and ensure the stability of product use through an effective structural heat dissipation scheme under high power application conditions. For application scenarios with high system functional safety requirements, it is necessary to add a current sensor 21 at the first connecting copper plate 41 or the second connecting copper plate 42 for real-time data acquisition. Under high power and high temperature environment conditions, the capacitor cell 12 needs to have a strong current carrying capacity, which means that necessary structural heat dissipation is required for the capacitor cell 12.
[0046] First, this utility model customizes the current sensor 21 according to the specific installation position and installation situation of the capacitor bank structure. By customizing the shape of the current sensor 21, the current sensor 21 and the adapter copper busbar 43 are connected by the second screw 23. The signal interface of the current sensor 21 faces upward, which facilitates wiring and signal transmission, thereby saving space. Since the capacitor base 13 is made of plastic (because the capacitor base 13 needs insulation, it is cheap and easy to mold, so plastic is the best choice, but plastic has a low melting point), when one or more of the capacitor cell 12, the first connecting copper plate 41, the second connecting copper plate 42, and the current sensor 21 heat up severely, the capacitor base 13 will melt, which will cause structural damage or fire. Therefore, heat dissipation is required for the capacitor cell 12, the first connecting copper plate 41, the second connecting copper plate 42, and the current sensor 21.
[0047] To address the aforementioned heat dissipation problem, this invention employs the following method:
[0048] The capacitor bank structure of this utility model also includes a controller housing 30. A thermally conductive silicone 31 is provided at the bottom of the controller housing 30. The capacitor base 13, sensor module 20, and wiring structure 40 are installed inside the controller housing 30, and the capacitor base 13 and wiring structure 40 are in contact with the upper surface of the thermally conductive silicone 31. Specifically, by providing thermally conductive silicone 31 on the surface of the bottom of the sensor module 20, heat transfer is achieved, thereby improving the heat dissipation effect. Since the controller housing 30 has a water cooling system, heat dissipation is faster, improving heat dissipation efficiency.
[0049] Specifically, the adapter copper busbar 43 is installed between the current sensor 21 and the second connecting copper plate 42, and the adapter copper busbar 43 is in contact with the second connecting copper plate 42, thereby dissipating the heat generated by the second connecting copper plate 42 and the heat generated by the current sensor 21. The heat is then transferred to the controller housing 30 through the thermal conductive silicone 31. The controller housing 30 is cooled by water and by its own heat dissipation, thereby improving the heat dissipation efficiency and preventing damage to the capacitor base 13 due to excessive temperature of the current sensor 21 or the second connecting copper plate 42.
[0050] Method 3: A heat dissipation aluminum plate 11 is provided on the lower surface of the capacitor base 13. The heat dissipation aluminum plate 11 is in contact with the upper surface of the thermally conductive silicone 31, which can transfer most of the heat to the controller housing 30, thereby ensuring the stable operation of the capacitor cell 12.
[0051] Example 3,
[0052] A power domain control unit includes a control board, a housing, and a capacitor bank structure as described in Embodiment 1 or 2. Both the control board and the capacitor bank structure are fixedly installed in the housing, and the control board and the capacitor bank structure are electrically connected.
[0053] Example 4,
[0054] An electric vehicle includes a power domain control unit, a battery pack, and a vehicle body, as described in Embodiment 3. Both the power domain control unit and the battery pack are mounted on the vehicle body, and the power domain control unit and the battery pack are electrically connected.
[0055] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A capacitor bank structure, characterized in that, The device includes a capacitor cell (12), a capacitor base (13), a sensor module (20), and a wiring structure (40). The capacitor cell (12) is fixedly installed inside the capacitor base (13). The wiring structure (40) is fixedly installed on a bracket (131) at the end of the capacitor base (13), and the wiring structure (40) is electrically connected to the capacitor cell (12) through a first connecting copper plate (41) and a second connecting copper plate (42). The sensor module (20) is installed on the upper surface of the bracket (131). The sensor module (20) includes a current sensor (21), which is installed above the second connecting copper plate (42) and electrically connected to the second connecting copper plate (42).
2. The capacitor bank structure according to claim 1, characterized in that, The current sensor (21) is fixedly mounted on the bracket (131) by the second screw (23).
3. The capacitor bank structure according to claim 1, characterized in that, The capacitor bank structure also includes a controller housing (30), the bottom of which is provided with thermally conductive silicone (31). The controller housing (30) is installed on the outside of the capacitor base (13), the sensor module (20) and the wiring structure (40), and the capacitor base (13) and the wiring structure (40) are in contact with the upper surface of the thermally conductive silicone (31).
4. A capacitor bank structure according to claim 3, characterized in that, The wiring structure (40) also includes a transition copper busbar (43), which is installed between the current sensor (21) and the second connecting copper plate (42), and the transition copper busbar (43) is in contact with the second connecting copper plate (42).
5. A capacitor bank structure according to claim 4, characterized in that, The current sensor (21) and the adapter copper busbar (43) are fixedly connected by the first screw (22).
6. A capacitor bank structure according to claim 4 or 5, characterized in that, The adapter copper busbar (43) is provided with a heat dissipation copper busbar connector (431), which is in contact with the upper surface of the thermally conductive silicone (31).
7. A capacitor bank structure according to claim 3, characterized in that, The lower surface of the capacitor base (13) is provided with a heat dissipation aluminum plate (11), which is in contact with the upper surface of the thermally conductive silicone (31).
8. A capacitor bank structure according to claim 1, characterized in that, The capacitor base (13) has an output terminal (50) on its side.
9. A power domain control unit, characterized in that, The device includes a control board, a housing, and a capacitor bank structure as described in any one of claims 1-8, wherein the control board and the capacitor bank structure are both fixedly installed in the housing, and the control board and the capacitor bank structure are electrically connected.
10. A tram, characterized in that, The system includes the power domain control unit, battery pack, and vehicle body as described in claim 9, wherein the power domain control unit and the battery pack are both mounted on the vehicle body, and the power domain control unit and the battery pack are electrically connected.