Circuit board assembly, battery assembly, and electronic device

Abstract

The present disclosure relates to a circuit board assembly, a battery assembly and an electronic device. The circuit board assembly comprises a first flexible circuit board, a second flexible circuit board, a first printed circuit board and electrical components. The first flexible circuit board, the first printed circuit board and the second flexible circuit board are arranged in a stack, the first flexible circuit board is electrically connected to the second flexible circuit board through the first printed circuit board, and the electrical components are multiple, and the multiple electrical components are arranged on the first flexible circuit board and the second flexible circuit board respectively. By stacking the first flexible circuit board and the second flexible circuit board, the space in the thickness direction of the first flexible circuit board or the second flexible circuit board is utilized, the electrical components are arranged on the stacked first flexible circuit board or second flexible circuit board respectively, and the overall area of the circuit board assembly in the thickness direction perpendicular to the first flexible circuit board or the second flexible circuit board is reduced.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to a circuit board assembly, a battery assembly, and an electronic device. Background Technology

[0002] In related technologies, a battery consists of a cell and a protection board. The protection board contains a protection circuit to protect the cell from charging and discharging. Because the protection circuit has many electrical components, a larger protection board is needed to house these components, resulting in a larger overall area occupied by the protection board. Utility Model Content

[0003] To overcome the problems existing in the related technologies, this disclosure provides a circuit board assembly, a battery assembly, and an electronic device.

[0004] According to some embodiments of this disclosure, a circuit board assembly is provided, including: a first flexible circuit board, a second flexible circuit board, a first printed circuit board, and electrical components; the first flexible circuit board, the first printed circuit board, and the second flexible circuit board are arranged in a sequentially stacked manner, the first flexible circuit board is electrically connected to the second flexible circuit board through the first printed circuit board, the first printed circuit board has a first pad and a second pad corresponding to the first pad on its two opposite sides, the first flexible circuit board is soldered to the first printed circuit board through the first pad, and the second flexible circuit board is soldered to the first printed circuit board through the second pad; there are multiple electrical components, and the multiple electrical components are respectively disposed on the first flexible circuit board and the second flexible circuit board.

[0005] In some embodiments, at least a portion of the projection of the first flexible circuit board coincides with the projection of the second flexible circuit board in the thickness direction of the first flexible circuit board.

[0006] In some embodiments, in the thickness direction of the first flexible circuit board, the projection of the first printed circuit board is located within the projection of the second flexible circuit board.

[0007] In some embodiments, the circuit board assembly further includes a second printed circuit board; the first printed circuit board, the second printed circuit board and the second flexible circuit board are stacked in sequence, and the first printed circuit board and the second printed circuit board are offset; the two opposite sides of the second printed circuit board are respectively provided with a third pad and a fourth pad corresponding to the third pad, the third pad is soldered to the second pad, and the second flexible circuit board is soldered to the second printed circuit board through the fourth pad.

[0008] In some embodiments, there are multiple first pads, and / or second pads, and / or third pads, and / or fourth pads.

[0009] In some embodiments, a sealant is provided between the first printed circuit board and the second printed circuit board.

[0010] In some embodiments, there are two or more first printed circuit boards, and / or two or more second printed circuit boards.

[0011] In some embodiments, the circuit board assembly further includes a first connecting portion and a second connecting portion; the first connecting portion and the second connecting portion are disposed on the first flexible circuit board and / or the second flexible circuit board, the first connecting portion is used to connect the battery cell, and the second connecting portion is used to connect the electronic device motherboard.

[0012] In some embodiments, the plurality of electrical components respectively form a power circuit, a protection circuit, and a power detection circuit; the power circuit, the first connection portion, and the second connection portion are disposed on the second flexible circuit board; the protection circuit and the power detection circuit are disposed on the first flexible circuit board.

[0013] According to some embodiments of this disclosure, a battery assembly is provided, including: a battery cell; and a circuit board assembly as described in any of the above embodiments, wherein the circuit board assembly is electrically connected to the tabs of the battery cell, and the circuit board assembly is used to protect the battery cell during the charging and discharging process.

