A microphone array voiceprint analysis sensor

Abstract

The utility model discloses a microphone array voiceprint analysis sensor, including sensor body, the sensor body outside is equipped with connecting component, the connecting component includes the connecting pipe of fixed mounting in the circumference outer wall of sensor body, the connecting pipe outside is equipped with the moving pipe no.

Description

Technical Field

[0001] This utility model relates to the field of material sorting technology, specifically to a microphone array acoustic signature analysis sensor. Background Technology

[0002] The microphone array acoustic signature sensor is a high-precision device based on multi-channel acoustic signal acquisition, specifically designed for acoustic signature recognition, noise source localization, and anomaly detection in industrial environments. Through the collaborative operation of multiple microphones, it can capture sound field distribution in real time and, combined with deep learning algorithms, achieve equipment status assessment and fault early warning.

[0003] A search revealed a utility model patent with Chinese patent publication number CN113126028B, which discloses a noise source localization method based on multiple microphone arrays. This method selects M microphone sensors to construct a ring-shaped microphone array, sets one microphone sensor as a reference microphone sensor, establishes an array coordinate system using this reference microphone sensor, and sets the remaining M-1 microphone sensors around the reference microphone sensor. D sound sources are then placed within the cabin. The relative transfer functions from the D sound sources to each microphone sensor are obtained, and the array manifold matrix of the ring-shaped microphone array is constructed.

[0004] As the aforementioned sensor has a complex internal structure, if the device is dropped on the ground due to improper operation, the resulting vibration may damage the internal circuitry, leading to high repair costs and inconvenience in operation, thus leaving room for improvement. Utility Model Content

[0005] The purpose of this invention is to provide a microphone array acoustic signature analysis sensor to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a microphone array voiceprint analysis sensor, comprising a sensor body, a connecting assembly installed on the outside of the sensor body, the connecting assembly including a connecting tube fixedly installed on the outer circumference of the sensor body, a movable tube one sleeved on the outside of the connecting tube, a movable tube two sleeved on the outside of the movable tube one, a plurality of shock-absorbing components installed between the connecting tube and the movable tube one, and a plurality of shock-absorbing components also installed between the movable tube one and the movable tube two, wherein the plurality of shock-absorbing components close to the sensor body are vertically distributed, and the plurality of shock-absorbing components far from the sensor body are horizontally distributed.

[0007] As a further preferred embodiment of this technical solution, the shock absorption assembly includes a mounting sleeve fixedly connected to the outer circumference of the connecting pipe. A spring is fixedly connected to the inner bottom wall of the mounting sleeve, and a piston is slidably inserted inside the mounting sleeve. A contact piece and a connecting post are fixedly connected to the top and bottom outer walls of the piston, respectively. The connecting post is fixedly installed on the inner circumference of the moving pipe.

[0008] This design ensures that the sensor body is cushioned regardless of its direction of movement when subjected to vibration, preventing vibration from being transmitted to the sensor body and thus extending its lifespan. When the device falls to the ground, the sensor body moves the connecting tube towards the ground, which in turn causes the connecting column, piston, and contact plate to slide along the mounting sleeve. During this process, the spring first cushions the impact force, while the compressed air between the piston and the mounting sleeve absorbs kinetic energy. The piston also converts kinetic energy into heat energy as it slides. If the impact force is too large, the piston will deform due to the external force to further cushion the impact. Furthermore, the shock-absorbing components are distributed around the sensor body, ensuring effective cushioning regardless of the sensor body's position when it hits the ground.

[0009] As a further preferred embodiment of this technical solution, a wire is fixedly installed inside the sensor body, and the wire passes through the inner wall of the sensor body and extends outward. A clamping assembly is installed between the sensor body and the wire.

[0010] As a further preferred embodiment of this technical solution, the clamping assembly includes a fixing sleeve fixedly connected to the outer wall of one side of the sensor body. A clamping sleeve is hinged inside the fixing sleeve. Two through slots are opened at the same end of the fixing sleeve and the clamping sleeve. A screw is hinged inside each of the two through slots at the bottom. A clamping nut is threaded to the outside of each of the two screws, and the width of the clamping nut is greater than the width of the through slot.

