Heat dissipation management system and energy storage device

Abstract

The application relates to the technical field of energy storage, in particular to a heat dissipation management system and an energy storage device. The application aims to solve the problem that it is difficult to realize miniaturization of the energy storage device. The application provides a heat dissipation management system, which comprises a first cooling loop, a second cooling loop and a first heat exchanger. The first heat exchanger comprises a first fluid channel and a second fluid channel which are arranged at intervals and a plurality of heat dissipation fins which are arranged at intervals. The first fluid channel and the second fluid channel both penetrate through the plurality of heat dissipation fins. The heat dissipation fins can exchange heat with the cooling medium of the first cooling loop and the cooling medium of the second cooling loop, and the cooling medium of the first cooling loop and the cooling medium of the second cooling loop can share the heat dissipation fins to realize heat dissipation. The cooling medium of the first cooling loop and the cooling medium of the second cooling loop can share the first heat exchanger, the number of heat exchangers is reduced, the volume of the energy storage device is reduced, and miniaturization of the energy storage device is facilitated.

Description

Technical Field

[0001] This application relates to the field of energy storage technology, specifically to a heat dissipation management system and energy storage device. Background Technology

[0002] Energy storage devices consist of a heating element and a compressor. Both the first fluid from the heating element and the second fluid from the compressor need to be cooled by heat exchangers. However, since the first and second fluids are of different types, two separate heat exchangers are required, one connected to the heating element and the other to the compressor. When the compressor is not working, the corresponding heat exchanger is not working, and the heat exchangers are also quite large, making it difficult to miniaturize the energy storage device. Utility Model Content

[0003] This application provides a heat dissipation management system and an energy storage device, which can realize the miniaturization of the energy storage device.

[0004] In a first aspect, embodiments of this application provide a heat dissipation management system, including a first cooling circuit, a second cooling circuit, and a first heat exchanger. The first heat exchanger includes a first fluid channel and a second fluid channel spaced apart and a plurality of heat dissipation fins spaced apart. Both the first fluid channel and the second fluid channel pass through the plurality of heat dissipation fins.

[0005] The first cooling circuit is connected to the cooling channel of the heat-generating device, which is also connected in series with the first fluid channel. The second cooling circuit includes a compressor, which is connected in series with the second fluid channel. The first and second cooling circuits share multiple heat dissipation fins.

[0006] Both the first and second fluid channels are pierced by multiple heat dissipation fins. This means the fins can exchange heat with both the cooling medium in the first and second cooling circuits, allowing them to share the same fins for heat dissipation. The shared cooling medium in both circuits reduces the number of heat exchangers required, thus decreasing the size of the energy storage device and facilitating its miniaturization. This also reduces costs.

[0007] In addition, the heat-generating equipment and the compressor share the same first heat exchanger, which can prevent the lack of cooling medium in the corresponding heat exchanger when the compressor or heat-generating equipment is not working, thereby avoiding energy waste and improving the efficiency of the energy storage equipment.

[0008] In some embodiments that may include the above embodiments, the number of first fluid channels is multiple or the number of second fluid channels is multiple. In a first direction, the multiple first fluid channels and the multiple second fluid channels are alternately arranged. Along the first direction, the projections of at least a portion of the multiple first fluid channels do not overlap with the projections of the multiple second fluid channels. The first direction intersects with and is parallel to the arrangement direction of the multiple heat dissipation fins.

[0009] The number of first and second fluid channels is multiple, which can increase the heat exchange area of ​​the cooling medium in the first cooling circuit and the cooling medium in the second cooling circuit, improve the heat dissipation rate of the cooling medium in the first cooling circuit and the cooling medium in the second cooling circuit, thereby ensuring the heat dissipation rate of the heat-generating equipment.

[0010] At least some of the projections of the first fluid channels do not overlap with the projections of the second fluid channels. In other words, the first fluid channels and the second fluid channels are staggered, which can prevent the cooling medium of the first cooling circuit and the cooling medium of the second cooling circuit from flowing through the same position of the first heat exchanger at the same time, thereby increasing the heat exchange area of ​​the cooling medium of the first cooling circuit and the cooling medium of the second cooling circuit, and improving the heat exchange rate of the cooling medium of the first cooling circuit and the cooling medium of the second cooling circuit.

[0011] In some embodiments that may include the above embodiments, the first fluid channel includes a plurality of first heat exchange tubes arranged at intervals along a second direction, and a manifold disposed at both ends of the plurality of first heat exchange tubes, wherein the aperture of the manifold of the first fluid channel is larger than the aperture of the plurality of first heat exchange tubes.

[0012] The second fluid channel includes a plurality of second heat exchange tubes arranged at intervals along a second direction, and a manifold disposed at both ends of the plurality of second heat exchange tubes, wherein the orifice diameter of the manifold diameter of the second fluid channel is larger than the orifice diameter of the plurality of second heat exchange tubes.

[0013] Multiple first heat exchange tubes penetrate multiple heat dissipation fins, and the second direction intersects with the first direction and the arrangement direction of the heat dissipation fins.

[0014] The first fluid channel includes multiple first heat exchange tubes, which are arranged at intervals along the second direction. The first heat exchange tubes can disperse the flow rate of the cooling medium in the first cooling circuit, increase the heat exchange area between the cooling medium and the heat dissipation fins in the first cooling circuit, and improve the heat dissipation rate of the cooling medium fluid in the first cooling circuit.

[0015] The second fluid channel includes multiple second heat exchange tubes, which are arranged at intervals along the second direction. The second heat exchange tubes can disperse the flow rate of the cooling medium in the second cooling circuit, increase the heat exchange area between the cooling medium and the heat dissipation fins in the second cooling circuit, and improve the heat dissipation rate of the cooling medium in the second cooling circuit.

[0016] The orifice diameter of the manifold in the first fluid channel is larger than that of the first heat exchange tube. This larger orifice diameter ensures a consistent flow velocity of the cooling medium in the first cooling circuit, thereby guaranteeing its heat dissipation rate. Conversely, the smaller orifice diameter of the first heat exchange tube allows for more dispersed flow of the cooling medium, resulting in a larger heat exchange area and further ensuring its heat dissipation rate.

[0017] The orifice diameter of the manifold in the second fluid channel is larger than that of the second heat exchange tube. This larger orifice diameter ensures a consistent flow velocity of the cooling medium in the second cooling circuit, thereby guaranteeing its heat dissipation rate. Conversely, the smaller orifice diameter of the second heat exchange tube allows for more dispersed flow of the cooling medium, resulting in a larger heat exchange area and further ensuring a consistent heat dissipation rate.

[0018] In some embodiments that may include the above embodiments, the first heat exchanger further includes a first connecting pipe disposed between two adjacent first fluid channels. The first connecting pipe connects the manifold of one first fluid channel and the manifold of another first fluid channel. Along the first direction, the projection of the first connecting pipe does not overlap with the projection of the plurality of second fluid channels.

[0019] Since the first fluid channel is connected to the first cooling circuit and the first connecting pipe is connected to the two first fluid channels, the number of interfaces between the first fluid channel and the first cooling circuit can be reduced. In other words, the number of interfaces between the first fluid channel and the heating device is reduced, which simplifies the connection steps between the first heat exchanger and the heating device and improves feasibility.

