A honeycomb wave-absorbing material structure

Abstract

The utility model relates to wave absorbing material technical field provides a kind of honeycomb wave absorbing material structure, including mainboard and protective coating;The outside of the mainboard is provided with protective coating, the inside of the mainboard is provided with wave absorbing structure;The side of the mainboard is fixed with lug, the side of the mainboard away from lug is equipped with clamping groove, the both sides of the mainboard bottom are all fixed with mounting structure.The utility model is provided with mounting structure, so that the mounting plate of the side of adjacent mainboard is in the inside of the reserved slot of the side of another group of mainboard mounting plate, further to make two groups of mainboard facilitate mutual friction to reduce the gap generated between, and facilitate the mounting bolt inside screw hole to rotate to the wall body and the like object to be installed, and then the material is installed and used, to reach the purpose that a plurality of groups of materials are combined and installed and used.

Description

Technical Field

[0001] This utility model relates to the field of microwave absorbing materials technology, and in particular to a honeycomb microwave absorbing material structure. Background Technology

[0002] With the development of the times, people are using various new materials more and more widely, and absorbing materials are an important component of them;

[0003] To address this, patent CN217523143U discloses a honeycomb absorbing material structure, relating to the field of honeycomb materials. The structure includes a structural plate with several honeycomb panels evenly spaced at its upper end. Installation mechanisms are located at the bottom and on both sides of each honeycomb panel, and fixing mechanisms are located near the sides of the upper end of each honeycomb panel. Each installation mechanism includes a partition plate with an insert plate at its bottom. A groove is formed on one side of the insert plate, and a sliding rod is provided on the inner wall of the groove near its corner. A positioning plate is fitted onto the sliding rod. A slot that mates with the insert plate is formed on the surface of the structural plate below the partition plate, and a positioning groove that mates with the positioning plate is formed on the inner wall of the slot. A spring is wound around the surface of the sliding rod. This honeycomb absorbing material structure facilitates the installation and removal of honeycomb panels and effectively increases the stability between two adjacent honeycomb panels.

[0004] The aforementioned absorbing materials rely solely on honeycomb panels for wave absorption, which limits their application and makes it difficult to meet practical needs. Utility Model Content

[0005] The purpose of this invention is to provide a honeycomb absorbing material structure to solve the problem of poor absorption effect of existing honeycomb absorbing material structures.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a honeycomb absorbing material structure, including a main board and a protective coating;

[0007] The motherboard has a protective coating on its outer side and a wave-absorbing structure on its inner side.

[0008] A protrusion is fixed on one side of the motherboard, a slot is provided on the side of the motherboard away from the protrusion, and mounting structures are fixed on both sides of the bottom of the motherboard.

[0009] The mounting structure includes a mounting plate, threaded holes, mounting bolts, and a reserved slot. The mounting plates are fixed to both sides of the bottom of the motherboard. Threaded holes are opened inside the mounting plates, and mounting bolts are installed inside the threaded holes. A reserved slot is opened at the bottom end of the motherboard on one side of the mounting plate.

[0010] Preferably, the absorbing structure includes a transmission layer, an absorption layer, a reflection layer, and a sandwich layer. The transmission layer is disposed inside the motherboard, the absorption layer is disposed inside the transmission layer, the reflection layer is disposed inside the absorption layer, and the sandwich layer is disposed inside the reflection layer.

[0011] Preferably, the transmissive layer is a reinforced resin, and the absorbent layer is a resin-based carbon powder.

[0012] Preferably, the reflective layer is a carbon fiber composite layer, and the sandwich layer has a honeycomb design.

[0013] Preferably, the protrusion is disposed inside the snap-fit ​​groove, and the adjacent motherboards form a snap-fit ​​structure through the protrusion and the snap-fit ​​groove.

[0014] Preferably, the mounting plates are symmetrically distributed on both sides of the main board, and the mounting bolts and threaded holes form a threaded connection.

[0015] Preferably, the mounting plate is disposed inside the reserved slot, and the adjacent motherboards form an engaging structure through the mounting plate and the reserved slot.

