A multi-interface type multi-layer FPC structure

Abstract

The utility model relates to FPC technical field, and disclose a kind of multi-interface type multilayer FPC structure, including wire end and interface end, the wire end shaft end is equipped with interface end, the interface end is covered and is adhered to wire end shaft end, wire end outside is equipped with surface protective layer, first functional composite layer, second functional composite layer and third functional composite layer are sequentially equipped in surface protective layer inside, and the first functional composite layer top is equipped with heat conduction radiating layer, the heat conduction radiating layer top is equipped with identification layer, and the third functional composite layer is inserted inside interface end correspondingly, and this multilayer FPC is significantly improved space utilization by the superposition design of three layers functional composite layer, and the circuit capacity is improved from single layer 7 to 21, effectively utilize limited space.

Description

Technical Field

[0001] This utility model relates to the field of FPC technology, specifically to a multi-interface type multi-layer FPC structure. Background Technology

[0002] With the booming development of consumer electronics, automotive electronics, smart wearable devices and other industries, electronic devices are rapidly evolving towards miniaturization and multi-functionality. In order to achieve high performance and diversified functions of the devices, more electronic components and complex circuits need to be integrated inside, which makes the internal space of the devices increasingly tight. This places extremely high demands on the line integration, interface adaptability and space utilization of flexible printed circuit boards (FPCs). Traditional FPCs are difficult to meet the needs of modern electronic devices.

[0003] However, existing FPC structures have many problems. Single-layer FPCs have limited line capacity, making it difficult to meet the needs of multi-signal transmission. Internal interface conversion is complex, and space utilization is low. Although some multi-layer FPCs improve line integration, the inter-layer structure is not stable enough, and the signal anti-interference capability is weak. They cannot achieve high line density, multi-interface adaptation, and stable signal transmission in a limited space. These defects seriously restrict the miniaturization process and performance improvement of electronic devices. To address this, we propose a multi-interface type multi-layer FPC structure. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a multi-interface type, multi-layer FPC structure, which solves the aforementioned problems.

[0005] To achieve the above-mentioned objectives, this utility model provides the following technical solution: a multi-interface type, multi-layer FPC structure, comprising:

[0006] The cable end and the interface end are provided. The axial end of the cable end is provided with an interface end. The interface end is wrapped and bonded to the axial end of the cable end. The outer side of the cable end is provided with a surface protective layer. The surface protective layer is provided with a first functional composite layer, a second functional composite layer and a third functional composite layer in sequence. The first functional composite layer is provided with a heat-conducting and heat-dissipating layer on top. The heat-conducting and heat-dissipating layer is provided with an identification layer on top. The third functional composite layer is inserted into the interface end.

[0007] Preferably, the first functional composite layer, the second functional composite layer, and the third functional composite layer have the same structure and are bonded together in sequence.

[0008] Preferably, the first functional composite layer is a first circuit layer, the bottom of the first functional composite layer is a first insulating layer, and a first adhesive layer is provided between the first circuit layer and the first insulating layer. An electromagnetic shielding layer is bonded to the top of the first circuit layer, and the top of the electromagnetic shielding layer is bonded to the bottom of the heat-conducting and heat-dissipating layer.

[0009] Preferably, the surface of the first functional composite layer has seven signal lines formed by an etching process.

[0010] Preferably, the interface end body is an interface plastic adjustment layer, and a board-to-board connector interface is opened on the outer top of the interface plastic adjustment layer corresponding to the wire end. A gold finger interface layer is provided on the top back of the interface plastic adjustment layer on the wire end side, and two wire bar interface layers are provided on the two opposite sidewalls of the interface plastic adjustment layer in an axially symmetrical distribution.

[0011] Preferably, the interface plasticity adjustment layer is inserted into the third functional composite layer, and a stress buffer layer is provided inside the interface plasticity adjustment layer corresponding to the bottom of the third functional composite layer, and the stress buffer layer is bonded to the bottom of the third functional composite layer.

[0012] Compared with the prior art, this utility model provides a multi-interface type, multi-layer FPC structure, which has the following advantages:

[0013] This multi-interface, multi-layer FPC structure significantly improves space utilization. Through the stacked design of three functional composite layers, the line capacity is increased from 7 to 21 lines per layer. Without increasing the floor area occupied, it greatly increases the signal transmission paths, effectively resolving the contradiction between compact internal space and dense wiring in electronic devices. At the same time, the interface end integrates multiple interface types, and the interface plastic adjustment layer can be flexibly shaped to adapt to installation spaces of different shapes and sizes, avoiding space waste caused by interface conversion or unreasonable layout. This design makes the internal layout of electronic devices more compact and orderly, providing key support for achieving miniaturization and thinning of devices. It is especially suitable for products with strict space requirements such as smart wearable devices and foldable screen phones, improving product performance while optimizing user experience. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the multi-interface type, multi-layer FPC structure of this utility model;

[0015] Figure 2 This is a schematic cross-sectional view of the wire end of this utility model;

[0016] Figure 3 This is a cross-sectional schematic diagram of the first functional composite layer of this utility model;

[0017] Figure 4 This is a cross-sectional view of the interface end of this utility model.

