A circuit board integrated with a heat dissipation channel

Abstract

The utility model discloses a kind of integrated heat dissipation passageway's circuit board belong to circuit board technical field, to the problem that integrated circuit board cannot be uniformly heat dissipation operation and heat dissipation structure is more likely to cause electronic components heat generation on circuit board, including mounting plate, mounting groove and circuit board main body, positioning device is provided on the mounting plate for the positioning installation of circuit board main body, mounting hole is provided on the left and right sides of mounting plate, heat dissipation mechanism is provided on the mounting plate on the bottom of circuit board main body for the heat dissipation of circuit board main body, the left and right sides of the bottom of circuit board main body are also provided on the mounting plate Ejector mechanism is used for the installation support of circuit board main body;The heat dissipation mechanism of the utility model is set in the bottom of circuit board main body, can uniformly heat generated on circuit board main body is heat-conducted and radiated, to improve the heat dissipation uniformity of circuit board main body, and then improve heat dissipation efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically relating to a circuit board with integrated heat dissipation channels. Background Technology

[0002] An integrated circuit board, also known as an integrated circuit board, is a carrier that holds integrated circuits, but the term integrated circuit board is often used in conjunction with integrated circuits.

[0003] A prior art patent, CN221103622U, describes an integrated circuit board with convenient heat dissipation. This patent includes a circuit board body, a heat sink on top of the circuit board body, mounting tubes fixed on both sides of the heat sink, and screws threaded to the mounting tubes on both sides of the circuit board body. Multiple heat-conducting plates are detachably mounted on the bottom of the heat sink, with the lower surface of the heat-conducting plates contacting the upper surface of the circuit board body. A heat dissipation groove is formed on the top of the heat sink, with a fixing ring at the center of the groove. Both sides of the fixing ring are fixedly connected to the sides of the heat dissipation groove via fixing rods, and an exhaust fan is fixedly installed inside the fixing ring. The bottom of the heat dissipation groove... The integrated circuit board has multiple evenly distributed threaded holes and adopts a structure of heat sink and exhaust fan, which allows the surface heat of the integrated circuit board to be dissipated quickly, facilitating heat dissipation and extending the service life of the integrated circuit board. However, in actual use, there are still the following shortcomings: From a practical point of view, in the process of heat dissipation of the integrated circuit board, the heat dissipation operation is carried out by the fan structure set on the top. The fan blowing position is fixed and the range is limited, which cannot perform a relatively uniform heat dissipation operation on the integrated circuit board, reducing the heat dissipation performance. At the same time, the fan structure on the top of the integrated circuit board forms a closed space for the electronic components, which makes the electronic components more prone to heat generation, further reducing the heat dissipation efficiency of the electronic components.

[0004] Therefore, there is a need for a circuit board with integrated heat dissipation channels to solve the problems in the existing technology, such as the inability to perform uniform heat dissipation on the integrated circuit board and the fact that the heat dissipation structure is more likely to cause heat generation in the electronic components on the circuit board. Utility Model Content

[0005] The purpose of this invention is to provide a circuit board with an integrated heat dissipation channel to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a circuit board with an integrated heat dissipation channel, comprising a mounting plate, a mounting groove, and a circuit board body. The mounting groove is located on the top of the mounting plate, and the circuit board body is mounted on the upper part of the mounting plate through the mounting groove. A positioning device is provided on the mounting plate for positioning and mounting the circuit board body. Mounting holes are provided on the left and right sides of the mounting plate. A heat dissipation mechanism is provided on the bottom of the circuit board body on the mounting plate for heat dissipation of the circuit board body. Ejection mechanisms are also provided on the left and right sides of the bottom of the circuit board body on the mounting plate for mounting support of the circuit board body.

[0007] The positioning device includes a positioning cylinder, a screw, and a baffle. The positioning cylinder is fixedly installed on the top of the mounting plate through a mounting groove. The baffle is fixedly connected to the screw. The screw is threadedly connected to the positioning cylinder. The circuit board body has a through hole corresponding to the mounting plate. The baffle on the screw is used to limit the upper part of the circuit board body.

[0008] It should be noted in the solution that there are four positioning cylinders, which are located near the four corners of the mounting groove.

[0009] It is worth noting that the diameter of the baffle is larger than the diameter of the top of the positioning cylinder.

