A double-sided etching-resistant plate structure of a thick copper plate

Abstract

The utility model provides a kind of thick copper plate double-sided etching's board surface structure, comprising: first copper foil, second copper foil and PP layer, PP layer is set to the middle of first copper foil and second copper foil;First copper foil and second copper foil both sides are provided with first etching area and second etching area.The utility model provides a kind of thick copper plate double-sided etching's board surface structure, by setting support in the inner side of first etching area, in the pressing process, support can provide stable and uniform supporting force, effectively disperses pressing pressure, avoids the situation that first etching area appears pressure loss depression due to insufficient supporting force after part copper layer is removed, which not only improves pressing alignment, ensures that first copper foil, second copper foil and PP layer between position accurate alignment, also guarantees the flatness of board after pressing, reduces the problem of uneven thickness, provides good foundation for subsequent etching process, avoids adversely affecting subsequent etching.

Description

Technical Field

[0001] This utility model relates to the field of thick copper plate technology, and in particular to a plate structure for double-sided etching of thick copper plates. Background Technology

[0002] Thick copper plates are widely used in high-current, high-voltage products such as power amplifiers, chargers, inverters, and automotive lights. Although they appear to have a simple graphic, they are extremely difficult to manufacture. Ensuring good etching processability, lamination filling and reliability, mechanical wear during drilling, and ink volume control during solder mask processing are all extremely challenging aspects that differ significantly from traditional PCB manufacturing processes. In terms of etching, traditional processes involve applying a dry film to the copper surface, transferring the pattern through exposure and development, and then reacting the dry film with the exposed copper surface using chemicals. Considering the adhesion between the dry film and the remaining copper surface, the etching spray pressure is generally less than 3.5 kgf. Traditional production lines with insufficient length usually use two or more etching passes to reduce the pooling effect. Even so, etching has strict requirements on the spacing, especially now that there are thick copper products ≥ 8 oz.

[0003] The current process for manufacturing products with copper thickness of 8oz and above uses a double-sided etching process. This involves drilling tool holes in two 8oz copper foils, then using the tool holes to position and lightly etch 2-3oz of copper on both sides of the foil, leaving a 2-3oz thick layer of copper in the middle. After the light etching, the two copper foils are pressed and riveted together. The resulting double-sided board is then etched to remove the remaining 2-3oz of copper foil. If multiple layers are used, this process is repeated to create multiple double-sided boards before adding more layers according to the standard procedure. This method effectively solves the problem of adhesive residue when laminating thick copper boards. Each lamination only requires filling the top and bottom with 2-3oz of copper, and it also solves the problems of large burrs and poor etching factor caused by direct multiple etching.

[0004] However, after etching two copper foils, a 2-3 oz thick copper layer will remain in the middle of the copper foil. When the area of ​​the etched copper is large, the support of the large 2-3 oz thick copper layer is insufficient after lamination. Moreover, this is a recessed area compared to the unetched area. During lamination, pressure is lost, resulting in an uneven copper surface and uneven dielectric thickness after lamination. This has a significant impact on the lamination alignment and subsequent etching.

[0005] Therefore, it is necessary to provide a plate structure for double-sided etching of thick copper plates to solve the above-mentioned technical problems. Summary of the Invention

[0006] This invention provides a plate structure for double-sided etching of thick copper plates, which solves the problems of easy denting and uneven plate surface after double-sided etching of thick copper plates in the prior art.

[0007] To solve the above-mentioned technical problems, this utility model provides a plate structure for double-sided etching of thick copper plates, comprising:

[0008] A first copper foil, a second copper foil, and a PP layer, wherein the PP layer is disposed between the first copper foil and the second copper foil;

[0009] Both sides of the first copper foil and the second copper foil are provided with a first etching area and a second etching area, and multiple support members are provided on the inner side of the two first etching areas.

[0010] Preferably, tool holes are provided on the surface of the first copper foil, the second copper foil, and the PP layer.

[0011] Preferably, the two second etched areas are respectively disposed at the bottom of the first copper foil and the top of the second copper foil, and the two second etched areas are respectively attached to the top and bottom of the PP layer.

[0012] Preferably, the two first etched areas are respectively disposed on the top of the first copper foil and the bottom of the second copper foil.

[0013] Preferably, all of the support members are trapezoidal strips and are evenly distributed.

[0014] Preferably, all of the support members are cylinders and are evenly distributed.

[0015] Preferably, all of the support members are strip-shaped and are combined with each other to form a mesh structure.

[0016] Compared with related technologies, the plate structure for double-sided etching of thick copper plates provided by this utility model has the following beneficial effects:

[0017] This invention provides a plate structure for double-sided etching of thick copper plates. By setting a support member on the inner side of the first etching area, the support member can provide stable and uniform support force during the pressing process, effectively dispersing the pressing pressure and avoiding the situation where the first etching area loses pressure and sinks due to insufficient support force after part of the copper layer is removed. This not only significantly improves the pressing alignment and ensures that the positions of the first copper foil, the second copper foil and the PP layer are accurately aligned, but also ensures the flatness of the plate surface after pressing, reduces the problem of uneven dielectric thickness, provides a good foundation for subsequent etching processes, and avoids adverse effects on subsequent etching. Attached Figure Description

[0018] Figure 1 A schematic diagram of the first embodiment of a thick copper plate double-sided etching plate structure provided by this utility model;

[0019] Figure 2 for Figure 1 The enlarged schematic diagram of part A shown below;

[0020] Figure 3 for Figure 1 The diagram shows a top view of the first copper foil structure.