[0018] In the diagram: 1. Cable end; 2. Interface end; 3. First functional composite layer; 4. Second functional composite layer; 5. Third functional composite layer; 6. Thermal conductive and heat dissipation layer; 7. Identification layer; 8. Surface protective layer; 9. First circuit layer; 10. First adhesive layer; 11. First insulation layer; 12. Electromagnetic shielding layer; 13. Interface plastic adjustment layer; 14. Gold finger interface layer; 15. Cable strip interface layer; 16. Stress buffer layer; 17. Board-to-board connector interface. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 A multi-interface type, multi-layer FPC structure, comprising:

[0021] The cable end 1 and the interface end 2 are provided. The interface end 2 is provided on the shaft end of the cable end 1. The interface end 2 covers and bonds the shaft end of the cable end 1. The outer side of the cable end 1 is provided with a surface protective layer 8. The surface protective layer 8 is provided with a first functional composite layer 3, a second functional composite layer 4 and a third functional composite layer 5 in sequence. The top of the first functional composite layer 3 is provided with a heat-conducting and heat-dissipating layer 6. The top of the heat-conducting and heat-dissipating layer 6 is provided with a marking layer 7. The third functional composite layer 5 is inserted into the interface end 2. The heat-conducting and heat-dissipating layer 6 is bonded with thermally conductive adhesive to quickly dissipate the heat inside the cable end 1, reduce the overall operating temperature of the FPC and avoid the degradation of circuit performance due to high temperature.

[0022] Furthermore, the first functional composite layer 3, the second functional composite layer 4, and the third functional composite layer 5 have the same structure and are bonded together in sequence. The three layers are superimposed, which can realize the connection of multiple interfaces within a limited space, greatly improving the space utilization rate.

[0023] Furthermore, the first functional composite layer 3 is mainly composed of the first circuit layer 9, the bottom of the first functional composite layer 3 is the first insulating layer 11, and a first adhesive layer 10 is provided between the first circuit layer 9 and the first insulating layer 11. An electromagnetic shielding layer 12 is bonded to the top of the first circuit layer 9, and the top of the electromagnetic shielding layer 12 is bonded to the bottom of the heat-conducting and heat-dissipating layer 6. The first circuit layer 9 is made of high-purity rolled copper foil material with a thickness of 12-18μm. The surface of the circuit of the first circuit layer 9 is chemically plated with nickel and gold to improve conductivity and oxidation resistance, meeting the requirements of high-speed signal transmission. The first insulating layer 11 is made of polyimide film with a thickness of 15-20μm to achieve electrical isolation between the first functional composite layer 3 and the second functional composite layer 4, avoid signal crosstalk, and ensure the purity of high-frequency signal transmission. The first adhesive layer 10 is made of acrylic adhesive, which has good flexibility and adhesion, firmly bonding the first circuit layer 9 and the first insulating layer 11, while buffering interlayer stress and preventing the circuit from breaking due to bending. The electromagnetic shielding layer 12 suppresses electromagnetic interference and ensures the stability of high-speed signal transmission.

[0024] Furthermore, the surface of the first functional composite layer 3 is provided with seven signal lines by means of an etching process. Through the basic stacking of the first functional composite layer 3, the second functional composite layer 4 and the third functional composite layer 5, the line density is increased to twenty-one, breaking through the single-layer space limitation.

[0025] Furthermore, the main body of the interface end 2 is an interface plastic adjustment layer 13. A board-to-board connector interface 17 is opened on the outer top of the interface plastic adjustment layer 13 corresponding to the side of the wire end 1. A gold finger interface layer 14 is provided on the top back of the interface plastic adjustment layer 13 on the side of the wire end 1. Two wire bar interface layers 15 are provided on the two opposite sidewalls of the interface plastic adjustment layer 13 in an axially symmetrical distribution. The interface plastic adjustment layer 13 is made of flexible epoxy resin material with a thickness of 10-15μm. Through molding or laser engraving process, a shape-forming area that can be cut and bent is formed at the FPC interface. The length and curvature of the interface can be adjusted according to the equipment assembly requirements to adapt to narrow or irregular installation spaces without affecting the integrity of the internal circuit.