[0020] At the same time, the flow distance of the cooling medium in the first fluid channel is increased, and the heat exchange area between the cooling medium and the heat dissipation fins in the first cooling circuit is increased, which accelerates the heat exchange rate between the cooling medium fluid in the first cooling circuit and the heat dissipation fins, thereby improving the heat exchange effect of the first heat exchanger.

[0021] Along the first direction, the projection of the first connecting pipe does not overlap with the projections of multiple second fluid channels. In other words, the first fluid channels and the second fluid channels are staggered, which can prevent the cooling medium of the first cooling circuit and the cooling medium of the second cooling circuit from flowing through the same position of the first heat exchanger at the same time, thereby increasing the heat exchange area of ​​the cooling medium of the first cooling circuit and the cooling medium of the second cooling circuit, and improving the heat exchange rate of the cooling medium of the first cooling circuit and the cooling medium of the second cooling circuit.

[0022] In some embodiments that may include the above embodiments, the first heat exchanger further includes a second connecting pipe disposed between two adjacent second fluid channels. The second connecting pipe connects the manifold of one second fluid channel and the manifold of another second fluid channel. Along the first direction, the projection of the second connecting pipe does not overlap with the projection of the plurality of first fluid channels.

[0023] Since the second fluid channel is connected to the second cooling circuit, and the second connecting pipe is connected to the two second fluid channels, the number of interfaces between the second fluid channel and the second cooling circuit can be reduced. In other words, the number of interfaces between the second fluid channel and the compressor is reduced, which simplifies the connection steps between the first heat exchanger and the compressor and improves feasibility.

[0024] Meanwhile, the increased flow distance of the cooling medium in the second fluid channel increases the heat exchange area between the cooling medium and the heat dissipation fins in the second cooling circuit, thereby accelerating the heat exchange rate between the cooling medium fluid and the heat dissipation fins in the second cooling circuit and improving the heat exchange effect of the first heat exchanger.

[0025] Along the first direction, the projection of the second connecting pipe does not overlap with the projections of multiple first fluid channels. In other words, the first fluid channels and the second fluid channels are staggered, which can prevent the cooling medium of the first cooling circuit and the cooling medium of the second cooling circuit from flowing through the same position of the first heat exchanger at the same time, thereby increasing the heat exchange area of ​​the cooling medium of the first cooling circuit and the cooling medium of the second cooling circuit, and improving the heat exchange rate of the cooling medium of the first cooling circuit and the cooling medium of the second cooling circuit.

[0026] In some embodiments that may include the above embodiments, the sum of the number of the first fluid channel and the second fluid channel is less than or equal to 6.

[0027] The sum of the number of the first fluid channel and the second fluid channel is less than or equal to 6, which can ensure the fluid exchange rate between the heating device and the first heat exchanger, as well as between the compressor and the first heat exchanger, while ensuring that the processing difficulty and processing cost of the first heat exchanger are low.

[0028] In some embodiments that may include the above embodiments, the first heat exchange tube and the second heat exchange tube are arranged in parallel with each other, and the manifold of the first fluid channel and the manifold of the second fluid channel are arranged in parallel with each other.

[0029] The first and second heat exchange tubes are arranged in parallel to each other, which ensures a more uniform heat exchange area between the heat dissipation fins and the first heat exchange tube, as well as between the heat dissipation fins and the second heat exchange tube, thereby guaranteeing the heat dissipation rates of the first and second fluids. The parallel arrangement of the manifolds of the first and second fluid channels saves space and facilitates maintenance of both fluid channels.

[0030] In some embodiments that may include the above embodiments, the heat dissipation management system further includes a third cooling circuit and a second heat exchanger, the second heat exchanger being connected to both the second and third cooling circuits, and the cooling channel of the heat-generating device being connected to the third cold zone cooling circuit.

[0031] Since the cooling channel of the heating device is connected to the third cooling circuit, and the second heat exchanger is connected to both the second and third cooling circuits, the cooling medium in the second cooling circuit and the cooling medium of the heating device exchange heat in the second heat exchanger, causing the cooling medium of the heating device to cool down again and continue to be used to dissipate heat from the heating device.

[0032] In some embodiments that may include the above embodiments, the first heat exchanger includes a first inlet and a first outlet, both of which are connected to a first cooling circuit. The first inlet and the first outlet are located on the side of the first heat exchanger closer to the heat-generating device. The first heat exchanger also includes a second inlet and a second outlet, which are connected to a second cooling circuit. The second inlet and the second outlet are located on the side of the first heat exchanger closer to the compressor.

[0033] The second heat exchanger includes a third inlet and a third outlet, which are connected to a third cooling circuit. The third inlet and the third outlet are located on the side of the second heat exchanger closer to the heat-generating equipment. The second heat exchanger also includes a fourth inlet and a fourth outlet, which are connected to the second cooling circuit. The fourth inlet and the fourth outlet are located on the side of the second heat exchanger closer to the compressor.

[0034] The first inlet, first outlet, third inlet, and third outlet are all located close to the heating device, which can be located on the same side of the first and second heat exchangers. The second inlet, second outlet, fourth inlet, and fourth outlet are all located close to the compressor, which can be located on the same side of the first and second heat exchangers. This makes the connection between the heating device and the first and second heat exchangers, as well as the connection between the compressor and the first and second heat exchangers, more convenient.

[0035] In some embodiments that may include the above embodiments, the heat dissipation management system further includes a multi-way valve, wherein the cooling channel of the heat-generating device in the first cooling circuit is connected to the first heat exchanger through the multi-way valve, and the cooling channel of the heat-generating device in the third cooling circuit is connected to the second heat exchanger through the multi-way valve.

[0036] Since the cooling channels of the heat-generating equipment are connected to the first and second heat exchangers respectively through multi-way valves, the switching between the first and third cooling circuits can be realized by controlling the state of the multi-way valves. This allows the cooling medium of the heat-generating equipment to dissipate heat using different heat dissipation methods, so that the heat dissipation management system can adapt to different ambient temperatures and realize the sharing of heat exchange area under different modes.

[0037] In some embodiments that may include the above examples, when the multi-way valve is in the first state, the second heat exchanger is not connected to the cooling channel of the heating device or the first heat exchanger, and the cooling medium in the third cooling circuit does not flow. The cooling channel of the heating device is connected to the first heat exchanger, and the cooling medium in the first cooling circuit flows. The compressor is not working, and the cooling medium in the second cooling circuit does not flow.

[0038] When operating at medium and low temperatures, the multi-way valve is in the first state, and the cooling channel of the heating device is connected to the first heat exchanger. The cooling medium of the heating device can enter the first heat exchanger through the first cooling circuit and exchange heat with the heat dissipation fins to achieve cooling of the cooling medium of the heating device. Then it flows back to the cooling channel of the heating device through the first cooling circuit. In other words, the heat energy of the heating device is transferred to the atmospheric environment through the first cooling circuit and the first heat exchanger.

[0039] In some embodiments that may include the above examples, when the multi-way valve is in the second state, the second heat exchanger is connected to the cooling channel of the heating device, and the cooling medium in the third cooling circuit flows. The first heat exchanger is not connected to the cooling channel of the heating device, and the cooling medium in the first cooling circuit does not flow. When the compressor is operating, the first heat exchanger is connected to the second heat exchanger, and the cooling medium in the second cooling circuit flows.