[0014] According to some embodiments of this disclosure, an electronic device is provided, including: a circuit board assembly as described in any of the above embodiments; and / or a battery assembly as described in the above embodiments.

[0015] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: by stacking a first flexible circuit board and a second flexible circuit board, electrical components are arranged on the stacked first flexible circuit board or second flexible circuit board by utilizing the space in the thickness direction of the first flexible circuit board or the second flexible circuit board, thereby reducing the area occupied by the circuit board assembly in the direction perpendicular to the thickness direction of the first flexible circuit board or the second flexible circuit board.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0018] Figure 1 This is a schematic diagram of the battery cell structure in related technologies.

[0019] Figure 2 This is a schematic diagram of the battery structure in related technologies.

[0020] Figure 3 This is a left view of a battery in related technologies.

[0021] Figure 4 This is the front view of the protection plate in the related technology.

[0022] Figure 5 This is a rear view of the protection plate in the related technology.

[0023] Figure 6 This is a top view of the protective plate in the relevant technology.

[0024] Figure 7 This is a schematic diagram showing the connection between the battery and the motherboard of an electronic device in related technologies.

[0025] Figure 8 This is a schematic diagram of the structure of irregularly shaped batteries in related technologies.

[0026] Figure 9 This is a schematic diagram of the structure of irregularly shaped batteries in related technologies.

[0027] Figure 10 This is a schematic diagram of the structure of a circuit board assembly according to some embodiments of the present disclosure.

[0028] Figure 11 This is a schematic diagram of the structure of a circuit board assembly according to some other embodiments of the present disclosure.

[0029] Figure 12 This is a schematic diagram of the structure of a circuit board assembly according to some other embodiments of the present disclosure.

[0030] Figure 13 This is a circuit diagram of a power circuit, protection circuit, and power detection circuit shown according to other embodiments of this disclosure.

[0031] Figure 14 This is a block diagram illustrating an electronic device according to some embodiments of the present disclosure. Detailed Implementation

[0032] Some embodiments of this disclosure will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. Various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but can be changed as will become apparent upon understanding this disclosure, except for operations that must be performed in a particular order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0033] The embodiments described in the following examples of this disclosure are not representative of all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0034] The circuit board assembly, battery assembly, and electronic device provided in some embodiments of this disclosure are applied to scenarios where the charging and discharging of battery cells is protected.

[0035] Figure 1 This is a schematic diagram of the structure of cell 101 in the relevant technology. Figure 2 This is a schematic diagram of the battery structure in related technologies. Figure 7 This is a schematic diagram showing the connection between the battery and the mainboard 105 of the electronic device in related technologies. For example... Figure 1 , Figure 2 and Figure 7 As shown, in related technologies, the battery consists of a cell 101 and a protection board 100. The tabs 102 of the cell 101 are welded to the first connecting portion 6 of the protection board 100, and the first connecting portion 6 is a nickel sheet or nickel brick. The second connecting portion 7 of the protection board 100 is electrically connected to the main board 105 of the electronic device, and the second connecting portion 7 is a connector. The protection board 100 is provided with a protection circuit for protecting the charging and discharging of the cell 101. Figure 3 This is a left view of a battery in related technologies. Figure 4 This is the front view of the protection plate 100 in the related technology. Figure 5 This is a rear view of the protection plate 100 in the related technology. Figure 6 This is a top view of the protection plate 100 in the related technology. For example... Figures 3 to 6 As shown, in the related technology, the protection board 100 is disposed at the end of the battery cell 101, and the protection board 100 is relatively long. The protection board 100 includes a printed circuit board (PCB) 103 with multiple electrical components 5 and a flexible printed circuit (FPC) 104. Figure 8 This is a schematic diagram of the structure of irregularly shaped batteries in related technologies.Figure 9 This is a schematic diagram of the structure of irregularly shaped batteries in related technologies. For example... Figure 8 and Figure 9 As shown in the irregularly shaped battery diagram, the longer protection plate 100 can only be placed at the end of the cell 101 with the longer side length. The longer protection plate 100 not only occupies a larger overall battery space, resulting in a smaller battery capacity for the same battery volume, but also limits the placement of irregularly shaped batteries.

