An interface circuit and vehicle

Abstract

This application provides an interface circuit and a vehicle. The interface circuit includes a driver chip and at least one driver circuit. The driver circuit includes: a transistor, with its first electrode, second electrode, and control electrode all connected to the driver chip; a first configuration module connected between a power supply, the first electrode of the transistor, and an output port; and a second configuration module connected between the output port, the second electrode of the transistor, and a ground terminal. When both the first and second configuration modules are configured in a first state, the power supply is connected to the first electrode of the transistor, and the second electrode of the transistor is connected to the output port, so that the driver circuit constitutes a high-side driver circuit. When both the first and second configuration modules are configured in a second state, the first electrode of the transistor is connected to the output port, and the second electrode of the transistor is connected to the ground terminal, so that the driver circuit constitutes a low-side driver circuit. The interface circuit of this solution can effectively reduce reserved resources, thereby reducing costs.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, and more particularly to an interface circuit and a vehicle. Background Technology

[0002] Currently, vehicle electronic and electrical architectures are gradually shifting towards a central computing plus regional control architecture. Regional controllers typically connect to various loads such as motors, solenoid valves, power outputs, and heating elements via interface circuits. To meet the driving requirements of different types of loads, the interface circuits of related technologies usually reserve at least two different types of drive circuits. However, due to the varying types and quantities of loads in different vehicle models, one drive circuit may be used while another remains unused, resulting in a waste of reserved resources. Utility Model Content

[0003] This application provides an interface circuit and a vehicle to solve the problem in related technologies where the interface circuit pre-sets at least two types of drive circuits, resulting in a waste of reserved resources.

[0004] The first aspect of this application provides an interface circuit, including a driver chip and at least one driver circuit, the driver circuit including:

[0005] A transistor, whose first, second, and control terminals are all connected to a driver chip;

[0006] The first configuration module is connected between the power supply, the first electrode of the transistor, and the output port;

[0007] The second configuration module is connected between the output port, the second electrode of the transistor, and the ground terminal;

[0008] When the first configuration module is configured in the first state, the power supply is connected to the first terminal of the transistor, and when the second configuration module is configured in the first state, the second terminal of the transistor is connected to the output port, so that the driving circuit constitutes a high-side driving circuit.

[0009] When the first configuration module is configured in the second state, the first terminal of the transistor is connected to the output port, and when the second configuration module is configured in the second state, the second terminal of the transistor is connected to the ground terminal, so that the driving circuit constitutes a low-side driving circuit.

[0010] In some implementations, the driving circuit includes at least two, wherein the first configuration module and the second configuration module of one driving circuit are both configured in a first state, and the first configuration module and the second configuration module of the other driving circuit are both configured in a second state, and the output ports of the two driving circuits are connected so that the two driving circuits constitute a half-bridge driving circuit.

[0011] In some implementations, the output port is used to connect to the power supply of the load.

[0012] In some embodiments, the driving circuit includes at least four, with the first and second configuration modules of the first and third driving circuits both configured in a first state, and the first and second configuration modules of the second and fourth driving circuits both configured in a second state. The output ports of the first and second driving circuits are connected to form a first output port connection, and the output ports of the third and fourth driving circuits are connected to form a second output port connection, so that the four driving circuits constitute an H-bridge driving circuit.

[0013] In some implementations, the first output port is used to connect to the power supply terminal of the load, and the second output port is used to connect to the ground terminal of the load.

[0014] In some implementations, the first configuration module includes a first configuration bit and a second configuration bit. A first end of the first configuration bit is connected to a power supply, a second end of the first configuration bit is connected to a first electrode of a transistor and a first end of the second configuration bit, and a second end of the second configuration bit is connected to an output port. The first configuration module is configured to a first state only when a configuration element is assembled in the first configuration bit; the first configuration module is configured to a second state only when a configuration element is assembled in the second configuration bit.

[0015] The second configuration module includes a third configuration bit and a fourth configuration bit. The first end of the third configuration bit is connected to the output port, the second end of the third configuration bit is connected to the second electrode of the transistor and the first end of the fourth configuration bit, respectively, and the second end of the fourth configuration bit is grounded. The second configuration module is configured to the first state only when the third configuration bit is equipped with a configuration element; the second configuration module is configured to the second state only when the fourth configuration bit is equipped with a configuration element.

[0016] In some implementations, the configuration elements include either a bridging resistor or a wire.

