A BDU assembly, battery pack, and vehicle

Abstract

The utility model provides a kind of BDU assembly, battery pack and car, it is related to the field of automobile parts, the BDU assembly includes BDU casing, copper bar group, baffle and heat-conducting adhesive, baffle is placed inside BDU casing, it is oppositely arranged with the bottom wall of BDU casing and is connected with the side wall of BDU casing, baffle, the side wall of BDU casing and the bottom wall of BDU casing are enclosed to form accommodating cavity, at least part of copper bar group is located in accommodating cavity, BDU casing is equipped with the glue injection port being communicated with accommodating cavity, glue injection port is used to inject heat-conducting adhesive into accommodating cavity. Heat-conducting adhesive is injected into accommodating cavity by glue injection port, heat-conducting adhesive is directly contacted with copper bar group in accommodating cavity, and the heat dissipation effect is better;Moreover, the relative arrangement height of baffle and the bottom wall of BDU casing can be controlled to adjust the filling amount of heat-conducting adhesive in accommodating cavity, so that it satisfies the heat dissipation requirement;In addition, since accommodating cavity is relatively closed, when glue injection is needed, BDU assembly can be inverted or laid on side, so that glue injection port on BDU casing faces upwards, and glue injection is more convenient.

Description

Technical Field

[0001] This utility model relates to the field of automotive parts, specifically to a BDU assembly, a battery pack, and an automobile. Background Technology

[0002] The Battery Disconnect Unit (BDU) is a high-voltage power distribution device for a battery pack, responsible for controlling the energy distribution and safety protection of the battery pack. A BDU typically includes multiple devices such as relays, fuses, pre-charge resistors, and current sensors, which are connected by highly conductive wires such as copper busbars.

[0003] In related technologies, when the BDU is working, the components inside it generate a lot of heat, which cannot be dissipated in time, affecting the safety and lifespan of the battery pack. Utility Model Content

[0004] The present invention aims to solve the technical problem of untimely heat dissipation of BDU in related technologies.

[0005] In a first aspect, this utility model provides a BDU assembly, including a BDU housing, a copper busbar assembly, a baffle, and thermally conductive adhesive. The baffle is placed inside the BDU housing, opposite to the bottom wall of the BDU housing, and connected to the side wall of the BDU housing. The baffle, the side wall of the BDU housing, and the bottom wall of the BDU housing enclose a receiving cavity. At least a portion of the copper busbar assembly is located within the receiving cavity. The BDU housing is provided with an adhesive injection port communicating with the receiving cavity, and the adhesive injection port is used to inject the thermally conductive adhesive into the receiving cavity.

[0006] Optionally, the bottom wall of the BDU housing is provided with the glue injection port.

[0007] Optionally, the bottom wall of the BDU housing is provided with a groove that is recessed towards the interior of the BDU housing, and the groove and the receiving cavity are filled with the thermally conductive adhesive.

[0008] Optionally, a portion of the copper busbar assembly is bent out of the receiving cavity and located within the groove, and is at least partially wrapped by the thermally conductive adhesive located within the groove.

[0009] Optionally, the BDU assembly further includes a liquid cooling plate located outside the BDU housing, and the liquid cooling plate is configured to make contact with the thermally conductive adhesive within the groove.

[0010] Optionally, the thermally conductive adhesive is a thermally conductive potting compound.

[0011] Optionally, the BDU assembly also includes a main circuit relay located inside the BDU housing. The corresponding copper busbar of the copper busbar assembly has a connection hole. One end of the main circuit relay passes through the baffle, is inserted into the connection hole, and is welded and fixed to the copper busbar.

[0012] Optionally, the BDU assembly further includes a sampling board, a low-voltage control terminal, a high-voltage sampling terminal, and copper busbar connecting posts. The sampling board is located on the side of the main circuit relay away from the copper busbar group. The low-voltage control terminal and the high-voltage sampling terminal are integrated on the sampling board. The low-voltage control terminal is welded and fixed to the end of the main circuit relay away from the copper busbar group. The two ends of the copper busbar connecting posts are respectively welded and fixed to the high-voltage sampling terminal and the corresponding copper busbar of the copper busbar group.