[0036] In view of this, some embodiments of this disclosure provide a circuit board assembly, a battery assembly, and an electronic device. Embodiments of this disclosure employ a stacked circuit board structure to utilize the space in the thickness direction of the circuit board to arrange electrical components on the stacked circuit board structure, thereby reducing the overall area occupied by the circuit board.

[0037] Figure 10 This is a schematic diagram of the structure of a circuit board assembly according to some embodiments of the present disclosure. Figure 11 This is a schematic diagram illustrating the structure of a circuit board assembly according to other embodiments of this disclosure. For example... Figure 10 and Figure 11 As shown, the circuit board assembly includes: a first flexible circuit board 1, a second flexible circuit board 2, a first printed circuit board 3, and electrical components 5. The first flexible circuit board 1, the first printed circuit board 3, and the second flexible circuit board 2 are stacked sequentially. The first flexible circuit board 1 is electrically connected to the second flexible circuit board 2 through the first printed circuit board 3. The opposite sides of the first printed circuit board 3 are respectively provided with first pads 31 and second pads 32 corresponding to the first pads 31. The first flexible circuit board 1 is soldered to the first printed circuit board 3 through the first pads 31, and the second flexible circuit board 2 is soldered to the first printed circuit board 3 through the second pads 32. Multiple electrical components 5 are respectively disposed on the first flexible circuit board 1 and the second flexible circuit board 2.

[0038] The first flexible circuit board 1 and the second flexible circuit board 2 are electrically connected via the first printed circuit board 3, enabling communication between multiple electrical components 5 located on the first flexible circuit board 1 and the second flexible circuit board 2 respectively. By stacking the first flexible circuit board 1 and the second flexible circuit board 2, the electrical components 5 are arranged on the stacked first flexible circuit board 1 or the second flexible circuit board 2 using the space in the thickness direction of the first flexible circuit board 1 or the second flexible circuit board 2, thereby reducing the area occupied by the entire circuit board assembly in the direction perpendicular to the thickness direction of the first flexible circuit board 1 or the second flexible circuit board 2.

[0039] Secondly, by using the first flexible circuit board 1 and the second flexible circuit board 2 as carriers for multiple electrical components 5 to connect the electrical components 5, the range of sizes of the compatible electrical components 5 can be increased. Utilizing the deformable characteristics of the first flexible circuit board 1 and the second flexible circuit board 2, that is, by deforming the first flexible circuit board 1 and / or the second flexible circuit board 2, the distance between the first flexible circuit board 1 and the second flexible circuit board 2 is increased, thereby enabling the adaptation of larger electrical components 5.

[0040] Furthermore, the first flexible circuit board 1 and the second flexible circuit board 2 are connected by a first printed circuit board 3, and there are multiple first pads 31 and / or second pads 32 on the first printed circuit board 3. By setting multiple first pads 31 and / or second pads 32, the first printed circuit board 3 has more lines for the connection between the first flexible circuit board 1 and the second flexible circuit board 2, thereby satisfying the relatively complex circuit layout on the first flexible circuit board 1 and the second flexible circuit board 2.

[0041] In some embodiments, the first flexible circuit board 1 and the second flexible circuit board 2 may be ultra-thin printed circuit boards.

[0042] In some embodiments, in the thickness direction of the first flexible circuit board 1, at least a portion of the projection of the first flexible circuit board 1 coincides with the projection of the second flexible circuit board 2, so as to make full use of the space in the thickness direction of the first flexible circuit board 1 and the second flexible circuit board 2 for arranging electrical components 5.

[0043] For example, the first flexible circuit board 1 and the second flexible circuit board 2 have the same shape, and the projection of the first flexible circuit board 1 coincides with the projection of the second flexible circuit board 2 in the thickness direction of the first flexible circuit board 1. Alternatively, both the first flexible circuit board 1 and the second flexible circuit board 2 are elongated strips, and the length direction of the first flexible circuit board 1 is the same as the length direction of the second flexible circuit board 2, so as to achieve a reduction in the length of the circuit board assembly.