[0017] In some implementations, the interface circuit also includes a controller connected to the driver chip to control the driver chip to drive the driver circuit to perform drive output.

[0018] In some implementations, the controller includes a zone controller.

[0019] A second aspect of this application provides a vehicle including a load and an interface circuit according to any of the above embodiments, wherein the output port of the interface circuit is connected to the load.

[0020] The advantages or beneficial effects of the above technical solution include at least the following: Since a first configuration module is provided between the power supply, the first electrode of the transistor, and the output port, and a second configuration module is provided between the output port, the second electrode of the transistor, and the ground terminal, and when both the first and second configuration modules are configured in the first state, the power supply is connected to the first electrode of the transistor, and the second electrode of the transistor is connected to the output port, enabling the driving circuit to form a high-side driving circuit. Conversely, when both the first and second configuration modules are configured in the second state, the first electrode of the transistor is connected to the output port, and the second electrode of the transistor is connected to the ground terminal, enabling the driving circuit to form a low-side driving circuit. Thus, when at least one driving circuit is provided in the interface circuit, at least one driving circuit can be flexibly selected as a high-side driving circuit or a low-side driving circuit, allowing one driving circuit to flexibly adapt to the driving requirements of two different types of loads. This effectively reduces the reserved resources of the interface circuit, thereby reducing the cost of the interface circuit and further improving the integration of the interface circuit. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Furthermore, these drawings and textual descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art by reference to specific embodiments.

[0022] Figure 1 The diagram shown is a schematic diagram of the structure of the driver circuit in an interface circuit of an embodiment of this application when the first configuration module and the second configuration module are not configured.

[0023] Figure 2 As shown Figure 1 The schematic diagram shows the structure of the driver circuit configured as a high-side driver circuit in the interface circuit.

[0024] Figure 3 As shown Figure 1 A schematic diagram of the interface circuit where the driving circuit is configured as a low-side driving circuit.

[0025] Figure 4 As shown Figure 1 A schematic diagram of the interface circuit where the driver circuit is configured as a half-bridge driver circuit.

[0026] Figure 5 As shown Figure 1 A schematic diagram of the interface circuit where the driving circuit is configured as an H-bridge driving circuit. Detailed Implementation

[0027] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0028] Figure 1 The diagram shown is a schematic diagram of the structure of the driver circuit in an interface circuit of an embodiment of this application when the first configuration module and the second configuration module are not configured. Figure 2 As shown Figure 1 The schematic diagram shows the structure of the driver circuit configured as a high-side driver circuit in the interface circuit. Figure 3 As shown Figure 1 A schematic diagram of the interface circuit where the driving circuit is configured as a low-side driving circuit.

[0029] Please refer to the following: Figures 1 to 3 The interface circuit 100 includes a driver chip 10 and at least one driver circuit 20. The driver circuit 20 includes a transistor 21, a first configuration module 22, and a second configuration module 23. The first terminal, the second terminal, and the control terminal of the transistor 21 are all connected to the driver chip 10. The first configuration module 22 is connected between the power supply Vbat, the first terminal of the transistor 21, and the output port Out. The second configuration module 23 is connected between the output port Out, the second terminal of the transistor 21, and the ground terminal GND.

[0030] like Figure 1 and Figure 2 As shown, when the first configuration module 22 is configured in the first state, the power supply Vbat is connected to the first terminal of transistor 21, and when the second configuration module 23 is configured in the first state, the second terminal of transistor 21 is connected to the output port Out, so that the drive circuit 20 constitutes a high-side driver (HSD) circuit. Specifically, the first state of the first configuration module 22 is the state in which the first configuration module 22 connects the power supply Vbat to the first terminal of transistor 21; the first state of the second configuration module 23 is the state in which the second terminal of transistor 21 is connected to the output port Out; the output port Out of the high-side driver circuit is used to connect to the power supply terminal of the load 200, so that the high-side driver circuit is located between the power supply Vbat and the load 200 to perform high-side driving on the load 200.