[0010] Furthermore, it should be noted that the heat dissipation mechanism includes a heat-conducting plate, which is located at the bottom of the circuit board body and fixedly connected to the mounting plate. A heat sink is fixedly connected to the bottom of the heat-conducting plate. A heat dissipation channel is provided on one side of the heat sink between the heat-conducting plate and the mounting plate. An air inlet is provided at the front of the heat dissipation channel, and a guide port is provided at the rear of the heat dissipation channel. A mounting frame is fixedly connected to the outside of the guide port on the mounting plate. A fan is fixedly installed inside the mounting frame. A slot is opened on the mounting plate at the front of the air inlet. A fixing plate is detachably installed in the slot. A dustproof net is fixedly connected to the fixing plate. A push block is fixedly connected to the upper part of the front surface of the dustproof net.

[0011] In a preferred embodiment, multiple heat sinks are provided at the bottom of the heat-conducting plate, and the multiple heat sinks are evenly spaced through heat dissipation channels.

[0012] In one preferred embodiment, multiple fans are evenly installed within the mounting frame.

[0013] In a preferred embodiment, the ejection mechanism includes two limiting grooves, which are symmetrically opened on the mounting plate and located on both sides of the heat-conducting plate. A movable plate is slidably disposed in the limiting groove, and an ejection block is fixedly connected to the top. A spring is fixedly installed at the bottom of the movable plate in the limiting groove.

[0014] In a preferred embodiment, the top of the ejector block is compressed by a spring and positioned horizontally with the top of the limiting groove.

[0015] Compared with the prior art, the circuit board with integrated heat dissipation channel provided by this utility model has at least the following beneficial effects:

[0016] (1) By setting a heat dissipation mechanism, which is located at the bottom of the circuit board body, the heat generated on the circuit board body can be evenly conducted and dissipated, thereby improving the heat dissipation uniformity of the circuit board body and thus improving the heat dissipation efficiency.

[0017] (2) By using the positioning device and the ejection mechanism, the circuit board body can be positioned and installed on the upper part of the mounting plate, so that the electronic components on the circuit board body are not blocked, so that the heat generated by the relevant electronic components during use can be cooled and dissipated quickly, and the heat dissipation mechanism can further improve its heat dissipation efficiency. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a frontal sectional view of the present invention.

[0020] Figure 3 This is a side view sectional view of the present invention.

[0021] Figure 4 This is a schematic diagram of the disassembled structure of this utility model.

[0022] In the diagram: 1. Mounting plate; 101. Mounting hole; 2. Mounting slot; 3. Circuit board body; 4. Positioning device; 401. Positioning cylinder; 402. Screw; 403. Baffle; 5. Heat dissipation mechanism; 501. Heat-conducting plate; 502. Heat sink; 503. Heat dissipation channel; 504. Mounting frame; 505. Fan; 506. Air guide port; 507. Air inlet; 508. Fixing plate; 509. Dustproof net; 5010. Slot; 5011. Push block; 6. Ejection mechanism; 601. Limiting slot; 602. Movable plate; 603. Ejection block; 604. Spring. Detailed Implementation

[0023] The present invention will be further described below with reference to the embodiments.

[0024] Please see Figure 1-4This utility model provides a circuit board with an integrated heat dissipation channel, including a mounting plate 1, a mounting groove 2, and a circuit board body 3. The mounting groove 2 is located on the top of the mounting plate 1, and the circuit board body 3 is mounted on the upper part of the mounting plate 1 through the mounting groove 2. The mounting plate 1 is provided with a positioning device 4 for positioning and mounting the circuit board body 3. Mounting holes 101 are provided on the left and right sides of the mounting plate 1. A heat dissipation mechanism 5 is provided on the bottom of the circuit board body 3 on the mounting plate 1 for heat dissipation of the circuit board body 3. The bottom left and right sides of the circuit board body 3 are also provided with an ejection mechanism 6 on the mounting plate 1 for mounting support of the circuit board body 3.

[0025] The positioning device 4 includes a positioning cylinder 401, a screw 402, and a baffle 403. The positioning cylinder 401 is fixedly installed on the top of the mounting plate 1 through the mounting groove 2. The baffle 403 is fixedly connected to the screw 402. The screw 402 is internally threaded to the positioning cylinder 401. The circuit board body 3 has a through hole corresponding to the mounting plate 1. The baffle 403 on the screw 402 is used to limit the upper part of the circuit board body 3. Four positioning cylinders 401 are provided. The four positioning cylinders 401 are set near the four corners of the mounting groove 2. The diameter of the baffle 403 is larger than the top diameter of the positioning cylinder 401.

[0026] By removing the screw 402 from the upper part of the positioning cylinder 401, the circuit board body 3 is aligned with the positioning cylinder 401 and installed in the mounting groove 2. At this time, the bottom of the baffle 403 is limited by the installation screw 402.