[0044] In some embodiments, in the thickness direction of the first flexible circuit board 1, the projection of the first printed circuit board 3 is located within the projection of the second flexible circuit board 2, so as to avoid the first printed circuit board 3 protruding from the first flexible circuit board 1 or the second flexible circuit board 2, causing an increase in the size of the circuit board assembly in the length or width direction.

[0045] In some embodiments, multiple electrical components 5 are located between the first flexible circuit board 1 and the second flexible circuit board 2. That is, the multiple electrical components 5 disposed on the first flexible circuit board 1 are located on the side of the first flexible circuit board 1 facing the second flexible circuit board 2, and the multiple electrical components 5 disposed on the second flexible circuit board 2 are located on the side of the second flexible circuit board 2 facing the first flexible circuit board 1. This avoids damage to the electrical components 5 during the encapsulation of the circuit board assembly.

[0046] In some embodiments, the electrical component 5 has a package 51. The package 51 encapsulates the electrical component 5 using a system-in-package (SIP) to improve the reliability of the electrical component 5.

[0047] In some embodiments, such as Figure 10 and Figure 11 As shown, the circuit board assembly also includes a second printed circuit board 4. The first printed circuit board 3, the second printed circuit board 4, and the second flexible circuit board 2 are stacked sequentially, and the first flexible circuit board 1 and the second flexible circuit board 2 are connected through the first printed circuit board 3 and the second printed circuit board 4. The first printed circuit board 3 and the second printed circuit board 4 are staggered to achieve circuit connectivity with a large size difference between the first flexible circuit board 1 and the second flexible circuit board 2. Furthermore, by setting the first printed circuit board 3 and the second printed circuit board 4 in a stacked arrangement, the distance between the first flexible circuit board 1 and the second flexible circuit board 2 can be increased to accommodate larger electrical components 5.

[0048] The second printed circuit board 4 has a third pad 41 on each of its two opposite sides, and a fourth pad 42 corresponding to the third pad 41. The third pad 41 is soldered to the second pad 32, and the second flexible circuit board 2 is soldered to the second printed circuit board 4 through the fourth pad 42. The interconnected third pad 41 and fourth pad 42 connect the first flexible circuit board 1 and the second flexible circuit board 2 through the first printed circuit board 3 and the second printed circuit board 4.

[0049] In some embodiments, there are multiple third pads 41 and / or fourth pads 42. By providing multiple third pads 41 and / or fourth pads 42, the second printed circuit board 4 has more lines for communication between the first flexible circuit board 1 and the second flexible circuit board 2, thereby satisfying the more complex circuit layout on the first flexible circuit board 1 and the second flexible circuit board 2.

[0050] In some embodiments, a sealant is provided between the first printed circuit board 3 and the second printed circuit board 4, that is, the welding gap between the second solder pad 32 and the third solder pad 41 is filled with sealant to improve the reliability between the first printed circuit board 3 and the second printed circuit board 4 and reduce the risk of deformation under pressure.

[0051] Figure 12 This is a schematic diagram illustrating the structure of a circuit board assembly according to other embodiments of this disclosure. For example... Figure 12 As shown, in some embodiments, there are two or more first printed circuit boards 3 and / or two or more second printed circuit boards 4. In other words, those skilled in the art can configure the first printed circuit boards 3 and the second printed circuit boards 4 according to actual conditions to meet the relatively complex circuit layout between the first flexible circuit board 1 and the second flexible circuit board 2.

[0052] In some embodiments, the circuit board assembly further includes a first connecting portion 6 and a second connecting portion 7. The first connecting portion 6 and the second connecting portion 7 are disposed on the first flexible circuit board 1 and / or the second flexible circuit board 2. The first connecting portion 6 is used to connect the battery cell 101, and the second connecting portion 7 is used to connect the electronic device motherboard 105. The circuit board assembly of this disclosure embodiment is used to protect the battery cell 101 during the charging and discharging process.