[0011] Flip the movable end of the clamping sleeve toward the wire, then flip the movable end of the screw upward into the through groove inside the clamping sleeve. Then drive the clamping nut downward along the screw. The clamping nut will then drive the movable end of the clamping sleeve closer to the fixed sleeve. The fixed sleeve and the clamping sleeve can then tightly clamp the wire. When the wire is pulled, under the action of static friction, the external force will not be able to continue to be transmitted into the sensor body, thus avoiding the problem of disconnection.

[0012] As a further preferred embodiment of this technical solution, two limiting grooves are provided on the top outer wall of the movable end of the clamping sleeve, and the two clamping nuts are respectively located inside the two limiting grooves.

[0013] As a further preferred embodiment of this technical solution, the thread helix angle of the external thread groove of the screw is smaller than the equivalent friction angle.

[0014] As a further preferred embodiment of this technical solution, a flange ring is fixedly connected to one end of the outer circumference of the connecting component.

[0015] This invention provides a microphone array acoustic signature analysis sensor, which has the following advantages:

[0016] (1) By setting up a connecting component and a shock-absorbing component, the sensor body can be buffered when it is subjected to vibration, regardless of the direction it moves, thereby preventing the vibration from being transmitted to the inside of the sensor body and ensuring the service life of the sensor. When the device falls to the ground, the sensor body will drive the connecting pipe to move towards the ground, and then drive the connecting column, piston and contact plate to slide along the mounting sleeve. In this process, the spring first buffers the impact force, and at the same time, the compressed air between the piston and the mounting sleeve absorbs the kinetic energy. When the piston slides, it will also convert the kinetic energy into heat energy for consumption. If the impact force is too large, the piston will deform due to the external force to further buffer it. The shock-absorbing component is distributed around the sensor body, so the sensor body can be effectively buffered no matter where it hits the ground.

[0017] (2) By setting up a clamping component, the movable end of the clamping sleeve is flipped toward the wire direction, and the movable end of the screw is flipped upward to enter the through groove inside the clamping sleeve. Then the clamping nut is driven to move downward along the screw. Subsequently, the clamping nut can drive the movable end of the clamping sleeve to approach the fixed sleeve. The fixed sleeve and the clamping sleeve can then clamp the wire tightly. When the wire is pulled, under the action of static friction, the external force will not be able to continue to be transmitted to the inside of the sensor body, thus avoiding the problem of disconnection. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall first-view structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the overall second-view structure of this utility model;

[0020] Figure 3 This is an enlarged structural schematic diagram of the shock absorption component of this utility model;

[0021] Figure 4 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0022] In the diagram: 1. Sensor body; 2. Wire; 3. Flange ring; 4. Connecting assembly; 5. Shock absorption assembly; 6. Clamping assembly; 401. Connecting pipe; 402. Moving pipe one; 403. Moving pipe two; 501. Mounting sleeve; 502. Spring; 503. Contact piece; 504. Piston; 505. Connecting column; 601. Fixing sleeve; 602. Clamping sleeve; 603. Through groove; 604. Screw; 605. Clamping nut; 606. Limiting groove. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0024] This utility model provides a technical solution: such as Figure 2 and Figure 3 As shown, in this embodiment, a microphone array voiceprint analysis sensor includes a sensor body 1 (microphone array module: containing 4-16 high-precision MEMS microphones, with adjustable array spacing (default 50mm), signal processing unit: integrating FPGA chip, supporting real-time signal preprocessing (FFT, filtering, noise reduction), power supply and communication module: supporting PoE power supply or independent power adapter), a connecting component 4 is installed on the outside of the sensor body 1, the connecting component 4 includes a connecting tube 401 fixedly installed on the outer circumference of the sensor body 1, a first movable tube 402 is sleeved on the outside of the connecting tube 401, a second movable tube 403 is sleeved on the outside of the first movable tube 402, a number of shock-absorbing components 5 are installed between the connecting tube 401 and the first movable tube 402, and a number of shock-absorbing components 5 are also installed between the first movable tube 402 and the second movable tube 403, and the number of shock-absorbing components 5 close to the sensor body 1 are vertically distributed, and the number of shock-absorbing components 5 far away from the sensor body 1 are horizontally distributed.