[0013] Secondly, this utility model proposes a battery pack, including the aforementioned BDU assembly.

[0014] Thirdly, this utility model also proposes an automobile that includes the aforementioned battery pack.

[0015] The BDU assembly, battery pack, and automobile of this invention have at least the following advantages compared to related technologies:

[0016] The BDU housing has an internal baffle plate positioned opposite the bottom wall of the BDU housing. This baffle plate connects to the side wall of the BDU housing, and together with the side and bottom walls, forms a cavity at the bottom of the BDU housing. An injection port on the BDU housing communicates with this cavity. After the BDU assembly is encapsulated, thermally conductive adhesive can be injected into the cavity through this port. The adhesive fills the cavity and encapsulates the copper busbars within. The direct contact between the adhesive and the busbars allows for rapid and efficient heat dissipation, resulting in excellent heat dissipation for the BDU assembly and effectively ensuring the safety and lifespan of the battery pack. Furthermore, the amount of thermally conductive adhesive in the cavity can be adjusted by controlling the relative height of the baffle plate to the bottom wall of the BDU housing, ensuring the adhesive meets heat dissipation requirements. Additionally, because the cavity is relatively enclosed, the BDU assembly can be inverted or placed on its side with the injection port facing upwards for easier adhesive injection. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the BDU assembly according to an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A schematic diagram of the decomposed structure;

[0019] Figure 3 for Figure 1 A sectional view;

[0020] Figure 4 This is a schematic diagram of the structure of the BDU housing according to an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of the internal structure of the BDU assembly according to an embodiment of the present invention;

[0022] Figure 6 This is another structural schematic diagram of the BDU assembly according to an embodiment of the present utility model.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. BDU housing; 101. Injection port; 102. Groove; 103. Rib; 104. Housing body; 105. Protective top cover; 2. Copper busbar assembly; 201. Copper busbar; 202. Connecting hole; 3. Baffle; 4. Thermally conductive adhesive; 5. Liquid cooling plate; 6. Main circuit relay; 7. Sampling board; 8. Low-voltage control terminal; 9. High-voltage sampling terminal; 10. Copper busbar connecting post; 11. Pre-charge resistor; 12. Pre-charge relay. Detailed Implementation

[0025] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0026] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fitting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] In addition, it should be noted that in the description of this utility model, the terms and nouns in each embodiment, such as "upper," "lower," "front," and "rear," which indicate the location, are only used to simplify the description of the positional relationship based on the accompanying drawings. They do not mean that the components and devices referred to must be operated in accordance with the specific location and limited operation, method, and structure in the specification. Such directional terms do not constitute a limitation on this utility model.

[0028] like Figures 1-4As shown, a BDU assembly according to an embodiment of the present invention includes a BDU housing 1, a copper busbar assembly 2, a baffle 3, and thermally conductive adhesive 4. The baffle 3 is placed inside the BDU housing 1, opposite to the bottom wall of the BDU housing 1, and connected to the side wall of the BDU housing 1. The baffle 3, the side wall of the BDU housing 1, and the bottom wall of the BDU housing 1 enclose a receiving cavity. At least a portion of the copper busbar assembly 2 is located in the receiving cavity. The bottom wall of the BDU housing 1 is provided with an adhesive injection port 101 communicating with the receiving cavity. The adhesive injection port 101 is used to inject the thermally conductive adhesive 4 into the receiving cavity.

[0029] Specifically, the BDU housing 1 is made of plastic and is roughly rectangular. The BDU housing 1 includes a detachable housing body 104 and a protective cover 105. The bottom wall and side walls of the BDU housing 1 enclose the housing body 104 with the opening facing upward. Components are installed inside the housing body 104. The protective cover 105 covers the opening of the housing body 104. Removing the protective cover 105 allows for easy disassembly and replacement of the relevant components inside.

