A switching module

Abstract

The utility model discloses a switch module, and the module contains several side -by -side setting relays. Side edge cooling assembly is arranged on the left and right sides of the relay, and it is composed of copper heat conduction sheet, heat conduction connecting plate, TEC semiconductor refrigeration sheet and micro heat dissipation fan. Copper heat conduction sheet is attached to the side of relay through heat conduction silicone grease, heat conduction connecting plate is fixed in the front side of copper heat conduction sheet, TEC semiconductor refrigeration sheet refrigeration end is connected with heat conduction connecting plate, and the heat dissipation end is connected with micro heat dissipation fan, and can efficiently take away the heat of relay. The upper surface of relay is covered with anti - electromagnetic cover, and the anti - electromagnetic cover is composed of transparent plastic baffle and metal shell, the metal shell is covered with the outer surface of relay and is provided with relay electricity connection mouth, and the inner side of transparent plastic baffle and metal shell is sprayed with transparent water -based electromagnetic wave coating, and can block outside electromagnetic wave interference. The switch module has efficient heat dissipation and good electromagnetic protection function, and guarantees the stable operation of relay.

Description

Technical Field

[0001] This utility model relates to the field of relay technology, specifically to a switch module. Background Technology

[0002] In the field of electronic equipment, relays are key circuit control components, and their stability and reliability are crucial to the operation of the entire system. In practical applications, relays generate heat during operation. If this heat cannot be dissipated in time, the relay temperature will rise, affecting its performance and lifespan. Simultaneously, the electromagnetic environment in which relays operate is complex; external electromagnetic waves may interfere with their contacts, causing malfunctions and affecting the normal control of the circuit.

[0003] Currently, several solutions exist in the market for addressing the issues of relay heat dissipation and electromagnetic protection. For heat dissipation, common methods include using heat sinks and fans, but these devices often suffer from low heat dissipation efficiency and large space requirements. For example, heat sinks only dissipate heat through natural convection, resulting in slow cooling; while fans accelerate airflow, they generate noise and tend to accumulate dust in dusty environments, affecting heat dissipation. Regarding electromagnetic protection, some relays use metal casings for shielding, but this shielding method is often insufficient and cannot effectively block electromagnetic interference from all directions. Furthermore, the metal casing may hinder heat dissipation, leading to heat buildup. In addition, some electromagnetic protection solutions may increase the size and cost of the relay, making them unsuitable for applications with limited space or cost sensitivity. Therefore, a switching module that effectively dissipates heat and provides good electromagnetic protection is needed to meet the requirements of practical applications. Utility Model Content

[0004] The purpose of this utility model is to provide a technical solution for a switching module to address the shortcomings mentioned in the background art. To overcome the drawbacks and defects described in the background art, this technical solution includes the following:

[0005] It includes several relays arranged side by side, with side cooling components on both the left and right sides of each relay, and an anti-electromagnetic shield fixedly covering the upper surface of each relay.

[0006] Each side cooling component includes a copper heat-conducting sheet that is attached and fixed to the left and right sides of the relay by thermal grease, and a heat-conducting connecting plate fixed to the front side of the copper heat-conducting sheet. A TEC semiconductor cooling chip is fixed on the end face of the heat-conducting connecting plate away from the copper heat-conducting sheet, and a miniature heat dissipation fan is fixedly connected to the end face of the TEC semiconductor cooling chip away from the heat-conducting connecting plate.

[0007] The electromagnetic shield includes a transparent plastic baffle covering the upper surface of the relay, a metal housing fixed to the front and rear ends of the transparent plastic baffle and covering the outer surface of the relay, and the interior of the metal housing has a relay power port for connecting the relay to the wiring harness.

[0008] As a preferred embodiment of this utility model: the cooling end face of the TEC semiconductor refrigeration chip is fixedly connected to the side of the thermally conductive connecting plate away from the copper thermally conductive sheet by thermally conductive silicone grease, and the heat dissipation end face of the TEC semiconductor refrigeration chip is fixedly connected to a miniature heat dissipation fan.

[0009] As a preferred embodiment of this utility model: the exhaust end face of the micro heat dissipation fan is connected to the heat dissipation end face of the TEC semiconductor cooling chip, and is used to draw away the hot air at the heat dissipation end face of the TEC semiconductor cooling chip.