[0025] The shock absorption assembly 5 includes a mounting sleeve 501 fixedly connected to the outer circumference of the connecting pipe 401. A spring 502 is fixedly connected to the inner bottom wall of the mounting sleeve 501. A piston 504 is slidably inserted inside the mounting sleeve 501. A contact piece 503 and a connecting post 505 are fixedly connected to the top and bottom outer walls of the piston 504, respectively. The connecting post 505 is fixedly installed on the inner circumference of the moving pipe 402.

[0026] When the device falls to the ground, the sensor body 1 will move the connecting pipe 401 toward the ground, which in turn will cause the connecting column 505, piston 504 and contact piece 503 to slide along the mounting sleeve 501. During this process, the spring 502 first buffers the impact force, and at the same time, the compressed air between the piston 504 and the mounting sleeve 501 absorbs kinetic energy. When the piston 504 slides, it will also convert kinetic energy into heat energy and consume it. If the impact force is too large, the piston 504 will deform due to the external force to further buffer it. In addition, the shock absorption components 5 are distributed around the sensor body 1, so no matter where the sensor body 1 hits the ground, it can be effectively buffered.

[0027] like Figure 2 and Figure 4 As shown, a wire 2 is fixedly installed inside the sensor body 1, and the wire 2 passes through the inner wall of the sensor body 1 and extends outward. A clamping assembly 6 is installed between the sensor body 1 and the wire 2.

[0028] The clamping assembly 6 includes a fixing sleeve 601 fixedly connected to the outer wall of one side of the sensor body 1. A clamping sleeve 602 is hinged inside the fixing sleeve 601. Two through slots 603 are opened at the same end of both the fixing sleeve 601 and the clamping sleeve 602. A screw 604 is hinged inside each of the two through slots 603 at the bottom. A clamping nut 605 is threaded to the outside of each of the two screws 604, and the width of the clamping nut 605 is greater than the width of the through slot 603.

[0029] Flip the movable end of the clamping sleeve 602 toward the wire 2, then flip the movable end of the screw 604 upward into the through groove 603 inside the clamping sleeve 602, and then drive the clamping nut 605 to move downward along the screw 604. Subsequently, the clamping nut 605 can drive the movable end of the clamping sleeve 602 to approach the fixed sleeve 601. The fixed sleeve 601 and the clamping sleeve 602 can then tightly clamp the wire 2. When the wire 2 is pulled, under the action of static friction, the external force will not be able to continue to be transmitted into the sensor body 1, thus avoiding the problem of disconnection.

[0030] like Figure 4 As shown, two limiting grooves 606 are provided on the top outer wall of the movable end of the clamping sleeve 602, and two clamping nuts 605 are respectively located inside the two limiting grooves 606, which can prevent the clamping nuts 605 from coming off the outside of the clamping sleeve 602 during use.

[0031] like Figure 4 As shown, the thread helix angle of the external thread groove of screw 604 is less than the equivalent friction angle, giving it a self-locking property.

[0032] like Figure 1 and Figure 2 As shown, a flange ring 3 is fixedly connected to one end of the outer circumference of the connecting component 4. By passing bolts through the through hole of the flange ring 3, the connection and fixation between the moving pipe 403 and the external equipment can be achieved.