[0021] Figure 4 A schematic diagram of the second embodiment of a thick copper plate double-sided etching plate structure provided by this utility model;

[0022] Figure 5 This is a schematic diagram of the third embodiment of a thick copper plate double-sided etching plate structure provided by this utility model.

[0023] The numbers in the diagram are: 1. First copper foil, 2. Second copper foil, 3. PP layer, 4. Tool hole, 5. First etching area, 6. Second etching area, 7. Support. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments. Example

[0025] Please refer to the following: Figure 1 , Figure 2 , Figure 3 ,in, Figure 1 A schematic diagram of the first embodiment of a thick copper plate double-sided etching plate structure provided by this utility model; Figure 2 for Figure 1 The enlarged schematic diagram of part A shown below; Figure 3 for Figure 1 The diagram shows a top view of the first copper foil structure. A thick copper plate double-sided etching plate structure includes: a first copper foil 1, a second copper foil 2, and a PP layer 3, wherein the PP layer 3 is disposed between the first copper foil 1 and the second copper foil 2;

[0026] Both sides of the first copper foil 1 and the second copper foil 2 are provided with a first etching area 5 and a second etching area 6, and multiple support members 7 are provided on the inner side of the two first etching areas 5.

[0027] Both the first copper foil 1 and the second copper foil 2 are made of thick copper material with a thickness of ≥8oz. This thickness of copper foil can meet the conductivity requirements under high current and high voltage scenarios and is widely used in products such as power amplifiers and inverters. The PP layer 3 (i.e., the prepreg layer) serves as the middle bonding and insulation layer. Its material is glass fiber impregnated with epoxy resin. After curing, it can firmly bond the first copper foil 1 and the second copper foil 2, while providing good electrical insulation performance and preventing short circuits between the two copper foil layers.

[0028] The first etching area 5 and the second etching area 6 are the main working areas of the subsequent etching process. The first etching area 5 is located on the outside of the copper foil (the side away from the PP layer 3), and the second etching area 6 is located on the inside of the copper foil (the side close to the PP layer 3). The support 7 is made of the same material as the copper foil and is a part of the copper layer that is retained during the first etching. It is used to provide support during the pressing process and prevent dents caused by insufficient support after the copper layer is partially etched.

[0029] Tool holes 4 are provided on the surface of the first copper foil 1, the second copper foil 2, and the PP layer 3.

[0030] The tool hole 4 is machined using precision drilling equipment. The tool hole 4 plays a positioning role in the entire manufacturing process. Through the tool hole 4 that passes through the first copper foil 1, PP layer 3 and second copper foil 2, it can be used with tooling fixtures such as positioning pins to achieve precise alignment of the three-layer structure, which ensures the positional accuracy of subsequent etching and pressing processes and avoids etching deviation or poor pressing caused by misalignment.

[0031] Two second etched areas 6 are respectively disposed at the bottom of the first copper foil 1 and the top of the second copper foil 2, and the two second etched areas 6 are respectively attached to the top and bottom of the PP layer 3.

[0032] The two first etched areas 5 are respectively located on the top of the first copper foil 1 and the bottom of the second copper foil 2.

[0033] All of the aforementioned support members 7 are trapezoidal strips and are evenly distributed.

[0034] The trapezoidal support 7 has a structure that is wider at the top and narrower at the bottom, and its height is the same as the height of the surface of the first copper foil 1 and the second copper foil 2 after the first etching.

[0035] The working principle of the thick copper plate double-sided etching plate structure provided by this utility model is as follows:

[0036] In the double-sided etching process of thick copper plate, the tool hole 4 on the first copper foil 1 and the second copper foil 2 is used to achieve precise positioning to ensure that the position alignment deviation of subsequent processes does not exceed 0.1mm. During the first etching process, the first etching area 5 and the second etching area 6 on the first copper foil 1 and the second copper foil 2 are etched to remove a copper layer with a thickness of 2-3oz. At the same time, the trapezoidal strip support 7 is retained on the inner side of the first etching area 5.

[0037] During lamination, the PP layer 3 is located between the first copper foil 1 and the second copper foil 2, and the second etching area 6 is attached to the top and bottom of the PP layer 3 respectively. During the lamination process, the trapezoidal strip support 7 is in direct contact with the lamination steel plate, and uses its structural strength to disperse the pressure, providing stable support for the first etching area 5, and avoiding pressure loss and depression due to insufficient support after the copper layer in this area is partially etched.

[0038] After lamination, the remaining copper layer between the support 7 and the first etching area 5 and the second etching area 6 is completely removed by secondary etching, and finally a flat double-sided panel structure is formed.

