Optimized line-up anti-interference circuit board

Abstract

The utility model discloses an optimization line row anti -interference circuit board, including the board main part for containing fixed line, one side of board main part is equipped with the first pin end, the other side of board main part is equipped with the second pin end, the first pin end between the second pin end of board main part one side is equipped with the component area for installing component, one side of second pin end is equipped with the first copper area that exposes for grounding to increase static electricity export, the thickness ratio of first copper area that exposes with the thickness of board main part is 1:2~5. Through improve the thickness ratio of first copper area that exposes relative board main part, thicken copper layer makes the grounding loop resistance reduce, improves static electricity discharge efficiency, and the optimization circuit board performance enhances the heat capacity simultaneously, restrains the sheet deformation of temperature rise, and guarantees signal transmission stability, reduces the interference of static electricity to circuit board.

Description

[Technical Field]

[0001] This utility model relates to the field of printed circuit technology, and in particular to an optimized line bar anti-interference circuit board. [Background Technology]

[0002] Flexible printed circuit boards (FPCs), using polyimide (PI) or polyester (PET) films as substrates, have become a key solution for the miniaturization and integration of modern electronic devices due to their high flexibility, thinness, and bendability. Compared to traditional rigid circuit boards, FPCs can be freely bent, rolled, or folded in three-dimensional space, significantly optimizing space utilization. They are particularly suitable for applications requiring dynamic deformation, such as smartphone hinges, wearable devices, and medical electronics.

[0003] However, flexible printed circuit boards (PCBs) are widely used in smart terminal screen assemblies due to their thinness and bendability. However, their insulating substrate and dense wiring structure are prone to static electricity buildup during production, assembly, and use due to friction and electric field induction. When the static voltage exceeds the breakdown threshold of integrated circuits or micro-components, it can damage the oxide layer or melt the metal interconnects, leading to interruption of the display drive signal. Therefore, an optimized anti-interference PCB with optimized line bars is needed. [Utility Model Content]

[0004] To solve the above-mentioned technical problems, this utility model proposes an optimized anti-interference circuit board with a wireline.

[0005] This utility model is achieved by the following technical solution:

[0006] An optimized line bus anti-interference circuit board includes a board body for accommodating fixed lines. A first pin terminal is provided on one side of the board body, and a second pin terminal is provided on the other side of the board body. A component area for mounting components is provided between the first pin terminal and the second pin terminal on one side of the board body. A first exposed copper area for grounding to increase static electricity discharge is provided on one side of the second pin terminal. The ratio of the thickness of the first exposed copper area to the thickness of the board body is 1:2 to 5.

[0007] By increasing the thickness ratio of the first exposed copper area relative to the main body of the board, the thickened copper layer reduces the grounding circuit resistance, improves electrostatic discharge efficiency, optimizes the performance of the circuit board, enhances the heat capacity, suppresses board deformation caused by temperature rise, ensures signal transmission stability, and reduces electrostatic interference to the circuit board.

[0008] As described above, the optimized line bus anti-interference circuit board has a first electromagnetic film on one side of the board body to prevent electromagnetic signals from interfering with the normal operation of electrical components.

[0009] As described above, in the optimized line bus anti-interference circuit board, a first reinforcing steel plate is provided on the side of the board body away from the component area, and a second exposed copper area is provided on the other side of the first reinforcing steel plate opposite to the first electromagnetic film.

[0010] As described above, the optimized line bus anti-interference circuit board has a connector on the other side of the board body corresponding to the first reinforcing steel plate.

[0011] As described above, the optimized line array anti-interference circuit board has a bending portion between the side of the component area on the board body and the side of the first reinforcing steel plate to facilitate protection of the board when it is bent.

[0012] The optimized busbar anti-interference circuit board described above includes a single-layer region with a softened finish in the bent portion.

[0013] As described above, the optimized busbar anti-interference circuit board has a second electromagnetic membrane on one side of the board body and the connector to prevent electromagnetic signals from interfering with the normal operation of electrical components, and the two sides of the bent portion are connected to the second electromagnetic membrane.

[0014] As described above, the optimized line bus anti-interference circuit board has a second reinforcing steel plate on the other side of the board body at a location corresponding to the component area.

[0015] As described above, the optimized line bus anti-interference circuit board has a mounting component for fixed installation on one side of the board body and the side where the connector is located.

[0016] The optimized line bus anti-interference circuit board described above has a main body made of polyimide or polyester material.

[0017] Compared with the prior art, the optimized busbar anti-interference circuit board proposed in this utility model has the following beneficial effects:

[0018] 1. By increasing the thickness ratio of the first exposed copper area relative to the main body of the board, the copper layer is thickened, which reduces the grounding circuit resistance, improves the electrostatic discharge efficiency, optimizes the performance of the circuit board, enhances the heat capacity, suppresses board deformation caused by temperature rise, ensures signal transmission stability, and reduces electrostatic interference to the circuit board.