[0030] The copper busbar group 2 is located at the bottom of the BDU housing 1 and is used for electrical connection between related devices. The copper busbar group 2 includes multiple copper busbars 201, each of which is strip-shaped. The baffle 3 can be a horizontally arranged bent plate. The edge of the baffle 3 is connected to each side wall of the BDU housing 1 so that the lower part of the baffle 3 and the bottom wall of the BDU housing 1 form a receiving cavity.

[0031] The glue injection port 101 on the BDU housing 1 can be of any shape. The BDU assembly is placed in a vacuum pressure chamber, and glue is injected into the receiving cavity through the glue injection port 101 to ensure that there are no air bubbles in the glue.

[0032] In this embodiment, a baffle 3 is provided inside the BDU housing 1. The baffle 3 is connected to the side wall of the BDU housing 1. The baffle 3, together with the side wall and bottom wall of the BDU housing 1, forms a receiving cavity at the bottom of the BDU housing 1. A glue injection port 101 communicating with the receiving cavity is provided on the BDU housing 1. After the BDU assembly is packaged, thermally conductive adhesive 4 can be injected into the receiving cavity through the glue injection port 101. The thermally conductive adhesive 4 can fill the receiving cavity and form a wrapping around the copper busbar assembly 2 inside the receiving cavity. The thermally conductive adhesive 4 and The copper busbar group 2 is in direct contact, which can quickly and timely dissipate the heat of the copper busbar group 2, resulting in better heat dissipation of the BDU assembly and effectively ensuring the safety and lifespan of the battery pack. Moreover, the amount of thermally conductive adhesive 4 in the receiving cavity can be adjusted by controlling the relative height of the baffle 3 and the bottom wall of the BDU housing 1, so that the thermally conductive adhesive 4 meets the heat dissipation requirements. In addition, since the receiving cavity is relatively closed, when adhesive injection is required, the BDU assembly can be inverted or placed on its side so that the adhesive injection port 101 on the BDU housing 1 faces upward, making adhesive injection more convenient.

[0033] Optionally, the bottom wall of the BDU housing 1 is provided with the glue injection port 101. When glue injection is required, the BDU assembly is inverted so that the glue injection port 101 faces upward, and glue can be injected.

[0034] Since the injection port 101 is located on the bottom wall of the BDU housing 1, which is also the bottom wall of the receiving cavity, and the bottom wall of the receiving cavity has a larger area than the side wall of the receiving cavity, the thermally conductive adhesive 4 entering the receiving cavity from the injection port 101 can quickly spread to the periphery of the receiving cavity and fill the receiving cavity. In addition, more injection ports 101 can be set on the bottom wall of the receiving cavity to ensure injection efficiency.

[0035] Of course, in some other embodiments, a glue injection port 101 can also be provided on the side wall of the BDU housing 1. When glue injection is required, the BDU assembly can be placed on its side so that the glue injection port 101 faces upward.

[0036] like Figure 4 As shown, optionally, the bottom wall of the BDU housing 1 is provided with a groove 102 that is recessed toward the interior of the BDU housing 1, and the groove 102 and the receiving cavity are filled with the thermally conductive adhesive 4.

[0037] Specifically, the BDU assembly is placed horizontally, and the bottom wall of the BDU housing 1 is provided with a groove 102 that is recessed inward towards the inside of the BDU housing 1, that is, recessed upward. The groove can be formed by a flange set on the edge of the bottom wall of the BDU housing 1. The opening of the groove 102 faces downward. An injection port 101 communicating with the receiving cavity can be provided in the groove 102 (such as the bottom wall of the groove 102, the side wall of the groove 102) or on the side wall of the BDU housing 1.