[0031] like Figure 3As shown, when the first configuration module 22 is configured in the second state, the first terminal of transistor 21 is connected to the output port Out, and when the second configuration module 23 is configured in the second state, the second terminal of transistor 21 is connected to the ground terminal GND, so that the driving circuit 20 constitutes a low-side driver (LSD) circuit. Specifically, the second state of the first configuration module 22 is the state in which the first terminal of transistor 21 is connected to the output port Out; the second state of the second configuration module 23 is the state in which the second terminal of transistor 21 is connected to the ground terminal GND; the output port Out of the low-side driver circuit is used to connect to the ground terminal GND of the load 200, so that the low-side driver circuit is located between the load 200 and the ground terminal GND to perform low-side driving on the load 200. At this time, the power supply terminal of the load 200 is used to connect to the power supply Vbat.

[0032] For example, at least one driving circuit 20 includes one or more driving circuits 20, with the latter including two or more. When there is only one driving circuit 20, it can be configured as a low-side driving circuit or a high-side driving circuit. When there are multiple driving circuits 20, all of them can be configured as low-side driving circuits; or, all of them can be configured as high-side driving circuits; or, a portion of the multiple driving circuits 20 can be configured as low-side driving circuits, and another portion as high-side driving circuits. It should be noted that the number and type of driving circuits 20 can be selected and adjusted according to the number and type of loads 200, as long as the number and type of driving circuits 20 correspond one-to-one with the number and type of loads 200. This application embodiment does not impose any limitations in this regard.

[0033] In this embodiment, transistor 21 can be an NMOS transistor, with its first electrode being the drain, its second electrode being the source, and its control electrode being the gate. It is understood that transistor 21 can also be a PMOS transistor. The type of transistor 21 can be selected and adjusted according to actual needs, and the type of transistor 21 in this application embodiment is not limited.

[0034] In the above scheme, since a first configuration module 22 is provided between the power supply Vbat, the first terminal of transistor 21 and the output port Out, and a second configuration module 23 is provided between the output port Out, the second terminal of transistor 21 and the ground terminal GND, and when both the first configuration module 22 and the second configuration module 23 are configured in the first state, the power supply Vbat is connected to the first terminal of transistor 21 and the second terminal of transistor 21 is connected to the output port Out, the driving circuit 20 can be configured as a high-side driving circuit. And when both the first configuration module 22 and the second configuration module 23 are configured in the second state, the first terminal of transistor 21 is connected to the output port Out and the second terminal of transistor 21 is connected to the ground terminal GND, the driving circuit 20 can be configured as a low-side driving circuit. Thus, when at least one drive circuit 20 is provided in the interface circuit 100, at least one drive circuit 20 can be flexibly selected as a high-side drive circuit or a low-side drive circuit, so that one drive circuit 20 can flexibly adapt to the drive requirements of two different types of loads 200, which can effectively reduce the reserved resources of the interface circuit 100, thereby reducing the cost of the interface circuit 100 and further improving the integration of the interface circuit 100.

[0035] In some implementation methods, please refer to the following: Figure 4 The driving circuit 20 includes at least two, wherein the first configuration module 22 and the second configuration module 23 of one driving circuit 20 are both configured in a first state, and the first configuration module 22 and the second configuration module 23 of the other driving circuit 20 are both configured in a second state, and the output ports Out of the two driving circuits 20 are connected to form a half-bridge driving circuit.

[0036] Specifically, when both the first configuration module 22 and the second configuration module 23 of one of the driving circuits 20 are configured in the first state, the first configuration module 22 connects the first terminal of transistor 21 to the power supply Vbat, and the second configuration module 23 connects the second terminal of transistor 21 to the output port Out of the driving circuit 20, thus enabling the driving circuit 20 to form a high-side driving circuit. When both the first configuration module 22 and the second configuration module 23 of the other driving circuit 20 are configured in the second state, the first configuration module 22 connects the first terminal of transistor 21 to the output port Out of the driving circuit 20, and the second configuration module 23 connects the second terminal of transistor 21 to the ground terminal GND, thus enabling the driving circuit 20 to form a low-side driving circuit. By connecting the output port Out of one driving circuit 20 and the output port Out of the other driving circuit 20, the high-side driving circuit formed by one driving circuit 20 and the low-side driving circuit formed by the other driving circuit 20 can form a half-bridge driver circuit.

[0037] For example, the driving circuit 20 includes at least two driving circuits 20, which can be two or more. When there are two driving circuits 20, they can be configured as a half-bridge driving circuit. When there are more than two driving circuits 20, any two of them can be configured as a half-bridge driving circuit, and the remaining driving circuits 20 can all be configured as high-side driving circuits or low-side driving circuits. Alternatively, some of the remaining driving circuits 20 can be configured as high-side driving circuits and others as low-side driving circuits. It should be noted that the number and type of driving circuits 20 can be selected and adjusted according to the number and type of loads 200, as long as the number and type of driving circuits 20 correspond one-to-one with the number and type of loads 200. This application embodiment does not impose any limitations in this regard.