[0019] 2. The device is mounted to the component area by adhesive. This area is used to install integrated circuit chips and is responsible for core functions such as signal processing and control. The first exposed copper area is grounded to increase the discharge of static electricity and prevent excessive static electricity in the screen assembly from damaging the IC or components and causing no display. [Attached Image Description]

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0021] Figure 1 This is a schematic diagram of one perspective of the present invention;

[0022] Figure 2 This is a schematic diagram from another perspective of the present invention.

[0023] The corresponding reference numerals in the attached figures are as follows:

[0024] 1. Board body; 101. First pin terminal; 102. Second pin terminal; 11. Component area; 12. First exposed copper area; 13. First electromagnetic film; 14. First reinforcing steel plate; 15. Second exposed copper area; 16. Connector; 17. Bending part; 171. Single-layer area; 18. Second electromagnetic film; 19. Second reinforcing steel plate; 2. Mounting parts.

Detailed Implementation Methods

[0025] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0026] Specific embodiments, combined with Figures 1 to 2 As shown, further illustrating the technical solution of this utility model, an optimized line bus anti-interference circuit board includes a board body 1 for accommodating fixed lines. A first pin terminal 101 is provided on one side of the board body 1, and a second pin terminal 102 is provided on the other side. A component area 11 for mounting components is provided between the first pin terminal 101 and the second pin terminal 102 on one side of the board body 1. A first exposed copper area 12 for grounding to increase static electricity discharge is provided on one side of the second pin terminal 102. Devices are glued to the component area 11, which is the area for mounting integrated circuit chips responsible for core functions such as signal processing and control. The grounding of the first exposed copper area 12 increases static electricity discharge, preventing excessive static electricity in the screen assembly from damaging ICs or components and causing no display.

[0027] Furthermore, as a preferred embodiment of this solution and not a limitation, the ratio of the thickness of the first exposed copper area 12 to the thickness of the board body 1 is 1:2 to 5. Preferably, the ratio of the thickness of the first exposed copper area 12 to the thickness of the board body 1 is 1:2. By increasing the thickness ratio of the first exposed copper area 12 to the board body 1, the copper layer is thickened, which reduces the grounding circuit resistance, improves the electrostatic discharge efficiency, optimizes the circuit board performance, enhances the heat capacity, suppresses board deformation caused by temperature rise, ensures signal transmission stability, and reduces electrostatic interference to the circuit board.

[0028] Furthermore, as a preferred embodiment of this solution and not a limitation, a first reinforcing steel plate 14 is provided on the side of the board body 1 away from the component area 11, and a second exposed copper area 15 is provided on the other side of the first reinforcing steel plate 14 opposite to the electromagnetic film 13. The first reinforcing steel plate 14 can provide mechanical support for the component area 11, enhance local rigidity, and prevent the component from being damaged by bending, vibration, or external impact of the board body 1.

[0029] Furthermore, as a preferred embodiment of this solution and not a limitation, one side of the board body 1 is provided with a first electromagnetic film 13 for preventing electromagnetic signals from interfering with the normal operation of electrical components. The first electromagnetic film 13 can prevent electromagnetic signals from interfering with the normal operation of electrical components, ensuring the normal operation of the circuit board circuit.

[0030] Furthermore, as a preferred embodiment of this solution and not a limitation, a connector 16 is provided on the other side of the main body 1, corresponding to the first reinforcing steel plate 14. The connector 16 enables electrical connection between the optimized busbar anti-interference circuit board and other circuit boards or electronic components, ensuring stable transmission of current, data signals, or control signals, and realizing circuit functions.

[0031] Furthermore, as a preferred embodiment of this solution and not a limitation, a bending portion 17 is provided on the side of the main body 1 where the component area 11 is located and the side where the first reinforcing steel plate 14 is located to facilitate protection of the plate when it is bent. The bending portion 17 can reduce the bending stress of the wiring, protect the wiring when it is bent, and prevent stress tension from causing the anisotropic conductive adhesive film to peel off and fail, thus ensuring the safe use and service life of the product.

[0032] Furthermore, as a preferred embodiment of this solution and not a limitation, a second electromagnetic membrane 18 is provided on one side of the board body 1 and the connector 16 to prevent electromagnetic signals from interfering with the normal operation of electrical components. The second electromagnetic membrane 18 can prevent electromagnetic signals from interfering with the normal operation of electrical components, ensuring the normal operation of the circuit board.

[0033] Furthermore, as a preferred embodiment of this solution and not a limitation, the bending portion 17 includes a softened single-layer region 171, with both adjacent sides of the single-layer region 171 in contact with the second electromagnetic film 18. The single-layer region 171 can form a bendable structure with the adjacent second electromagnetic film 18. At the same time, the softening treatment of the single-layer region 171 can further optimize the stress at the bending portion 17, avoiding stress tension that could cause the anisotropic conductive adhesive film to peel off and fail.

