A high power array laser

Abstract

The utility model belongs to the technical field of semiconductor laser, and disclose a kind of high-power array laser, including step heat sink and laser module;One side of step heat sink is equipped with multiple ladder type step surface, and multiple laser modules are respectively arranged on each step surface of step heat sink;Another side of step heat sink is equipped with multiple heat exchange channels;Each heat exchange channel is respectively arranged in each step surface of step heat sink in close range;Through the above-mentioned mode, the high-power laser array heat sink formed, simple structure, good heat dissipation effect.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor laser technology, and in particular relates to a high-power array laser. Background Technology

[0002] High-power lasers are developing towards higher power, higher quality, and lower cost, and their applications have expanded from traditional processing to strategic fields such as energy, defense, and scientific research. In the next decade, with breakthroughs in heat dissipation technology, the application of new materials, and the maturity of intelligent control, kilowatt-level lasers may become standard in industry, while kilowatt- and megawatt-level laser systems will drive the practical application of directed energy weapons and fusion energy. However, this process not only relies on innovation in optical technology but also requires solving the heat dissipation problem of high-power lasers. The main function of heat sinks is to rapidly dissipate and diffuse the heat generated by these laser units. By designing and optimizing the heat dissipation method of heat sinks, the heat dissipation energy of the heat sink can be greatly improved, and through an external cooling system for cyclic cooling, heat can be continuously removed, ensuring the stable operation of the laser. Existing stepped heat sink designs suffer from low heat dissipation efficiency and complex structures, resulting in large thermal effects and poor stability in high-power array lasers. Utility Model Content

[0003] The purpose of this invention is to provide a high-power array laser to solve the problems existing in the prior art.

[0004] To achieve the above objectives, this utility model provides a high-power array laser, including a stepped heat sink. The upper surface of the stepped heat sink is provided with multiple stepped surfaces, and a laser module is installed on each step of the stepped surface. The interior of the stepped heat sink is provided with multiple horizontally arranged heat exchange channels, and each heat exchange channel is arranged in a one-to-one correspondence with each step.

[0005] Optionally, the stepped heat sink is provided with an inlet channel and an outlet channel inside. The end face of the stepped heat sink is provided with an inlet port and an outlet port on both sides near the bottom. The inlet channel is connected to the inlet port, and the outlet channel is connected to the outlet port. One end of each heat exchange channel is connected to the inlet channel through an inlet channel, and the other end is connected to the outlet channel through an outlet channel.

[0006] Optionally, the inner diameter of the liquid inlet channel is larger than the inner diameter of the inlet channel and the inner diameter of each heat exchange channel.

[0007] Optionally, the inner diameter of the liquid outlet channel is larger than the inner diameter of the outlet channel and the inner diameter of each heat exchange channel.

[0008] Optionally, the heat exchange channels include a first heat exchange channel, a second heat exchange channel, a third heat exchange channel, a fourth heat exchange channel, and a fifth heat exchange channel arranged sequentially from bottom to top.

[0009] Optionally, the inner diameter of the third heat exchange channel is larger than the inner diameters of the second and fourth heat exchange channels, and the inner diameter of the fourth heat exchange channel is larger than the inner diameters of the first and fifth heat exchange channels.

[0010] Optionally, each of the heat exchange channels has a spiral groove on its inner wall.

[0011] The technical effects of this utility model are as follows:

[0012] This invention uses heat dissipation components installed within each stepped surface to provide close-range heat dissipation for the laser modules located on each stepped surface. This effectively avoids the continuous rise in product water temperature caused by the straight-through structure, thereby improving the heat dissipation performance of the laser and solving the problems of complex cooling structure, low heat dissipation efficiency, and high cost of traditional stepped array lasers. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0015] Figure 1 This is a front view schematic diagram of the laser structure in an embodiment of the present invention;

[0016] Figure 2 This is a side view of the laser structure in an embodiment of the present invention;

[0017] Figure 3 This is a schematic diagram of the internal channel structure of the laser in an embodiment of the present invention;

[0018] Figure 4 This is a schematic diagram of the internal structure of the heat exchange channel in an embodiment of this utility model.

