A voltage controlled oscillator base

Abstract

The utility model discloses a kind of voltage-controlled oscillator pedestals, it relates to electronic component technical field.It includes pedestal body, heat-conducting base, shielding cover, mounting seat;Heat-conducting base is vertically arranged multiple heat dissipation channels that pass through heat-conducting base;Mounting seat is installed in heat-conducting base top, and mounting seat is located above heat dissipation channel;Pedestal body inboard, heat-conducting base top, shielding cover bottom enclose and form cavity.The utility model realizes excellent heat dissipation performance by setting heat-conducting base, the heat dissipation channel that is arranged in heat-conducting base interior significantly enhances the longitudinal heat conduction capacity of pedestal body, and the transfer of heat from core heating device to pedestal body bottom or external radiator is accelerated.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, and more specifically, it is a voltage-controlled oscillator base. Background Technology

[0002] A voltage-controlled oscillator (VCO) is a core component of a wireless communication system, and its output frequency is modulated by a control voltage.

[0003] Existing voltage-controlled oscillators typically use metal or ceramic bases. While metal bases offer better heat dissipation, their electromagnetic shielding is limited, making them susceptible to external interference and leading to a deterioration in the phase noise performance of the VCO output signal. Ceramic bases, while providing good insulation, have relatively poor thermal conductivity. In high-power VCO applications, heat accumulation can cause the temperature of the resonant cavity or varactor diode to rise, resulting in oscillation frequency drift and affecting the stability of the VCO.

[0004] Therefore, it is necessary to develop a voltage-controlled oscillator base that simultaneously achieves excellent heat dissipation performance and efficient electromagnetic shielding. Utility Model Content

[0005] The primary objective of this invention is to overcome the shortcomings of the aforementioned background technology and to provide a voltage-controlled oscillator base.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows: a voltage-controlled oscillator base, characterized in that: it includes a base body, a heat-conducting substrate, a shielding cover, and a mounting base; the heat-conducting substrate is located on the inner side of the bottom of the base body, and the heat-conducting substrate is provided with multiple heat dissipation channels running longitudinally through the heat-conducting substrate; the shielding cover is located on the top of the base body;

[0007] The mounting base is installed on top of the thermally conductive substrate and is located above the heat dissipation channel;

[0008] The inner side of the base body, the top of the heat-conducting substrate, and the bottom of the shielding cover together form a cavity.

[0009] The above technical solution also includes an electromagnetic shielding layer, which is located on the inner side of the bottom of the base body and on the top of the heat-conducting substrate, and the mounting base is installed on the top of the electromagnetic shielding layer.

[0010] The above technical solution also includes a flange, which is located on the outer side of the bottom of the base body.

[0011] In the above technical solution, the base body has a slot at the top and the shielding cover has an insert at the bottom, and the slot matches the insert.

[0012] In the above technical solution, the heat dissipation channel is filled with a highly thermally conductive material.

[0013] In the above technical solution, the mounting base has a groove for mounting a dielectric resonator on its inner side, and the mounting base is provided with multiple positioning holes in the longitudinal direction for mounting transistor sockets.

[0014] In the above technical solution, the distance between the groove and the position for connecting the radio frequency output terminal is less than a preset threshold.

[0015] In the above technical solution, the flange has multiple through holes extending longitudinally.

[0016] Compared with the prior art, this utility model has the following advantages:

[0017] 1) This utility model achieves excellent heat dissipation performance by setting a heat-conducting substrate. The heat dissipation channels set inside the heat-conducting substrate significantly enhance the longitudinal heat conduction capability of the base body and accelerate the transfer of heat from the core heat-generating device (such as a transistor) to the bottom of the base body or the external heat sink.

[0018] 2) This utility model achieves a highly efficient electromagnetic shielding effect by setting an electromagnetic shielding layer, effectively suppressing frequency drift caused by temperature rise and phase noise introduced by external interference, and significantly improving the stability of VCO and the quality of output signal.

[0019] 3) This utility model achieves both excellent heat dissipation performance and efficient electromagnetic shielding effect through the composite structure of a thermally conductive substrate and an electromagnetic shielding layer.

[0020] 4) The integrated mounting flange of this utility model simplifies the assembly process, improves production efficiency, and enhances the mechanical stability of the overall structure.

[0021] 5) The optimized layout of the mounting positions in this utility model shortens the critical signal path and reduces distributed parameters, which is beneficial to improving high-frequency performance. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of this utility model.

[0023] Figure 2 This is a cross-sectional view of the present invention.

[0024] Figure 3 This is a cross-sectional view of the cavity structure.

[0025] Figure 4 This is a schematic diagram of the heat dissipation channel.

[0026] Among them, 100-base body, 110-slot, 200-thermal conductive base, 210-heat dissipation channel, 300-shielding cover, 310-insertion strip, 400-mounting base, 410-groove, 420-positioning hole, 500-electromagnetic shielding layer, 600-flange, 610-through hole, and A-cavity. Detailed Implementation

[0027] The following detailed description, in conjunction with the accompanying drawings, illustrates the implementation of this utility model. However, these descriptions do not constitute a limitation of the present utility model and are merely illustrative. Furthermore, the advantages of this utility model will become clearer and easier to understand through this description.