[0038] In this embodiment, the example of providing a glue injection port 101 within the groove 102 is used for illustration. When glue injection is required, the BDU assembly is inverted, and the glue injection head moves back and forth above the opening of the groove 102, evenly injecting glue into the groove 102. After a certain amount of glue has been injected, that is, after the glue has spread evenly on the bottom wall of the groove 102, the glue will enter the receiving cavity from the glue injection port 101 on the bottom wall of the groove, until the receiving cavity and the groove 102 are filled with glue. Compared to directly injecting glue into the smaller diameter glue injection port 101 using the glue injection head, the groove 102 has a larger opening, making glue injection more convenient and efficient. Here, multiple glue injection ports 101 can be provided to further improve glue injection efficiency.

[0039] Furthermore, since a portion of the thermally conductive adhesive 4 is located within the groove 102 on the outside of the BDU housing 1, and another portion is located within the receiving cavity inside the BDU housing 1, and both portions of the thermally conductive adhesive 4 are in contact with the inner and outer surfaces of the bottom wall of the BDU housing 1 respectively, the heat generated by the copper busbar assembly 2 inside the BDU housing 1 can be conducted to the outside of the BDU housing 1 more quickly, resulting in better heat dissipation. Moreover, when the injection port 101 is located within the groove 102, the thermally conductive adhesive 4 in the inner and outer portions of the BDU housing 1 can be connected through the injection port 101, further ensuring the heat dissipation effect.

[0040] like Figures 4-5 As shown, optionally, a portion of the copper busbar assembly 2 is bent out of the receiving cavity and located within the groove 102, and is at least partially wrapped by the thermally conductive adhesive 4 located within the groove 102.

[0041] Specifically, after a portion of each copper busbar 201 of the copper busbar assembly 2 is bent out of the receiving cavity, it is placed horizontally in the groove 102. By placing a portion of the copper busbar assembly 2 in the groove 102 of the BDU housing 1 and being wrapped by the thermally conductive adhesive 4 in the groove 102, the heat dissipation effect of the copper busbar assembly 2 can be further improved.

[0042] In addition, the bottom wall of the groove 102 is provided with multiple baffles 103, which physically separate adjacent copper busbars 201 to increase the creepage distance between them and avoid signal interference.

[0043] like Figure 6 As shown, optionally, the BDU assembly further includes a liquid cooling plate 5, which is located outside the BDU housing 1 and is used to contact the thermally conductive adhesive 4 in the groove 102.

[0044] Specifically, the liquid cooling plate 5 is a flat plate located below the bottom of the BDU housing 1 and is attached to the thermally conductive adhesive 4 in the groove 102, so that the heat generated by the copper busbar assembly 2 of the BDU assembly can be quickly transferred to the liquid cooling plate 5 through the thermally conductive adhesive 4, resulting in higher heat dissipation efficiency and better heat dissipation effect.

[0045] Optionally, the thermally conductive adhesive 4 is a thermally conductive potting compound.

[0046] Specifically, the thermally conductive adhesive 4 can be a silicone-based thermally conductive potting compound. Compared to semi-solid thermally conductive gels, thermally conductive potting compounds are initially liquid, have better fluidity, can fill spaces with more complex shapes, better meet the filling needs of the accommodating cavity and groove 102, and after heating and curing, have better thermal conductivity, hardness and insulation properties. They can absorb the impact of vibration on the internal components of the BDU assembly while ensuring the heat dissipation effect of the BDU assembly, improve mechanical durability, and ensure electrical isolation to prevent short circuits and electrical interference.

[0047] After the adhesive is applied, the BDU assembly can be placed in a high-temperature oven at 80°C to cure the adhesive. After complete curing, a dustproof film can be pasted on the groove of the groove 102 to prevent dust and impurities from entering the thermally conductive adhesive 4.

[0048] like Figure 2 , Figure 3 and Figure 5 As shown, optionally, the BDU assembly also includes a main circuit relay 6, which is located inside the BDU housing 1. The corresponding copper busbar 201 of the copper busbar group 2 is provided with a connection hole 202. One end of the main circuit relay 6 passes through the baffle 3, is inserted into the connection hole 202, and is welded and fixed to the copper busbar 201.

