A camera positioning device for dust cleaning of a semiconductor device

Abstract

The utility model belongs to semiconductor device production equipment technical field discloses a kind of camera positioning device for semiconductor device dust cleaning, this kind of camera positioning device for semiconductor device dust cleaning includes drive structure, support plate, positioning structure, camera, dust cleaning structure and magnifying glass, drive structure is used to drive support plate movement, support plate is connected in support plate, for carrying positioning structure, positioning structure is connected in support plate, for fixed camera, camera is inserted in positioning structure, for collecting semiconductor device surface image, identifying dust position, dust cleaning structure is connected in support plate, for cleaning camera, by positioning structure, the tool-free assembly and disassembly of camera can be realized, without the aid of additional tools, when installing, camera is inserted in positioning structure, simplify operation and maintenance process, reduce equipment loss, effectively solve the pain point of traditional rigid connection assembly and disassembly cumbersome.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor device manufacturing equipment, and in particular relates to a camera positioning device for cleaning dust from semiconductor devices. Background Technology

[0002] In the semiconductor device manufacturing process, dust adhering to the device surface can seriously affect its electrical performance and product yield. Therefore, accurate positioning and cleaning of dust is a key step in the semiconductor production process.

[0003] In existing technologies, cameras and mounting structures are mostly rigidly fixed and fastened with screws. When production needs change and cameras with different resolutions and angles need to be replaced, or when cameras malfunction and need to be repaired, the disassembly process requires the use of professional tools to remove the screws one by one. The operation process is cumbersome and consumes a lot of time.

[0004] In other words, because the existing devices are rigidly connected to the installation structure, when faced with changes in production needs or equipment maintenance, the installation and disassembly are cumbersome and time-consuming, which not only reduces the efficiency of operation and maintenance, but also easily damages the equipment and affects the quality of production. Utility Model Content

[0005] The purpose of this invention is to provide a camera positioning device for cleaning dust from semiconductor devices, solving the problem that existing devices, due to the rigid connection between the camera and the mounting structure, are cumbersome and time-consuming to install and disassemble when production needs change or equipment maintenance is required. This reduces maintenance efficiency and can easily damage equipment and affect production quality.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] This utility model provides a camera positioning device for cleaning dust from semiconductor devices, which includes:

[0008] A drive structure for driving the support plate to move;

[0009] A support plate, connected to the support plate, is used to support the positioning structure;

[0010] The positioning structure is connected to the support plate to fix the camera, and the camera is inserted into the positioning structure to collect images of the surface of the semiconductor device and identify the location of dust.

[0011] A dust-cleaning structure and a magnifying glass are provided. The dust-cleaning structure is connected to the support plate and is used to clean the camera. The magnifying glass is connected to the support plate and is used to magnify and observe a local area of ​​the semiconductor device.

[0012] As an optional technical solution for a camera positioning device for cleaning dust from semiconductor devices, the dust cleaning structure includes:

[0013] A driving component and a fixed frame, wherein the driving component is connected to the support plate for swinging the fixed frame to move, and the fixed frame is connected to the driving component for supporting the ash collection box;

[0014] A dust collection box and a cleaning component are provided. The dust collection box is inserted into the fixed frame and is used to collect dust that falls off during cleaning by the cleaning component. The cleaning component is inserted into the dust collection box and is used to clean dust on the camera.

[0015] As an optional technical solution for a camera positioning device for dust cleaning of semiconductor devices, the positioning structure includes:

[0016] A fixing component includes a fixing sleeve, a movable sleeve, and a hinge, wherein the hinge is connected to the fixing sleeve and the movable sleeve is connected to the hinge;

[0017] A sliding column and a fixed base are provided. The fixed base is connected to the fixed sleeve and is used to support the sliding column. The sliding column is inserted into the fixed base and is used to limit the movement of the movable sleeve.

[0018] As an optional technical solution for a camera positioning device for cleaning dust from semiconductor devices, an installation hole is provided at the contact position of the fixed sleeve and the movable sleeve, and the sliding column is inserted into the installation hole.

[0019] As an optional technical solution for a camera positioning device for cleaning dust from semiconductor devices, the slide column is equipped with a handle for the user to drive the slide column to move back and forth.

[0020] As an optional technical solution for a camera positioning device for cleaning dust from semiconductor devices, the cleaning component includes:

[0021] A fixing rod and a cleaning component are provided, wherein the fixing rod is inserted into the dust collection box and the cleaning component is inserted into the fixing rod.

[0022] Beneficial effects:

[0023] This utility model provides a camera positioning device for cleaning dust from semiconductor devices. The device includes a driving structure, a support plate, a positioning structure, a camera, a dust removal structure, and a magnifying glass. The driving structure drives the support plate to move. The support plate is connected to the camera and supports the positioning structure. The positioning structure is connected to the support plate and fixes the camera. The camera is inserted into the positioning structure to collect images of the semiconductor device surface and identify dust locations. The dust removal structure is connected to the support plate to clean the camera. The magnifying glass is connected to the support plate to magnify and observe local areas of the semiconductor device. The positioning structure enables tool-free installation and removal of the camera, eliminating the need for additional tools. During installation, the camera is inserted into the positioning structure, simplifying maintenance processes, reducing equipment wear, and effectively solving the pain point of cumbersome installation and removal associated with traditional rigid connections. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of a camera positioning device for cleaning dust from semiconductor devices provided in this embodiment of the utility model. Figure 1 ;

[0025] Figure 2 This is a schematic diagram of the installation structure of the positioning structure provided in this embodiment of the utility model. Figure 1 ;

[0026] Figure 3 This is a schematic diagram of the installation structure of the positioning structure provided in this embodiment of the utility model. Figure 2 .