[0010] As a preferred embodiment of this utility model: the end face of the heat-conducting connecting plate away from the TEC semiconductor cooling chip has a distance of 2-5cm between it and the front end face of the relay, so as to avoid blocking the wiring port on the front end face of the relay.

[0011] As a preferred embodiment of this utility model, the inner sidewalls of the transparent plastic baffle and the metal shell are both coated with transparent water-based electromagnetic wave coating to prevent external electromagnetic waves from interfering with the relay contacts.

[0012] As a preferred embodiment of this utility model, there is a gap of 0.5-1.0 cm between the bottom surface of the transparent plastic baffle and the upper surface of the relay.

[0013] As a preferred embodiment of this utility model, the lower inner surface of the metal housing is fixedly connected to the front area of ​​the upper surface of the relay.

[0014] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0015] The copper heat-conducting fins in the side cooling assembly quickly dissipate heat from the side of the relay, transferring it to the TEC semiconductor cooling chip via a heat-conducting connecting plate. The cooling end absorbs heat, lowering the relay temperature, while the heat dissipation end, in conjunction with a miniature cooling fan, promptly removes hot air, forming an efficient heat dissipation cycle. This effectively prevents the relay from overheating and affecting its performance and lifespan. The metal shell of the electromagnetic shield and the inner side of the transparent plastic baffle are coated with a transparent water-based electromagnetic wave coating, which reflects and absorbs external electromagnetic waves. The metal shell covers the outer surface of the relay, forming a physical shield. This double protection reduces electromagnetic interference to the relay contacts, ensuring precise circuit control. Furthermore, a gap is left between the heat-conducting connecting plate and the front of the relay to avoid obstructing the wiring port, and a gap exists between the transparent plastic baffle and the upper surface of the relay to facilitate airflow. This achieves both heat dissipation and electromagnetic protection while also considering installation convenience and the normal operating requirements of the relay. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0017] Figure 1 This is a schematic diagram of the overall structure of the switch module;

[0018] Figure 2 This is a schematic diagram showing the disassembled state of the switch module;

[0019] Figure 3 This is a schematic diagram of the side cooling assembly;

[0020] Figure 4 This is a schematic diagram of an electromagnetic shield.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1. Side cooling component; 11. Copper heat-conducting plate; 12. Heat-conducting connecting plate; 13. TEC semiconductor cooling chip; 14. Miniature heat dissipation fan; 2. Relay; 3. Electromagnetic shield; 31. Transparent plastic baffle; 32. Metal housing; 33. Relay power interface. Detailed Implementation

[0023] To provide a clearer explanation and illustration of the technical solution and implementation of this utility model, several preferred specific embodiments for implementing the technical solution of this utility model are introduced below. The following description is merely exemplary and not intended to limit the scope, application, or use of this disclosure. It should be understood that in all these drawings, the same or similar reference numerals indicate the same or similar parts and features. The various drawings only schematically illustrate the concept and principles of the embodiments of this disclosure and do not necessarily show the specific dimensions and scale of each embodiment. Specific parts in particular drawings may be exaggerated to illustrate relevant details or structures of the embodiments of this disclosure. The disclosures of various publications, patents, and published patent specifications cited herein are incorporated herein by reference in their entirety. The technical solution of this utility model will be clearly and completely described below in conjunction with embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model.

[0024] Example 1: The main body of the switch module consists of three relays 2 arranged side by side, with side cooling components 1 installed on both the left and right sides of each relay 2. During installation, copper heat-conducting sheets 11 are evenly attached to the left and right surfaces of the relay 2 using thermally conductive silicone grease, ensuring tight contact between the copper heat-conducting sheets 11 and the relay 2. A thermally conductive connecting plate 12 is fixed to the front side of the copper heat-conducting sheets 11 with bolts. A TEC semiconductor cooling chip 13 is installed at the end away from the copper heat-conducting sheets 11. The cooling end face of the TEC semiconductor cooling chip 13 is connected to the thermally conductive connecting plate 12 via thermally conductive silicone grease, and the heat dissipation end face is fixed to a miniature cooling fan 14. The exhaust end face of the miniature cooling fan 14 is in contact with the heat dissipation end face of the TEC semiconductor cooling chip 13, drawing away hot air during operation. An anti-electromagnetic shield 3 covers the upper surface of the relay 2, a transparent plastic baffle 31 is placed above the relay 2, and a metal housing 32 is fixed to the front and rear end faces of the transparent plastic baffle 31 and covers the outer surface of the relay 2. The relay connection port 33 is located on the metal housing 32, facilitating connection between the relay 2 and the wiring harness.