[0026] Furthermore, the interface plastic adjustment layer 13 is inserted into the third functional composite layer 5, and a stress buffer layer 16 is provided inside the interface plastic adjustment layer 13 corresponding to the bottom of the third functional composite layer 5. The stress buffer layer 16 is bonded to the bottom of the third functional composite layer 5. The stress buffer layer 16 is made of elastic silicone material and is fixed by dispensing process to absorb bending and torsional stress, prevent breakage due to stress concentration, and improve the mechanical reliability of FPC.

[0027] Structural Description:

[0028] Wire end 1: The wire end is the main part of the FPC structure and is used to transmit signals and power. Its shaft end is provided with an interface end 2 and is covered with a surface protective layer 8 on the outside, providing basic protection and transmission channel for the internal functional layer.

[0029] Interface end 2: The interface end is wrapped and bonded to the shaft end of the wire end 1. The main body is the interface plastic adjustment layer 13, which integrates multiple interface types and can be flexibly shaped to achieve adaptable connection with different electronic components.

[0030] First functional composite layer 3: The first functional composite layer is the core conductive structural unit, which is composed of the first circuit layer 9, the first adhesive layer 10 and the first insulating layer 11. It carries signal transmission and realizes interlayer isolation and firm connection.

[0031] Second functional composite layer 4: The second functional composite layer has the same structure as the first functional composite layer 3, and is sequentially bonded to the first functional composite layer to jointly enhance line density and expand signal transmission capacity.

[0032] Third functional composite layer 5: As the bottom layer of the functional composite layer, the third functional composite layer continues the same structure and is inserted into the interface end 2. It works in conjunction with the interface structure to ensure the overall connection stability.

[0033] Thermal conductive and heat dissipation layer 6: The thermal conductive and heat dissipation layer is bonded to the top of the first functional composite layer 3 with thermally conductive adhesive, which can quickly dissipate internal heat, effectively reduce the operating temperature of FPC, and maintain stable circuit performance.

[0034] Identification layer 7: The identification layer is located on top of the heat conduction and heat dissipation layer 6. The circuit and interface information is marked by processes such as silk screen printing, which facilitates quick identification during production and assembly and subsequent maintenance and repair.

[0035] Surface protective layer 8: The surface protective layer is wrapped around the outside of wire end 1, which serves to prevent water, dust and scratches, and provides basic protection for the internal functional layers, thus extending the service life of the FPC;

[0036] First line layer 9: The first line layer uses high-purity rolled copper foil, which is chemically plated with nickel and gold and etched to form signal lines. It is the key layer in the first functional composite layer 3 that carries electrical signal transmission.

[0037] First adhesive layer 10: The first adhesive layer is made of acrylic adhesive, which has good flexibility and adhesion, firmly bonding the first circuit layer 9 and the first insulation layer 11, and buffering the interlayer stress.

[0038] First insulating layer 11: The first insulating layer is made of polyimide film to achieve electrical isolation between functional composite layers, prevent signal crosstalk, and ensure the purity and stability of high-frequency signal transmission;

[0039] Electromagnetic shielding layer 12: The electromagnetic shielding layer is bonded to the top of the first circuit layer 9, effectively suppressing electromagnetic interference, providing a stable environment for high-speed signal transmission, and improving signal transmission quality;

[0040] Interface plastic adjustment layer 13: The interface plastic adjustment layer is the main structure of the interface end 2. It is made of flexible epoxy resin material, which can be cut and bent to fit narrow and irregular spaces and protect the internal circuits.

[0041] Gold finger interface layer 14: The gold finger interface layer is located on top of the interface plastic adjustment layer 13. It is formed by electroplating to form a gold finger structure, which is used to connect with external connectors to achieve a stable electrical connection.

[0042] Cable interface layer 15: The cable interface layer is symmetrically distributed on both sides of the interface plastic adjustment layer 13, and the end of the line is processed into a flat cable, which is suitable for the multi-contact connection requirements of narrow-pitch components.

[0043] Stress buffer layer 16: The stress buffer layer is located inside the interface plastic adjustment layer 13. It is made of elastic silicone material to absorb the bending and torsional stress of the FPC and prevent the circuit from breaking due to stress concentration.

[0044] Board-to-board connector interface 17: The board-to-board connector interface is located at the top outer side of the interface plastic adjustment layer 13, with reserved pads and positioning holes to enable fast and accurate docking of the FPC with other circuit boards.