[0053] The first connecting part 6 can be a nickel sheet, which is used to weld to the tab 102 of the battery cell 101. The second connecting part 7 can be a board-to-board connector, one end of which is welded to the first flexible circuit board 1, and the other end is used to electrically connect to the electronic device motherboard 105. It is detachably connected to the electronic device motherboard 105 for easy installation.

[0054] In some embodiments, multiple electrical components 5 respectively form a power circuit, a protection circuit, and a power detection circuit. The power circuit, the first connection portion 6, and the second connection portion 7 are disposed on the second flexible circuit board 2. The protection circuit and the power detection circuit are disposed on the first flexible circuit board 1. The power supply line formed by the power circuit, the first connection portion 6, and the second connection portion 7 is located on the second flexible circuit board 2, meaning that the power supply line does not pass through the second printed circuit board 4, the first printed circuit board 3, and the first flexible circuit board 1. This prevents the transmission of high-voltage supply current through the fourth pad 42, the third pad 41, the second pad 32, and the first pad 31, thus avoiding the impact of high-voltage supply current on the stability of the solder joint.

[0055] Figure 13 These are circuit diagrams illustrating power circuits, protection circuits, and power detection circuits according to other embodiments of this disclosure. Figure 13As shown, in some embodiments, the power circuit consists of a battery cell, precision resistors Rs1 and Rs2, and MOSFETs Q1, Q2, Q3, and Q4. The protection circuit consists of a first-stage protection IC, a second-stage protection IC, and peripheral resistors and capacitors. It achieves overcharge and over-discharge protection and overcurrent protection by controlling the conduction and disconnection of MOSFETs Q1, Q2, Q3, and Q4. The power detection circuit consists of a fuel gauge and its peripheral resistors and capacitors. It calculates the power level by detecting the voltage across the precision resistors and the voltage across the battery cell. P1+, P2+, SDA, SCL, P1-, and P2- are used to connect to the electronic device's motherboard.

[0056] According to some embodiments of this disclosure, a battery assembly is provided, including: a battery cell 101 and a circuit board assembly as described in any of the above embodiments. The circuit board assembly is electrically connected to the tabs 102 of the battery cell 101, and the circuit board assembly is used to protect the battery cell 101 during charging and discharging. By stacking a first flexible circuit board 1 and a second flexible circuit board 2, electrical components 5 are respectively arranged on the stacked first flexible circuit board 1 or second flexible circuit board 2 using the space in the thickness direction of the first flexible circuit board 1 or the second flexible circuit board 2, thereby reducing the area occupied by the circuit board assembly in the direction perpendicular to the thickness direction of the first flexible circuit board 1 or the second flexible circuit board 2. This reduces the overall space ratio of the battery assembly.

[0057] According to some embodiments of this disclosure, an electronic device is provided, including: a circuit board assembly as described in any of the foregoing embodiments, and / or a battery assembly as described in the foregoing embodiments.

[0058] Figure 14 This is a block diagram illustrating an electronic device 8 according to some embodiments of the present disclosure. For example, the electronic device 8 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0059] Reference Figure 14 The electronic device 8 may include one or more of the following components: processing component 802, memory 804, power supply component 806, multimedia component 808, audio component 810, input / output (I / O) interface 812, sensor component 814, and communication component 816.

[0060] Processing component 802 typically controls the overall operation of electronic device 8, such as operations associated with display, telephone calls, data communication, camera operation, and recording operations. Processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 802 may include one or more modules to facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.

[0061] Memory 804 is configured to store various types of data to support the operation of electronic device 8. Examples of such data include instructions for any application or method operating on electronic device 8, contact data, phonebook data, messages, pictures, videos, etc. Memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0062] Power supply component 806 provides power to various components of electronic device 8. Power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 8.