[0038] The above solution, by configuring both the first configuration module 22 and the second configuration module 23 of one of the at least two driving circuits 20 to a first state, and configuring both the first configuration module 22 and the second configuration module 23 of the other driving circuit 20 to a second state, and connecting the output ports Out of the two driving circuits 20, allows the two driving circuits 20 to be flexibly selected as half-bridge driving circuits, enabling the interface circuit 100 to perform half-bridge driving output. Thus, when the interface circuit 100 has at least two driving circuits 20, the at least two driving circuits 20 can be flexibly selected as at least one of a high-side driving circuit, a low-side driving circuit, or a half-bridge driving circuit, which helps to reduce the reserved resources of the interface circuit 100 and lower its cost.

[0039] In some implementation methods, please refer to the following: Figure 4 The output port Out is used to connect to the power supply terminal of load 200. The ground terminal of load 200 is connected to the ground. The half-bridge drive circuit, driven by the driver chip 10, provides half-bridge drive output to load 200 to flexibly adapt to the drive mode of load 200. Load 200 can be a unidirectional rotary motor. By controlling the alternating operation of the high-side drive circuit and the low-side drive circuit in the half-bridge drive circuit, the speed of the unidirectional rotary motor can be adjusted.

[0040] In some implementation methods, please refer to the following: Figure 5The drive circuit 20 includes at least four components. The first configuration module 22 and the second configuration module 23 of the first drive circuit 20A and the third drive circuit 20C are both configured in a first state. The first configuration module 22 and the second configuration module 23 of the second drive circuit 20B and the fourth drive circuit 20D are both configured in a second state. The output port Out of the first drive circuit 20A and the output port Out of the second drive circuit 20B are connected to form a first output port Out1. The output port Out of the third drive circuit 20C and the output port Out of the fourth drive circuit 20D are connected to form a second output port Out2, so that the four drive circuits 20 constitute an H-bridge driver circuit.

[0041] Specifically, when the first drive circuit 20A is configured in a first state, the second drive circuit 20B is configured in a second state, and the output ports Out of the first drive circuit 20A and the second drive circuit 20B are connected to form a first output port Out1, the first drive circuit 20A and the second drive circuit 20B constitute a first half-bridge drive circuit. When the third drive circuit 20C is configured in a first state, the fourth drive circuit 20D is configured in a second state, and the output ports Out of the third drive circuit 20C and the fourth drive circuit 20D are connected to form a second output port Out2, the third drive circuit 20C and the fourth drive circuit 20D constitute a second half-bridge drive circuit. In this way, the first half-bridge drive circuit and the second half-bridge drive circuit can jointly form an H-bridge drive circuit. When the interface circuit 100 is provided with at least four drive circuits 20, the at least four drive circuits 20 can be flexibly selected as at least one of high-side drive circuit, low-side drive circuit, half-bridge drive circuit or H-bridge drive circuit, which helps to reduce the reserved resources of the interface circuit 100 and thus reduce the cost of the interface circuit 100.

[0042] In some implementation methods, please refer to the following: Figure 5The first output port Out1 is used to connect to the power supply terminal of the load 200, and the second output port Out2 is used to connect to the ground terminal of the load 200. Driven by the driver chip 10, the H-bridge driver circuit provides two complementary PWM (Pulse Width Modulation) signals to the load 200 through the first output port Out1 and the second output port Out2. That is, the waveform of the PWM signal provided by the first output port Out1 is opposite to the waveform of the PWM signal provided by the second output port Out2, thereby driving the load 200. This adapts the H-bridge driver circuit to the driving mode of the load 200, thus matching the type of the load 200. The load 200 can be a bipolar load such as a DC motor.

[0043] In some implementation methods, please refer to the following: Figures 1 to 3 The first configuration module 22 includes a first configuration bit 221 and a second configuration bit 222. The first end of the first configuration bit 221 is connected to the power supply Vbat, and the second end of the first configuration bit 221 is connected to the first electrode of the transistor 21 and the first end of the second configuration bit 222. The second end of the second configuration bit 222 is connected to the output port Out of the drive circuit 20. The first configuration module 22 is configured in a first state only when the first configuration bit 221 is equipped with the configuration element 24; the first configuration module 22 is configured in a second state only when the second configuration bit 222 is equipped with the configuration element 24.

