Camera module and terminal

Abstract

The application discloses a camera module, which comprises a lens seat, a lens for capturing light signals installed in the lens seat, a circuit board arranged at one end of the lens seat away from the lens, a photosensitive chip arranged between the lens seat and the circuit board for receiving the light signals passing through the lens and imaging, and a wire for electrically connecting the photosensitive chip and the circuit board. The wire comprises at least a conductor core and an extinction layer arranged outside the conductor core. The extinction layer can absorb or block the light signals irradiated from the lens to the wire, thereby eliminating the image flare caused by the reflection of the wire and improving the imaging quality of the camera module. Meanwhile, the structure has the advantages of simple process and low cost, and compared with the traditional gold wire bonding, the wire spacing can be smaller and will not be short-circuited, which is beneficial to miniaturization design. The application further discloses a terminal comprising the camera module.

Description

Technical Field

[0001] This utility model relates to the field of imaging equipment technology, and in particular to a camera module and terminal. Background Technology

[0002] Currently, the most common packaging method for photosensitive chips is COB (Chip-on-Board) packaging. In this packaging method, gold wires are typically used to connect the photosensitive chip to the circuit board to transmit electrical signals. Simultaneously, light is refracted through a lens onto the photosensitive chip to ultimately form an image.

[0003] In related technologies, to prevent light from directly hitting the gold wire and reflecting onto the imaging area of ​​the image sensor, thus affecting the imaging effect, a piece of optical glass with ink screen printing is usually placed between the lens and the image sensor to block part of the light path. However, since materials such as optical glass cannot achieve theoretically perfect mirror flatness, diffuse reflection is inevitable, resulting in uncontrollable characteristics of the light path. Therefore, some light will still hit the gold wire and be reflected onto the imaging area of ​​the image sensor, affecting the final imaging effect. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a camera module and terminal that can prevent light reflection from reaching the imaging area of ​​the photosensitive chip, thereby improving the imaging quality.

[0005] This utility model provides a camera module including a lens mount, a lens mounted in the lens mount for capturing light signals, a circuit board disposed at the end of the lens mount away from the lens, and a photosensitive chip disposed between the lens mount and the circuit board for receiving light signals passing through the lens and forming an image, and a wire for electrically connecting the photosensitive chip and the circuit board; the wire includes at least a conductor core and an anti-light layer disposed outside the conductor core, the anti-light layer being used to absorb or block light from the lens that shines onto the surface of the wire.

[0006] In one embodiment, the lens mount includes a first base and a second base. The first base has a first mounting cavity, and a connecting part is provided in the first mounting cavity. The connecting part is used to connect the lens to the first mounting cavity.

[0007] In one embodiment, the second base has a second mounting cavity, which together with the circuit board forms a receiving space for accommodating the photosensitive chip.

[0008] In one embodiment, the camera module further includes optical glass installed in the second mounting cavity. The optical glass is arranged parallel to the circuit board and is used to filter out excess light signal bands captured by the lens.

[0009] In one embodiment, the optical glass is bonded to the second mounting cavity, and the second mounting cavity is provided with a plurality of limiting parts for limiting the optical glass in the circumferential direction.

[0010] In one embodiment, the conductor further includes a heat insulation layer covering the conductor core for heat insulation, and a reinforcing layer covering the heat insulation layer for reinforcing the structure, wherein the matte layer is disposed outside the reinforcing layer.

[0011] In one embodiment, the camera module further includes an adhesive assembly, which includes a first adhesive portion disposed between the second base and the circuit board for fixing the lens mount to the circuit board, and a second adhesive portion disposed at the end of the circuit board away from the lens mount for preventing deformation of the circuit board.

[0012] In one embodiment, the adhesive assembly further includes a third adhesive portion disposed between the lens and the first mounting body, the third adhesive portion being used to fix the lens in the first mounting cavity.

[0013] In one embodiment, the mirror base is provided with an exhaust hole, which is connected to the second base body and is used to discharge the gas generated by the first adhesive part during drying.