[0025] Example 2: Based on Example 1, the side cooling component 1 is optimized. The end face of the heat-conducting connecting plate 12 away from the TEC semiconductor cooling chip 13 is kept 3cm away from the front end face of the relay 2 to avoid blocking the wiring port on the front end face of the relay 2. During installation, first determine the position of the relay 2, and then install the heat-conducting connecting plate 12 according to the spacing requirements, ensuring that it is parallel to the front end face of the relay 2 and the spacing meets the requirements. The installation method of other components is the same as in Example 1.

[0026] Example 3: Based on Example 1, the anti-electromagnetic shield 3 is improved. A transparent water-based electromagnetic wave coating is sprayed onto the inner sidewalls of the transparent plastic baffle 31 and the metal housing 32, evenly covering the entire inner sidewall to form an electromagnetic wave shielding layer. A 0.8cm gap is maintained between the bottom surface of the transparent plastic baffle 31 and the upper surface of the relay 2 to facilitate air circulation. The lower inner surface of the metal housing 32 is fixed to the front area of ​​the upper surface of the relay 2 with bolts, ensuring that the anti-electromagnetic shield 3 is securely installed on the relay 2. The installation method of other components is the same as in Example 1.

[0027] Example 4: Based on the improvements of Examples 2 and 3, the heat-conducting connecting plate 12 in the side cooling component 1 of the switch module maintains a 4cm gap with the front end face of the relay 2. The transparent plastic baffle 31 and the inner sidewall of the metal shell 32 of the electromagnetic shield 3 are sprayed with transparent water-based electromagnetic wave coating. The bottom surface of the transparent plastic baffle 31 maintains a 0.6cm gap with the upper surface of the relay 2, and the lower inner surface of the metal shell 32 is fixedly connected to the front area of ​​the upper surface of the relay 2. During installation, the side cooling component 1 is installed first, followed by the electromagnetic shield 3, ensuring that the installation positions of each component are accurate and the connections are secure.

[0028] Example 5: The switching module uses five relays 2 arranged side by side, with side cooling components 1 installed on both the left and right sides of each relay 2. The copper heat-conducting sheet 11 of the side cooling component 1 is attached to the left and right sides of the relay 2 with thermal grease. The thermally conductive connecting plate 12 is fixed to the front side of the copper heat-conducting sheet 11, maintaining a 2cm gap with the front end face of the relay 2. The TEC semiconductor cooling chip 13 is installed at the end of the thermally conductive connecting plate 12 away from the copper heat-conducting sheet 11, and its heat dissipation end face is connected to the miniature cooling fan 14. The transparent plastic baffle 31 of the anti-electromagnetic shield 3 is placed above the relay 2, with a 1.0cm gap between its bottom surface and the upper surface of the relay 2. The metal shell 32 is fixed to the front and rear end faces of the transparent plastic baffle 31 and covers the outer surface of the relay 2. The inner sidewall is sprayed with transparent water-based electromagnetic wave coating, and the lower inner surface is fixedly connected to the front area of ​​the upper surface of the relay 2.

[0029] Based on the above preferred technical solution, the workflow of this technical solution is described as follows:

[0030] Relay 2 is in an energized or de-energized state to control the circuit's on / off state, generating heat during this process and potentially subject to external electromagnetic interference. The side cooling assembly 1 activates, with the copper heat-conducting sheet 11 rapidly conducting the heat generated on both sides of relay 2. Because the copper heat-conducting sheet 11 is tightly bonded to relay 2 via thermal grease, heat transfer is highly efficient. The thermally conductive connecting plate 12 receives the heat conducted by the copper heat-conducting sheet 11 and further transfers it to the cooling end face of the TEC semiconductor cooler 13. When the TEC semiconductor cooler 13 is energized, its cooling end face absorbs heat, lowering the temperature of the thermally conductive connecting plate 12, thereby continuously removing heat from the copper heat-conducting sheet 11 and the sides of relay 2.