[0040] When operating at high temperatures, the multi-way valve is in its second state, connecting the cooling channel of the heating device to the second heat exchanger. The cooling medium of the heating device can enter the second heat exchanger through the third cooling circuit. Simultaneously, the cooling medium in the second cooling circuit, after passing through the first heat exchanger, enters the second heat exchanger and exchanges heat with the cooling medium of the heating device, thus cooling the cooling medium of the heating device. The cooling medium of the heating device then flows back to the cooling channel of the heating device through the third cooling circuit. In other words, the heat energy of the heating device is transferred to the atmospheric environment through the third cooling circuit and the second heat exchanger.

[0041] In some embodiments that may include the above embodiments, the cooling medium of the first cooling circuit is a coolant, and the cooling medium of the second cooling circuit is a refrigerant.

[0042] The cooling medium in the first cooling circuit is used to cool the heat-generating equipment, and the cooling medium in the second cooling circuit is used to cool the cooling medium in the first cooling circuit. The cooling medium in the second cooling circuit from the compressor is usually a high-temperature, high-pressure gaseous refrigerant. After passing through the first heat exchanger, the cooling medium in the second cooling circuit becomes a low-temperature liquid refrigerant. After passing through the second heat exchanger, the cooling medium in the second cooling circuit becomes a gaseous refrigerant again.

[0043] Secondly, embodiments of this application provide an energy storage device, including a heating device and the aforementioned heat dissipation management system. The heating device is connected to the heat dissipation management system, which is used to dissipate heat from the heating device.

[0044] The energy storage device provided in this application includes the heat dissipation management system in any of the above embodiments. Therefore, both can solve the same technical problem and achieve the same technical effect. Attached Figure Description

[0045] Figure 1 Schematic diagram of the energy storage device provided in the embodiments of this application Figure 1 ;

[0046] Figure 2 A schematic diagram of the structure of the first heat exchanger provided in the embodiments of this application. Figure 1 ;

[0047] Figure 3 A top view of the first heat exchanger provided in an embodiment of this application;

[0048] Figure 4 A schematic diagram of the structure of the first heat exchanger provided in the embodiments of this application. Figure 2 ;

[0049] Figure 5 Top view of the first and second fluid channels provided in the embodiments of this application Figure 1 ;

[0050] Figure 6 A schematic diagram of the structure of the first heat exchanger provided in the embodiments of this application. Figure 3 ;

[0051] Figure 7 Top view of the first and second fluid channels provided in the embodiments of this application Figure 2 ;

[0052] Figure 8 A schematic diagram of the structure of the first heat exchanger provided in the embodiments of this application. Figure 4 ;

[0053] Figure 9 Top view of the first and second fluid channels provided in the embodiments of this application Figure 3 ;

[0054] Figure 10 Schematic diagram of the energy storage device provided in the embodiments of this application Figure 2 .

[0055] Explanation of reference numerals in the attached figures:

[0056] 10: Energy storage device; 11: Heating device; 111: Cooling channel of heating device; 12: Compressor; 13: Multi-way valve; 14: Water pump; 15: Second heat exchanger; 16: Electronic expansion valve; 17: Heat dissipation management system; 20: First heat exchanger; 21: First fluid channel; 22: Second fluid channel; 23: Heat dissipation fins; 31: First connecting pipe; 32: Second connecting pipe; 41: First manifold; 42: Second manifold; 43: Third manifold; 44: Fourth manifold; 51: First heat exchange tube; 52: Second heat exchange tube; 61: First cooling circuit; 62: Second cooling circuit; 63: Third cooling circuit; 71: First inlet; 72: First outlet; 73: Second inlet; 74: Second outlet; 75: Third inlet; 76: Third outlet; 77: Fourth inlet; 78: Fourth outlet. Detailed Implementation

[0057] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0058] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0059] Furthermore, in the embodiments of this application, directional terms such as "up," "down," "left," "right," "horizontal," and "vertical" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0060] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0061] Please refer to Figure 1 This application provides an energy storage device 10, including a heating device 11 and a heat dissipation management system 17. The heating device 11 is connected to the heat dissipation management system 17, which dissipates heat from the heating device 11. Here, the energy storage device 10 is a device for converting electrical or other forms of energy into a storable form and releasing it for use when needed. This application does not limit the energy storage device 10; for example, the energy storage device 10 can be an energy storage power station.

[0062] In some embodiments, the heat-generating device 11 includes a battery pack or a power storage converter (PCS).

[0063] Continue to refer to Figure 1 , Figure 2 and Figure 3 The heat dissipation management system 17 provided in this application embodiment includes a first cooling circuit 61, a second cooling circuit 62, and a first heat exchanger 20. The first heat exchanger 20 includes a first fluid channel 21 and a second fluid channel 22 spaced apart, and a plurality of heat dissipation fins 23 spaced apart. Both the first fluid channel 21 and the second fluid channel 22 pass through the plurality of heat dissipation fins 23. This application embodiment does not limit the first heat exchanger 20. For example, the first heat exchanger 20 can be a through-tube microchannel heat exchanger.

[0064] The first cooling circuit 61 is connected to the cooling channel 111 of the heat-generating device, and the cooling channel 111 of the heat-generating device is also connected in series with the first fluid channel 21. The second cooling circuit 62 includes a compressor 12, which is connected in series with the second fluid channel 22. The first cooling circuit 61 and the second cooling circuit 62 share multiple heat dissipation fins 23.

[0065] The embodiments of this application do not limit the connection method between the heat dissipation fins 23 and the first fluid channel 21, or between the heat dissipation fins 23 and the second fluid channel 22. For example, the heat dissipation fins 23 and the first fluid channel 21 can be bonded together with adhesive. In embodiments where both the first fluid channel 21 and the heat dissipation fins 23 are metal, the heat dissipation fins 23 and the first fluid channel 21 can be welded together.

[0066] The heating device 11 continuously generates heat. A cooling medium flows within the cooling channel 111 of the heating device. The cooling medium absorbs the heat from the heating device 11, thereby lowering its temperature and ensuring its normal operation. This application embodiment does not limit the cooling medium of the first cooling circuit 61. For example, the cooling medium of the first cooling circuit 61 can be coolant, water, etc.

[0067] The first cooling circuit 61 is connected to the cooling channel of the heating device 11, and the cooling channel 111 of the heating device is also connected in series with the first fluid channel 21. The cooling medium that has absorbed heat can be connected to the first heat exchanger 20 through the first cooling circuit 61 and flow into the first fluid channel 21. The first fluid channel 21 has multiple heat dissipation fins 23 running through it. The heat dissipation fins 23 can absorb the heat of the cooling medium. When air passes through the heat dissipation fins 23, it can absorb the heat on the heat dissipation fins 23, thereby achieving heat dissipation of the cooling medium. This allows the cooling medium to return to the heating device 11 through the first cooling circuit 61 and continue to be used for heat dissipation.