[0063] Multimedia component 808 includes a screen that provides an output interface between the electronic device 8 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 808 includes a front-facing camera and / or a rear-facing camera. When the electronic device 8 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0064] Audio component 810 is configured to output and / or input audio signals. For example, audio component 810 includes a microphone (MIC) configured to receive external audio signals when electronic device 8 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

[0065] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0066] Sensor assembly 814 includes one or more sensors for providing state assessments of various aspects of electronic device 8. For example, sensor assembly 814 can detect the on / off state of electronic device 8, the relative positioning of components such as the display and keypad of electronic device 8, changes in position of electronic device 8 or a component of electronic device 8, the presence or absence of user contact with electronic device 8, orientation or acceleration / deceleration of electronic device 8, and temperature changes of electronic device 8. Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 814 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0067] Communication component 816 is configured to facilitate wired or wireless communication between electronic device 8 and other devices. Electronic device 8 can access wireless networks based on communication standards, such as WiFi, 3G, 4G, 5G, other communication standards, or combinations thereof. In some embodiments of this disclosure, communication component 816 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In some embodiments of this disclosure, communication component 816 further includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0068] In some embodiments of this disclosure, the electronic device 8 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0069] In the above detailed description, reference has been made to the accompanying drawings, which illustrate specific aspects of this disclosure by way of illustration. In this regard, terms indicating direction or positional relationship, such as “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential,” are used with reference to the orientation of the described figures. Since components of the described device can be positioned in multiple different orientations, directional terms are used for illustrative purposes and not for limitation. It should be understood that other aspects can be utilized and structural or logical changes can be made without departing from the concept of this disclosure. Therefore, the following detailed description should not be considered limiting.

[0070] It should be understood that, unless otherwise specifically indicated, features of various embodiments of this disclosure described herein can be combined with each other. As used herein, the term "and / or" includes any of the associated listed items and any combination of any two or more; it should be understood that, unless otherwise expressly specified and limited, the terms "joining," "attaching," "mounting," "connecting," "linking," "fixing," etc., used in the embodiments of this disclosure should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral part; as a mechanical connection, an electrical connection, or a communicative connection; as a direct connection or an indirect connection through an intermediate medium; as a connection within two elements or an interaction between two elements, unless otherwise expressly limited. Those skilled in the art will understand the specific meaning of the above terms herein according to the specific circumstances.

[0071] Furthermore, the term "above" as used herein with respect to components, elements, or material layers formed or located "above" a surface may be used to indicate that the component, element, or material layer is "indirectly" positioned (e.g., placed, formed, deposited, etc.) on the surface such that one or more additional components, elements, or layers are arranged between the surface and the component, element, or material layer. However, the term "above" as used with respect to components, elements, or material layers formed or located "above" a surface may also optionally have a specific meaning: that the component, element, or material layer is "directly" positioned (e.g., placed, formed, deposited, etc.) on the surface, for example, in direct contact with the surface.

[0072] It should be understood that spatial relative terms, such as “above,” “upper,” “below,” and “lower,” are used herein to describe the relationship between one element and another shown in the figures. In addition to the orientation depicted in the figures, these spatial relative terms are also intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “above” or “upper” relative to another element would be “below” or “lower” relative to that other element. Thus, depending on the spatial orientation of the device, the term “above” encompasses both above and below orientations. Devices may have other orientations (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0073] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited to these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, a first component, part, region, layer, or section mentioned in the examples may also be referred to as a second component, part, region, layer, or section. Furthermore, the terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first” or “second” may explicitly or implicitly include at least one of that feature.

[0074] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0075] In this description, "multiple" means at least two, referring to two or more, such as two, three, etc., unless otherwise explicitly specified. Other quantifiers are similar. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. Furthermore, unless otherwise specified or clearly indicated from the context, the articles "a" and "an" as used in this application and the appended claims are generally understood to mean "one or more."

[0076] It should be understood that, unless otherwise specifically indicated, features of various embodiments of this disclosure described herein can be combined with each other. As used herein, the term "and / or" includes any one of the related listed items and any combination of two or more; "and / or" describes the association relationship between related objects, indicating that three relationships may exist, for example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. Similarly, "at least one of..." includes any one of the related listed items and any combination of two or more.

