An electroplated cavity filter

Abstract

The utility model relates to electroplating hardware technology field, concretely relates to a kind of electroplating cavity filter, including filter body, the left side of filter body is provided with input port, the right side of filter body is provided with output port, inner cavity middle is provided with the filter channel of connecting input port and output port, the front and back of filter channel are separated into multiple resonance cavities by separating rib and divide inner cavity, the bottom of each resonance cavity is fixed with resonance column, resonance cavity is communicated with filter channel by coupling window, the multiple resonance cavities of the front and back of filter channel are staggered arrangement, inner cavity surface is electroplated with copper plating layer, the surface of copper plating layer is electroplated with silver plating layer.The utility model discloses an electroplating cavity filter by inner cavity surface of cavity filter electroplating copper plating layer and silver plating layer, can improve the conductivity of filter inner cavity, to reduce the heat generated under high power operating state of filter, improve the average power and peak power that filter can handle.

Description

Technical Field

[0001] This utility model relates to the field of electroplated hardware products technology, specifically to an electroplated cavity filter. Background Technology

[0002] With the rapid development of signal processing equipment, the performance requirements for filters are becoming increasingly stringent. Traditional filters are made of aluminum or have a single coating plated on the surface of aluminum filters. The aluminum oxide insulating layer or single coating on the aluminum surface has poor conductivity. Under high power operation, this not only affects the stability of filtering performance but also limits the average and peak power that the filter can handle, making it unable to meet the needs of high-power application scenarios such as 5G. Summary of the Invention

[0003] In order to overcome the shortcomings and deficiencies of the existing technology, the purpose of this utility model is to provide an electroplated cavity filter.

[0004] The objective of this utility model is achieved through the following technical solution: an electroplated cavity filter, comprising a filter body, an inner cavity with an inverted cavity at the top center of the filter body, an input port on the left side of the filter body, an output port on the right side of the filter body, a filter channel connecting the input port and the output port in the middle of the inner cavity, the inner cavity being divided into multiple resonant cavities by ribs on the front and rear sides of the filter channel, a resonant post fixed at the bottom center of each resonant cavity, the resonant cavity being connected to the filter channel through a coupling window, the multiple resonant cavities on the front and rear sides of the filter channel being staggered, a copper plating layer being electroplated on the surface of the inner cavity, and a silver plating layer being electroplated on the surface of the copper plating layer.

[0005] Furthermore, a mounting platform is fixed at the bottom center of each resonant cavity, and the top of the mounting platform is fixedly connected to the bottom of the resonant column.

[0006] Furthermore, a first mounting hole is provided at the bottom of the filter channel corresponding to the position of each coupling window, and a coupling rod is installed in each first mounting hole.

[0007] Furthermore, the inner cavity sidewall is provided with an installation groove, the top of the installation groove is in the same plane as the top of the partition rib, and both the top of the installation groove and the top of the partition rib are provided with multiple second installation holes.

[0008] Furthermore, the bottom plane of the filter channel is higher than the bottom plane of each resonant cavity.

[0009] Furthermore, protrusions are fixed on both the front and rear sides of the top center of the filter body, and a third mounting hole is provided on the top of each protrusion and at the four corners of the top of the filter body.

[0010] Furthermore, the thickness of the copper plating layer is 6-8 μm.

[0011] Furthermore, the thickness of the silver plating layer is 0.5-1.5 μm.

[0012] The beneficial effects of this utility model are as follows: The electroplated cavity filter of this utility model can improve the conductivity of the filter cavity by electroplating a copper layer and a silver layer on the inner cavity surface of the cavity filter. The improved conductivity can reduce the energy loss and heat accumulation of the filter under high power operation, thereby improving the average power and peak power that the filter can handle, avoiding performance degradation caused by temperature rise, meeting the requirements of high power application scenarios of the filter, and reducing production costs. Attached Figure Description

[0013] Figure 1 This is a perspective view of the present invention.

[0014] Figure 2 This is a partial cross-sectional view of the filter body described in this utility model.

[0015] The attached figures are labeled as follows: filter body 1, second mounting hole 10, inner cavity 11, input port 12, output port 13, mounting groove 14, protrusion 15, third mounting hole 16, filter channel 3, coupling rod 32, partition 4, resonant cavity 5, resonant column 51, mounting platform 52, coupling window 6, copper plating layer 7, silver plating layer 8. Detailed Implementation

[0016] To facilitate understanding by those skilled in the art, the following description is provided in conjunction with embodiments and appendices. Figure 1-2 The present invention will be further described below. The content mentioned in the embodiments is not intended to limit the present invention.