[0068] The second cooling circuit 62 includes a compressor 12, which is connected in series with the second fluid channel 22. The cooling medium in the second cooling circuit 62 becomes a high-temperature and high-pressure gaseous cooling medium after passing through the compressor 12. After the gaseous cooling medium enters the second fluid channel 22, multiple heat dissipation fins 23 pass through the second fluid channel 22. The heat dissipation fins 23 can absorb the heat of the gaseous cooling medium, which lowers the temperature of the cooling medium in the second cooling circuit 62, turning it into a low-temperature liquid cooling medium.

[0069] The cooling medium in the second cooling circuit 62 undergoes a phase change. This application embodiment does not limit the cooling medium of the second cooling circuit 62; for example, the cooling medium of the second cooling circuit 62 can be a refrigerant, etc. Here, phase change refers to the process of a fluid changing from one state to another. For example, a fluid is a liquid at room temperature, and under certain conditions, the fluid can change from a liquid to a gas; or, a fluid is a gas at room temperature, and under certain conditions, the fluid can change from a gas to a liquid.

[0070] Both the first fluid channel 21 and the second fluid channel 22 have multiple heat dissipation fins 23 running through them. This means that the heat dissipation fins 23 can exchange heat with both the cooling medium of the first cooling circuit 61 and the cooling medium of the second cooling circuit 62. The cooling media of the first cooling circuit 61 and the second cooling circuit 62 can share the heat dissipation fins 23 for heat dissipation. The cooling media of the first cooling circuit 61 and the second cooling circuit 62 can share the first heat exchanger 20, reducing the number of heat exchangers and thus reducing the size of the energy storage device 10, which is beneficial for miniaturization. At the same time, it can reduce costs.

[0071] In addition, the first heat exchanger 20 is shared by the heating device 11 and the compressor 12, which can prevent the lack of cooling medium in the corresponding heat exchanger when the compressor 12 or the heating device 11 is not working, thereby avoiding energy waste and improving the efficiency of the energy storage device 10.

[0072] Please refer to Figure 4 and Figure 5 In the above embodiments, the number of first fluid channels 21 is multiple, or the number of second fluid channels 22 is multiple. That is, in some embodiments, the number of first fluid channels 21 is multiple, and the number of second fluid channels 22 is one (e.g., Figure 4 and Figure 5 (As shown). In some embodiments, the number of first fluid channels 21 is one, and the number of second fluid channels 22 is multiple (e.g., ...). Figure 6 and Figure 7 (As shown). In some embodiments, the number of first fluid channels 21 is multiple, and the number of second fluid channels 22 is multiple (e.g., ...). Figure 8 and Figure 9 (As shown).

[0073] The number of first fluid channels 21 and second fluid channels 22 is multiple, which can increase the heat exchange area of ​​the cooling medium in the first cooling circuit 61 and the cooling medium in the second cooling circuit 62, and improve the heat dissipation rate of the cooling medium in the first cooling circuit 61 and the cooling medium in the second cooling circuit 62, thereby ensuring the heat dissipation rate of the heat-generating device 11.

[0074] Along the first direction x, a plurality of first fluid channels 21 and a plurality of second fluid channels 22 are alternately arranged. Along the first direction x, the projections of at least a portion of the first fluid channels 21 do not overlap with the projections of the second fluid channels 22. The first direction x intersects with the arrangement direction y of the plurality of fins 23 and is parallel to the heat dissipation fins 23.

[0075] Understandably, when the first fluid channel 21 is not working and the second fluid channel 22 is working, no cooling medium from the first cooling circuit 61 flows through the first fluid channel 21, while the cooling medium from the second cooling circuit 62 flows through the second fluid channel 22. Since the first fluid channel 21 and the second fluid channel 22 are alternately arranged, and the second fluid channel 22 is adjacent to the first fluid channel 21, when the cooling medium of the second cooling circuit 62 exchanges heat with the heat dissipation fins 23, the cooling medium of the second cooling circuit 62 can utilize the heat dissipation fins 23 near the first fluid channel 21 to dissipate heat. In other words, the area of ​​the heat dissipation fins 23 that the cooling medium of the second cooling circuit 62 can utilize increases, thereby increasing the heat exchange area of ​​the cooling medium in the second cooling circuit 62 and accelerating the heat dissipation rate.

[0076] Similarly, when the first fluid channel 21 is working and the second fluid channel 22 is not working, no cooling medium of the second cooling circuit 62 passes through the second fluid channel 22. When the cooling medium of the first cooling circuit 61 exchanges heat with the heat dissipation fins 23, the cooling medium of the first cooling circuit 61 can dissipate heat using the heat dissipation fins 23 near the second fluid channel 22. In other words, the area of ​​the heat dissipation fins 23 that the cooling medium of the first cooling circuit 61 can utilize increases, thereby increasing the heat exchange area of ​​the cooling medium of the first cooling circuit 61 and accelerating the heat dissipation rate.

[0077] At least some of the projections of the first fluid channels 21 do not overlap with the projections of the second fluid channels 22. That is, the first fluid channels 21 and the second fluid channels 22 are staggered, which can prevent the cooling medium of the first cooling circuit 61 and the cooling medium of the second cooling circuit 62 from flowing through the same position of the first heat exchanger 20 at the same time, thereby increasing the heat exchange area of ​​the cooling medium of the first cooling circuit 61 and the cooling medium of the second cooling circuit 62 and improving the heat exchange rate of the cooling medium of the first cooling circuit 61 and the cooling medium of the second cooling circuit 62.

[0078] Continue to refer to Figure 2 and Figure 3 In the above embodiment, the first fluid channel 21 includes a plurality of first heat exchange tubes 51 arranged at intervals along the second direction z, and a manifold disposed at both ends of the plurality of first heat exchange tubes 51. Figure 2 (41 and 42 in the text), the orifice diameter of the manifold of the first fluid channel 21 is larger than the orifice diameter of the first heat exchange tube 51.

[0079] The second fluid channel 22 includes a plurality of second heat exchange tubes 52 arranged at intervals along the second direction z, and a manifold disposed at both ends of the plurality of second heat exchange tubes 52. Figure 2 (43 and 44 in the text), the orifice diameter of the manifold of the second fluid channel 22 is larger than the orifice diameter of the second heat exchange tube 52.

[0080] Multiple first heat exchange tubes 51 and multiple second heat exchange tubes 52 pass through multiple heat dissipation fins 23. The second direction z intersects with the first direction x and also intersects with the arrangement direction y of the heat dissipation fins 23.

[0081] The first fluid channel 21 includes a plurality of first heat exchange tubes 51, which are arranged at intervals along a second direction z. The first heat exchange tubes 51 enable the first cooling circuit 61 ( Figure 1 The flow rate of the cooling medium (as shown) is dispersed, increasing the heat exchange area between the cooling medium in the first cooling circuit 61 and the heat dissipation fins 23, thereby improving the heat dissipation rate of the cooling medium in the first cooling circuit 61.

[0082] The second fluid channel 22 includes a plurality of second heat exchange tubes 52, which are arranged at intervals along a second direction z. The second heat exchange tubes 52 enable the second cooling circuit 62 to ( Figure 1 The flow rate of the cooling medium (as shown) is dispersed, increasing the heat exchange area between the cooling medium and the heat dissipation fins 23 in the second cooling circuit 62, thereby improving the heat dissipation rate of the cooling medium in the second cooling circuit 62.

