Sound production module unit and earphone

Abstract

The utility model provides a kind of sound production module unit and earphone, belong to electroacoustic technology field, specifically including shell, loudspeaker I and loudspeaker II, the shell is enclosed for the inner cavity of accommodating component, still include support, support piece is configured as independent sound channel, avoid the sound wave interference of loudspeaker, it is favorable to promote the tone quality of sound.

Description

Technical Field

[0001] This utility model relates to the field of electroacoustic technology, and in particular to a sound-generating module unit. Background Technology

[0002] Headphones are widely used as consumer electronics products. Multiple drivers are combined in a headphone to form a multi-driver headphone, which can cover multiple frequency bands and improve the sound quality. However, the sound waves emitted by multiple drivers are prone to mutual interference, resulting in poor sound quality.

[0003] Patent document 1 (CN 220528218U) discloses a dual-speaker headphone. The specific solution is as follows: one speaker is placed in a speaker mounting base, and the speaker mounting base is eccentrically positioned above the other speaker. The sound generated by the second speaker is sequentially guided to the first speaker through the second sound outlet and the sound guide channel. After mixing with the sound generated by the first speaker, it is emitted from the first sound outlet, realizing high and low frequency stereo sound effects. It can obtain a wider range of sound quality within the sound range, and the sound quality has better layering and detail, and can better reproduce the original sound.

[0004] In the above technical solution, the two speakers are not completely isolated, and there is still a problem of sound waves interfering with each other.

[0005] Patent document 1 (CN 115914913A) discloses a sound output device, which has a bracket inside the housing and is constructed with a central part and a peripheral part surrounding the central part. A first channel and a second channel are separated. The first channel is connected to a vent hole, and the second channel is connected to a sound outlet. A first speaker part is located in the first space of the bracket and its sound outlet side faces the sound outlet. A second speaker part is located in the second space of the bracket and its front cavity is connected to the second channel.

[0006] In the above solution, a first channel and a second channel are set at intervals by a bracket, and are respectively connected to the corresponding speakers to solve the problem of sound wave interference. The bracket component has a complex structure and high processing requirements. Utility Model Content

[0007] This application provides a sound-generating module unit. The sound-generating module unit is beneficial for improving the sound quality.

[0008] This application provides a sound-generating module unit. The sound-generating module unit includes a housing, a speaker I, and a speaker II, wherein the housing forms an inner cavity for accommodating components. The device also includes a support member, which is assembled in the inner cavity of the housing. The support member includes a side wall and a partition wall. The side wall is arranged around the partition wall. The partition wall has a first surface and a second surface opposite to the first surface. The first surface and the side wall enclose a first space for accommodating the speaker II. The second surface and the side wall enclose a second space for accommodating the speaker I. The side wall thickness of the second space is greater than the side wall thickness of the first space. Through holes I are formed at intervals at the edge positions of the partition wall, and the through holes I extend to the side wall of the second space. The support member has a long through groove on its side wall facing the first space, and a long groove is formed on the outer side surface of the support member along the axial direction of the side wall; the sound outlet of the speaker II is parallel to the sound outlet of the speaker I through the through hole I; the back sound outlet of the speaker I is parallel to the back sound outlet of the speaker II through the long groove and faces the outer side of the inner cavity of the housing.

[0009] Preferably, speaker I is a MEMS speaker, a balanced armature speaker, or a dynamic coil speaker; speaker II is a MEMS speaker, a balanced armature speaker, or a dynamic coil speaker.

[0010] Preferably, the sound-emitting module unit further includes a sound-emitting plate, the sound-emitting plate including a boss and a peripheral portion surrounding the boss; the sound-emitting plate has a central sound-emitting hole penetrating the boss, the sound-emitting hole is connected to the sound-emitting end of the speaker I, and the peripheral portion is circumferentially spaced with edge sound-emitting holes, the sound-emitting holes are connected to the sound-emitting end of the speaker II.

[0011] Preferably, the sound-generating module unit further includes a signal processing circuit unit, which includes a substrate and electrical components disposed on the substrate.

[0012] Preferably, corresponding to the long through groove and the long recess, the substrate has a notch and a through hole II, which connects to the back sound end of the speaker II.

[0013] Preferably, the end of the housing extends from the wall of the housing towards the center to form flange I and flange II, and defines the inner diameter of the housing.

[0014] Preferably, the inner diameter defined by flange I of the housing is larger than the inner diameter defined by flange II.

[0015] Preferably, the sound-emitting plate is disposed on the flange II side of the housing.

[0016] Preferably, the inner surface of the sidewall of the first space is stepped.

