Loudspeaker module and electronic device

Abstract

The utility model belongs to electroacoustic conversion technical field, and relates to a kind of loudspeaker module and electronic equipment, and loudspeaker module includes metal shell and sounding single body, metal shell includes bottom wall and the side wall of the circumference around bottom wall setting, bottom wall and side wall are enclosed to form and have the receiving cavity with opening, the thickness of metal shell is 0.15mm-0.3mm, sounding single body is received in receiving cavity, when loudspeaker module is assembled to electronic equipment, the component of electronic equipment covers opening.The above structure can reduce the overall thickness of loudspeaker module, and then can adapt to the requirement of electronic equipment increasingly light and thin.

Description

Technical Field

[0001] This utility model belongs to the field of electroacoustic conversion technology, and specifically relates to a loudspeaker module and electronic equipment. Background Technology

[0002] A loudspeaker module is an electroacoustic conversion device that is commonly used as a sound-generating structure in electronic devices.

[0003] With technological advancements, electronic products are not only demanding higher performance but also becoming increasingly thinner and lighter. Correspondingly, speaker modules must not only adapt to reduced space but also achieve improved performance. Therefore, ensuring speaker module performance within a limited space is a critical issue that urgently needs to be addressed.

[0004] Therefore, in view of the above shortcomings, this utility model is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a speaker module and electronic device to at least partially solve the above-mentioned technical problems.

[0006] The first aspect of this utility model provides a speaker module, comprising:

[0007] A metal housing, comprising a bottom wall and side walls surrounding the periphery of the bottom wall, wherein the bottom wall and the side walls enclose a receiving cavity with an opening, and the thickness of the metal housing is 0.15mm-0.3mm;

[0008] A sound-emitting unit, wherein the sound-emitting unit is housed within the receiving cavity;

[0009] When the speaker module is assembled into an electronic device, components of the electronic device cover the opening.

[0010] In one specific embodiment of this utility model, the material of the metal casing includes stainless steel, aluminum alloy, titanium alloy, or iron; and / or,

[0011] The thickness of the metal casing is 0.2 mm.

[0012] In one specific embodiment of this utility model, the inner wall of the metal shell is provided with a baffle wall, the baffle wall defines the installation position of the sound-generating unit, and the bottom wall, the baffle wall and the sound-generating unit together enclose to form a front cavity.

[0013] In one specific embodiment of this utility model, the side wall has a notch, and a sound hole is provided at the notch, which communicates with the front cavity.

[0014] In one specific embodiment of this utility model, the sound hole portion and the retaining wall are integrally injection molded.

[0015] In one specific embodiment of this utility model, an annular sealing ring is further included, which is disposed between the metal housing and the electronic device.

[0016] In one specific embodiment of this utility model, it further includes an FPC, one end of which is connected to the sound-generating unit, and the other end is attached to the inner wall of the metal shell.

[0017] In one specific embodiment of this utility model, the retaining wall is provided with a support body with an inclined surface on the outer side away from the front cavity, and the FPC is at least partially placed on the inclined surface.

[0018] In one specific embodiment of this utility model, a fixing ear is further included, which is welded and fixed to the side wall.

[0019] The second aspect of this utility model also provides an electronic device, including any one of the speaker modules described above.

[0020] The speaker module provided by this utility model includes a metal housing and a sound-emitting unit. The metal housing is formed with an open receiving cavity, and during assembly, it is fitted with components of the electronic device to form a complete cavity. Compared to the full-cavity speaker modules in related technologies, the semi-cavity metal housing used in this utility model can reduce the overall thickness of the speaker module without affecting its acoustic performance, thus meeting the increasingly thinner and lighter requirements of electronic devices. Furthermore, compared to traditional plastic housings, the metal housing, with a thickness of 0.15mm-0.3mm, further reduces the thickness of the speaker module while maintaining the same cavity volume. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a top view of a speaker module in one embodiment of the present invention;

[0023] Figure 2 This is a perspective view of a speaker module in one embodiment of the present invention;

[0024] Figure 3 This is an exploded view of a speaker module in one embodiment of the present invention.

