Temperature-voltage acquisition board with wire clamp
By setting wire clamps in the empty area of the acquisition board to position and fix the wire harness, the problem of high fixture and equipment costs caused by the increase in CCS size is solved, realizing low-cost and high-efficiency automated welding, which is suitable for CCS mass production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUHAN TEPUSHENG SENSING TECH CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-07-14
AI Technical Summary
During the assembly process of existing signal acquisition components, as the size of CCS increases, the cost of fixtures and equipment becomes high, which cannot meet the process requirements. Furthermore, the laser welding fixtures and equipment are not interchangeable, resulting in high production costs.
Design a temperature-voltage acquisition board with wire clamps. By setting wire clamps in the empty area of the acquisition board, the wire harness is positioned and fixed, avoiding pre-soldering, realizing the arrangement and fixation of the wire harness, supporting manual, semi-automatic or fully automatic soldering, and reducing the size and cost of fixtures and equipment.
It reduces assembly costs, increases automation, and reduces the need for fixtures and equipment. It is suitable for CCS mass production. Laser welding fixtures and equipment requirements are low, and the size and cost are small.
Smart Images

Figure CN224503610U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of new energy vehicles, specifically to a temperature-voltage acquisition board with wire clamps. Background Technology
[0002] The integrated busbar (Cells Contact System, CCS) mainly consists of signal acquisition components, plastic structural parts, and copper / aluminum busbars, connected into a whole through processes such as thermoforming or riveting. It enables high-voltage series and parallel connection of battery cells, as well as battery temperature and cell voltage sampling. The CCS provides temperature and voltage data to the Battery Management System (BMS) through the signal acquisition components and corresponding connectors. As part of the BMS system, the CCS has functions such as battery temperature sampling, cell voltage sampling, and overcurrent protection. The CCS also features high integration, reliable sealing and insulation, high production efficiency, and ease of maintenance, and is currently widely used in new energy vehicles and power batteries.
[0003] In the early stages of the CCS industry, CCS products mainly consisted of injection-molded tray wire harness sampling. With the continuous improvement of battery structure, the signal acquisition components and integration processes of CCS are also constantly developing. Currently, CCS using printed circuit boards (PCBs) as signal acquisition components has the advantages of thin and light structure and high integration, which is conducive to improving the space utilization and assembly efficiency of battery packs, and is in line with the trend of lightweighting, component system integration and large modularization of new energy vehicles.
[0004] However, during the assembly of signal acquisition components, the positioning fixtures required for welding are relatively large. The larger the CCS, the larger the corresponding fixture and the larger the laser welding equipment. To meet the increasing demand for larger CCS sizes, the fixture and equipment costs for mass production of CCS are very high. Laser welding fixtures and laser welding equipment for large-size CCS solutions cannot meet the process requirements. Utility Model Content
[0005] In view of this, the present invention provides a temperature-voltage acquisition board with wire clamps to solve the problem that the current signal acquisition components cannot meet the process requirements for the increasingly larger CCS size.
[0006] According to a first aspect, this utility model provides a temperature-voltage acquisition board with wire clamps, comprising:
[0007] The acquisition board body has functional areas and empty areas;
[0008] At least one wire clamp is provided in the vacant area. The wire clamp includes a clamp base and a base. The base is disposed in the vacant area. The clamp base is provided on the base. The clamp base is provided with a clamping notch for positioning and fixing the wire harness. The front and rear ends of the clamping notch are connected. A clamping arm is provided at the upper edge of the clamping notch. The clamping arm is bent toward the inside of the clamping notch. A clamping opening is formed on the outside of the clamping arm.
[0009] In conjunction with the first aspect, in the first embodiment of the first aspect, one end of the clamp is provided with an extension seat extending out of the clamping notch, and the extension seat is connected to the base.
[0010] In conjunction with the first aspect, in the second embodiment of the first aspect, the clamp is made of an elastic material.
[0011] In conjunction with the first aspect, in the third embodiment of the first aspect, the clamp is fixedly connected to the base.
[0012] In conjunction with the first aspect, in the fourth embodiment of the first aspect, a base is provided on the vacant area, and a plurality of clamps are provided on the base.
[0013] In conjunction with the first aspect, in the fifth embodiment of the first aspect, the wire clamp includes a clamp base, which is fixedly connected to the vacant area.