[0016] The honeycomb absorbing material structure provided by this utility model has the following advantages:

[0017] By setting up an installation structure, the mounting plates on one side of adjacent motherboards are placed inside the reserved slots on the other side of the motherboard mounting plate. This allows the two motherboards to easily contact each other, reducing the gap between them. It also makes it easy to rotate the mounting bolts inside the threaded holes onto the wall or other objects to be installed, thus enabling the material to be installed and used. This achieves the purpose of facilitating the combined installation and use of multiple sets of materials.

[0018] By incorporating a wave-absorbing structure, the transmission layer, made of reinforced resin, can absorb as much external electromagnetic wave as possible into its interior, where it is then absorbed by the absorption layer. The absorption layer, made of resin-based carbon powder, facilitates the conversion of most electromagnetic waves into heat energy. The honeycomb-shaped reflective layer reflects and absorbs electromagnetic waves, thereby increasing the absorption bandwidth. Furthermore, the reflective layer, being a carbon fiber composite layer, can prevent unabsorbed electromagnetic waves from returning to the outside environment, thus achieving a comprehensive absorption and conversion of electromagnetic waves. Attached Figure Description

[0019] Figure 1 This is a front-view three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 This is a frontal three-dimensional structural diagram of the present invention;

[0021] Figure 3 This is a top-view cross-sectional three-dimensional structural schematic diagram of the present invention;

[0022] Figure 4 This is a three-dimensional structural diagram of the present invention viewed from below;

[0023] Figure 5 This is a schematic diagram of the combined three-dimensional structure of this utility model.

[0024] The following are the annotations in the figure: 1. Main board; 2. Protective coating; 3. Wave-absorbing structure; 301. Transmitting layer; 302. Absorbing layer; 303. Reflecting layer; 304. Sandwich layer; 4. Protrusion; 5. Snap-fit ​​groove; 6. Mounting structure; 601. Mounting plate; 602. Threaded hole; 603. Mounting bolt; 604. Reserved groove. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figures 1-5 The present invention provides a honeycomb absorbing material structure, including a main board 1 and a protective coating 2.

[0027] Reference Figure 3 As shown, a protective coating 2 is provided on the outer side of the motherboard 1, and a wave-absorbing structure 3 is provided inside the motherboard 1. The wave-absorbing structure 3 includes a transmission layer 301, an absorption layer 302, a reflection layer 303, and a sandwich layer 304. The transmission layer 301 is located inside the motherboard 1. The absorption layer 302 is located inside the transmission layer 301. The reflection layer 303 is located inside the absorption layer 302. The sandwich layer 304 is located inside the reflection layer 303. The transmission layer 301 is reinforced resin, the absorption layer 302 is resin-based carbon powder, the reflection layer 303 is a carbon fiber composite layer, and the sandwich layer 304 has a honeycomb design.

[0028] To improve the effectiveness of the absorbing material in absorbing electromagnetic waves and reduce potential hazards, the device is constructed by setting a transmission layer 301, an absorption layer 302, a reflection layer 303, and a sandwich layer 304 inside the main board 1. The transmission layer 301 enhances the ability of electromagnetic waves to enter the material, and the absorption layer 302, which is actually a resin-based carbon powder, absorbs the electromagnetic waves and converts them into heat energy. During the absorption process, some residues may remain, and the reflection layer 303 prevents them from returning to the outside space. The sandwich layer 304 at the center has a honeycomb design, which disperses the absorbing coating, provides a transmission channel for electromagnetic waves, adjusts impedance matching, and carries the load, thereby greatly increasing the practicality of the device.