[0077] Furthermore, the term "exemplary" is used herein to indicate that it serves as an example, instance, or illustration. Any aspect or design described herein as "exemplary" is not necessarily to be construed as advantageous compared to other aspects or designs. Rather, the use of the term "exemplary" is intended to present concepts in a concrete manner. As used herein, the term "or" is intended to indicate an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X applies A or B" is intended to indicate any of the natural inclusive permutations. That is, if X applies A; X applies B; or X applies both A and B, then applying A or B satisfies the condition under any of the foregoing instances.

[0078] Similarly, although this disclosure has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art upon reading and understanding the specification and drawings. This disclosure includes all such modifications and variations and is limited only by the scope of the claims. In particular, with respect to the various functions performed by the components described above (e.g., elements, resources, etc.), unless otherwise indicated, the terminology used to describe such components is intended to correspond to any component (functionally equivalent) that performs the specific function of the described component, even if it is not structurally equivalent to the disclosed structure. Furthermore, although specific features of this disclosure may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous to any given or particular application. Moreover, with regard to the terms “comprising,” “owning,” “having,” “having,” or variations thereof as used in this disclosure, such terms are intended to be inclusive in a manner similar to the term “including.”

[0079] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility model disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein.

[0080] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A circuit board assembly, characterized in that, include: A first flexible circuit board, a second flexible circuit board, a first printed circuit board, and electrical components; The first flexible circuit board, the first printed circuit board, and the second flexible circuit board are stacked in sequence. The first flexible circuit board is electrically connected to the second flexible circuit board through the first printed circuit board. The two opposite sides of the first printed circuit board are respectively provided with a first pad and a second pad corresponding to the first pad. The first flexible circuit board is soldered to the first printed circuit board through the first pad, and the second flexible circuit board is soldered to the first printed circuit board through the second pad. The electrical components are multiple, and the multiple electrical components are respectively disposed on the first flexible circuit board and the second flexible circuit board.

2. The circuit board assembly according to claim 1, characterized in that, In the thickness direction of the first flexible circuit board, at least a portion of the projection of the first flexible circuit board coincides with the projection of the second flexible circuit board.

3. The circuit board assembly according to claim 2, characterized in that, In the thickness direction of the first flexible circuit board, the projection of the first printed circuit board is located within the projection of the second flexible circuit board.

4. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes a second printed circuit board; The first printed circuit board, the second printed circuit board, and the second flexible circuit board are stacked in sequence, with the first printed circuit board and the second printed circuit board being staggered. The second printed circuit board has a third pad on each of its two opposite sides, and a fourth pad corresponding to the third pad. The third pad is soldered to the second pad, and the second flexible circuit board is soldered to the second printed circuit board through the fourth pad.

5. The circuit board assembly according to claim 4, characterized in that, The first pad, and / or the second pad, and / or the third pad, and / or the fourth pad may be multiple.

6. The circuit board assembly according to claim 4, characterized in that, A sealant is provided between the first printed circuit board and the second printed circuit board.

7. The circuit board assembly according to claim 4, characterized in that, There are two or more first printed circuit boards, and / or two or more second printed circuit boards.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The circuit board assembly further includes a first connecting part and a second connecting part; The first connecting portion and the second connecting portion are disposed on the first flexible circuit board and / or the second flexible circuit board. The first connecting portion is used to connect the battery cell, and the second connecting portion is used to connect the electronic device motherboard.

9. The circuit board assembly according to claim 8, characterized in that, The multiple electrical components respectively form a power circuit, a protection circuit, and a power detection circuit; The power circuit, the first connection portion, and the second connection portion are disposed on the second flexible circuit board; The protection circuit and the power detection circuit are disposed on the first flexible circuit board.

10. A battery assembly, characterized in that, include: Battery cell; The circuit board assembly according to any one of claims 1 to 9, wherein the circuit board assembly is electrically connected to the tab of the battery cell, and the circuit board assembly is used to protect the battery cell during the charging and discharging process of the battery cell.

11. An electronic device, characterized in that, include: The circuit board assembly according to any one of claims 1 to 9; and / or The battery assembly of claim 10.

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