[0014] In conjunction with the first aspect, in the sixth embodiment of the first aspect, the functional area of the acquisition board body is provided with a pressure sampling connecting piece, a temperature sensor, a temperature sampling wire pad, and a pressure sampling wire pad. The pressure sampling connecting piece is disposed at one end of the acquisition board body. The acquisition board body is provided with a functional substrate. One end of the pressure sampling connecting piece is connected to the functional substrate, and the other end of the pressure sampling connecting piece extends to the outside of the acquisition board body. A receiving cavity for placing the temperature sensor is provided at the end of the pressure sampling connecting piece connected to the functional substrate. The acquisition board body is provided with at least one pair of temperature sampling wire pads. The temperature sampling wire pads are electrically connected to the temperature sensor, and the pressure sampling wire pads are electrically connected to the functional substrate.
[0015] In conjunction with the sixth embodiment of the first aspect, in the seventh embodiment of the first aspect, the pressure-conducting connecting piece is made of nickel or copper.
[0016] In conjunction with the sixth embodiment of the first aspect, in the eighth embodiment of the first aspect, the pressure line pad is electrically connected to the functional substrate via a connecting fuse.
[0017] In conjunction with the sixth embodiment of the first aspect, in the ninth embodiment of the first aspect, the acquisition board body is provided with at least one spare pad for the acquisition pressure line.
[0018] This utility model discloses a temperature-voltage acquisition board with wire clamps. By setting several wire clamps in the empty area of the acquisition board body, the wire harness used in the signal acquisition component is positioned and fixed. This eliminates the need for pre-soldering the acquisition board body to the wire harness, allowing for pre-organization of the wire harness, facilitating straightening and processing. It solves the problem of existing wire harness solutions requiring pre-connection to nickel sheets or the acquisition board, leading to unsmooth wire harness organization. The wire clamps also secure the wire harness to prevent pull-out, further protecting solder joints. It can accommodate manual, semi-automatic, or fully automatic soldering, improving automation and efficiency. The acquisition board does not require additional positioning fixtures and has no process limitations, thus reducing assembly costs. The acquisition board with wire clamps can be laser welded to aluminum busbars independently. The positions of the temperature and pressure sampling pads are not affected by the distribution of CCS voltage and temperature acquisition points, so a universal fixture can be designed, greatly reducing the fixture cost for mass production. This solves the problem of high cost of laser welding fixtures and equipment for mass production of existing CCS solutions. The acquisition board with wire clamps is suitable for CCS mass production, and the required laser welding fixtures and equipment are low-requirement, small in size, and low in cost. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] in:
[0021] Figure 1 This invention provides a schematic diagram of the structure of a temperature-voltage acquisition board with wire clamps.
[0022] Figure 2 This is a second schematic diagram of the structure of the temperature-voltage acquisition board with wire clamps provided by this utility model;
[0023] Figure 3 This invention provides a schematic diagram of the structure of the voltage acquisition connecting piece in a temperature-voltage acquisition board with wire clamps.
[0024] Figure 4 This invention provides a schematic diagram of the structure of the wire clamp in a temperature-voltage acquisition board with wire clamps.
[0025] Figure 5 The second schematic diagram shows the structure of the wire clamp in the temperature-voltage acquisition board with wire clamp provided by this utility model.
[0026] In the diagram: 1-Collection board body; 11-Functional substrate; 2-Wire clamp; 21-Clamping seat; 211-Clamping notch; 212-Pressure arm; 213-Pressure port; 22-Base; 3-Collection pressure connecting piece; 31-Receiving cavity; 4-Temperature sensor; 5-Temperature line pad; 6-Pressure line pad; 7-Connecting fuse; 8-Spare pad. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0028] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0029] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0030] The Battery Control System (CCS) mainly consists of signal acquisition components, plastic structural parts, and copper-aluminum busbars, which are connected into a whole through processes such as hot pressing or riveting. It enables high-voltage series and parallel connection of battery cells, as well as battery temperature and cell voltage sampling. The CCS provides temperature and voltage data to the Battery Management System (BMS) through the signal acquisition components and corresponding connectors. As part of the BMS system, the CCS has functions such as battery temperature sampling, cell voltage sampling, and overcurrent protection. The CCS also features high integration, reliable sealing and insulation, high production efficiency, and ease of maintenance, and is currently widely used in new energy vehicles and power batteries.
[0031] In the early stages of the CCS industry, CCS products were mainly injection molded tray wire harness sampling. With the continuous improvement of battery structure, the signal acquisition components and integration processes of CCS are also constantly developing. Currently, CCS using PCBs as signal acquisition components has the advantages of thin and light structure and high integration, which is conducive to improving the space utilization and assembly efficiency of battery packs, and is in line with the trend of lightweighting, component system integration and large modularization of new energy vehicles.
