A laminated busbar frequency converter main circuit design

Abstract

The utility model provides a kind of laminated busbar frequency converter main circuit design, it is related to frequency converter technical field, including positive busbar and negative busbar, first interlayer insulation isolation plate is arranged between the positive busbar and negative busbar, the bottom of the negative busbar is provided with protruding connection copper bar, the bottom of the protruding connection copper bar is provided with second interlayer insulation isolation plate.The utility model is arranged by first interlayer insulation isolation plate between positive busbar and first interlayer insulation isolation plate, forms close coupling, significantly reduces loop inductance and resistance, reduces voltage peak and switching loss, improves system efficiency, positive busbar, negative busbar and intermediate connection copper bar are vertically stacked between, installation space is saved, suitable for compact equipment, reduce the risk of connection loose by integrated structure, strong anti-vibration, while prefabricated modular design reduces field wiring, reduces assembly complexity, improves production consistency, suitable for automated production.

Description

Technical Field

[0001] This utility model relates to the field of frequency converter technology, and in particular to a main circuit design for a stacked busbar frequency converter. Background Technology

[0002] Laminated busbar inverters (MWIs) are widely used in industrial automation, such as various motor drive systems including CNC machine tools, textile machinery, and elevators. They are also used in new energy fields, such as in converters for wind power and solar photovoltaic power generation. Furthermore, in transportation, such as in the motor drive systems of electric vehicles, the MWI main circuit plays a crucial role in improving the performance of the power system. In inverter equipment, the main circuit is used to convert and transmit electrical energy, and its busbar structure significantly affects the inverter's power density, electromagnetic compatibility, and heat dissipation performance.

[0003] Existing multilayer busbar structures typically employ discrete conductors or simple busbar splicing, resulting in significant spatial distances between conductors or busbars and a loose layout. This leads to high parasitic inductance and resistance in the circuits, affecting the system's power conversion efficiency. Utility Model Content

[0004] The purpose of this utility model is to solve the problem that the existing technology of stacked busbar structure usually adopts discrete wires or simple busbar splicing form, which results in a large spatial distance between wires or busbars, a loose layout, and thus high parasitic inductance and resistance of the circuit, affecting the system's power conversion efficiency. Therefore, a stacked busbar frequency converter main circuit design is proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a multilayer busbar inverter main circuit design, including a positive busbar and a negative busbar, wherein a first interlayer insulating isolation plate is provided between the positive busbar and the negative busbar, a protruding connecting copper busbar is provided at the bottom of the negative busbar, and a second interlayer insulating isolation plate is provided at the bottom of the protruding connecting copper busbar.

[0006] Preferably, the bottom of the second interlayer insulating barrier is provided with an intermediate connecting copper busbar, and a lower plastic sealing plate is installed at the bottom of the intermediate connecting copper busbar.

[0007] Preferably, the top of the positive busbar is provided with an upper plastic sealing plate.

[0008] Preferably, the protruding connecting copper busbar is provided with a protruding structure.

[0009] Preferably, the thickness of the first interlayer insulating isolation plate and the second interlayer insulating isolation plate is 0.1mm-2mm.

[0010] Preferably, both the positive and negative busbars have multiple through slots.

[0011] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0012] In this invention, the positive busbar and the first interlayer insulating isolation plate are stacked together to form a tight coupling, which significantly reduces the circuit inductance and resistance, reduces voltage spikes and switching losses, and improves system efficiency. The positive busbar, negative busbar and intermediate connecting copper busbar are stacked vertically, saving installation space and making it suitable for compact equipment. The integrated structure reduces the risk of loose connections and has strong vibration resistance. At the same time, the prefabricated modular design reduces on-site wiring, reduces assembly complexity, improves production consistency, and is suitable for automated production. Attached Figure Description

[0013] Figure 1 This utility model presents an overall structural schematic diagram of the main circuit design of a stacked busbar frequency converter.