[0044] The second configuration module 23 includes a third configuration bit 231 and a fourth configuration bit 232. The first end of the third configuration bit 231 is connected to the output port Out. The second end of the third configuration bit 231 is connected to the second electrode of the transistor 21 and the first end of the fourth configuration bit 232, respectively. The second end of the fourth configuration bit 232 is grounded. The second configuration module 23 is configured in the first state only when the third configuration bit 231 is equipped with the configuration element 24. The second configuration module 23 is configured in the second state only when the fourth configuration bit 232 is equipped with the configuration element 24.

[0045] The above scheme, by pre-setting a first configuration module 22 and a second configuration module 23 in the interface circuit 100, and connecting the first end of the first configuration bit 221 of the first configuration module 22 to the power supply Vbat, the second end of the first configuration bit 221 to the first pole of the transistor 21 and the first end of the second configuration bit 222 respectively, and the second end of the second configuration bit 222 to the output port Out, and connecting the first end of the third configuration bit 231 of the second configuration module 23 to the output port Out, the second end of the third configuration bit 231 to the second pole of the transistor 21 and the first end of the fourth configuration bit 232 respectively, and grounding the second end of the fourth configuration bit 232, can flexibly configure the state of the first configuration module 22 and the second configuration module 23 according to the driving mode and quantity of the load 200, so that the type and quantity of the driving circuit 20 in the interface circuit 100 are adapted to the type and quantity of the load 200. In this way, when the type of load 200 changes, it is only necessary to select the first configuration module 22 and the second configuration module 23 in the drive circuit 20 to be adapted to the type of load 200, without having to redevelop the interface circuit 100, which helps to shorten the R&D cycle and save R&D costs.

[0046] In some implementation methods, please refer to the following: Figures 1 to 5 Configuration element 24 includes either a bridging resistor or a wire. By mounting a bridging resistor or a wire at each configuration bit, the two ends of the corresponding configuration bit can be electrically connected. It should be noted that... Figures 1 to 5 In the diagram, the dashed boxes in the first configuration module 22 and the second configuration module 23 represent configuration positions, and the solid boxes in the first configuration module 22 and the second configuration module 23 represent configuration elements mounted on the configuration positions. Furthermore, Figures 1 to 5 The dashed line in the image indicates a disconnection, for example, Figure 1 Disconnect the power supply terminal of load 200 from the output port Out and the power supply Vbat, and do not ground the ground terminal of load 200; Figures 1 to 5 Solid lines in the diagram represent connections, for example... Figure 2 The power supply terminal of the load 200 is connected to the output port Out, and the ground terminal of the load 200 is grounded.

[0047] In some implementation methods, please refer to the following: Figures 1 to 5 The interface circuit 100 also includes a controller 30, which is connected to the driver chip 10 to control the driver chip 10 to drive the driver circuit 20 to perform drive output.

[0048] For example, the controller 30 includes an SPI (Serial Peripheral Interface) interface, and the controller 30 is connected to the driver chip 10 through the SPI interface. The controller 30 controls the driver chip 10 to drive the driver circuit 20 to perform drive outputs including at least one of the following:

[0049] The controller 30 sends a configuration command to the driver chip 10 through the SPI interface, so that the driver chip 10 configures the operating parameters of the driver circuit 20 according to the configuration command, and then controls the driver circuit 20 to drive the output according to the configured operating parameters. For example, the operating parameters include the on or off frequency of each transistor 21 in the driver circuit 20.

[0050] The controller 30 sends a shutdown command to the driver chip 10 through the SPI interface, so that the driver chip 10 controls each transistor 21 in the driver circuit 20 to turn off according to the shutdown command, thereby controlling the driver circuit 20 to stop working.

[0051] Preferably, the controller 30 includes a Zone Control Unit (ZCU). By setting the controller 30 as a zone controller, the zone controller can connect to a load 200 in a specific area of ​​the vehicle through the interface circuit 100 to drive the load 200 in that specific area.

[0052] This application also provides a vehicle, which includes a load 200 and an interface circuit 100 according to any of the above embodiments, wherein the output port Out of the interface circuit 100 is connected to the load 200.