[0032] Signal acquisition components made using PCBs are characterized by high wiring density, light weight, and thinness. All lines are pre-configured, eliminating the need for redundant cabling connections, which improves flexibility, enhances assembly reliability, and increases convenience.
[0033] Currently, signal acquisition components are mainly assembled in the following two ways:
[0034] 1. The temperature and voltage acquisition lines need to be crimped with the nickel sheet first, then the wire bundle is organized, and then the nickel sheet is positioned on the aluminum busbar using a CCS welding fixture, and then laser welding is performed using a CCS laser welding device.
[0035] 2. Temperature and voltage acquisition lines need to be positioned and welded to the PCB acquisition board using a fixture. Then, the wire harness is organized, and the nickel sheet is positioned on the aluminum busbar using a CCS welding fixture. Laser welding is then performed using a CCS laser welding device. At the same time, wires can be fixed by setting strip holes to prevent them from being pulled off and to protect the solder joints.
[0036] However, in the first assembly method, the temperature and voltage acquisition lines need to be crimped to the nickel sheets first. This crimping process is cumbersome, resulting in very high labor costs for subsequent wire harness processing. It also easily leads to uneven wire lengths and scratches on the wires. Furthermore, the laser welding of each nickel sheet to the aluminum busbar requires a large positioning fixture; the larger the CCS (Computer-Generated Panel), the larger the corresponding fixture and laser welding equipment become. For the increasingly larger CCS sizes, the fixture and equipment costs for mass production of CCS are very high. In the second assembly method, the temperature and voltage acquisition lines need to be positioned and welded to the PCB acquisition board using a fixture. This welding process to the PCB acquisition board is cumbersome and inconvenient for subsequent wire harness processing. For example, when straightening, separating, or wrapping tape, the PCB acquisition board and wire harness require a fixture to position the wire harness during this assembly method. Without a fixture, precise manual or semi-automatic welding is impossible. Similarly, the positioning fixture for laser welding of the nickel sheet and aluminum busbar on each PCB acquisition board of the wire harness is relatively large. The larger the CCS, the larger the corresponding fixture and the larger the laser welding equipment. For the increasingly larger CCS size requirements, the fixture and equipment costs for mass production of CCS are very high. It should be noted that the second assembly method is a relatively uncommon assembly method, which results in different temperature and voltage acquisition positions for different CCS models. Laser welding fixtures are not universal, and the fixture manufacturing cost is very high.
[0037] To address the aforementioned issues, this specification provides a temperature-voltage acquisition board with wire clamps. For example... Figures 1 to 5 As shown, the acquisition board includes:
[0038] The acquisition board body 1, i.e. the PCB board body, is based on which the printed circuit board (PCBA) required for the signal acquisition component can be formed. The acquisition board body 1 has functional areas and empty areas.
[0039] Specifically, the acquisition board 1 is equipped with a pressure-sensing connecting piece 3, a temperature sensor 4, temperature-sensing wire pads 5, and pressure-sensing wire pads 6. The pressure-sensing connecting piece 3 is located at one end of the acquisition board 1. The acquisition board 1 is equipped with a functional substrate 11. One end of the pressure-sensing connecting piece 3 is connected to the functional substrate 11, and the other end of the pressure-sensing connecting piece 3 extends to the outside of the acquisition board 1. A receiving cavity 31 for placing the temperature sensor 4 is provided at the end of the pressure-sensing connecting piece 3 connected to the functional substrate 11. The acquisition board 1 is equipped with at least one pair of temperature-sensing wire pads 5, that is, the temperature-sensing wire pads 5 are arranged in pairs on the acquisition board 1. The number of pairs of temperature-sensing wire pads 5 is determined by the number of temperature sensors selected. The temperature-sensing wire pads 5 are electrically connected to the temperature sensor 4, and the pressure-sensing wire pads 6 are electrically connected to the functional substrate 11, for example, through a connecting fuse 7. All of the above components are located in the functional area of the acquisition board 1.
[0040] Preferably, the receiving cavity 31 can be protruding, so that the receiving cavity 31 can both house the temperature sensor 4 and protect the temperature sensor 4.
[0041] It should be noted that, in order to ensure the stability of components and wiring harness connections, reinforcing adhesive and conformal coating can be used selectively. When installing the above-mentioned components, mature PCBA processes can be used for processing.