[0017] This application also proposes an earphone, including the aforementioned sound-generating module unit.

[0018] The technical solution disclosed in this application can improve the perceived sound quality. Attached Figure Description

[0019] Referring to the accompanying drawings, the drawings used in the following description of the embodiments or prior art will be briefly introduced. Obviously, the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model.

[0020] Figure 1 This is a three-dimensional structural diagram of the sound-generating module unit involved in this application; Figure 2a It shows Figure 1 An exploded view of the sound-generating module unit shown; Figure 2b It shows Figure 1 An exploded view of the sound-generating module unit from another angle; Figure 3 It shows Figure 2a and Figure 2b A three-dimensional structural diagram of the middle shell; Figure 4a It shows Figure 2a and Figure 2b A three-dimensional structural diagram of the assembly of the middle shell and the sound outlet plate; Figure 4b It shows Figure 4a A cross-sectional view; Figure 5 It shows Figure 2a and Figure 2b A three-dimensional structural diagram of loudspeaker I and loudspeaker II; Figure 6a It shows Figure 2a and Figure 2b A three-dimensional structural diagram of the central support component; Figure 6b It shows Figure 2a and Figure 2b A three-dimensional structural diagram of the central support component from another angle; Figure 6c It shows Figure 2a and Figure 2b A cross-sectional view of the assembly of the middle shell, sound outlet plate, and support components; Figure 7 It shows Figure 2a and Figure 2b A three-dimensional structural diagram of the signal processing circuit unit; Figure 8 It shows Figure 1 A cross-sectional view.

[0021] Explanation of icon numbers: 10. Sound-generating module unit; 11. Shell; 110. Cavity; 111. Flange I; 112. Flange II; 12. Soundboard; 120. Boss; 121. Peripheral part; 122. Center sound hole; 123. Edge sound hole; 13. Loudspeaker I; 131. Sound output end; 132. Back sound output end; 14. Support component; 141. Side wall; 1411. First side wall; 1412. Second side wall; 1413. Long through groove; 1414. Long groove; 142. Partition wall; 1421. First surface; 1422. Second surface; 1423. Through hole I; 143. First space; 1431. Stepped surface; 144. Second space; 15. Loudspeaker II; 151. Sound output end; 152. Back sound output end; 16. Signal processing circuit unit; 161. Substrate; 1611. Notch; 1612. Through hole II; 162. Electrical components; 17. Mesh fabric.

[0022] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the described embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0024] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0025] To facilitate understanding, the relevant terms and concepts involved in the embodiments of this application will be introduced below.

[0026] Dynamic loudspeaker: The coil of a moving loudspeaker is fixed on the cone and placed in a magnetic field. When the current in the loudspeaker coil changes, a Lorentz force is generated in the magnetic field and the coil moves, thereby causing the cone to vibrate and produce sound, converting the audio electrical signal into a sound wave signal.

[0027] The moving iron unit, also known as the balanced armature transducer: A balanced armature transducer mainly includes a coil, a balanced armature, a transmission rod, a magnet, a diaphragm and a sound tube, and a housing. The coil, diaphragm, and sound tube are fixed together. The audio electrical signal changes within the coil and, under the influence of a magnetic field, the magnet vibrates. This vibration is transmitted to the diaphragm via the transmission rod, producing sound. This process converts the audio electrical signal into a sound wave signal. When installed in headphones, it becomes a balanced armature headphone.

[0028] MEMS speakers: Micro-electro-mechanical systems (MEMS) are used in loudspeakers, such as those utilizing the piezoelectric effect, where applying voltage causes piezoelectric materials to contract or expand, thus pushing air to produce sound. MEMS loudspeakers have a high-frequency advantage.

[0029] Frequency division design: Since the frequency range of a single sound unit is limited and it cannot reproduce full-frequency sound, the desired frequency range, such as full low frequencies, clear mid frequencies, and clear high frequencies, can be achieved by using passive frequency division, physical frequency division, or phase adjustment to adjust multiple sound units connected in series or parallel.

[0030] This application proposes a sound-generating module unit, designated by reference numeral 10 in the accompanying drawings. Figure 1 A three-dimensional structural schematic diagram of the sound-generating module unit involved in this application is shown. This sound-generating module unit 10 can be used independently as a speaker, or in electronic products such as headphones, computers, iPads, wearable devices, in-vehicle devices, and electronic watches. It should be noted that this sound-generating module unit can also be used in combination to cover a wider frequency band, for use in adjustable sound headphones such as those disclosed in CN220273835U.