[0039] Compared with related technologies, the plate structure for double-sided etching of thick copper plates provided by this utility model has the following beneficial effects:

[0040] By setting a support member 7 on the inner side of the first etching area 5, the support member 7 can provide a stable and uniform support force during the pressing process, effectively dispersing the pressing pressure and avoiding the situation where the first etching area 5 loses pressure and sinks due to insufficient support force after some copper layers are removed. This not only significantly improves the pressing alignment and ensures that the positions of the first copper foil 1, the second copper foil 2 and the PP layer 3 are accurately aligned, but also ensures the flatness of the board surface after pressing, reduces the problem of uneven dielectric thickness, provides a good foundation for subsequent etching processes, and avoids adverse effects on subsequent etching. Example

[0041] Please refer to the following: Figure 4 Based on the first embodiment of this application, which provides a plate structure for double-sided etching of a thick copper plate, the second embodiment of this application proposes another plate structure for double-sided etching of a thick copper plate. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0042] Specifically, the difference in the plate structure for double-sided etching of thick copper plate provided in the second embodiment of this application is that, in the plate structure for double-sided etching of thick copper plate, the plurality of the support members 7 are all cylinders and are evenly arranged.

[0043] The evenly spaced cylinders have appropriate gaps, which ensures comprehensive support without taking up too much space and affecting the flow of the etching solution. During the subsequent secondary etching, the etching solution can more smoothly contact the support 7, ensuring that it is completely removed and avoiding residue. This structural design not only ensures the support effect, but also simplifies the processing and forming process of the support, which is conducive to improving production efficiency.

[0044] Compared with related technologies, the plate structure for double-sided etching of thick copper plates provided by this utility model has the following beneficial effects:

[0045] By setting the support members 7 as cylindrical and evenly distributed, each cylindrical support member 7 can independently bear a certain pressure during the pressing process, and the force during pressing is evenly distributed. The cylindrical structure has good compressive strength and can maintain a stable shape under stress, and is not easy to deform, thus providing continuous and reliable support for the first etching area 5. Example

[0046] Please refer to the following: Figure 5 Based on the first embodiment of this application, which provides a plate structure for double-sided etching of a thick copper plate, the third embodiment of this application proposes another plate structure for double-sided etching of a thick copper plate. The third embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the third embodiment will not affect the separate implementation of the first embodiment.

[0047] Specifically, the difference in the thick copper plate double-sided etching plate structure provided in the third embodiment of this application is that in the thick copper plate double-sided etching plate structure, the plurality of the support members 7 are all strip-shaped and are combined with each other to form a mesh structure.

[0048] The mesh structure has many pores, which allow the etching solution to penetrate more smoothly into all parts of the support 7 during the secondary etching process, ensuring that the support 7 is completely etched away and avoiding the problem of residual support structure. In addition, the mesh structure has strong integrity and can maintain good structural stability during the first etching process to form the support 7, making it less prone to breakage or deformation, which helps to ensure the reliability of the support effect. This structural design not only improves the support performance, but also better adapts to the etching process and ensures the quality of subsequent board surface processing.

[0049] Compared with related technologies, the plate structure for double-sided etching of thick copper plates provided by this utility model has the following beneficial effects:

[0050] By setting the support 7 as a mesh and forming it by combining strips, an integrated support structure can be formed. This mesh structure can distribute the pressure during pressing more evenly to the entire first etching area 5, avoiding excessive or insufficient local pressure, thereby providing comprehensive and stable support for the first etching area 5 and effectively preventing depressions caused by local pressure loss during pressing.

[0051] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A plate structure for double-sided etching of a thick copper plate, characterized in that, include: A first copper foil, a second copper foil, and a PP layer, wherein the PP layer is disposed between the first copper foil and the second copper foil; Both sides of the first copper foil and the second copper foil are provided with a first etching area and a second etching area, and multiple support members are provided on the inner side of the two first etching areas.

2. The plate structure for double-sided etching of a thick copper plate according to claim 1, characterized in that, Tool holes are provided on the surface of the first copper foil, the second copper foil, and the PP layer.

3. The plate structure for double-sided etching of a thick copper plate according to claim 1, characterized in that, The two second etched areas are respectively disposed at the bottom of the first copper foil and the top of the second copper foil, and the two second etched areas are respectively attached to the top and bottom of the PP layer.

4. The plate structure for double-sided etching of a thick copper plate according to claim 3, characterized in that, The two first etched areas are respectively located on the top of the first copper foil and the bottom of the second copper foil.

5. The plate structure for double-sided etching of a thick copper plate according to claim 1, characterized in that, All of the aforementioned support members are trapezoidal strips and are evenly distributed.

6. The plate structure for double-sided etching of a thick copper plate according to claim 1, characterized in that, All of the aforementioned support members are cylinders and are evenly distributed.

7. The plate structure for double-sided etching of a thick copper plate according to claim 1, characterized in that, The multiple support members are all strip-shaped and are combined with each other to form a mesh structure.

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