[0042] It is understandable that the temperature sampling line pad 5 and the pressure sampling line pad 6 are used to weld the temperature sampling line harness and the pressure sampling line harness, respectively. That is, the temperature sampling line pad 5 and the pressure sampling line pad 6 provide the welding positions for the temperature sampling line harness and the pressure sampling line harness, respectively.
[0043] Preferably, the pressure-collecting connecting piece 3 is made of nickel, i.e., the pressure-collecting connecting piece 3 is a pressure-collecting nickel piece. In some cases, the pressure-collecting connecting piece 3 may also be made of copper, i.e., the pressure-collecting connecting piece 3 is a pressure-collecting copper piece.
[0044] In this embodiment, the acquisition board body 1 is also provided with at least one spare pad 8 for the acquisition line. The spare pad 8 is also electrically connected to the functional substrate 11, for example, through a connecting fuse 7.
[0045] In this embodiment, at least one wire clamp 2 is provided on the acquisition board body 1. All wire clamps 2 are located in the empty area of the acquisition board body 1, that is, the wire clamps 2 are located away from the functional area. The wire clamp 2 includes a clamp base 21 and a base 22. The base 22 is located in the empty area. The clamp base 21 is provided on the base 22. The clamp base 21 is provided with a clamping notch 211 for positioning and fixing the wire harness. The front and rear ends of the clamping notch 211 are connected. A clamping arm 212 is provided at the upper edge of the clamping notch 211. The clamping arm 212 is bent toward the inside of the clamping notch 211, and a clamping opening 213 is formed on the outside of the clamping arm 212.
[0046] The number of wire clamps 2 can be determined according to the number of wire harnesses needed, and each wire clamp 2 is set to correspond to a wire harness.
[0047] In this embodiment, the clamp 21 is made of an elastic material. The clamping notch 211 formed on the wire clamp 2 is used to position and fix the wire harness (e.g., temperature acquisition wire, voltage acquisition wire). The clamping arm 212 extending from the edge of the clamping notch 211 can cooperate with other positioning components to complete the pre-assembly of the wire harness during the welding process, preventing the wire harness from falling off the acquisition plate. The clamping opening 213 formed on the outer side of the curved clamping notch 211 facilitates the tightening of the clamping notch 211 by the fixture or other positioning components during automatic and semi-automatic assembly, better fixing the wire harness.
[0048] Considering the clamping effect of the clamping notch 211 on the wire harness, the upper end of the clamping notch 211 is relatively tighter than the lower end. That is, the clamping notch 211 is designed so that the upper opening is smaller than the lower opening, thus forming a closed shape.
[0049] To ensure that the clamp 21 is stably installed on the base 22, one end of the clamp 21 is provided with an extension seat 23 extending out a clamping notch 211, and the extension seat 23 is connected to the base 22. The extension seat 23 and the base 22 are integrally formed.
[0050] Preferably, the base 22 and the clamp 21 can also be integrally formed.
[0051] In this embodiment, the base 22 of the wire clamp 2 and the acquisition board 1 can be fixed by means of patch welding, plug-in welding, etc.
[0052] In some possible embodiments, only one base 22 is provided on the empty area of the acquisition board 1, and all the clamps 21 of the wire clamps 2 share one base 22, and these clamps 21 are all fixedly connected to the base 22.
[0053] In some possible embodiments, the clamp 2 may be used without the base 22, and the clamp 21 may be directly fixedly connected to the empty area of the acquisition board 1.
[0054] In this embodiment, when assembling the acquisition board into a signal acquisition component, for the acquisition wire harness, one end of the harness is first connected to the connector, and the other end only needs to be stripped and tinned. The harness is positioned using the corresponding wire clamp 2, without the need for pre-soldering. The harness can be pre-organized for easier straightening and processing. For example, if the harness needs to be rolled or wound, this can be done in one step, improving the efficiency of harness processing. The acquisition board with the wire clamp 2 can be laser-welded to the aluminum busbar independently, without the need for additional positioning fixtures. The required welding fixture is small, eliminating the need for large CCS fixtures and equipment. CCS laser welding equipment is not affected by the size of the CCS. The above process can be automated, so a universal laser welding fixture can be designed to solve the problem of high fixture and equipment costs caused by increasingly larger CCS sizes. The aluminum busbar with the acquisition board welded is assembled onto a blister tray, and then the processed wire harness is installed. Then, each temperature acquisition wire is... The stripped ends of the voltage acquisition lines are fixed to the corresponding pad positions on the functional area of the acquisition board 1 (temperature acquisition line pad 5, pressure acquisition line pad 6, and spare pad 8) by the wire clamp 2, so that the tinned stripped ends overlap with the pad positions. Tinning is performed on the overlapping positions. Since the positions of each pad, i.e. the welding positions, are fixed, the welding positions are not affected by the distribution of CCS voltage and temperature acquisition points, which greatly reduces the fixture cost of mass production. At the same time, the wire clamp 2 can also fix the wire harness to prevent the wire harness from being pulled off, further protecting the solder joints. It can meet manual or semi-automatic welding, as well as fully automatic welding, improving the degree of automation and thus improving efficiency.