[0028] like Figure 1-4 As shown, a voltage-controlled oscillator base is characterized by comprising a base body 100, a thermally conductive substrate 200, a shielding cover 300, and a mounting base 400; the thermally conductive substrate 200 is located on the inner side of the bottom of the base body 100, and the thermally conductive substrate 200 is provided with a plurality of heat dissipation channels 210 extending through the thermally conductive substrate 200 longitudinally; the shielding cover 300 is located on the top of the base body 100.

[0029] The mounting base 400 is mounted on top of the thermally conductive substrate 200 and is located above the heat dissipation channel 210;

[0030] The base body 100, the top of the heat-conducting substrate 200, and the bottom of the shielding cover 300 together form a cavity A; the cavity A is used to accommodate the voltage-controlled oscillator element.

[0031] It also includes an electromagnetic shielding layer 500, which is located on the inner side of the bottom of the base body 100 and on the top of the thermally conductive substrate 200, and the mounting base 400 is mounted on the top of the electromagnetic shielding layer 500.

[0032] It also includes a flange 600, which is located on the outer side of the bottom of the base body 100.

[0033] The base body 100 has a slot 110 on its top, and the shielding cover 300 has an insert 310 at its bottom. The slot 110 matches the insert 310.

[0034] The heat dissipation channel 210 is filled with a highly thermally conductive material.

[0035] The mounting base 400 has a groove 410 for mounting a dielectric resonator on its inner side, and the mounting base 400 has a plurality of positioning holes 420 for mounting transistor sockets in its longitudinal direction.

[0036] The distance between the groove 410 and the position for connecting the RF output terminal is less than a preset threshold.

[0037] The flange 600 has multiple through holes 610 extending longitudinally, and the flange 600 is used to fix the base body 100 to the external structure.

[0038] In actual use, the heat dissipation channel 210 is directly below the active device mounting area in the mounting position 400.

[0039] The heat dissipation channel 210 is filled with highly thermally conductive materials, including but not limited to thermal grease and metal pillars.

[0040] The electromagnetic shielding layer 500 includes, but is not limited to, a metal plating and a conductive coating, and the materials of the electromagnetic shielding layer 500 include, but are not limited to, nickel, gold, and silver; the material of the thermally conductive substrate 200 includes, but is not limited to, copper and aluminum alloys.

[0041] This invention achieves both excellent heat dissipation and efficient electromagnetic shielding through a composite structure of a thermally conductive substrate 200 and an electromagnetic shielding layer 500. This effectively suppresses frequency drift caused by temperature rise and phase noise introduced by external interference, significantly improving the stability of the VCO and the quality of the output signal. The internally designed heat dissipation channel 210 significantly enhances the longitudinal heat conduction capability of the base body 100, accelerating the transfer of heat from the core heat-generating device (such as a transistor) to the bottom of the base body 100 or an external heat sink. The integrated mounting flange 600 simplifies the assembly process, improves production efficiency, and enhances the mechanical stability of the overall structure. The optimized mounting position shortens the critical signal path and reduces distributed parameters, which is beneficial for improving high-frequency performance.

[0042] All other unspecified parts belong to the prior art.

Claims

1. A voltage-controlled oscillator base, characterized in that: It includes a base body (100), a heat-conducting substrate (200), a shielding cover (300), and a mounting base (400); the heat-conducting substrate (200) is located on the inner side of the bottom of the base body (100), and the heat-conducting substrate (200) is provided with multiple heat dissipation channels (210) running through the heat-conducting substrate (200) in the longitudinal direction; the shielding cover (300) is located on the top of the base body (100); The mounting base (400) is mounted on top of the thermally conductive substrate (200), and the mounting base (400) is located above the heat dissipation channel (210); The cavity (A) is formed by the inner side of the base body (100), the top of the heat-conducting base (200), and the bottom of the shielding cover (300).

2. The voltage-controlled oscillator base according to claim 1, characterized in that: It also includes an electromagnetic shielding layer (500), which is located on the inner side of the bottom of the base body (100) and on the top of the thermally conductive substrate (200), and the mounting base (400) is mounted on the top of the electromagnetic shielding layer (500).

3. The voltage-controlled oscillator base according to claim 1, characterized in that: It also includes a flange (600) located on the outer side of the bottom of the base body (100).

4. A voltage-controlled oscillator base according to claim 1, characterized in that: The base body (100) has a slot (110) on its top, and the shielding cover (300) has an insert (310) at its bottom. The slot (110) matches the insert (310).

5. A voltage-controlled oscillator base according to claim 1, characterized in that: The heat dissipation channel (210) is filled with a highly thermally conductive material.

6. A voltage-controlled oscillator base according to claim 1, characterized in that: The mounting base (400) has a groove (410) for mounting a dielectric resonator on its inner side, and the mounting base (400) has a plurality of positioning holes (420) for mounting transistor sockets in the longitudinal direction.

7. A voltage-controlled oscillator base according to claim 6, characterized in that: The distance between the groove (410) and the position for connecting the RF output terminal is less than a preset threshold.

8. A voltage-controlled oscillator base according to claim 3, characterized in that: The flange (600) has multiple through holes (610) extending longitudinally through it.

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