[0031] Meanwhile, heat is generated at the heat dissipation end face of the TEC semiconductor cooler 13, and the miniature cooling fan 14 starts. Its exhaust end face draws out the hot air from the heat dissipation end face of the TEC semiconductor cooler 13, accelerating airflow and dissipating heat into the surrounding environment, thereby maintaining the normal operating temperature of the TEC semiconductor cooler 13 and ensuring that the side cooling component 1 continuously cools the relay 2. In terms of electromagnetic protection, when external electromagnetic waves attempt to interfere with the relay 2, the electromagnetic shield 3 comes into play. The transparent water-based electromagnetic wave coating sprayed on the inner side wall of the metal shell 32 and the transparent plastic baffle 31 reflects and absorbs the electromagnetic waves, weakening their intensity.

[0032] Meanwhile, the metal casing 32 covers the outer surface of the relay 2, forming a physical shielding layer to further block electromagnetic waves from entering the area where the relay 2 is located. A transparent plastic baffle 31 covers the upper surface of the relay 2, with a gap between its bottom surface and the upper surface of the relay 2 to facilitate air circulation and not affect the heat dissipation of the relay 2. Its transparency also allows for easy observation of the operating status of the relay 2. The relay 2 is connected to the wiring harness through the relay terminal 33 on the metal casing 32 to realize the circuit control function. Throughout the operation, the side cooling component 1 continuously cools the relay 2, and the anti-electromagnetic shield 3 continuously resists external electromagnetic interference, ensuring the stable operation of the switching module.

[0033] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A switching module comprising a plurality of relays (2) arranged side by side, characterized in that: The relay (2) is provided with side cooling components (1) on both the left and right sides, and the upper surface of the relay (2) is covered and fixed with an anti-electromagnetic cover (3). Each of the side cooling components (1) includes a copper heat-conducting sheet (11) attached and fixed to the left and right sides of the relay (2) by thermal grease, and a heat-conducting connecting plate (12) fixed to the front side of the copper heat-conducting sheet (11). A TEC semiconductor cooling chip (13) is fixed on the end face of the heat-conducting connecting plate (12) away from the copper heat-conducting sheet (11), and a miniature heat dissipation fan (14) is fixedly connected on the end face of the TEC semiconductor cooling chip (13) away from the heat-conducting connecting plate (12). The electromagnetic shield (3) includes a transparent plastic baffle (31) covering the upper surface of the relay (2), a metal housing (32) fixed to the front and rear ends of the transparent plastic baffle (31) and covering the outer surface of the relay (2), and the interior of the metal housing (32) is provided with a relay connection port (33) for connecting the relay (2) to the wiring harness.

2. A switching module according to claim 1, characterized in that: The cooling end face of the TEC semiconductor refrigeration chip (13) is fixedly connected to the side of the thermally conductive connecting plate (12) away from the copper thermally conductive chip (11) by thermally conductive silicone grease, and the heat dissipation end face of the TEC semiconductor refrigeration chip (13) is fixedly connected to the micro heat dissipation fan (14).

3. A switching module according to claim 1, characterized in that: The exhaust end face of the micro heat dissipation fan (14) is connected to the heat dissipation end face of the TEC semiconductor cooling chip (13) to remove hot air from the heat dissipation end face of the TEC semiconductor cooling chip (13).

4. A switching module according to claim 1, characterized in that: The heat-conducting connecting plate (12) has a 2-5cm gap between the end face away from the TEC semiconductor cooling chip (13) and the front end face of the relay (2) to avoid blocking the wire insertion port on the front end face of the relay (2).

5. A switching module according to claim 1, characterized in that: The inner sidewalls of the transparent plastic baffle (31) and the metal housing (32) are coated with transparent water-based electromagnetic wave coating to prevent external electromagnetic waves from interfering with the contacts of the relay (2).

6. A switching module according to claim 1, characterized in that: There is a gap of 0.5-1.0 cm between the bottom surface of the transparent plastic baffle (31) and the upper surface of the relay (2).

7. A switching module according to claim 1, characterized in that: The inner lower surface of the metal housing (32) is fixedly connected to the front area of ​​the upper surface of the relay (2).

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