[0031] Please see Figure 2a and Figure 2b , Figure 2a It shows Figure 1 An exploded view of the sound-generating module unit shown; Figure 2b It shows Figure 1 The diagram shows an exploded view of the sound-generating module unit from another angle. The sound-generating module unit 10 may include a housing 11, a sound output plate 12, a speaker I 13, a support member 14, a speaker II 15, and a signal processing circuit unit 16. It should be noted that... Figure 2a and Figure 2b The accompanying drawings below only schematically show some components, and the actual shape and size of these components are not limited by the drawings.

[0032] In this application, loudspeaker I 13 and loudspeaker II 15 can be MEMS loudspeakers, balanced armature loudspeakers, or moving coil loudspeakers. In this embodiment, loudspeaker I 13 and loudspeaker II 15 are described using moving coil loudspeakers as examples. It should be noted that the sound-generating principle of loudspeakers is similar to the process of driving a diaphragm to vibrate and produce sound; therefore, loudspeakers all have a sound-emitting end and a back end opposite to the sound-emitting end.

[0033] See Figure 3 and combined Figure 2a and Figure 2b As shown, Figure 3 A three-dimensional structural schematic diagram of the housing 11 is shown. The housing 11 forms an inner cavity 110, which is used to house other components of the sound-generating module unit, such as speakers, support components, signal processing circuit units, etc. Since the sound-generating module unit is a single unit, in order to improve its structural strength and service life, the housing material can be selected from metal materials or rigid organic materials.

[0034] The shell 11 is constructed as a cylindrical structure, with flanges I 111 and II 112 extending from the shell wall toward the center at its ends, defining the inner diameter of the shell 11. Specifically, the inner diameter defined by flange I 111 is larger than the inner diameter defined by flange II 112.

[0035] See Figure 4a and Figure 4b and combined Figure 2a and Figure 2b As shown, Figure 4a A three-dimensional structural diagram of the assembly of housing 11 and sound output plate 12 is shown. Figure 4b It shows Figure 4a A cross-sectional view. The sound plate 12 includes a boss 120 and a peripheral portion 121, the peripheral portion 121 being disposed around the boss 120.

[0036] The sound-emitting plate 12 has a central sound-emitting hole 122, which passes through the boss 120 to form a through hole. Peripheral sound-emitting holes 123 are circumferentially spaced on the peripheral side portion 121. The central sound-emitting hole 122 can also be configured as a series of small holes to facilitate the transmission of sound waves. It is understood that a mesh can be installed inside the central sound-emitting hole 122 and the peripheral sound-emitting holes 123 on the sound-emitting plate, or the mesh can cover the entire sound-emitting plate, or cover the inner diameter area of ​​the housing 11 defined by the flange II 112. That is, the mesh can be installed at one end of the sound-emitting plate or housing on the flange II 112 side, serving to filter external air impurities and adjust air acoustic resistance.

[0037] It is understandable that the sound plate 12 and the housing 11 can be set separately or integrally molded, which is convenient for processing and molding.

[0038] See Figure 5 , Figure 5 The diagram shows a three-dimensional view of loudspeaker I 13 and loudspeaker II 15 at different angles. The operating frequencies of loudspeaker I 13 and loudspeaker II 15 are determined by their physical structures; for example, a large-diameter loudspeaker has a low-frequency advantage. Loudspeaker I 13 has a sound-emitting end 131 and a back-sound end 132 facing away from each other. It can be understood that the sound-emitting end 131 of loudspeaker I 13 can be the sound-emitting side of loudspeaker I 13 or the surface where the sound hole is located; the back-sound end 132 of loudspeaker I 13 can be the surface facing away from the sound-emitting end 131 of loudspeaker I 13. Loudspeaker II 15 also has a sound-emitting end 151 and a back-sound end 152 facing away from each other. The sound-emitting end 151 of loudspeaker II 15 can be the sound-emitting side of loudspeaker II 15 or the surface where the sound hole is located; the back-sound end 152 of loudspeaker II 15 can be the surface facing away from the sound-emitting end 151 of loudspeaker II 15.

[0039] Speaker I 13 and speaker II 15 are assembled together via support 14, see [reference]. Figure 6a , Figure 6b and Figure 6c and combined Figure 2a and Figure 2b As shown, Figure 6a A three-dimensional structural schematic diagram of the support member 14 at one angle is shown. Figure 6b A three-dimensional structural diagram of the support member 14 is shown from another angle. Figure 6c A cross-sectional view of the support member 14 assembled with the housing 11 is shown. The support member 14 has a side wall 141 and a partition wall 142. The side wall 141 is disposed around the periphery of the partition wall 142 and fixes the periphery of the partition wall 142. The partition wall 142 has a first surface 1421 and a second surface 1422 opposite to the first surface 1421.