[0014] This utility model also provides a terminal, including a camera module as described above, wherein the camera module includes a connector, and the camera module is electrically connected to the interior of the terminal through the connector.

[0015] This invention provides a camera module that incorporates an anti-glare layer on the surface of a conductive wire. This anti-glare layer absorbs or blocks light signals, effectively eliminating stray light caused by reflections from the lens onto the conductive wire and improving the imaging quality of the camera module. Furthermore, this structure offers advantages such as simple manufacturing and low cost. Compared to traditional gold wire bonding, the wire spacing can be smaller without short circuits, facilitating miniaturization. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 An exploded view of a camera module provided in a preferred embodiment of this utility model.

[0018] Figure 2 This is a schematic diagram of the structure of a camera module provided in a preferred embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the structure of the mirror mount provided in a preferred embodiment of the present invention.

[0020] Figure 4 This is a schematic diagram of the structure of the mirror mount provided in a preferred embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of the conductor structure provided in a preferred embodiment of the present invention.

[0022] Figure label:

[0023] 1. Lens mount; 2. Lens; 3. Circuit board; 4. Photosensitive chip; 5. Wire; 6. Optical glass; 7. Connector; 8. First adhesive part; 9. Second adhesive part; 10. Third adhesive part; 101. First base; 102. Second base; 1011. First mounting cavity; 1012. Connecting part; 1021. Vent hole; 1022. Second mounting cavity; 1023. Limiting part; 501. Conductor core; 502. Heat insulation layer; 503. Reinforcing layer; 504. Matting layer. Detailed Implementation

[0024] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Based on the description of this utility model, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this utility model.

[0025] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "install," and "connect," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0026] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0028] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0029] Please refer to Figure 1 This utility model provides a camera module, which includes a lens mount 1, a lens 2, a circuit board 3, a photosensitive chip 4, and a wire 5. The lens 2 is installed in the lens mount 1 and is used to capture external light signals. The photosensitive chip 4 is disposed on the circuit board 3 and located between the lens mount 1 and the circuit board 3. It is used to receive the light signals transmitted through the lens 2 and convert them into electrical signals. The wire 5 electrically connects the photosensitive chip 4 and the circuit board 3, thereby realizing the electrical connection between the photosensitive chip 4 and the circuit board 3.

[0030] The conductor 5 includes a conductor core 501 for transmitting electrical signals and an anti-reflective layer 504 disposed outside the conductor core 501 (the conductor core is generally gold wire). This anti-reflective layer 504 is made of an oily material with low or no reflective properties, such as a black acrylic coating, a carbon black coating, a black polyimide film, or a nano-light-absorbing coating. It can absorb or block light signals incident from the lens 2 onto the surface of the conductor 5, thereby eliminating stray light in the image caused by reflection from the conductor 5 and improving the imaging quality of the camera module. This structure also has the advantages of simple manufacturing and low cost. Compared with traditional gold wire bonding, the wire spacing can be smaller and short circuits are avoided, which is beneficial for miniaturization design.

[0031] Furthermore, such as Figures 3-4 As shown, the lens mount 1 includes a first mount 101 and a second mount 102. The first mount 101 has a first mounting cavity 1011, and a connecting part 1012 is provided inside the first mounting cavity 1011. The lens 2 is movably connected to the connecting part 1012 inside the first mounting cavity 1011. Through the movable connection structure of the connecting part 1012, the lens 2 can be finely adjusted along the optical axis direction within the first mounting cavity 1011, thereby adjusting the relative position between the lens 2 and the image sensor 4 to achieve focus. It should be noted that this focusing method is a one-time focus setting and does not have the function of a zoom camera; that is, the lens body does not have a focus length changing structure.

[0032] Specifically, the second mounting body 102 has a second mounting cavity 1022, which together with the circuit board 3 forms a receiving space. The photosensitive chip 4 is disposed in this receiving space, enabling it to stably receive light signals from the lens 2 and convert them into electrical signals. At the same time, space is reserved in this receiving space for connecting wires 5, so that the photosensitive chip 4 can be electrically connected to the circuit board 3 through the wires 5.