[0027] Further as Figure 2 , Figure 3 and Figure 4 As shown, it is worth noting that the heat dissipation mechanism 5 includes a heat-conducting plate 501, which is located at the bottom of the circuit board body 3 and fixedly connected to the mounting plate 1. A heat sink 502 is fixedly connected to the bottom of the heat-conducting plate 501. A heat dissipation channel 503 is provided on one side of the heat sink 502 between the heat-conducting plate 501 and the mounting plate 1. Multiple heat sinks 502 are provided at the bottom of the heat-conducting plate 501. The multiple heat sinks 502 are evenly spaced through the heat dissipation channel 503. An air inlet 507 is provided at the front of the heat dissipation channel 503. A guide port 506 is provided on the rear side of the heat dissipation channel 503. A mounting frame 504 is fixedly connected to the outside of the guide port 506 on the mounting plate 1. A fan 505 is fixedly installed inside the mounting frame 504. Multiple fans 505 are evenly installed inside the mounting frame 504. A slot 5010 is opened on the mounting plate 1 at the front of the air inlet 507. A fixing plate 508 is detachably installed in the slot 5010. A dustproof net 509 is fixedly connected to the fixing plate 508. A push block 5011 is fixedly connected to the upper part of the front surface of the dustproof net 509.

[0028] Among them, the heat-conducting plate 501 is made of 6063 aluminum alloy with a thermal conductivity ≥200W / (m·K).

[0029] During use, the heat generated on the circuit board body 3 is rapidly conducted through the heat-conducting plate 501 and then transferred to the heat sink 502. Simultaneously, with the operation of the fan 505, airflow enters the air inlet 507 through the dust filter 509 and is blown out by the fan 505 through the heat dissipation channel 503. The rapid airflow within the heat dissipation channel 503 quickly dissipates heat from the heat sink 502, thereby improving the heat transfer efficiency. This facilitates rapid heat dissipation of the circuit board body 3 through the heat-conducting plate 501 and the heat sink 502, and the heat is evenly distributed at the bottom of the circuit board body 3, improving the uniformity of heat dissipation.

[0030] As can be seen from the above working process, the heat dissipation mechanism 5, which is located at the bottom of the circuit board body 3, can evenly conduct and dissipate the heat generated on the circuit board body 3, thereby improving the heat dissipation uniformity of the circuit board body 3 and thus improving the heat dissipation efficiency.

[0031] Further as Figure 1 , Figure 2 and Figure 4 As shown, it is worth noting that the ejection mechanism 6 includes two limiting grooves 601. The two limiting grooves 601 are symmetrically opened on the mounting plate 1 and located on both sides of the heat-conducting plate 501. A movable plate 602 is slidably arranged in the limiting groove 601. An ejection block 603 is fixedly connected to the top of the plate 602. A spring 604 is fixedly installed at the bottom of the movable plate 602 in the limiting groove 601. The top of the ejection block 603 is compressed by the spring 604 and is set horizontally with the top of the limiting groove 601.

[0032] When in use, when the circuit board body 3 is disassembled by the positioning device 4, the spring force of the spring 604 causes the ejector block 603 to lift the circuit board body 3 from the bottom into the mounting groove 2, so as to facilitate the disassembly of the circuit board body 3.

[0033] This solution has the following working process: When this device is used, by disassembling the screw 402 from the upper part of the positioning cylinder 401, the through hole on the circuit board body 3 is aligned with the positioning cylinder 401, and the circuit board body 3 is installed in the mounting groove 2. At this time, the bottom of the baffle 403 is limited by the mounting screw 402, and the bottom of the circuit board body 3 is pressed against the top of the ejector block 603. The ejector block 603 slides inside the limiting groove 601 through the movable plate 602 and presses against the spring 604, thereby making the circuit board body 3 stably installed in the mounting groove 2, and the bottom is tightly attached to the heat-conducting plate 501. Under the operation of the circuit board body 3, the heat generated on it is quickly conducted through the heat-conducting plate 501, and the heat is conducted on the heat sink 502. At this time, under the operation of the fan 505, the airflow passes through the dustproof net 50. 9. The air enters the air inlet 507 and is blown out by the fan 505 through the heat dissipation channel 503. The rapid airflow inside the heat dissipation channel 503 can quickly dissipate heat from the heat sink 502, thereby improving the heat transfer efficiency. This allows the heat conduction plate 501 and the heat sink 502 to quickly dissipate heat from the circuit board body 3. The heat sink is evenly distributed at the bottom of the circuit board body 3, improving the uniformity of heat dissipation. At the same time, the exposed circuit board body 3 prevents heat accumulation, allowing the electronic components installed on it to cool naturally, further improving its cooling efficiency. When the circuit board body 3 is disassembled by the positioning device 4, the spring force of the spring 604 causes the ejector block 603 to lift the circuit board body 3 from the bottom into the mounting groove 2, facilitating the disassembly of the circuit board body 3.