[0027] In the picture:

[0028] 1. Drive structure; 2. Support plate; 3. Camera; 4. Magnifying glass; 5. Drive component; 6. Fixing bracket; 7. Dust collection box; 8. Fixing sleeve; 9. Movable sleeve; 10. Hinge; 11. Sliding column; 12. Fixing base; 13. Handle; 14. Fixing rod; 15. Cleaning component. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0030] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0033] like Figures 1 to 3As shown, this embodiment provides a camera positioning device for cleaning dust from semiconductor devices. This device includes a driving structure 1, a support plate 2, a positioning structure, a camera 3, a dust removal structure, and a magnifying glass 4. The driving structure 1 drives the support plate 2 to move. The support plate 2 is connected to the camera and supports the positioning structure. The positioning structure is connected to the support plate 2 and fixes the camera 3. The camera 3 is inserted into the positioning structure to acquire images of the semiconductor device surface and identify dust locations. The dust removal structure is connected to the support plate 2 and cleans the camera 3. The magnifying glass 4 is connected to the support plate 2. Support plate 2 is used for magnified observation of local areas of semiconductor devices. The positioning structure includes a fixed component, a sliding column 11, and a fixed base 12. The fixed component includes a fixed sleeve 8, a movable sleeve 9, and a hinge 10. The hinge 10 is connected to the fixed sleeve 8, the movable sleeve 9 is connected to the hinge 10, and the fixed base 12 is connected to the fixed sleeve 8 to support the sliding column 11. The sliding column 11 is inserted into the fixed base 12 to limit the movable sleeve 9. An installation hole is provided at the contact position of the fixed sleeve 8 and the movable sleeve 9, and the sliding column 11 is inserted into the installation hole. A handle 13 is provided on the sliding column 11 for the user to drive the sliding column 11 to move back and forth.

[0034] The positioning structure enables tool-free installation and removal of camera 3. No additional tools are needed. During installation, camera 3 is inserted into the positioning structure, simplifying the operation and maintenance process, reducing equipment wear and tear, and effectively solving the pain point of cumbersome installation and removal of traditional rigid connections.

[0035] When replacing camera 3, first pinch handle 13 and move it upwards. Handle 13 will move slide column 11. Then rotate handle 13 and place it on the top of the fixing base 12. Then support camera 3 to prevent it from falling off. Then move movable sleeve 9 so that it rotates around hinge 10, separating movable sleeve 9 from fixed sleeve 8. Then remove camera 3 and insert the new camera 3 into fixed sleeve 8. Then move movable sleeve 9 so that it is inserted into fixed sleeve 8. Then rotate handle 13 and release handle 13. Slide column 11 will move downwards under the influence of gravity, inserting into the mounting hole. Slide column 11 will limit the fixed sleeve 8 and movable sleeve 9 to prevent them from separating accidentally, thus completing the installation of camera 3.

[0036] Specifically, the fixed sleeve 8 is fixedly installed on the support plate 2, and a hinge 10 is fixedly installed on one side of the fixed sleeve 8. A movable sleeve 9 is fixedly installed on one side of the hinge 10. The fixed seat 12 is fixedly installed at the mounting hole position at the top of the fixed sleeve. The drive structure 1 is composed of two sets of electric slide rail structures, which enables the drive structure 1 to drive the support plate 2 to move horizontally. This technology is existing technology and will not be elaborated on here.

[0037] See Figure 2 and Figure 3 In this embodiment, the dust removal structure includes a driving component 5, a fixed frame 6, a dust collection box 7, and a cleaning component. The driving component 5 is connected to the support plate 2 and is used to swing the fixed frame 6 to move. The fixed frame 6 is connected to the driving component 5 and is used to support the dust collection box 7. The dust collection box 7 is inserted into the fixed frame 6 and is used to collect dust that falls off during cleaning by the cleaning component. The cleaning component is inserted into the dust collection box 7 and is used to clean the dust on the camera 3. The cleaning component includes a fixed rod 14 and a cleaning component 15. The fixed rod 14 is inserted into the dust collection box 7, and the cleaning component 15 is inserted into the fixed rod 14.

[0038] The cleaning structure effectively maintains the cleanliness of the camera lens surface, preventing dust and dirt from causing image blurring, ensuring the accuracy of dust positioning coordinates, and reducing the frequency of manual wiping.