[0019] Labeling Explanation: 100 - Stepped heat sink; 11, 12, 13, 14, 15 - Stepped surface; 200 - Laser module; 21, 22, 23, 24, 25 - Heat exchange channels; 31 - Liquid inlet; 32 - Liquid outlet; 33 - Liquid inlet channel; 34 - Liquid outlet channel; 41, 42, 43, 44 - Inlet channel; 45, 46, 47, 48 - Outlet channel; 50 - Spiral groove. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0021] To facilitate understanding of this utility model, a more comprehensive description of the utility model will be given below with reference to the accompanying drawings, and several embodiments of the utility model will be provided. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and complete.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] The terms “include,” “including,” “have,” “contain,” etc., used in this article are all open-ended terms, meaning that they include but are not limited to.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0026] like Figures 1-4 As shown, this embodiment provides a high-power array laser, including a stepped heat sink. The upper surface of the stepped heat sink is provided with multiple stepped surfaces, and a laser module is installed on each step of the stepped surface. The interior of the stepped heat sink is provided with multiple horizontally arranged heat exchange channels, and each heat exchange channel is arranged in a one-to-one correspondence with each step.

[0027] In conventional stepped heat sinks, the heat dissipation channels are usually set horizontally on the bottom surface of the heat sink. The distance between the other water channels and the various stepped surfaces of the stepped heat sink is inconsistent. In addition, the water channels adopt a straight-through series mode. After the water flows through the front modules, the water temperature gradually increases, resulting in the water temperature being higher on the steps further back, which is not conducive to product expansion. All of the above situations will lead to an imbalance in the heat dissipation capacity of the various stepped surfaces of the product, which in turn leads to unstable product performance.

[0028] like Figure 1 This embodiment provides a high-power array laser, which includes a stepped heat sink 100 and laser modules 200. One side of the stepped heat sink 100 has multiple stepped surfaces 11, 12, 13, 14, and 15, and multiple laser modules 200 are respectively disposed on each stepped surface of the stepped heat sink 100. The other side of the stepped heat sink 100 has multiple heat exchange channels 21, 22, 23, 24, and 25. Each heat exchange channel 21, 22, 23, 24, and 25 is horizontally disposed within each stepped surface 11, 12, 13, 14, and 15 near the stepped heat sink 100. The high-power laser array heat sink formed by this method has a simple structure and good heat dissipation effect.

[0029] The stepped heat sink 100 further includes an inlet 31, an outlet 32, an inlet channel 33, an outlet channel 34, inlet channels 41, 42, 43, 44, and outlet channels 45, 46, 47, and 48; the inlet 31 and outlet 32 ​​are respectively located on both sides of the heat sink end face near the bottom; one end of the inlet channel 33 is connected to the inlet 31, one end of the outlet channel 34 is connected to the outlet 32, and the other end of the inlet channel 33 extends into the heat sink until it reaches the lowest heat exchange channel 2 of the stepped heat sink 100. 5. Both ends are connected; the inlet channels 41, 42, 43, and 44 are respectively set inside the stepped heat sink 100 near the liquid inlet channel 33. One end of the inlet channels 41, 42, 43, and 44 is connected to one side of the corresponding heat exchange channels 21, 22, 23, and 24. The other end of the inlet channels 41, 42, 43, and 44 is connected to the liquid inlet channel 33. One end of the outlet channels 45, 46, 47, and 48 is connected to the corresponding heat exchange channels 21, 22, 23, and 24, and the other end is connected to the liquid outlet channel 34.

[0030] It is feasible that the inner diameter of the liquid inlet channel 33 is larger than that of the inlet channels 41, 42, 43, 44 and the heat exchange channels 21, 22, 23, 24.

[0031] It is feasible that the inner diameter of the liquid outlet channel 34 is larger than that of the outlet channels 45, 46, 47, 48 and the heat exchange channels 21, 22, 23, 24.

[0032] Implementable channels include inlet channels 41, 42, 43, and 44, outlet channels 45, 46, 47, and 48, and corresponding heat exchange channels 21, 22, 23, and 24. The diameter of each channel can be set according to the position of the heat sink step surface, so that the water flow through it is consistent with the heat dissipation requirements of each step surface of the stepped heat sink 100. For example, heat dissipation channels 25 and 21, located on the highest and lowest steps of the stepped heat sink 100, have less thermal crosstalk effect from other laser modules due to their location on both sides of the heat sink, and therefore require less heat dissipation. Thus, the diameter of heat dissipation channels 25 and 21 can be set smaller than other channels. Heat exchange channel 23, located in the middle of the step, is located in the very center of the stepped heat sink 100 and experiences the greatest thermal crosstalk effect from other modules. Therefore, the diameter of heat exchange channel 23 located here is larger than other heat dissipation channels. Specifically, the order of the diameters of the heat dissipation channels is 23 > 22, 24 > 25, 21. The stepped heat sink 100 and laser designed accordingly can improve the consistency of product performance.