[0033] To further prevent stray light from interfering with imaging, such as Figure 1 As shown, in this embodiment, the camera module also includes an optical glass 6 installed in the second mounting cavity 1022. The optical glass 6 is a piece of glass with ink screen printing. It is arranged parallel to the circuit board 3 and is used to filter out excess light signal bands captured by the lens 2, such as infrared or ultraviolet light, to prevent non-visible light bands from interfering with the imaging area of ​​the photosensitive chip, thereby further improving the image quality.

[0034] Preferably, the optical glass 6 is fixed within the second mounting cavity 1022 by adhesive bonding. Simultaneously, to limit the position of the optical glass 6, the second mounting cavity 1022 is provided with multiple limiting portions 1023 along its circumference. The limiting portions 1023 engage with the edges of the optical glass 6 to constrain its position and prevent movement or tilting. In this embodiment, the limiting portions 1023 can be bosses or flanges evenly distributed along the inner wall of the second mounting cavity 1022, with their height matching the thickness of the optical glass 6, ensuring that the optical glass 6 remains parallel to the circuit board 3 after bonding, thereby ensuring the stability of the optical path.

[0035] Because wire 5 generates heat during the transmission of electrical signals, in order to avoid the heat affecting the photosensitive chip 4 and other components, such as... Figure 5As shown, in this embodiment, the conductor 5 further includes a heat insulation layer 502 covering the conductor core 501, and a reinforcing layer 503 covering the heat insulation layer 502. The heat insulation layer 502 is made of a material with low thermal conductivity, such as polyimide, a ceramic coating, or high-temperature resistant silicone rubber. Its function is to isolate the heat generated by the conductor core 501 during electrical signal transmission, thereby reducing heat interference to surrounding components. The reinforcing layer 503 is disposed outside the heat insulation layer 502 to enhance the structural strength and toughness of the conductor 5, preventing breakage or damage caused by external forces during assembly or operation. The reinforcing layer 503 can be made of high-strength fiber materials, such as aramid fiber or carbon fiber, providing necessary mechanical support by tightly wrapping the structure of the conductor 5. Furthermore, an matting layer 504 is located outside the reinforcing layer 503. It absorbs or blocks light signals irradiating the surface of the conductor 5, thereby preventing reflected light from entering the imaging area of ​​the photosensitive chip 4 and effectively improving imaging quality. Specifically, during the process of connecting the photosensitive chip 4 and the circuit board 3 with the wire 5, the connection end needs to be stripped, that is, the external matting layer 504, reinforcing layer 503 and heat insulation layer 502 are stripped, leaving only the conductor core 501 exposed, so as to achieve a reliable electrical connection.

[0036] like Figure 2 As shown, in this embodiment, the camera module further includes an adhesive assembly, comprising a first adhesive portion 8 and a second adhesive portion 9. The first adhesive portion 8 is disposed between the second base 102 and the circuit board 3, for fixing the lens mount 1 to the circuit board 3. The second adhesive portion 9 is disposed at the end of the circuit board 3 away from the lens mount 1, for preventing deformation of the circuit board 3 due to external force or thermal stress. The first adhesive portion 8 can use a high-strength adhesive material, such as epoxy resin or acrylic glue, which, by uniformly coating the contact surface, achieves a reliable connection between the lens mount 1 and the circuit board 3, thereby ensuring that the assembly will not loosen due to vibration or external force during operation. The second adhesive portion 9 uses an elastic adhesive material, such as silicone or polyurethane glue, which, by cooperating with the lens mount 1, absorbs and disperses stress on the circuit board 3, thereby effectively protecting the structural integrity of the circuit board 3.

[0037] Preferably, the bonding assembly further includes a third bonding part 10, which is disposed between the inner wall of the first mounting cavity 1011 and the outer periphery of the lens 2, and is used to fix the lens 2 in the first mounting cavity 1011 after the lens 2 has been focused, thereby preventing the lens 2 from being displaced due to vibration or external force during use.