[0055] This utility model discloses a temperature-voltage acquisition board with wire clamps. By setting several wire clamps 2 in the empty area of the acquisition board body 1, the wire harness used in the signal acquisition component is positioned and fixed. In this way, the acquisition board body 1 does not need to be soldered to the wire harness beforehand. The wire harness can be organized first, making it easier to straighten and process. This solves the problem of the existing wire harness solution where the acquisition wires need to be connected to the nickel sheet or acquisition board first, resulting in messy wire harness organization. The wire clamps 2 can also fix the wire harness to prevent it from pulling out, further protecting the solder joints. It can meet manual, semi-automatic, or fully automatic soldering needs, improving the degree of automation and thus increasing efficiency. The acquisition board body 1 of component 2 does not require additional positioning fixtures and has no process limitations, thus reducing the cost of the assembly process. The acquisition board body 1 with wire clamps 2 can be laser welded to the aluminum busbar independently. The positions of the temperature sampling line pads 5 and the pressure sampling line pads 6 are not affected by the distribution of CCS voltage and temperature acquisition points, so a universal fixture can be designed, which greatly reduces the fixture cost for mass production. This solves the problem of high cost of laser welding fixtures and laser welding equipment in the mass production of existing CCS solutions. The acquisition board body 1 with wire clamps 2 is suitable for CCS mass production, and the requirements for laser welding fixtures and laser welding equipment are low, the size is small, and the cost is low.
[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A temperature-voltage acquisition board with wire clamps, characterized in that, include: The acquisition board body has functional areas and empty areas; At least one wire clamp is provided in the vacant area. The wire clamp includes a clamp base and a base. The base is disposed in the vacant area. The clamp base is provided on the base. The clamp base is provided with a clamping notch for positioning and fixing the wire harness. The front and rear ends of the clamping notch are connected. A clamping arm is provided at the upper edge of the clamping notch. The clamping arm is bent toward the inside of the clamping notch. A clamping opening is formed on the outside of the clamping arm.
2. The temperature-voltage acquisition board with wire clamps according to claim 1, characterized in that, One end of the clamp is provided with an extension seat extending out of the clamping notch, and the extension seat is connected to the base.
3. The temperature-voltage acquisition board with wire clamps according to claim 1, characterized in that, The clamp is made of a flexible material.
4. The temperature-voltage acquisition board with wire clamps according to claim 1, characterized in that, The clamp is fixedly connected to the base.
5. The temperature-voltage acquisition board with wire clamps according to claim 1, characterized in that, The vacant area is provided with a base, and the base is provided with a plurality of clamps.
6. The temperature-voltage acquisition board with wire clamps according to claim 1, characterized in that, The clamp includes a clamp base, which is fixedly connected to the empty area.
7. The temperature-voltage acquisition board with wire clamps according to claim 1, characterized in that, The functional area of the acquisition board is provided with a pressure sampling connecting piece, a temperature sensor, a temperature sampling wire pad, and a pressure sampling wire pad. The pressure sampling connecting piece is located at one end of the acquisition board. A functional substrate is provided on the acquisition board. One end of the pressure sampling connecting piece is connected to the functional substrate, and the other end of the pressure sampling connecting piece extends to the outside of the acquisition board. A receiving cavity for placing the temperature sensor is provided at the end of the pressure sampling connecting piece connected to the functional substrate. At least one pair of temperature sampling wire pads are provided on the acquisition board. The temperature sampling wire pads are electrically connected to the temperature sensor, and the pressure sampling wire pads are electrically connected to the functional substrate.
8. The temperature-voltage acquisition board with wire clamps according to claim 7, characterized in that, The pressure-bearing connecting plate is made of nickel or copper.
9. The temperature-voltage acquisition board with wire clamps according to claim 7, characterized in that, The pressure line pads are electrically connected to the functional substrate via a connecting fuse.
10. The temperature-voltage acquisition board with wire clamps according to claim 7, characterized in that, The acquisition board is provided with at least one spare pad for the sampling line.