[0034] Furthermore, as a preferred embodiment of this solution and not a limitation, a second reinforcing steel plate 19 is provided on the other side of the main body 1 at a location corresponding to the component area 16. The second reinforcing steel plate 19 can increase the mechanical strength of the connector 16 area, ensuring a reliable electrical connection between the connector 16 and the FPC, while maintaining the electrical performance of the connector 16 area by providing mechanical support, thus ensuring signal integrity.

[0035] Furthermore, as a preferred embodiment of this solution and not a limitation, a mounting component 2 for fixed installation is provided on one side of the board body 1 where the connector 16 is located. Optionally, the mounting component 2 is double-sided adhesive, which facilitates the fixing of the optimized line anti-interference circuit board to the electronic product, ensuring the normal operation of the circuit board.

[0036] Furthermore, as a preferred embodiment of this solution and not a limitation, the main body 1 of the board is made of polyimide or polyester material. Polyimide material can provide structural support for the product and has high heat resistance, enabling it to withstand the high temperatures of welding; polyester material has good flexibility, which can protect the circuit board from bending.

[0037] The working principle of this embodiment is as follows:

[0038] This utility model proposes an optimized anti-interference circuit board for busbars. By increasing the thickness ratio of the first exposed copper area 12 to the main board body 1, the thickened copper layer reduces the grounding circuit resistance and improves the electrostatic discharge efficiency. The specific principle is as follows:

[0039] The second pin terminal 102 has a first exposed copper area 12 for grounding to increase static electricity discharge. The board body 1 has a first reinforcing steel plate 14 on the side away from the component area 11. The first reinforcing steel plate 14 has a second exposed copper area 15 on the other side opposite to the electromagnetic film 13. The first exposed copper area 12 is grounded. The thickness of the first exposed copper area 12 is in the ratio of 1:2 to 5 to the thickness of the board body 1, which can increase the discharge of static electricity and prevent the screen assembly from being damaged by excessive static electricity, resulting in no display. In addition, the first reinforcing steel plate 14 and the second reinforcing steel plate 19 can provide protection for the component area 11 and the connector 16, and further increase the discharge of static electricity to protect the circuit board.

Claims

1. An optimized busbar anti-interference circuit board, characterized in that, The board includes a main body (1) for accommodating fixed circuits. A first pin terminal (101) is provided on one side of the main body (1), and a second pin terminal (102) is provided on the other side of the main body. A component area (11) for mounting components is provided between the first pin terminal (101) and the second pin terminal (102) on one side of the main body (1). A first exposed copper area (12) for grounding to increase static electricity discharge is provided on one side of the second pin terminal (102). The ratio of the thickness of the first exposed copper area (12) to the thickness of the main body (1) is 1:2~5.

2. The optimized busbar anti-interference circuit board according to claim 1, characterized in that, The main body of the plate (1) has a first electromagnetic membrane (13) on one side to prevent electromagnetic signals from interfering with the normal operation of electrical components.

3. The optimized busbar anti-interference circuit board according to claim 2, characterized in that, A first reinforcing steel plate (14) is provided on the side of the plate body (1) away from the component area (11), and a second exposed copper area (15) is provided on the other side of the first reinforcing steel plate (14) opposite to the first electromagnetic film (13).

4. The optimized busbar anti-interference circuit board according to claim 3, characterized in that, A connector (16) is provided on the other side of the plate body (1) corresponding to the first reinforcing steel plate (14).

5. The optimized busbar anti-interference circuit board according to claim 4, characterized in that, A bending portion (17) is provided between the side of the component area (11) on the main body of the plate (1) and the side of the first reinforcing steel plate (14) to facilitate protection of the plate when it is bent.

6. The optimized busbar anti-interference circuit board according to claim 5, characterized in that, The bent portion (17) includes a single-layer region (171) that has been softened.

7. The optimized busbar anti-interference circuit board according to claim 5, characterized in that, The plate body (1) and the connector (16) are provided with a second electromagnetic membrane (18) on one side to avoid electromagnetic signal interference with the normal operation of electrical components. The two sides of the bent part (17) are connected to the second electromagnetic membrane (18).

8. The optimized busbar anti-interference circuit board according to claim 1, characterized in that, A second reinforcing steel plate (19) is provided on the other side of the plate body (1) at a position corresponding to the component area (11).

9. The optimized busbar anti-interference circuit board according to claim 4, characterized in that, The plate body (1) and the side where the connector (16) is located are provided with a mounting component (2) for fixed installation.

10. The optimized busbar anti-interference circuit board according to claim 1, characterized in that, The main body of the plate (1) is made of polyimide or polyester material.

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