[0034] In summary: The heat dissipation mechanism 5, located at the bottom of the circuit board body 3, can evenly conduct and dissipate the heat generated on the circuit board body 3, thereby improving the heat dissipation uniformity of the circuit board body 3 and thus improving the heat dissipation efficiency; the positioning device 4, in conjunction with the ejection mechanism 6, facilitates the positioning and installation of the circuit board body 3 on the upper part of the mounting plate 1, ensuring that the electronic components on the circuit board body 3 are not obstructed, so that the heat generated by the relevant electronic components during use can be quickly and naturally cooled, thereby further improving the heat dissipation efficiency in conjunction with the heat dissipation mechanism 5.

Claims

1. A circuit board with an integrated heat dissipation channel, comprising a mounting plate (1), a mounting groove (2), and a circuit board body (3), wherein the mounting groove (2) is disposed on the top of the mounting plate (1), and the circuit board body (3) is mounted on the upper part of the mounting plate (1) through the mounting groove (2), characterized in that: The mounting plate (1) is provided with a positioning device (4) for positioning and installing the circuit board body (3). The mounting plate (1) is provided with mounting holes (101) on the left and right sides. The bottom of the circuit board body (3) is provided with a heat dissipation mechanism (5) on the mounting plate (1) for dissipating heat from the circuit board body (3). The bottom left and right sides of the circuit board body (3) are also provided with an ejection mechanism (6) on the mounting plate (1) for supporting the installation of the circuit board body (3). The positioning device (4) includes a positioning cylinder (401), a screw (402) and a baffle (403). The positioning cylinder (401) is fixedly installed on the top of the mounting plate (1) through the mounting groove (2). The baffle (403) is fixedly connected to the screw (402). The screw (402) is internally threaded to the positioning cylinder (401). The circuit board body (3) has a through hole corresponding to the mounting plate (1) at (30). The baffle (403) on the screw (402) is used to limit the upper part of the circuit board body (3).

2. The circuit board with an integrated heat dissipation channel according to claim 1, characterized in that: Four positioning cylinders (401) are provided, and the four positioning cylinders (401) are located near the four corners of the mounting groove (2).

3. The circuit board with an integrated heat dissipation channel according to claim 2, characterized in that: The diameter of the baffle (403) is larger than the top diameter of the positioning cylinder (401).

4. The circuit board with an integrated heat dissipation channel according to claim 3, characterized in that: The heat dissipation mechanism (5) includes a heat-conducting plate (501), which is located at the bottom of the circuit board body (3) and fixedly connected to the mounting plate (1). A heat sink (502) is fixedly connected to the bottom of the heat-conducting plate (501). A heat dissipation channel (503) is provided on one side of the heat sink (502) between the heat-conducting plate (501) and the mounting plate (1). An air inlet (507) is provided at the front of the heat dissipation channel (503), and a guide port (507) is provided at the rear of the heat dissipation channel (503). 6) The guide port (506) is fixedly connected to the mounting plate (1) with a mounting frame (504) on the outside. A fan (505) is fixedly installed in the mounting frame (504). A slot (5010) is opened on the mounting plate (1) at the front of the air inlet (507). A fixing plate (508) is detachably installed in the slot (5010). A dustproof net (509) is fixedly connected to the fixing plate (508). A push block (5011) is fixedly connected to the upper part of the front surface of the dustproof net (509).

5. A circuit board with an integrated heat dissipation channel according to claim 4, characterized in that: Multiple heat sinks (502) are provided at the bottom of the heat-conducting plate (501), and the multiple heat sinks (502) are evenly spaced through heat dissipation channels (503).

6. The circuit board with an integrated heat dissipation channel according to claim 5, characterized in that: Multiple fans (505) are evenly installed within the mounting frame (504).

7. A circuit board with an integrated heat dissipation channel according to claim 6, characterized in that: The ejection mechanism (6) includes two limiting grooves (601), which are symmetrically opened on the mounting plate (1) and located on both sides of the heat-conducting plate (501). A movable plate (602) is slidably arranged in the limiting groove (601). An ejection block (603) is fixedly connected to the top of the (60) and a spring (604) is fixedly installed at the bottom of the movable plate (602) in the limiting groove (601).

8. A circuit board with an integrated heat dissipation channel according to claim 7, characterized in that: The top of the ejector block (603) is compressed by a spring (604) and horizontally positioned at the top of the limiting groove (601).

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