[0040] In this embodiment, the first surface 1421 of the partition wall 142 and the side wall 141 enclose a first space 143 for accommodating the loudspeaker II 15. The inner surface of the side wall 141 within the first space 143 may be stepped, that is, the inner surface of the side wall 141 has a stepped surface 1431, which facilitates fixing the loudspeaker II 15.

[0041] Please continue reading Figure 6a , Figure 6b and Figure 6cThe second surface 1422 of partition wall 142 and the side wall 141 enclose a second space 144 for accommodating speaker I 14. The thickness of the second side wall 1412 within the second space 144 is greater than the thickness of the first side wall 1411 within the first space 143; that is, the first side wall 1411 on the first surface 1421 side of partition wall 142 is thinner than the second side wall 1412 on the second surface 1422 side of partition wall 142. It is understood that through-holes I 1423 are circumferentially spaced at the edge of the first surface 1421 of partition wall 142 and extend onto the second side wall 1412 on the second surface 1422 side of partition wall 142, so that the through-holes I 1423 are completely isolated from the second space 144 (see...). Figure 6b ).

[0042] In this embodiment, the partition wall 142 is located at 1 / 2 to 1 / 4 of the axial direction of the side wall 141. To ensure stable assembly of the speaker I 13 and speaker II 15 with the support member 14 and to avoid sound wave interference, the support member 14 is made of rubber or plastic. The rubber support member 14 can not only effectively clamp the speaker I 13 and speaker II 15, but also facilitates assembly into the inner cavity 110 of the housing 11 made of metal or rigid materials.

[0043] Please continue reading Figure 6a , Figure 6b and Figure 6c The support member 14 has an elongated groove 1413 on its sidewall 141 facing the first space 143, and extends axially along the sidewall 141 on the side of the first space 143. This structure facilitates the installation and clamping of the speaker II 15, while providing a pressure relief channel to balance the pressure on the back end 152 of the speaker II 15.

[0044] A long groove 1414 is constructed along the axial direction of the sidewall 141 on the outer surface of the support member 14, away from the long through groove 1413. The long groove 1414 and the long through groove 1413 are spaced apart. In this embodiment, the distance between the long groove 1414 and the long through groove 1413 corresponds to half of the outer diameter circumference of the first space 143 of the support member 14. This structural design reduces acoustic interference flowing through the long groove 1414 and the long through groove 1413. Specifically, the long groove 1414 extending to the side of the first space 143 connects to the first space 143, and the long groove 1414 extending to the side of the second space 144 connects to the second space 144. This structural design balances the air pressure at the back end 132 of the speaker I 13 in the second space 144.

[0045] See Figure 7 and combined Figure 2a and Figure 2b As shown, Figure 7A three-dimensional structural schematic diagram of the signal processing circuit unit 16 is shown. The signal processing circuit unit 16 includes a substrate 161 and electrical components 162 disposed on the substrate 161.

[0046] Specifically, corresponding to the elongated groove 1414 and elongated through groove 1413 on the side wall 141 of the support member 14, the substrate 161 is constructed with a notch 1611, so that the back sound end 132 of the speaker I 13 connected to the second space 144 can communicate with the outside, balance the internal pressure, and avoid sound wave interference. The substrate 161 is constructed with a through hole II 1612 for connecting the back sound end 152 of the speaker II 15 in the first space 143, balancing the internal pressure, and avoiding sound wave interference.

[0047] The electrical components 162 of the signal processing circuit unit 16 are used to amplify or reduce the noise of the electrical signal. For example, when the signal processing circuit unit 16 has an active noise reduction function, the electrical components also include components such as filters.

[0048] See Figure 8 and combined Figure 2a and Figure 2b As shown, Figure 8 It shows Figure 1 A cross-sectional view of the sound-emitting module unit 10 shows the long through groove 1413 and long groove 1414 of the support member 14 and the notch 1611 of the signal processing circuit unit 16 cut by the cross-section. The sound-emitting module unit 10 is constructed as a cylindrical structure, but it can also be constructed as a square column or other structures. The support member 14 is surrounded and enclosed by the housing 11. The first space 143 of the support member 14 accommodates the speaker II 15, and the second space 144 of the support member 14 accommodates the speaker I 13. A signal processing circuit unit 16 is disposed at the end of the first space 143 of the support member 14, and a sound-emitting plate 12 is disposed at the end of the second space 144 of the support member 14. The sound-emitting end 131 of the speaker I 13 communicates with the central sound-emitting hole 122 of the sound-emitting plate 12, and the back sound-emitting end 132 of the speaker I 13 communicates with the elongated groove 1414 on the support member 14. The sound-emitting end 151 of the speaker II 15 communicates with the edge sound-emitting hole of the sound-emitting plate 12 through the through hole I 1423 on the support member 14, and the back sound-emitting end 152 of the speaker II 15 communicates with the through hole II 1612 of the signal processing circuit unit 16. A mesh 17 is installed at position 1612 to adjust the air acoustic resistance and filter air impurities.