[0029] Reference Figure 1 , Figure 4 and Figure 5 As shown, a protrusion 4 is fixed on one side of the motherboard 1, and a snap-fit ​​groove 5 is provided on the side of the motherboard 1 away from the protrusion 4. The protrusion 4 is located inside the snap-fit ​​groove 5. Adjacent motherboards 1 form a snap-fit ​​structure through the protrusion 4 and the snap-fit ​​groove 5. Mounting structures 6 are fixed on both sides of the bottom of the motherboard 1. The mounting structure 6 includes a mounting plate 601, a threaded hole 602, a mounting bolt 603, and a reserved groove 604. The mounting plates 601 are fixed on both sides of the bottom of the motherboard 1. Threaded holes 602 are provided inside the mounting plates 601. Mounting bolts 603 are provided inside the threaded holes 602. A reserved groove 604 is provided at the bottom end of the motherboard 1 on one side of the mounting plate 601. The mounting plates 601 are symmetrically distributed on both sides of the motherboard 1. The mounting bolts 603 and the threaded holes 602 form a threaded connection. The mounting plates 601 are located inside the reserved groove 604. Adjacent motherboards 1 form a snap-fit ​​structure through the mounting plates 601 and the reserved groove 604.

[0030] When installing this material onto objects such as walls, adjacent main boards 1 are assembled by placing the protrusion 4 on one side into the snap-fit ​​groove 5 for easy combination. To prevent gaps during installation, an installation structure 6 is provided, in which the main board 1 has threaded holes 602 inside the mounting plates 601 fixed at both ends, and mounting bolts 603 are threaded inside to rotate it onto the object to be installed. When adjacent main boards 1 are assembled, the mounting plate 601 on one side is placed into the reserved groove 604 of the adjacent main board 1, so that the two sets of main boards 1 can easily abut against each other, making it difficult to produce large gaps that affect the wave absorption effect, thus greatly increasing the practicality of the device.

[0031] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A honeycomb absorbing material structure, comprising a main board (1) and a protective coating (2); Its features are: The motherboard (1) is provided with a protective coating (2) on its outer side and a wave-absorbing structure (3) is provided inside the motherboard (1); A protrusion (4) is fixed on one side of the motherboard (1), and a snap-fit ​​groove (5) is opened on the side of the motherboard (1) away from the protrusion (4). Mounting structures (6) are fixed on both sides of the bottom of the motherboard (1). The mounting structure (6) includes a mounting plate (601), threaded holes (602), mounting bolts (603), and a reserved groove (604). The mounting plates (601) are fixed to both sides of the bottom of the main board (1). The mounting plates (601) are provided with threaded holes (602) inside. The threaded holes (602) are provided with mounting bolts (603) inside. The bottom end of the main board (1) on one side of the mounting plate (601) is provided with a reserved groove (604).

2. The honeycomb absorbing material structure according to claim 1, characterized in that: The absorbing structure (3) includes a transmission layer (301), an absorption layer (302), a reflection layer (303), and a sandwich layer (304). The transmission layer (301) is disposed inside the motherboard (1). The absorption layer (302) is disposed inside the transmission layer (301), the reflection layer (303) is disposed inside the absorption layer (302), and the sandwich layer (304) is disposed inside the reflection layer (303).

3. The honeycomb absorbing material structure according to claim 2, characterized in that: The transmissive layer (301) is a reinforcing resin, and the absorbent layer (302) is a resin-based toner.

4. The honeycomb absorbing material structure according to claim 2, characterized in that: The reflective layer (303) is a carbon fiber composite layer, and the sandwich layer (304) has a honeycomb design.

5. The honeycomb absorbing material structure according to claim 1, characterized in that: The protrusion (4) is disposed inside the snap-fit ​​groove (5), and the adjacent motherboard (1) forms a snap-fit ​​structure through the protrusion (4) and the snap-fit ​​groove (5).

6. The honeycomb absorbing material structure according to claim 1, characterized in that: The mounting plate (601) is symmetrically distributed on both sides of the main board (1), and the mounting bolt (603) and the threaded hole (602) form a threaded connection.

7. The honeycomb absorbing material structure according to claim 1, characterized in that: The mounting plate (601) is disposed inside the reserved slot (604), and the adjacent main board (1) forms a locking structure through the mounting plate (601) and the reserved slot (604).

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