[0033] Feasible, the heat sink material can be made of copper with excellent thermal conductivity. Its internal heat dissipation channels can be processed by multiple drilling processes. Among them, the liquid inlet channel 33 and the liquid outlet channel 34 are processed by drilling holes on the end face of the stepped heat sink 100. The inlet channels 41, 42, 43, and 44 need to be drilled at the position of the liquid inlet channel 33 on the bottom surface of the heat sink in the direction of the stepped surface, and the openings are sealed by welding. The outlet channels 45, 46, 47, and 48 need to be drilled at the position of the liquid outlet channel 34 on the bottom surface of the heat sink in the direction of the stepped surface, and the openings are sealed by welding. The heat exchange channels 21, 22, 23, 24, and 25 are respectively drilled on the side of the heat sink near the stepped surface and connected to the inlet channels 41, 42, 43, and 44 and the outlet channels 45, 46, 47, and 48. After drilling, the opening direction of the heat exchange channels is stitched together to realize the processing of the entire heat dissipation channel. The liquid inlet 31 and the liquid outlet 32 ​​are connected to the external cooling system by quick-connect fittings installed with threads machined on the outside of the liquid inlet channel 33 and the liquid outlet channel 34.

[0034] It is feasible to machine spiral grooves 50 into the inner walls of the pipes in the inlet channel 33, outlet channel 34, inlet channels 41, 42, 43, 44, outlet channels 45, 46, 47, 48, and heat exchange channels 21, 22, 23, 24, 25. The spiral grooves will cause the coolant entering the heat exchange channel of the heat sink to change from a direct flow from the surface to a spiral fluid, breaking the boundary layer of the liquid and enhancing fluid mixing. This will significantly improve the heat transfer coefficient of the heat sink and thus improve the heat dissipation efficiency.

[0035] The heat dissipation medium is emitted by the cooling system and flows into the inlet channel 33 through the inlet port 31. After passing through the inlet channel 33, the heat dissipation medium is divided and flows to the inlet channels 41, 42, 43, and 44 respectively. After passing through the inlet channels, it enters the heat exchange channels 21, 22, 23, 24, and 25 corresponding to each step, and then flows to the outlet channel 34 through the outlet channels 45, 46, 47, and 48 of each step. After passing through the outlet channel 34, it flows to the outlet port 32 and flows out back to the cooling system, thus completing the entire refrigeration cycle.

[0036] In summary, the high-power laser array heat sink provided in this embodiment dissipates heat from the laser modules disposed on each step surface at close range through heat dissipation components disposed on each step surface. The inlet channel and outlet channel divert the liquid inlet channel 33 and the liquid outlet channel 34, thereby effectively avoiding the continuous rise in product water temperature caused by the straight-through structure, thus greatly improving the heat dissipation performance of the high-power laser.

[0037] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A high-power array laser, characterized in that, The device includes a stepped heat sink (100), the upper surface of which is provided with multiple stepped surfaces, and each step of the stepped surface is equipped with a laser module (200); the interior of the stepped heat sink (100) is provided with multiple horizontally arranged heat exchange channels, each heat exchange channel corresponding to each step.

2. The laser according to claim 1, characterized in that, The stepped heat sink (100) is provided with an inlet channel (33) and an outlet channel (34) inside. The end face of the stepped heat sink (100) near the bottom is provided with an inlet port (31) and an outlet port (32). The inlet channel (33) is connected to the inlet port (31), and the outlet channel (34) is connected to the inlet port (32). One end of each heat exchange channel is connected to the inlet channel (33) through an inlet channel, and the other end is connected to the outlet channel (34) through an outlet channel.

3. The laser according to claim 2, characterized in that, The inner diameter of the liquid inlet channel (33) is larger than the inner diameter of the inlet channel and the inner diameter of each heat exchange channel.

4. The laser according to claim 2, characterized in that, The inner diameter of the liquid outlet channel (34) is larger than the inner diameter of the outlet channel and the inner diameter of each heat exchange channel.

5. The laser according to claim 1, characterized in that, The heat exchange channels include a first heat exchange channel, a second heat exchange channel, a third heat exchange channel, a fourth heat exchange channel, and a fifth heat exchange channel arranged sequentially from bottom to top.

6. The laser according to claim 5, characterized in that, The inner diameter of the third heat exchange channel is larger than the inner diameters of the second and fourth heat exchange channels, and the inner diameter of the fourth heat exchange channel is larger than the inner diameters of the first and fifth heat exchange channels.

7. The laser according to claim 1, characterized in that, Spiral grooves are provided on the inner wall of each heat exchange channel.

Images