[0025] Explanation of reference numerals in the attached figures:

[0026] 11-Side wall, 111-Flanged edge, 12-Bottom wall, 13-Fixing ear, 131-Fixing hole, 14-Baffle wall, 141-Support body, 15-Sound hole, 20-Sound generating unit, 30-FPC, 40-Dustproof net, 50-Sealing ring. Detailed Implementation

[0027] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0028] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0029] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0030] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0031] This invention proposes a speaker module that can be used as a sound-generating component of electronic devices. The speaker module not only maintains its sound performance while reducing its thickness, but also reduces its material costs, thereby adapting to the trend of increasingly thinner and lighter electronic devices and meeting the performance requirements of electronic devices.

[0032] Reference Figures 1-3 This utility model proposes a speaker module, including a metal housing and a sound-emitting unit 20. The metal housing includes a bottom wall 12 and side walls 11 arranged around the periphery of the bottom wall 12. The bottom wall 12 and the side walls 11 enclose a receiving cavity with an opening. The thickness of the metal housing is 0.15mm-0.3mm. The sound-emitting unit 20 is housed within the receiving cavity. When the speaker module is assembled into an electronic device, the components of the electronic device cover the opening. The housing is made of metal, which reduces the thickness of the speaker module while maintaining a certain cavity volume, or increases the cavity volume while maintaining a certain speaker module thickness, thereby improving the acoustic performance of the speaker module. The metal housing thickness of 0.15mm-0.3mm allows for good rigidity while reducing thickness, ensuring reliability. Furthermore, by using components of the electronic device to cover the opening, compared to a closed housing, one layer of housing is reduced at the opening, reducing material usage, lowering costs, and also contributing to a reduction in product thickness.

[0033] In one embodiment, the thickness of the metal housing can be 0.2 mm. At this point, the metal housing is sufficiently rigid and thin, and the space utilization rate is 25.6% higher than that of a conventional plastic semi-cavity speaker module.

[0034] In one embodiment, the metal casing may be made of, but is not limited to, stainless steel, aluminum alloy, titanium alloy or iron, and the manufacturing process of the above-mentioned metal materials is mature enough, and the material hardness and stability are high enough.

[0035] In one embodiment, the inner wall of the metal housing is provided with a baffle 14, which defines the mounting position of the sound-emitting unit 20. Specifically, the baffle 14 is provided on the bottom wall 12, and the bottom wall 12, the baffle 14 and the sound-emitting unit 20 together enclose the front cavity.

[0036] The shape of the mounting position is approximately the same as that of the sound-generating unit 20. The sound-generating unit 20 is placed in the mounting position with the vibrating system side facing the bottom wall 12, and then fixedly connected to the metal housing. The side of the sound-generating unit 20 is adapted to and limited by the retaining wall 14.

[0037] In this embodiment, by setting a retaining wall 14 to define the installation position, it can facilitate the relative positioning of the metal shell and the sound-generating unit 20, thereby improving the positioning accuracy. On the other hand, the retaining wall 14 provides a certain space for excess glue, thereby improving the aesthetics of the speaker module.

[0038] In one embodiment, the sidewall 11 has a notch, and a sound hole 15 is provided at the notch, which communicates with the front cavity. The sound emitted by the sound-emitting unit 20 enters the front cavity and is propagated to the outside through the sound hole 15.

[0039] In one embodiment, the sound hole 15 and the baffle 14 are integrally injection molded, that is, the sound hole 15 and the baffle 14 are injection molded on the metal shell. The use of partial injection molding process can simplify the complex structure, increase the appearance and texture of the product, improve the durability of the product, and the partial injection molding process is relatively simple, reduces processing steps, improves production efficiency and reduces product defect rate.

[0040] In one embodiment, an annular sealing ring 50 is also included, which is disposed between the metal housing and the electronic device. Specifically, the shape of the sealing ring 50 is approximately the same as the shape of the opening in the metal housing, and it is clamped between the metal housing and the electronic device during assembly to ensure the sealing of the metal housing, thereby ensuring the performance of the speaker module.

[0041] More specifically, the periphery of the opening formed by the side wall 11 is bent outward to form a flange 111, and the sealing ring 50 is connected to the flange 111. The sealing ring 50 is located between the flange 111 and the electronic device to further improve its sealing performance.