[0033] This utility model provides a microphone array acoustic signature analysis sensor, the specific working principle of which is as follows:

[0034] When the device is working, the second movable tube 403 is inserted into the pre-reserved mounting hole of the application equipment, and then the bolt is passed through the through hole of the flange ring 3 to connect and fix the second movable tube 403 to the external equipment. The movable end of the clamping sleeve 602 is flipped towards the wire 2, and the movable end of the screw 604 is flipped upward to enter the through groove 603 inside the clamping sleeve 602. Then the clamping nut 605 is driven to move downward along the screw 604. Subsequently, the clamping nut 605 can drive the movable end of the clamping sleeve 602 to approach the fixed sleeve 601. The fixed sleeve 601 and the clamping sleeve 602 can tightly clamp the wire 2. When the wire 2 is pulled, under the action of static friction, the external force will not be able to continue to be transmitted to the inside of the sensor body 1, avoiding the problem of disconnection.

[0035] When the device falls to the ground, the sensor body 1 will move the connecting pipe 401 toward the ground, which in turn will cause the connecting column 505, piston 504 and contact piece 503 to slide along the mounting sleeve 501. During this process, the spring 502 first buffers the impact force, and at the same time, the compressed air between the piston 504 and the mounting sleeve 501 absorbs kinetic energy. When the piston 504 slides, it will also convert kinetic energy into heat energy and consume it. If the impact force is too large, the piston 504 will deform due to the external force to further buffer it. In addition, the shock absorption components 5 are distributed around the sensor body 1, so no matter where the sensor body 1 hits the ground, it can be effectively buffered.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A microphone array acoustic signature analysis sensor, comprising a sensor body (1), characterized in that: A connecting assembly (4) is installed on the outside of the sensor body (1). The connecting assembly (4) includes a connecting pipe (401) fixedly installed on the outer circumference of the sensor body (1). A movable pipe (402) is sleeved on the outside of the connecting pipe (401). A movable pipe (403) is sleeved on the outside of the movable pipe (402). Several shock-absorbing components (5) are installed between the connecting pipe (401) and the movable pipe (402). Several shock-absorbing components (5) are also installed between the movable pipe (402) and the movable pipe (403). The shock-absorbing components (5) close to the sensor body (1) are vertically distributed, and the shock-absorbing components (5) far away from the sensor body (1) are horizontally distributed.

2. The microphone array acoustic signature analysis sensor according to claim 1, characterized in that: The shock absorption assembly (5) includes a mounting sleeve (501) fixedly connected to the outer circumference of the connecting tube (401). A spring (502) is fixedly connected to the inner bottom wall of the mounting sleeve (501). A piston (504) is slidably inserted inside the mounting sleeve (501). A contact piece (503) and a connecting post (505) are fixedly connected to the top and bottom outer walls of the piston (504), respectively. The connecting post (505) is fixedly installed on the inner circumference of the moving tube (402).

3. The microphone array acoustic signature analysis sensor according to claim 1, characterized in that: A wire (2) is fixedly installed inside the sensor body (1), and the wire (2) passes through the inner wall of the sensor body (1) and extends outward. A clamping assembly (6) is installed between the sensor body (1) and the wire (2).

4. The microphone array acoustic signature analysis sensor according to claim 3, characterized in that: The clamping assembly (6) includes a fixed sleeve (601) fixedly connected to the outer wall of one side of the sensor body (1). A clamping sleeve (602) is hinged inside the fixed sleeve (601). Two through slots (603) are opened at the same end of the fixed sleeve (601) and the clamping sleeve (602). A screw (604) is hinged inside the two through slots (603) at the bottom. A clamping nut (605) is threaded to the outside of the two screws (604), and the width of the clamping nut (605) is greater than the width of the through slot (603).

5. A microphone array acoustic signature analysis sensor according to claim 4, characterized in that: The top outer wall of the movable end of the clamping sleeve (602) has two limiting grooves (606), and the two clamping nuts (605) are respectively located inside the two limiting grooves (606).

6. A microphone array acoustic signature analysis sensor according to claim 4, characterized in that: The thread helix angle of the external thread groove of the screw (604) is less than the equivalent friction angle.

7. A microphone array acoustic signature analysis sensor according to claim 4, characterized in that: A flange ring (3) is fixedly connected to one end of the outer circumference of the connecting component (4).

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