[0045] Working Principle: Install the multi-interface type multi-layer FPC structure correctly according to the diagram. This structure includes cable end 1 and interface end 2. Efficient connection and signal transmission are achieved through the coordinated operation of multiple functional composite layers and special functional layers. The outer surface protective layer 8 of cable end 1 provides basic protection. The internal first functional composite layer 3, second functional composite layer 4, and third functional composite layer 5 have identical structures and are bonded sequentially. Each layer consists of a first wiring layer 9, a first adhesive layer 10, and a first insulation layer 11, significantly increasing the wiring density from 7 wires per layer to 21 wires, breaking through the spatial limitations of planar wiring. The first wiring layer 9 uses 12-18μm high-purity rolled copper foil and undergoes chemical nickel-gold plating to ensure high-speed signal transmission. The first insulation layer 11 uses a 15-20μm polyimide film to isolate interlayer signal interference. The acrylic adhesive of the first adhesive layer 10 firmly bonds each layer... The FPC has multiple layers, including an electromagnetic shielding layer 12 covering the top of the first circuit layer 9, which effectively suppresses electromagnetic interference and ensures stable transmission of high-frequency signals. The heat dissipation layer 6 is connected to the first functional composite layer 3 through thermally conductive adhesive, which quickly dissipates the heat generated by the circuit operation and maintains the stable operating temperature of the FPC. The interface plastic adjustment layer 13 of the interface end 2 is made of 10-15μm flexible epoxy resin, which can be cut and bent as needed to adapt to narrow spaces. The gold finger interface layer 14, the wire strip interface layer 15 and the board-to-board connector interface 17 set on it can meet the connection requirements of different electronic components. At the same time, the stress buffer layer 16 inside the interface plastic adjustment layer 13 absorbs mechanical stress through elastic silicone, enhances the bending resistance of the FPC and ensures the integrity of the internal circuit. The marking layer 7 provides circuit and interface information, which facilitates production assembly and later maintenance. The close cooperation of each layer realizes the efficient operation of the FPC in a limited space.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-interface type, multi-layer FPC structure, characterized in that, include: The wire end (1) and the interface end (2) are provided. The axial end of the wire end (1) is provided with the interface end (2). The interface end (2) covers and bonds the axial end of the wire end (1). The outer side of the wire end (1) is provided with a surface protective layer (8). The surface protective layer (8) is provided with a first functional composite layer (3), a second functional composite layer (4) and a third functional composite layer (5) in sequence. The top of the first functional composite layer (3) is provided with a heat-conducting and heat-dissipating layer (6). The top of the heat-conducting and heat-dissipating layer (6) is provided with a marking layer (7). The third functional composite layer (5) is inserted into the interface end (2).

2. The multi-interface type multi-layer FPC structure according to claim 1, characterized in that, The first functional composite layer (3), the second functional composite layer (4), and the third functional composite layer (5) have the same structure and are bonded together in sequence.

3. The multi-interface type multi-layer FPC structure according to claim 2, characterized in that, The first functional composite layer (3) is mainly composed of a first circuit layer (9), the bottom of the first functional composite layer (3) is a first insulating layer (11), and a first adhesive layer (10) is provided between the first circuit layer (9) and the first insulating layer (11). An electromagnetic shielding layer (12) is bonded to the top of the first circuit layer (9), and the top of the electromagnetic shielding layer (12) is bonded to the bottom of the heat-conducting and heat-dissipating layer (6).

4. The multi-interface type multi-layer FPC structure according to claim 3, characterized in that, The surface of the first functional composite layer (3) is provided with seven signal lines by means of an etching process.

5. A multi-interface type, multi-layer FPC structure according to claim 1, characterized in that, The main body of the interface end (2) is the interface plastic adjustment layer (13). The top of the interface plastic adjustment layer (13) is provided with a board-to-board connector interface (17) on the side corresponding to the wire end (1). The top of the interface plastic adjustment layer (13) is provided with a gold finger interface layer (14) on the side of the wire end (1). The two opposite sidewalls of the interface plastic adjustment layer (13) are provided with two wire bar interface layers (15) that are axially symmetrically distributed.

6. The multi-interface type multi-layer FPC structure according to claim 5, characterized in that, The interface plastic adjustment layer (13) is inserted into the third functional composite layer (5), and a stress buffer layer (16) is provided inside the interface plastic adjustment layer (13) corresponding to the bottom of the third functional composite layer (5), and the stress buffer layer (16) is bonded to the bottom of the third functional composite layer (5).

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