[0049] Specifically, the main circuit relay 6 is located above the copper busbar group 2. The baffle 3 has a through hole extending along its thickness direction for the main body of the main circuit relay 6 to pass through. That is, the main body of the main circuit relay 6 is located both above and below the baffle 3. The shape of the through hole matches the main body of the main circuit relay 6 to ensure assembly sealing. In addition, multiple vertical partitions can be arranged inside the BDU housing 1 in a crisscross pattern. The multiple partitions are connected to the walls of the through holes respectively. The partitions enclose a cavity for placing the main circuit relay 6, avoiding interference between the main circuit relay 6 and other devices. The partitions, baffle 3 and the shell body of the BDU housing 1 can be integrally formed, which is simple to form and has good sealing performance.

[0050] The copper busbar 201 has a connecting hole 202 on the portion extending out of the receiving cavity, i.e., the portion located inside the groove 102. The connecting hole 202 vertically penetrates the copper busbar 201. The contacts at the lower end of the main circuit relay 6 can pass through the bottom wall of the BDU housing 1 and be inserted into the corresponding connecting hole 202 of the copper busbar 201. Alternatively, the contacts at the lower end of the main circuit relay 6 can be directly connected to the copper busbar 201 inside the BDU housing 1. Then, using a suitable laser welding technique, the contacts of the main circuit relay 6 are welded and fixed to the copper busbar 201. The laser welding process fuses the metal connection surfaces together, enabling... The overall strength and fatigue resistance of the structure are improved, and the connection strength of the two after welding is higher than 4000MPa. In addition, compared with the bolt-fixed connection method, there is no need to use special tools to strictly control the tightening torque, and there is no need to regularly check whether the bolts are loose, thus reducing maintenance costs. Moreover, there is no need to reserve installation space for fasteners such as bolts, nuts, and washers in the BDU housing 1, which reduces the overall weight of the BDU assembly. Furthermore, the contact resistance at the connection is reduced from 20uΩ to 5μΩ, effectively reducing the heat at the connection and the overall heat generation of the BDU assembly.

[0051] like Figure 2 and Figure 5As shown, optionally, the BDU assembly also includes a sampling board 7, a low-voltage control terminal 8, a high-voltage sampling terminal 9, and a copper busbar connecting post 10. The sampling board 7 is located on the side of the main circuit relay 6 away from the copper busbar group 2. The low-voltage control terminal 8 and the high-voltage sampling terminal 9 are integrated on the sampling board 7. The low-voltage control terminal 8 is welded and fixed to the end of the main circuit relay 6 away from the copper busbar group 2. The two ends of the copper busbar connecting post 10 are welded and fixed to the high-voltage sampling terminal 9 and the corresponding copper busbar 201 of the copper busbar group 2, respectively.

[0052] Specifically, the sampling board 7 is a PCB circuit board. The sampling board 7 is located on the side of the main circuit relay 6 away from the copper busbar group 2, that is, the sampling board 7 is located above the main circuit relay 6. The low-voltage control terminal 8 and the high-voltage sampling terminal 9 can be soldered and fixed on the sampling board 7, that is, the low-voltage control terminal 8 and the high-voltage sampling terminal 9 are integrated on the sampling board 7, realizing the wireless connection of the low-voltage control terminal 8 and the high-voltage sampling terminal 9, which greatly improves the integration, simplifies the circuit design, and eliminates the wire harness connection, which can reduce the space occupation.

[0053] In addition, by welding the upper contact of the main circuit relay 6 to the low-voltage control terminal 8, welding the high-voltage sampling terminal 9 to the upper end of the copper busbar connecting post 10, and the lower end of the copper busbar connecting post 10 passing through the baffle 3 and the bottom wall of the BDU housing 1 to weld to the copper busbar 201 in the groove 102, or by directly passing through the baffle 3 to weld to the copper busbar 201 in the receiving cavity, the connection strength of related devices is improved, bolt connections are eliminated, contact resistance is reduced, and heat generation is reduced, while realizing the internal circuit connection of the BDU assembly.