[0083] Both the first heat exchange tube 51 and the second heat exchange tube 52 pass through multiple heat dissipation fins 23. That is to say, the first heat exchange tube 51 and the second heat exchange tube 52 participate in the heat dissipation process of the cooling medium of the first cooling circuit 61 and the cooling medium of the second cooling circuit 62. The heat exchange between the cooling medium of the first cooling circuit 61 and the heat dissipation fins 23 occurs in the first heat exchange tube 51, and the heat exchange between the cooling medium of the second cooling circuit 62 and the heat dissipation fins 23 occurs in the second heat exchange tube 52.

[0084] The manifolds of the first fluid channel 21 are located at both ends of the first heat exchange tube 51. When the cooling medium of the first cooling circuit 61 enters the first fluid channel 21, it first enters the manifolds of the first fluid channel 21 and flows from the manifolds of the first fluid channel 21 to each of the first heat exchange tubes 51, thereby achieving the diversion of the cooling medium in the first cooling circuit 61. After passing through the first heat exchange tube 51, the cooling medium of the first cooling circuit 61 is collected in the manifold of the first fluid channel 21 at the other end and flows back to the heating device 11. The manifolds of the first fluid channel 21 can collect the cooled cooling medium of the first cooling circuit 61.

[0085] The orifice diameter of the manifold of the first fluid channel 21 is larger than that of the first heat exchange tube 51. The larger orifice diameter of the manifold of the first fluid channel 21 ensures the flow velocity of the cooling medium in the first cooling circuit 61, thereby ensuring the heat dissipation rate of the cooling medium in the first cooling circuit 61. The smaller orifice diameter of the first heat exchange tube 51 allows for a more dispersed flow of the cooling medium in the first cooling circuit 61, resulting in a larger heat exchange area for the cooling medium in the first cooling circuit 61, thus ensuring the heat dissipation rate of the cooling medium in the first cooling circuit 61.

[0086] The manifolds of the second fluid channel 22 are located at both ends of the second heat exchange tube 52. When the cooling medium of the second cooling circuit 62 enters the second fluid channel 22, it first enters the manifolds of the second fluid channel 22 and flows from the manifolds of the second fluid channel 22 to each of the second heat exchange tubes 52, thereby achieving the diversion of the cooling medium in the second cooling circuit 62. After passing through the second heat exchange tube 52, the cooling medium of the second cooling circuit 62 is collected in the manifold of the second fluid channel 22 at the other end and flows back to the heating device 11. The manifolds of the second fluid channel 22 can collect the cooled cooling medium of the second cooling circuit 62.

[0087] The orifice diameter of the manifold of the second fluid channel 22 is larger than that of the second heat exchange tube 52. The larger orifice diameter of the manifold of the second fluid channel 22 ensures the flow velocity of the cooling medium in the second cooling circuit 62, thereby guaranteeing the heat dissipation rate of the cooling medium in the second cooling circuit 62. The smaller orifice diameter of the second heat exchange tube 52 allows for a more dispersed flow of the cooling medium in the second cooling circuit 62, resulting in a larger heat exchange area for the cooling medium, thus ensuring the heat dissipation rate of the cooling medium in the second cooling circuit 62.

[0088] Continue to refer to Figure 4 and Figure 5 In some embodiments, the first heat exchanger 20 further includes a first connecting pipe 31 disposed between two adjacent first fluid channels 21, the first connecting pipe 31 connecting the manifold of one first fluid channel 21 and the manifold of the other first fluid channel 21. Along the first direction x, the projection of the first connecting pipe 31 does not overlap with the projection of the plurality of second fluid channels 22.

[0089] Since the first fluid channel 21 is connected to the first cooling circuit 61, and the first connecting pipe 31 is connected to both first fluid channels 21, the connection between the first fluid channel 21 and the first cooling circuit 61 can be reduced. Figure 1 As shown, the number of interfaces is exemplified by the fact that, for every two adjacent first fluid channels 21 and the first cooling circuit 61, there are two connection ports: one on the manifold of one first fluid channel 21 and one on the manifold of the other first fluid channel 21. One port is used to receive cooling medium from the first cooling circuit 61, and the other port is used to supply cooling medium to the first cooling circuit 61. Reducing the number of interfaces between the first fluid channel 21 and the first cooling circuit 61, that is, reducing the number of interfaces between the first fluid channel 21 and the heating device 11, simplifies the connection steps between the first heat exchanger 20 and the heating device 11, improving feasibility.

[0090] Meanwhile, the flow distance of the cooling medium in the first fluid channel 21 is increased, and the heat exchange area between the cooling medium in the first cooling circuit 61 and the heat dissipation fins 23 is increased, which accelerates the heat exchange rate between the cooling medium in the first cooling circuit 61 and the heat dissipation fins 23, thereby improving the heat exchange effect of the first heat exchanger 20.

[0091] The number of first connecting pipes 31 is not limited in this application embodiment. For example, the number of first connecting pipes 31 can be one, or the number of first connecting pipes 31 can be multiple. In the embodiment where the number of first connecting pipes 31 is one, the processing difficulty of the first fluid channel 21 is lower, the processing cost is lower, and the feasibility is higher. In the embodiment where the number of first connecting pipes 31 is multiple, the flow rate of the first fluid is faster. The number of first connecting pipes 31 can be adjusted according to the actual heat dissipation requirements.

[0092] Along the first direction x, the projection of the first connecting pipe 31 does not overlap with the projections of the multiple second fluid channels 22. That is, the first fluid channel 21 and the second fluid channel 22 are staggered, which can avoid the cooling medium of the first cooling circuit 61 and the second cooling circuit 62 ( Figure 1 The cooling medium (as shown) flows through the same position of the first heat exchanger 20 simultaneously, increasing the heat exchange area of ​​the cooling medium in the first cooling circuit 61 and the cooling medium in the second cooling circuit 62, and improving the heat exchange rate of the cooling medium in the first cooling circuit 61 and the cooling medium in the second cooling circuit 62.

[0093] Continue to refer to Figure 6 and Figure 7 In some embodiments, the first heat exchanger 20 further includes a second connecting pipe 32 disposed between two adjacent second fluid channels 22, the second connecting pipe 32 connecting the manifold of one second fluid channel 22 and the manifold of the other second fluid channel 22. Along the first direction x, the projection of the second connecting pipe 32 does not overlap with the projection of the plurality of first fluid channels 21.

[0094] Because the second fluid channel 22 and the second cooling circuit 62 ( Figure 1 As shown, the second connecting pipe 32 is connected to two second fluid channels 22, which can reduce the number of interfaces between the second fluid channels 22 and the second cooling circuit 62. For example, the number of connection ports between two adjacent second fluid channels 22 and the outside is two: an interface on the manifold of one second fluid channel 22 and an interface on the manifold of the other second fluid channel 22. One interface is used to receive cooling medium from the second cooling circuit 62, and the other interface is used to supply cooling medium to the second cooling circuit 62. The number of interfaces between the second fluid channels 22 and the second cooling circuit 62 is reduced, that is, the second fluid channels 22 and the compressor 12 ( Figure 1 The reduced number of interfaces between the first heat exchanger 20 and the compressor 12 simplifies the connection process and improves feasibility.