[0017] See Figure 1-2 An electroplated cavity filter includes a filter body 1. The filter body 1 has an inner cavity 11 with a downward opening at the top center. An input port 12 is provided on the left side of the filter body 1, and an output port 13 is provided on the right side of the filter body 1. A filter channel 3 is provided in the middle of the inner cavity 11, connecting the input port 12 and the output port 13. The inner cavity 11 is divided into multiple resonant cavities 5 by partition ribs 4 on the front and rear sides of the filter channel 3. A resonant post 51 is fixed at the bottom center of each resonant cavity 5. The resonant cavity 5 is connected to the filter channel 3 through a coupling window 6. The multiple resonant cavities 5 on the front and rear sides of the filter channel 3 are staggered. A copper plating layer 7 is electroplated on the surface of the inner cavity 11, and a silver plating layer 8 is electroplated on the surface of the copper plating layer 7.

[0018] The electroplated cavity filter of this invention improves the conductivity of the inner cavity 11 by electroplating a copper layer 7 and a silver layer 8 on the surface of the inner cavity 11. The improved conductivity reduces energy loss and heat accumulation in the high-power operating state of the filter, thereby increasing the average power and peak power that the filter can handle, avoiding performance degradation caused by temperature rise, meeting the requirements of high-power application scenarios of the filter, and reducing production costs.

[0019] In this embodiment, a mounting platform 52 is fixedly attached to the center of the bottom of each resonant cavity 5, and the top of the mounting platform 52 is fixedly connected to the bottom of the resonant column 51. The above structure is used to mount the resonant column 51.

[0020] In this embodiment, a first mounting hole (not shown in the figure) is provided at the bottom of the filter channel 3 corresponding to the position of each coupling window 6, and a coupling rod 32 is installed in each first mounting hole. The above structure can enhance the energy transfer between adjacent resonant cavities 5.

[0021] In this embodiment, the inner cavity 11 has a mounting groove 14 on its side wall. The top of the mounting groove 14 is in the same plane as the top of the partition 4, and both the top of the mounting groove 14 and the top of the partition 4 have multiple second mounting holes 10. By providing the mounting groove 14 and the second mounting holes 10, the installation of the cover plate is facilitated.

[0022] In this embodiment, the bottom plane of the filter channel 3 is higher than the bottom plane of each resonant cavity 5.

[0023] In this embodiment, protrusions 15 are fixed on both the front and rear sides of the top center of the filter body 1, and a third mounting hole 16 is provided on the top of each protrusion 15 and at the four corners of the top of the filter body 1. The third mounting holes 16 facilitate the installation of the cavity filter with other components.

[0024] In this embodiment, the thickness of the copper plating layer 7 is 6-8 μm. To achieve the best performance of this invention, the optimal thickness of the copper plating layer 7 is 7 μm.

[0025] In this embodiment, the thickness of the silver plating layer 8 is 0.5-1.5 μm. To achieve the best performance of this invention, the optimal thickness of the silver plating layer 8 is 1 μm.

[0026] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this utility model are within the protection scope of this utility model.

Claims

1. An electroplated cavity filter, characterized in that: The filter includes a filter body with an inner cavity opening downwards from the top center. An input port is located on the left side of the filter body, and an output port is located on the right side. A filter channel connecting the input and output ports is located in the middle of the inner cavity. The inner cavity is divided into multiple resonant cavities by ribs on the front and back sides of the filter channel. A resonant post is fixed at the bottom center of each resonant cavity. The resonant cavity is connected to the filter channel through a coupling window. The multiple resonant cavities on the front and back sides of the filter channel are staggered. The inner cavity surface is electroplated with a copper plating layer, and the surface of the copper plating layer is electroplated with a silver plating layer.

2. The electroplated cavity filter according to claim 1, characterized in that: Each of the resonant cavities has a mounting platform fixed at the bottom center, and the top of the mounting platform is fixedly connected to the bottom of the resonant column.

3. The electroplated cavity filter according to claim 1, characterized in that: The bottom of the filter channel has a first mounting hole corresponding to the position of each coupling window, and a coupling rod is installed in each first mounting hole.

4. The electroplating cavity filter according to claim 1, characterized in that: The inner cavity sidewall is provided with an installation groove, the top of the installation groove is in the same plane as the top of the partition rib, and both the top of the installation groove and the top of the partition rib are provided with multiple second installation holes.

5. The electroplating cavity filter according to claim 1, characterized in that: The bottom plane of the filter channel is higher than the bottom plane of each resonant cavity.

6. The electroplating cavity filter according to claim 1, characterized in that: The filter body has protrusions fixed on both the front and rear sides of the top center, and each protrusion and the four corners of the top of the filter body have a third mounting hole.

7. The electroplating cavity filter according to claim 1, characterized in that: The thickness of the copper plating layer is 6-8 μm.

8. The electroplated cavity filter according to claim 1, characterized in that: The thickness of the silver plating layer is 0.5-1.5 μm.

Images