[0054] like Figure 5 As shown, optionally, the BDU assembly also includes a pre-charge resistor 11 and a pre-charge relay 12, which are integrated on the sampling board 7.

[0055] Specifically, the pre-charge resistor 11 and the pre-charge relay 12 can be soldered and fixed to the sampling board 7, thereby achieving integrated installation of the pre-charge resistor 11 and the pre-charge relay 12 on the sampling board 7. This significantly improves integration, simplifies circuit design, and eliminates wiring harness connections, reducing space occupation. The pre-charge resistor 11 and the pre-charge relay 12 are connected to the relevant circuits on the sampling board 7 to form a pre-charge circuit, realizing the pre-charge function.

[0056] Another embodiment of this utility model provides a battery pack including the aforementioned BDU assembly. The advantages of this battery pack compared to related technologies are the same as those of the aforementioned BDU assembly, and will not be repeated here.

[0057] Another embodiment of this utility model proposes an automobile including the aforementioned battery pack. The automobile can be a new energy vehicle. The advantages of this automobile compared to related technologies are the same as those of the aforementioned battery pack, and will not be repeated here.

[0058] Although the present invention has been disclosed above, its protection scope is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the protection scope of the present invention.

Claims

1. A BDU assembly, characterized in that, The device includes a BDU housing (1), a copper busbar assembly (2), a baffle (3), and thermally conductive adhesive (4). The baffle (3) is placed inside the BDU housing (1), opposite to the bottom wall of the BDU housing (1), and connected to the side wall of the BDU housing (1). The baffle (3), the side wall of the BDU housing (1), and the bottom wall of the BDU housing (1) form a receiving cavity. At least a portion of the copper busbar assembly (2) is located in the receiving cavity. The BDU housing (1) is provided with an adhesive injection port (101) that communicates with the receiving cavity. The adhesive injection port (101) is used to inject the thermally conductive adhesive (4) into the receiving cavity.

2. The BDU assembly according to claim 1, characterized in that, The bottom wall of the BDU housing (1) is provided with the glue injection port (101).

3. The BDU assembly according to claim 1, characterized in that, The bottom wall of the BDU housing (1) is provided with a groove (102) that is recessed towards the inside of the BDU housing (1), and the thermally conductive adhesive (4) is poured into the groove (102) and the cavity.

4. The BDU assembly according to claim 3, characterized in that, The copper busbar assembly (2) is partially bent out of the receiving cavity and located in the groove (102), and is at least partially wrapped by the thermally conductive adhesive (4) located in the groove (102).

5. The BDU assembly according to claim 3, characterized in that, It also includes a liquid cooling plate (5), which is located outside the BDU housing (1) and is used to make contact with the thermally conductive adhesive (4) in the groove (102).

6. The BDU assembly according to claim 1, characterized in that, The thermally conductive adhesive (4) is a thermally conductive potting compound.

7. The BDU assembly according to claim 1, characterized in that, It also includes a main circuit relay (6), which is located inside the BDU housing (1). The corresponding copper busbar (201) of the copper busbar group (2) is provided with a connection hole (202). One end of the main circuit relay (6) passes through the baffle (3), is inserted into the connection hole (202), and is welded and fixed to the copper busbar (201).

8. The BDU assembly according to claim 7, characterized in that, It also includes a sampling board (7), a low-voltage control terminal (8), a high-voltage sampling terminal (9), and a copper busbar connecting post (10). The sampling board (7) is located on the side of the main circuit relay (6) away from the copper busbar group (2). The sampling board (7) integrates the low-voltage control terminal (8) and the high-voltage sampling terminal (9). The low-voltage control terminal (8) is welded and fixed to the end of the main circuit relay (6) away from the copper busbar group (2). The two ends of the copper busbar connecting post (10) are welded and fixed to the high-voltage sampling terminal (9) and the corresponding copper busbar (201) of the copper busbar group (2), respectively.

9. A battery pack, characterized in that, Includes the BDU assembly as described in any one of claims 1-8.

10. A car, characterized in that, Includes the battery pack as described in claim 9.

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