[0095] Meanwhile, the flow distance of the cooling medium in the second fluid channel 22 is increased, and the heat exchange area between the cooling medium in the second cooling circuit 62 and the heat dissipation fins 23 is increased, which accelerates the heat exchange rate between the cooling medium in the second cooling circuit 62 and the heat dissipation fins 23, thereby improving the heat exchange effect of the first heat exchanger 20.

[0096] This application does not limit the number of second connecting pipes 32. For example, there may be one or more second connecting pipes 32. In embodiments with only one second connecting pipe, the second fluid channel 22 is easier and cheaper to manufacture, and more feasible. In embodiments with multiple second connecting pipes 32, the flow rate of the second fluid is faster. The number of second connecting pipes 32 can be adjusted according to actual heat dissipation requirements.

[0097] Along the first direction x, the projection of the second connecting pipe 32 does not overlap with the projections of the multiple first fluid channels 21. That is, the first fluid channels 21 and the second fluid channels 22 are staggered, which can avoid the first cooling circuit 61 ( Figure 1 The cooling medium of the first cooling circuit 61 and the cooling medium of the second cooling circuit 62 flow through the same position of the first heat exchanger 20 simultaneously, thereby increasing the heat exchange area of ​​the cooling medium of the first cooling circuit 61 and the cooling medium of the second cooling circuit 62 and improving the heat exchange rate of the cooling medium of the first cooling circuit 61 and the cooling medium of the second cooling circuit 62.

[0098] Continue to refer to Figure 8 and Figure 9 In some embodiments, the first heat exchanger 20 includes a first connecting pipe 31 and a second connecting pipe 32. The first cooling circuit 61 ( Figure 1 The heat exchange area between the cooling medium and the heat dissipation fins 23 (as shown), and the second cooling circuit 62 ( Figure 1 The increased heat exchange area between the cooling medium and the heat dissipation fins 23 in the first cooling circuit 61 and the second cooling circuit 62 improves the heat exchange rate between the cooling medium and the heat dissipation fins 23, thereby enhancing the heat exchange effect of the first heat exchanger 20. Simultaneously, it reduces the heat exchange area between the first heat exchanger 20 and the heat-generating device 11. Figure 1 Between (as shown), the first heat exchanger 20 and the compressor 12 (as shown) Figure 1 The number of interfaces between (as shown) simplifies the connection steps between the first heat exchanger 20 and the heating device 11, and between the first heat exchanger 20 and the compressor 12, thereby improving feasibility.

[0099] In some embodiments, the first connecting pipe 31 and the first fluid channel 21 are integral structures, and the second connecting pipe 32 and the second fluid channel 22 are integral structures, which can simplify the manufacturing process of the first heat exchanger 20 and reduce the cost of the first heat exchanger 20.

[0100] In the above embodiments, the sum of the number of the first fluid channel 21 and the second fluid channel 22 is less than or equal to 6. For example, the sum of the number of the first fluid channel 21 and the second fluid channel 22 can be 2, 3, 4, or 6.

[0101] Understandably, the more first fluid channels 21 and second fluid channels 22 there are, the faster the fluid exchange rate between the heat-generating device 11 and the first heat exchanger 20, and between the compressor 12 and the first heat exchanger 20, and the faster the heat dissipation rate of the cooling medium in the first cooling circuit 61 and the cooling medium in the second cooling circuit 62. However, at the same time, the processing difficulty and cost of the first heat exchanger 20 will gradually increase. Therefore, the appropriate number of first fluid channels 21 and second fluid channels 22 can be selected according to actual needs.

[0102] The sum of the number of the first fluid channel 21 and the second fluid channel 22 is less than or equal to 6. This ensures that the fluid exchange rate between the heating device 11 and the first heat exchanger 20, as well as between the compressor 12 and the first heat exchanger 20, is maintained while keeping the processing difficulty and cost of the first heat exchanger 20 low.

[0103] Continue to refer to Figure 2 and Figure 3 In the above embodiments, the first heat exchange tube 51 and the second heat exchange tube 52 are arranged in parallel to each other, and the manifold of the first fluid channel 21 and the manifold of the second fluid channel 22 are arranged in parallel to each other.

[0104] The first heat exchange tube 51 and the second heat exchange tube 52 are arranged in parallel to each other, which ensures a more uniform heat exchange area between the heat dissipation fins 23 and the first heat exchange tube 51, as well as between the heat dissipation fins 23 and the second heat exchange tube 52, thereby ensuring the heat dissipation rate of the first fluid and the heat dissipation rate of the second fluid. The manifolds of the first fluid channel 21 and the second fluid channel 22 are arranged in parallel to each other, which saves space and facilitates the maintenance of the first fluid channel 21 and the second fluid channel 22.

[0105] Continue to refer to Figure 2 and Figure 3 In some embodiments, the manifold of the first fluid channel 21 includes a first manifold 41 and a second manifold 42, the first manifold 41 being used to receive fluid from the first cooling circuit 61 ( Figure 1 The second manifold 42 is used to supply cooling medium to the first cooling circuit 61. The manifolds of the second fluid channel 22 include a third manifold 43 and a fourth manifold 44. The third manifold 43 is used to receive cooling medium from the second cooling circuit 62 (shown). Figure 1 (As shown) the cooling medium, the fourth manifold 44 is used to supply the cooling medium to the second cooling circuit 62.

[0106] The first manifold 41 and the third manifold 43 are located on the same side of the multiple heat dissipation fins 23, which can control the direction of the cooling medium in the first fluid channel 21 flowing into or out of the first heat exchanger 20 to be consistent.

[0107] Since the cooling medium in the first fluid channel 21 and the cooling medium in the second fluid channel 22 have a high temperature when they enter the first heat exchanger 20, if the first manifold 41 and the third manifold 43 are located on different sides of the multiple heat dissipation fins 23, the temperature difference between the cooling medium in the first fluid channel 21 and the cooling medium in the second fluid channel 22 corresponding to the same heat dissipation fin 23 is large. The temperatures of the cooling medium in the first fluid channel 21 and the cooling medium in the second fluid channel 22 will affect each other, causing the lower-temperature cooling medium to become hotter, thereby resulting in a deterioration in the heat dissipation effect of the cooling medium in the first fluid channel 21 and the cooling medium in the second fluid channel 22.

[0108] The first manifold 41 and the third manifold 43 are located on the same side of the multiple heat dissipation fins 23, which can ensure that the temperature difference between the cooling medium in the first fluid channel 21 and the cooling medium in the second fluid channel 22 is small, avoid mutual influence between the cooling medium in the first fluid channel 21 and the cooling medium in the second fluid channel 22, and ensure the heat dissipation effect of the cooling medium in the first fluid channel 21 and the cooling medium in the second fluid channel 22.

[0109] Please refer to Figure 10 In the above embodiments, the heat dissipation management system 17 further includes a third cooling circuit 63 and a second heat exchanger 15. The second heat exchanger 15 is connected to both the second cooling circuit 62 and the third cooling circuit 63. The cooling channel 111 of the heat-generating device is also connected to the third cooling circuit 63. This application does not limit the second heat exchanger 15; for example, the second heat exchanger 15 can be a plate heat exchanger.