[0039] When the camera 3 is working, the drive component 5 is activated every once in a while. The drive component 5 moves the fixing frame 6, which in turn moves the dust collection box 7 and the cleaning component. When the cleaning component 15 passes the bottom of the lens of the camera 3, it cleans the lens. At the same time, some of the cleaned dust falls into the dust collection box 7, preventing dust from falling into the magnifying glass 4 below. When there is a lot of dust inside the dust collection box 7, the dust collection box 7 can be removed from the fixing frame 6 and replaced or cleaned.

[0040] Specifically, a fixed frame 6 is fixedly installed on the movable end of the drive component 5, and a dust collection box 7 is embedded inside the fixed frame 6. The fixed rod 14 is snapped onto the dust collection box 7, and the cleaning component 15 is movably sleeved onto the fixed rod 14 to facilitate the replacement of the cleaning component 15 and prevent excessive dust from adsorbing on the cleaning component 15, which would prevent the lens of the camera 3 from being cleaned properly. The cleaning component 15 can be an anti-static dust-free cloth, and the drive component 5 can be a drive component such as an electric telescopic rod that can move the fixed frame 6.

[0041] In this embodiment, there are two sets of driving components 5, which are located on the left and right sides of the bottom of the camera 3, respectively.

[0042] The following is a detailed description of the use of a camera positioning device for cleaning dust from semiconductor devices:

[0043] When replacing camera 3, first pinch handle 13 and move it upwards. Handle 13 will move slide column 11. Then rotate handle 13 to place it on the top of the fixing base 12, and support camera 3 to prevent it from falling off. Then move movable sleeve 9 so that it rotates around hinge 10, separating movable sleeve 9 from fixed sleeve 8. Then remove camera 3 and insert the new camera 3 into fixed sleeve 8. Then move movable sleeve 9 so that it is inserted into fixed sleeve 8. Then rotate handle 13 and release handle 13. Slide column 11, under the influence of gravity, will move handle 13 downwards, allowing the slide column 11 to move downwards. The column 11 is inserted into the mounting hole, so that the sliding column 11 limits the fixed sleeve 8 and the movable sleeve 9, preventing the movable sleeve 9 and the fixed sleeve 8 from separating accidentally, thus making the camera 3 installed. When the camera 3 is working, the drive component 5 is activated every once in a while. The drive component 5 drives the fixed frame 6 to move, and the fixed frame 6 drives the dust collection box 7 and the cleaning component to move. When the cleaning component 15 passes the bottom of the lens of the camera 3, the cleaning component 15 cleans the lens. At the same time, some of the cleaned dust falls into the dust collection box 7, preventing dust from falling into the magnifying glass 4 below. When there is a lot of dust inside the dust collection box 7, the dust collection box 7 can be removed from the fixed frame 6 for replacement or cleaning.

[0044] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A camera positioning device for cleaning dust from semiconductor devices, characterized in that, include: Drive structure (1) is used to drive the support plate (2) to move; Support plate (2), connected to the support plate (2), is used to support the positioning structure; The positioning structure and camera (3) are connected to the support plate (2) for fixing the camera (3). The camera (3) is inserted into the positioning structure for collecting images of the semiconductor device surface and identifying the location of dust. A dust removal structure and a magnifying glass (4) are provided. The dust removal structure is connected to the support plate (2) and is used to clean the camera (3). The magnifying glass (4) is connected to the support plate (2) and is used to magnify and observe a local area of ​​the semiconductor device.

2. The camera positioning device for dust cleaning of semiconductor devices according to claim 1, characterized in that, The dust removal structure includes: A driving component (5) and a fixed frame (6) are provided. The driving component (5) is connected to the support plate (2) and is used to swing the fixed frame (6) to move. The fixed frame (6) is connected to the driving component (5) and is used to support the ash collection box (7). The dust collection box (7) and the cleaning component are inserted into the fixing frame (6) to collect dust that falls off during cleaning by the cleaning component. The cleaning component is inserted into the dust collection box (7) to clean the dust on the camera (3).

3. The camera positioning device for dust cleaning of semiconductor devices according to claim 1, characterized in that, The positioning structure includes: The fixing component includes a fixed sleeve (8), a movable sleeve (9), and a hinge (10), wherein the hinge (10) is connected to the fixed sleeve (8), and the movable sleeve (9) is connected to the hinge (10). The sliding column (11) and the fixed seat (12) are connected to the fixed sleeve (8) to support the sliding column (11). The sliding column (11) is inserted into the fixed seat (12) to limit the movable sleeve (9).

4. The camera positioning device for dust cleaning of semiconductor devices according to claim 3, characterized in that, The fixed sleeve (8) and the movable sleeve (9) have mounting holes at their contact points, and the sliding column (11) is inserted into the mounting holes.

5. The camera positioning device for dust cleaning of semiconductor devices according to claim 3, characterized in that, The slide column (11) is provided with a handle (13) for the user to drive the slide column (11) to move back and forth.

6. The camera positioning device for cleaning dust from semiconductor devices according to claim 2, characterized in that, The cleaning components include: A fixing rod (14) and a cleaning component (15) are provided, wherein the fixing rod (14) is inserted into the dust collection box (7) and the cleaning component (15) is inserted into the fixing rod (14).

Images