[0042] In one embodiment, the speaker module further includes an FPC30 (flexible printed circuit), one end of which is connected to the sound-generating unit 20 and electrically connected to the voice coil of the sound-generating unit 20, and the other end is attached to the inner wall of the metal housing. Specifically, the other end of the FPC30 is attached to the bottom wall 12, and the other end of the FPC30 has a solder pad located on the side of the FPC30 away from the bottom wall 12. A single-sided solder pad FPC30 has lower cost. When the speaker module is assembled into an electronic device, the electrical connectors inside the electronic device are electrically connected to the solder pads. The electrical connection between the electrical connectors and the solder pads can be a contact connection, a soldering connection, a flexible contact connection, etc.

[0043] Electrical connectors include spring contacts, spring pins, probes, connectors, cable wires, or flying wires. Specifically, spring contacts, spring pins, and probes can make elastic contact with pads, connectors can be plugged into pads, and cable wires and flying wires can be soldered to pads. In practical applications, any of the above electrical connectors can be selected as needed.

[0044] In this embodiment, the electrical connector is connected to the motherboard of the electronic device. When the electrical connector is connected to the pad, the motherboard is connected to the voice coil of the sound-generating unit 20, thereby enabling control of the voice coil current to control the sound output of the sound-generating unit 20.

[0045] In one embodiment, the retaining wall 14 is provided with a support body 141 with an inclined surface on the outer side away from the front cavity, and the fpc30 is at least partially placed on the inclined surface. The fpc30 is partially attached to the inclined surface, the support body 141 provides support for the fpc30, and the inclined surface prevents the fpc30 from bending excessively, thereby improving reliability.

[0046] In one embodiment, the speaker module further includes mounting ears 13, that is, a plurality of mounting ears 13 are provided on the outer periphery of the metal housing. The mounting ears 13 have mounting holes 131. The speaker module is connected to the electronic device by screws passing through the mounting holes 131, thereby improving the reliability of the connection between the two.

[0047] Specifically, the fixing ear 13 is welded to the side wall 11. The fixing ear 13 has a connecting part and a bending part. The connecting part is welded to the side wall 11, and the bending part is provided with a fixing hole 131.

[0048] Optionally, a dustproof mesh 40 is also provided at the sound hole section 15 to improve the dustproof performance of the speaker module.

[0049] The second aspect of this utility model also provides an electronic device, including the speaker module described above. Since the electronic device includes the speaker module in all the above embodiments, it also includes at least the beneficial effects of all the above embodiments, which will not be elaborated here.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A speaker module, characterized in that, include: A metal housing, comprising a bottom wall and side walls surrounding the periphery of the bottom wall, wherein the bottom wall and the side walls enclose a receiving cavity with an opening, and the thickness of the metal housing is 0.15mm-0.3mm; A sound-emitting unit, wherein the sound-emitting unit is housed within the receiving cavity; When the speaker module is assembled into an electronic device, components of the electronic device cover the opening.

2. The speaker module according to claim 1, characterized in that, The metal casing is made of stainless steel, aluminum alloy, titanium alloy, or iron; and / or, The thickness of the metal casing is 0.2 mm.

3. The speaker module according to claim 1, characterized in that, The inner wall of the metal casing is provided with a baffle wall, which defines the installation position of the sound-generating unit. The bottom wall, the baffle wall, and the sound-generating unit together enclose and form a front cavity.

4. The speaker module according to claim 3, characterized in that, The sidewall has a notch, and a sound hole is provided at the notch, which communicates with the front cavity.

5. The speaker module according to claim 4, characterized in that, The acoustic hole is integrally injection molded with the retaining wall.

6. The speaker module according to claim 1, characterized in that, It also includes an annular sealing ring disposed between the metal housing and the electronic device.

7. The speaker module according to claim 3, characterized in that, It also includes an FPC, one end of which is connected to the sound-generating unit, and the other end is attached to the inner wall of the metal housing.

8. The speaker module according to claim 7, characterized in that, The retaining wall is provided with a support body with an inclined surface on the outer side away from the front cavity, and the FPC is at least partially placed on the inclined surface.

9. The speaker module according to claim 1, characterized in that, It also includes a fixing ear, which is welded and fixed to the side wall.

10. An electronic device, characterized in that, Includes the speaker module as described in any one of claims 1-9.

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