[0110] Since the cooling channel 111 of the heating device is connected to the third cooling circuit 63, and the second heat exchanger 15 is connected to the second cooling circuit 62 and the third cooling circuit 63 respectively, the cooling medium in the second cooling circuit 62 and the cooling medium of the heating device 11 exchange heat in the second heat exchanger 15, so that the cooling medium of the heating device 11 cools down again and continues to be used to dissipate heat from the heating device 11.

[0111] Continue to refer to Figure 10 In some embodiments, the first heat exchanger 20 includes a first inlet 71 and a first outlet 72, both of which are connected to the first cooling circuit 61. The first inlet 71 and the first outlet 72 are located on the side of the first heat exchanger 20 near the heat-generating device 11. The first heat exchanger 20 also includes a second inlet 73 and a second outlet 74, which are connected to the second cooling circuit 62. The second inlet 73 and the second outlet 74 are located on the side of the first heat exchanger 20 near the compressor 12.

[0112] The first inlet 71 and the first outlet 72 are located close to the heating device 11, which can shorten the distance of the first cooling circuit 61 and facilitate the connection between the first heat exchanger 20 and the heating device 11. The second inlet 73 and the second outlet 74 are located close to the compressor 12, which can shorten the distance of the second cooling circuit 62 and facilitate the connection between the first heat exchanger 20 and the compressor 12.

[0113] The second heat exchanger 15 includes a third inlet 75 and a third outlet 76, which are connected to the third cooling circuit 63. The third inlet 75 and the third outlet 76 are located on the side of the second heat exchanger 15 near the heat-generating device 11. The second heat exchanger 15 also includes a fourth inlet 77 and a fourth outlet 78, which are connected to the second cooling circuit 62. The fourth inlet 77 and the fourth outlet 78 are located on the side of the second heat exchanger 15 near the compressor 12.

[0114] The third inlet 75 and the third outlet 76 are located close to the heating device 11, which can shorten the distance of the third cooling circuit 63 and facilitate the connection between the second heat exchanger 15 and the heating device 11. The fourth inlet 77 and the fourth outlet 78 are located close to the compressor 12, which can shorten the distance of the second cooling circuit 62 and facilitate the connection between the second heat exchanger 15 and the compressor 12.

[0115] The first inlet 71, the first outlet 72, the third inlet 75, and the third outlet 76 are all located close to the heating device 11, which can be located on the same side as the first heat exchanger 20 and the second heat exchanger 15. The second inlet 73, the second outlet 74, the fourth inlet 77, and the fourth outlet 78 are all located close to the compressor 12, which can be located on the same side as the first heat exchanger 20 and the second heat exchanger 15, making the connection between the heating device 11 and the first heat exchanger 20 and the second heat exchanger 15, as well as the connection between the compressor 12 and the first heat exchanger 20 and the second heat exchanger 15, more convenient.

[0116] In some embodiments, a first inlet 71, a first outlet 72, a second inlet 73, and a second outlet 74 are disposed on the manifold of the first fluid channel 21, and a third inlet 75, a third outlet 76, a fourth inlet 77, and a fourth outlet 78 are disposed on the manifold of the second fluid channel 22. The embodiments of this application do not limit the specific locations of the inlets and outlets; for example, the inlets and outlets may be located at the top of the manifold, or they may be located at the bottom of the manifold.

[0117] Continue to refer to Figure 1 and Figure 10In the above embodiments, the heat dissipation management system 17 further includes a multi-way valve 13. In the first cooling circuit 61, the cooling channel 111 of the heat-generating device is connected to the first heat exchanger 20 through the multi-way valve 13. At the same time, in the third cooling circuit 63, the cooling channel 111 of the heat-generating device is connected to the second heat exchanger 15 through the multi-way valve 13.

[0118] Since the cooling channel 111 of the heat-generating device is connected to the first heat exchanger 20 and the second heat exchanger 15 respectively through the multi-way valve 13, the switching between the first cooling circuit 61 and the third cooling circuit 63 can be realized by controlling the state of the multi-way valve 13, so that the cooling medium of the heat-generating device 11 can use different heat dissipation methods to achieve heat dissipation. Thus, the heat dissipation management system 17 can adapt to different ambient temperatures and realize the sharing of heat exchange area under different modes.

[0119] Continue to refer to Figure 1 In the above embodiments, when the multi-way valve 13 is in the first state, the second heat exchanger 15 is not connected to the cooling channel 111 of the heating device and the first heat exchanger 20, and the cooling medium in the third cooling circuit 63 does not flow. The cooling channel 111 of the heating device is connected to the first heat exchanger 20, and the cooling medium in the first cooling circuit 61 flows. The compressor 12 is not working, and the cooling medium in the second cooling circuit 62 does not flow.

[0120] When operating at medium and low temperatures, the multi-way valve 13 is in the first state, and the cooling channel 111 of the heating device is connected to the first heat exchanger 20. The cooling medium of the heating device 11 can enter the first heat exchanger 20 through the first cooling circuit 61 and exchange heat with the heat dissipation fins 23 to achieve cooling of the cooling medium of the heating device 11. Then, it flows back to the cooling channel 111 of the heating device through the first cooling circuit 61. In other words, the heat energy of the heating device 11 is transferred to the atmospheric environment through the first cooling circuit 61 and the first heat exchanger 20.

[0121] Continue to refer to Figure 10 In the above embodiments, when the multi-way valve 13 is in the second state, the second heat exchanger 15 is connected to the cooling channel 111 of the heating device, and the cooling medium in the third cooling circuit 63 flows. The first heat exchanger 20 is not connected to the cooling channel 111 of the heating device, and the cooling medium in the first cooling circuit 61 does not flow. When the compressor 12 is working, the first heat exchanger 20 is connected to the second heat exchanger 15, and the cooling medium in the second cooling circuit 62 flows.

[0122] When operating at high temperatures, the multi-way valve 13 is in its second state, and the cooling channel 111 of the heating device is connected to the second heat exchanger 15. The cooling medium of the heating device 11 can enter the second heat exchanger 15 through the third cooling circuit 63. At the same time, the cooling medium of the second cooling circuit 62, after passing through the first heat exchanger 20, enters the second heat exchanger 15 and exchanges heat with the cooling medium of the heating device 11, causing the cooling medium of the heating device 11 to cool down. The cooling medium of the heating device 11 then flows back to the cooling channel 111 of the heating device through the third cooling circuit 63. In other words, the heat energy of the heating device 11 is transferred to the atmospheric environment through the third cooling circuit 63 and the second heat exchanger 15.

[0123] Continue to refer to Figure 1 and Figure 10 In some embodiments, the heat dissipation management system 17 further includes a water pump 14, and the cooling channel 111 of the heat-generating device is connected to the multi-way valve 13 through the water pump 14.

[0124] The water pump 14 can also control the flow rate of the cooling medium according to the heat generation and heat dissipation requirements of the heat-generating device 11. When the heat dissipation requirements of the heat-generating device 11 are high, the water pump 14 can increase the flow rate of the cooling medium to quickly remove heat. When the heat dissipation requirements of the heat-generating device 11 are low, the water pump 14 can reduce the flow rate of the cooling medium to avoid energy waste.