[0049] Speaker I 13 and speaker II 15 are electrically connected to signal processing circuit unit 16, and a connection port is formed on substrate 161 of signal processing circuit unit 16. In use, the sound-generating module unit 10 is placed in the device to be connected and connected to the device through the port. The two speakers work together to avoid sound wave interference and improve the sound quality of the output sound.

Claims

1. A sound-generating module unit (10), comprising a housing (11), a speaker I (13) and a speaker II (15), wherein the housing (11) forms an inner cavity (110) for accommodating components, characterized in that ； It also includes a support member (14) which is assembled in the inner cavity (110) of the housing (11). The support member (14) includes a side wall (141) and a partition wall (142). The side wall (141) is arranged around the partition wall (142). The partition wall (142) has a first surface (1421) and a second surface (1422) opposite to the first surface (1421). The first surface (1421) and the side wall (141) enclose an area for use. In the first space (143) accommodating the loudspeaker II (15), the second surface (1422) and the sidewall (141) enclose a second space (144) for accommodating the loudspeaker I (13), the sidewall thickness of the second space (144) is greater than the sidewall thickness of the first space (143); through holes I (1423) are formed at intervals at the edge positions of the partition wall (142), and the through holes I (1423) extend to the sidewall of the second space (144); The support member (14) has a long through groove (1413) on its side wall (141) facing the first space (143), and a long groove (1414) is formed on the outer side surface of the support member (14) along the axial direction of the side wall (141); the sound outlet of the speaker II (15) is parallel to the sound outlet of the speaker I (13) through the through hole I (1423); the back sound outlet of the speaker I (13) is parallel to the back sound outlet of the speaker II (15) through the long groove (1414) and faces the outer side of the inner cavity (110) of the housing (11).

2. The sound-generating module unit (10) according to claim 1, characterized in that, The loudspeaker I (13) is a MEMS loudspeaker, a moving iron loudspeaker, or a moving coil loudspeaker; the loudspeaker II (15) is a MEMS loudspeaker, a moving iron loudspeaker, or a moving coil loudspeaker.

3. The sound-generating module unit (10) according to claim 2, characterized in that, The sound-emitting module unit (10) further includes a sound-emitting plate (12), which includes a boss (120) and a peripheral side portion (121) surrounding the boss (120); the sound-emitting plate (12) has a central sound-emitting hole (122) that penetrates the boss (120), the sound-emitting hole (122) is connected to the sound-emitting end of the speaker I (13), and the peripheral side portion (121) has peripherally spaced edge sound-emitting holes (123), the sound-emitting holes (123) are connected to the sound-emitting end of the speaker II (15).

4. The sound-generating module unit (10) according to claim 3, characterized in that, The sound-generating module unit (10) also includes a signal processing circuit unit (16), which includes a substrate (161) and electrical components (162) disposed on the substrate (161).

5. The sound-generating module unit (10) according to claim 4, characterized in that, Corresponding to the long through groove (1413) and the long groove (1414), the substrate (161) is constructed with a notch (1611), and the substrate (161) is constructed with a through hole II (1612), which is connected to the back sound end of the speaker II (15).

6. The sound-generating module unit (10) according to claim 5, characterized in that, The end of the housing (11) extends from the wall of the housing (11) toward the center to form flange I (111) and flange II (112), and defines the inner diameter of the housing (11).

7. The sound-generating module unit (10) according to claim 6, characterized in that, The inner diameter defined by flange I (111) of the housing (11) is greater than the inner diameter defined by flange II (112).

8. The sound-generating module unit (10) according to claim 7, characterized in that, The sound plate (12) is disposed on the flange II (112) side of the housing (11).

9. The sound-generating module unit (10) according to claim 8, characterized in that, The inner surface of the sidewall (141) of the first space (143) is stepped.

10. An earphone, characterized in that, The sound-generating module unit (10) includes any one of claims 1-9 above.

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