[0053] For example, the drive circuit 20 in the interface circuit 100 can be selected as at least one of a high-side drive circuit, a low-side drive circuit, a half-bridge drive circuit, and an H-bridge drive circuit. The type of drive circuit selected for the drive circuit 20 can be flexibly selected and adjusted according to the drive mode of the load 200. For example, when the load 200 is an electronic component such as a lighting lamp that requires high-side drive, the drive circuit 20 in the interface circuit 100 is selected as a high-side drive circuit. When the load 200 is an electronic component such as a heater that requires low-side drive, the drive circuit 20 in the interface circuit 100 is selected as a low-side drive circuit. When the load 200 is a device such as a unidirectional motor that requires half-bridge drive, the drive circuit 20 in the interface circuit 100 is selected as a half-bridge drive circuit. When the load 200 is a device such as a DC motor that requires forward and reverse rotation control, the drive circuit 20 in the interface circuit 100 is selected as an H-bridge drive circuit.

[0054] The specific structure of the interface circuit 100 is as described in the above embodiments. Since the vehicle in this application adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0055] Furthermore, in this application, unless otherwise expressly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0056] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0058] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An interface circuit, characterized in that, It includes a driver chip and at least one driver circuit, the driver circuit comprising: A transistor, wherein the first terminal, the second terminal, and the control terminal of the transistor are all connected to the driving chip; The first configuration module is connected between the power supply, the first electrode of the transistor, and the output port; The second configuration module is connected between the output port, the second electrode of the transistor, and the ground terminal; When the first configuration module is configured in the first state, the power supply is connected to the first terminal of the transistor, and when the second configuration module is configured in the first state, the second terminal of the transistor is connected to the output port, so that the driving circuit constitutes a high-side driving circuit. When the first configuration module is configured in the second state, the first terminal of the transistor is connected to the output port, and when the second configuration module is configured in the second state, the second terminal of the transistor is connected to the ground terminal, so that the driving circuit constitutes a low-side driving circuit.

2. The interface circuit according to claim 1, characterized in that, The driving circuit includes at least two, wherein the first configuration module and the second configuration module of one driving circuit are both configured in a first state, and the first configuration module and the second configuration module of the other driving circuit are both configured in a second state, and the output ports of the two driving circuits are connected to form a half-bridge driving circuit.

3. The interface circuit according to claim 2, characterized in that, The output port is used to connect to the power supply of the load.

4. The interface circuit according to claim 1, characterized in that, The driving circuit includes at least four circuits. The first configuration module and the second configuration module of the first and third driving circuits are both configured in the first state. The first configuration module and the second configuration module of the second and fourth driving circuits are both configured in the second state. The output ports of the first and second driving circuits are connected to form a first output port connection, and the output ports of the third and fourth driving circuits are connected to form a second output port connection, so that the four driving circuits constitute an H-bridge driving circuit.

5. The interface circuit according to claim 4, characterized in that, The first output port is used to connect to the power supply terminal of the load, and the second output port is used to connect to the ground terminal of the load.

6. The interface circuit according to claim 1, characterized in that, The first configuration module includes a first configuration bit and a second configuration bit. The first end of the first configuration bit is connected to the power supply. The second end of the first configuration bit is connected to the first electrode of the transistor and the first end of the second configuration bit, respectively. The second end of the second configuration bit is connected to the output port. The first configuration module is configured in a first state only when the first configuration bit is equipped with a configuration element. The first configuration module is configured in a second state only when the second configuration bit is equipped with the configuration element. The second configuration module includes a third configuration bit and a fourth configuration bit. The first end of the third configuration bit is connected to the output port, and the second end of the third configuration bit is connected to the second electrode of the transistor and the first end of the fourth configuration bit, respectively. The second end of the fourth configuration bit is grounded. The second configuration module is configured in a first state only when the configuration element is assembled in the third configuration bit; the second configuration module is configured in a second state only when the configuration element is assembled in the fourth configuration bit.

7. The interface circuit according to claim 6, characterized in that, The configuration elements include either a bridging resistor or a wire.

8. The interface circuit according to claim 1, characterized in that, It also includes a controller, which is connected to the driver chip to control the driver chip to drive the driver circuit to perform drive output.

9. The interface circuit according to claim 8, characterized in that, The controller includes a region controller.

10. A vehicle, characterized in that, The device includes a load and an interface circuit as described in any one of claims 1 to 9, wherein the output port of the interface circuit is connected to the load.

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