[0038] After the lens mount 1 and the circuit board 3 are connected by the first adhesive part 8, they need to be placed in an oven to quickly dry the first adhesive part 8, thereby achieving a stable connection between the lens mount 1 and the circuit board 3. During the drying process, the adhesive material will release a certain amount of gas. If it cannot be discharged in time, this gas may accumulate in the second base 102, affecting the bonding effect and potentially impacting internal components. To solve this problem, in this embodiment, a vent hole 1021 is provided on the lens mount 1. The vent hole 1021 is connected to the second base 102, which can discharge the gas generated by the adhesive material during the drying process of the first adhesive part 8. After drying is completed and the gas is discharged, the vent hole 1021 is sealed by injecting glue into it to prevent external impurities from entering and ensure the sealing and stability of the camera module.

[0039] This utility model embodiment also provides a terminal, including the above-mentioned camera module. The camera module includes a connector 7, which is disposed at the end of the circuit board 3 away from the photosensitive chip 4. The camera module is electrically connected to the internal connector of the terminal through the connector 7.

[0040] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0041] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. A camera module, characterized in that, Includes a lens mount (1), a lens (2) installed in the lens mount (1) for capturing light signals, a circuit board (3) disposed at the end of the lens mount (1) away from the lens (2), a photosensitive chip (4) disposed between the lens mount (1) and the circuit board (3) for receiving light signals passing through the lens (2) and forming an image, and a wire (5) for electrically connecting the photosensitive chip (4) and the circuit board (3). The conductor (5) includes at least a conductor core (501) and an matting layer (504) disposed outside the conductor core (501), the matting layer (504) being used to absorb or block light from the lens (2) onto the surface of the conductor (5).

2. The camera module as described in claim 1, characterized in that, The lens mount (1) includes a first mount (101) and a second mount (102). The first mount (101) has a first mounting cavity (1011). The first mounting cavity (1011) has a connecting part (1012) inside. The connecting part (1012) is used to connect the lens (2) inside the first mounting cavity (1011).

3. The camera module as described in claim 2, characterized in that, The second base (102) has a second mounting cavity (1022), which together with the circuit board (3) forms a space for accommodating the photosensitive chip (4).

4. The camera module as described in claim 3, characterized in that, The camera module also includes optical glass (6) installed in the second mounting cavity (1022). The optical glass (6) is arranged parallel to the circuit board (3) and is used to filter out excess light signal bands captured by the lens (2).

5. The camera module as described in claim 4, characterized in that, The optical glass (6) is bonded to the second mounting cavity (1022), and the second mounting cavity (1022) is provided with a plurality of limiting parts (1023) for limiting the optical glass (6) in the circumferential direction.

6. The camera module as described in claim 1, characterized in that, The conductor (5) further includes a heat insulation layer (502) covering the conductor core (501) for heat insulation, and a reinforcing layer (503) covering the heat insulation layer (502) for reinforcing the structure, and the matte layer (504) is disposed outside the reinforcing layer (503).

7. The camera module as described in claim 2, characterized in that, The camera module also includes an adhesive component, which includes a first adhesive part (8) disposed between the second base (102) and the circuit board (3) for fixing the lens mount (1) and the circuit board (3), and a second adhesive part (9) disposed at the end of the circuit board (3) away from the lens mount (1) for preventing the circuit board (3) from deforming.

8. The camera module as described in claim 7, characterized in that, The bonding assembly further includes a third bonding part (10) disposed between the lens (2) and the first base (101), the third bonding part (10) being used to fix the lens (2) in the first mounting cavity (1011).

9. The camera module as described in claim 7, characterized in that, The mirror base (1) is provided with an exhaust hole (1021), which is connected to the second base body (102) and is used to discharge the gas generated by the first adhesive part (8) during drying.

10. A terminal, characterized in that, The camera module includes a camera module as described in any one of claims 1-9, the camera module including a connector (7), the camera module being electrically connected to the internal terminal via the connector (7).

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