[0125] In some embodiments, the cooling medium of the first cooling circuit 61 is a coolant, and the cooling medium of the second cooling circuit 62 is a refrigerant. The cooling medium of the first cooling circuit 61 is used to cool the heat-generating device 11, and the cooling medium of the second cooling circuit 62 is used to cool the cooling medium of the first cooling circuit 61. In embodiments where the cooling medium of the second cooling circuit 62 is a refrigerant, the cooling medium of the second cooling circuit 62 from the compressor 12 is typically a high-temperature, high-pressure gaseous refrigerant. After passing through the first heat exchanger 20, the cooling medium of the second cooling circuit 62 becomes a low-temperature liquid refrigerant. After passing through the second heat exchanger 15, the cooling medium of the second cooling circuit 62 returns to a gaseous refrigerant.

[0126] Continue to refer to Figure 10In some embodiments, the thermal management system 17 further includes an electronic expansion valve 16, one end of which is connected to the first heat exchanger 20, and the other end of which is connected to the second heat exchanger 15. The electronic expansion valve 16 can control the flow rate of the cooling medium in the second cooling circuit 62. When the heat dissipation demand of the cooling medium in the third cooling circuit 63 is high, the electronic expansion valve 16 can increase the flow rate of the cooling medium in the second cooling circuit 62, increasing the heat exchange rate between the cooling medium in the third cooling circuit 63 and the cooling medium in the second cooling circuit 62, thereby increasing the heat dissipation rate of the cooling medium in the heat-generating device 11. When the heat dissipation demand of the cooling medium in the third cooling circuit 63 is low, the electronic expansion valve 16 can reduce the flow rate of the cooling medium in the second cooling circuit 62, saving energy.

[0127] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation management system, characterized in that, include: The system comprises a first cooling circuit, a second cooling circuit, and a first heat exchanger. The first heat exchanger includes a first fluid channel and a second fluid channel spaced apart, and a plurality of heat dissipation fins spaced apart. Both the first fluid channel and the second fluid channel pass through the plurality of heat dissipation fins. The first cooling circuit is used to connect to the cooling channel of the heating device, and the cooling channel of the heating device is also connected in series with the first fluid channel; The second cooling circuit includes a compressor connected in series with the second fluid channel, and the first cooling circuit and the second cooling circuit share the plurality of heat dissipation fins.

2. The heat dissipation management system according to claim 1, characterized in that, The number of the first fluid channels is multiple or the number of the second fluid channels is multiple. In a first direction, the multiple first fluid channels and the multiple second fluid channels are alternately arranged. Along the first direction, at least some of the projections of the multiple first fluid channels do not overlap with the projections of the multiple second fluid channels. The first direction intersects with the arrangement direction of the plurality of heat dissipation fins and is parallel to the heat dissipation fins.

3. The heat dissipation management system according to claim 2, characterized in that, The first fluid channel includes a plurality of first heat exchange tubes arranged at intervals along a second direction, and a manifold disposed at both ends of the plurality of first heat exchange tubes, wherein the orifice diameter of the manifold of the first fluid channel is larger than the orifice diameter of the plurality of first heat exchange tubes. The second fluid channel includes a plurality of second heat exchange tubes arranged at intervals along a second direction, and a manifold disposed at both ends of the plurality of second heat exchange tubes, wherein the orifice diameter of the manifold of the second fluid channel is larger than the orifice diameter of the plurality of second heat exchange tubes. The plurality of first heat exchange tubes penetrate the plurality of heat dissipation fins, and the second direction intersects the first direction and the arrangement direction of the heat dissipation fins.

4. The heat dissipation management system according to claim 2 or 3, characterized in that, The first heat exchanger further includes a first connecting pipe disposed between two adjacent first fluid channels. The first connecting pipe connects a manifold of one first fluid channel and a manifold of another first fluid channel. Along the first direction, the projection of the first connecting pipe does not overlap with the projection of the plurality of second fluid channels.

5. The heat dissipation management system according to claim 2 or 3, characterized in that, The first heat exchanger further includes a second connecting pipe disposed between two adjacent second fluid channels. The second connecting pipe connects the manifold of one second fluid channel and the manifold of the other second fluid channel. Along the first direction, the projection of the second connecting pipe does not overlap with the projection of the plurality of first fluid channels.

6. The heat dissipation management system according to claim 2 or 3, characterized in that, The sum of the number of the first fluid channel and the number of the second fluid channel is less than or equal to 6.

7. The heat dissipation management system according to claim 3, characterized in that, The first heat exchange tube and the second heat exchange tube are arranged in parallel to each other, and the manifold of the first fluid channel and the manifold of the second fluid channel are arranged in parallel to each other.

8. The heat dissipation management system according to claim 2 or 3, characterized in that, The heat dissipation management system further includes a third cooling circuit and a second heat exchanger. The second heat exchanger is connected to both the second cooling circuit and the third cooling circuit. The cooling channel of the heat-generating device is also connected to the third cooling circuit.

9. The heat dissipation management system according to claim 8, characterized in that, The first heat exchanger includes a first inlet and a first outlet, both of which are connected to the first cooling circuit. The first inlet and the first outlet are located on the side of the first heat exchanger closer to the heat-generating device. The first heat exchanger also includes a second inlet and a second outlet, which are connected to the second cooling circuit. The second inlet and the second outlet are located on the side of the first heat exchanger closer to the compressor. The second heat exchanger includes a third inlet and a third outlet, which are connected to the third cooling circuit. The third inlet and the third outlet are located on the side of the second heat exchanger closer to the heat-generating device. The second heat exchanger also includes a fourth inlet and a fourth outlet, which are connected to the second cooling circuit. The fourth inlet and the fourth outlet are located on the side of the second heat exchanger closer to the compressor.

10. The heat dissipation management system according to claim 8, characterized in that, The heat dissipation management system also includes a multi-way valve. In the first cooling circuit, the cooling channel of the heat-generating device is connected to the first heat exchanger through the multi-way valve. At the same time, in the third cooling circuit, the cooling channel of the heat-generating device is connected to the second heat exchanger through the multi-way valve.

11. The heat dissipation management system according to claim 10, characterized in that, When the multi-way valve is in the first state, the second heat exchanger is not connected to the cooling channel of the heating device and the first heat exchanger, and the cooling medium in the third cooling circuit does not flow; the cooling channel of the heating device is connected to the first heat exchanger, and the cooling medium in the first cooling circuit flows; the compressor is not working, and the cooling medium in the second cooling circuit does not flow.

12. The heat dissipation management system according to claim 10, characterized in that, When the multi-way valve is in the second state, the second heat exchanger is connected to the cooling channel of the heating device, and the cooling medium of the third cooling circuit flows; when the first heat exchanger is not connected to the cooling channel of the heating device, the cooling medium of the first cooling circuit does not flow; when the compressor is working, the first heat exchanger is connected to the second heat exchanger, and the cooling medium of the second cooling circuit flows.

13. The heat dissipation management system according to claim 2 or 3, characterized in that, The cooling medium of the first cooling circuit is coolant, and the cooling medium of the second cooling circuit is refrigerant.

14. An energy storage device, characterized in that, It includes a heat-generating device and a heat dissipation management system as described in any one of claims 1-13, wherein the heat-generating device is connected to the heat dissipation management system, and the heat dissipation management system is used to dissipate heat from the heat-generating device.

15. The energy storage device according to claim 14, characterized in that, The heating device includes a battery pack or an energy storage converter.

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