[0014] Legend: 1. Upper plastic sealing plate; 2. Positive busbar; 3. First interlayer insulating shield; 4. Negative busbar; 5. Protruding connecting copper busbar; 6. Second interlayer insulating shield; 7. Middle connecting copper busbar; 8. Lower plastic sealing plate. Detailed Implementation

[0015] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0016] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0017] Example 1: As Figure 1As shown, this utility model provides a technical solution: a multilayer busbar inverter main circuit design, including a positive busbar 2 and a negative busbar 4, with a first interlayer insulating isolation plate 3 between the positive busbar 2 and the negative busbar 4, a protruding connecting copper busbar 5 at the bottom of the negative busbar 4, a second interlayer insulating isolation plate 6 at the bottom of the protruding connecting copper busbar 5, an intermediate connecting copper busbar 7 at the bottom of the second interlayer insulating isolation plate 6, a lower plastic sealing plate 8 installed at the bottom of the intermediate connecting copper busbar 7, an upper plastic sealing plate 1 at the top of the positive busbar 2, and a protruding structure on the protruding connecting copper busbar 5. The thickness of the first interlayer insulating isolation plate 3 and the second interlayer insulating isolation plate 6 is 0.1mm-2mm, and multiple through slots are opened on both the positive busbar 2 and the negative busbar 4.

[0018] In this embodiment, the positive busbar 2 and the first interlayer insulating isolation plate 3 are arranged in a stacked manner through the first interlayer insulating isolation plate 3 to form a tight coupling, which significantly reduces the circuit inductance and resistance, reduces voltage spikes and switching losses, and improves system efficiency. The positive busbar 2, negative busbar 4 and intermediate connecting copper busbar 7 are stacked vertically, saving installation space and making them suitable for compact equipment. The first interlayer insulating isolation plate 3 and negative busbar 4 are made of epoxy resin or polyimide, which helps to provide electrical isolation and avoid short circuits. The upper plastic sealing plate 1 and the lower plastic sealing plate 8 help to provide internal protection, prevent the internal structure from being directly subjected to external physical impacts, and extend the service life of the equipment. The integrated structure reduces the risk of loose connections and has strong vibration resistance. At the same time, the prefabricated modular design reduces on-site wiring, reduces assembly complexity, improves production consistency, and is suitable for automated production.

[0019] The working principle of this embodiment is as follows: In use, the positive busbar 2 and the first interlayer insulating isolation plate 3 are arranged in a stacked manner through the first interlayer insulating isolation plate 3 to form a tight coupling, which significantly reduces the circuit inductance and resistance, reduces voltage spikes and switching losses, and improves system efficiency. The positive busbar 2, negative busbar 4 and intermediate connecting copper busbar 7 are stacked vertically, saving installation space and making them suitable for compact equipment. The first interlayer insulating isolation plate 3 and negative busbar 4 are made of epoxy resin or polyimide, which helps to provide electrical isolation and avoid short circuits. The upper plastic sealing plate 1 and the lower plastic sealing plate 8 help to provide internal protection, prevent the internal structure from being directly subjected to external physical impacts, and extend the service life of the equipment. The integrated structure reduces the risk of loose connections and has strong vibration resistance. At the same time, the prefabricated modular design reduces on-site wiring, reduces assembly complexity, improves production consistency, and is suitable for automated production.

[0020] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A main circuit design for a laminated busbar frequency converter, characterized in that: It includes a positive busbar (2) and a negative busbar (4), with a first interlayer insulating isolation plate (3) provided between the positive busbar (2) and the negative busbar (4), a protruding connecting copper busbar (5) provided at the bottom of the negative busbar (4), and a second interlayer insulating isolation plate (6) provided at the bottom of the protruding connecting copper busbar (5).

2. The main circuit design of the laminated busbar frequency converter according to claim 1, characterized in that: The bottom of the second interlayer insulating isolation plate (6) is provided with an intermediate connecting copper busbar (7), and the bottom of the intermediate connecting copper busbar (7) is installed with a lower plastic sealing plate (8).

3. The main circuit design of the laminated busbar frequency converter according to claim 1, characterized in that: The top of the positive busbar (2) is provided with an upper plastic sealing plate (1).

4. The main circuit design of the laminated busbar frequency converter according to claim 1, characterized in that: The protruding connecting copper busbar (5) is provided with a protruding structure.

5. The main circuit design of the laminated busbar frequency converter according to claim 1, characterized in that: The thickness of the first interlayer insulating isolation plate (3) and the second interlayer insulating isolation plate (6) is 0.1mm-2mm.

6. The main circuit design of the laminated busbar frequency converter according to claim 1, characterized in that: Multiple through slots are provided on both the positive busbar (2) and the negative busbar (4).

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