PCB bonding apparatus

Abstract

The utility model provides a kind of PCB binding equipment, it is used to bind PCB to glass module, PCB binding equipment includes: base, binding compression mechanism and work platform, work platform is movably arranged on base, binding compression mechanism is fixedly connected with base and is located above work platform.Working platform includes connecting plate, support plate and adjusting plate, support plate is fixedly connected at one end of connecting plate, and support plate is used to fix and support glass module, adjusting plate is slidably and rotatably arranged on the surface of other end of connecting plate, and adjusting plate is used to fix and support PCB, so that binding compression mechanism is compressed with glass module with PCB.The utility model's PCB binding equipment is fixed and supported by setting adjusting plate to PCB, then the position of adjusting plate is manually adjusted, PCB and glass module alignment can be adjusted, semi-automatic repair to display screen product is realized, cost is low, and work efficiency is also higher.

Description

Technical Field

[0001] This utility model relates to the field of PCB bonding equipment, and in particular to a semi-automatic PCB bonding equipment. Background Technology

[0002] In the manufacturing process of display products, there will inevitably be situations where rework is required to some extent. For example, a defective connection between the glass module and the PCB may necessitate re-pressing and bonding.

[0003] Most existing PCB bonding equipment is fully automated, using cameras for positioning and then precise drive mechanisms to move and align the PCB with a robotic arm. However, the number of parts requiring repair on returned display products is often small. For such limited repair work, using camera positioning and fully automated control mechanisms is obviously very costly. This is especially true for small and medium-sized manufacturers, where the significant investment in such equipment severely hinders the economic viability of the repair process.

[0004] Therefore, a PCB bonding device is needed to solve the above-mentioned technical problems. Utility Model Content

[0005] This invention provides a PCB bonding device to solve the problem of high cost of existing PCB bonding devices used for rework.

[0006] To solve the above-mentioned technical problems, the technical solution of this utility model is: a PCB bonding device for bonding a PCB to a glass module, the PCB bonding device comprising: a base, a bonding and pressing mechanism and a working platform, the working platform being movably disposed on the base, and the bonding and pressing mechanism being fixedly connected to the base and located above the working platform;

[0007] The working platform includes a connecting plate, a support plate, and an adjustment plate. The support plate is fixedly connected to one end of the connecting plate and is used to fix and support the glass module. The adjustment plate is slidably and rotatably disposed on the other end surface of the connecting plate and is used to fix and support the PCB. The sliding and rotation of the adjustment plate aligns the PCB with the glass module so that the bonding and pressing mechanism can press and bind the PCB with the glass module.

[0008] In this utility model, both ends of the adjusting plate are connected to the connecting plate by Y-direction tension springs, and both sides of the side between the two ends of the adjusting plate are connected to the connecting plate by X-direction tension springs.

[0009] The connecting plate is also provided with a Y-direction fixing block and an X-direction fixing block. A Y-direction adjusting rod is threadedly connected to the Y-direction fixing block. One end of the Y-direction adjusting rod contacts the side of the adjusting plate. A pressure block is provided on the side of the adjusting plate. The pressure block is located between the two X-direction fixing blocks. An X-direction adjusting rod is threadedly connected to the X-direction fixing block. One end of the X-direction adjusting rod contacts the side of the pressure block. The pressing adjustment direction of the Y-direction adjusting rod is perpendicular to the pressing adjustment direction of the X-direction adjusting rod.

[0010] In this invention, the adjusting plate is made of aluminum, the connecting plate is made of iron, and a plurality of magnet blocks are provided on the side of the adjusting plate near the connecting plate.

[0011] In this utility model, one side of the support plate is provided with a suction groove for holding the glass module. The suction groove is a straight strip or a bent straight strip. Multiple suction grooves are arranged around one side of the support plate to form multiple annular adsorption structures. The adjustment plate is provided with a clamping mechanism for pressing the PCB.

[0012] The support plate is equipped with an X-axis positioning plate and a Y-axis positioning plate, the positions of which are adjustable.

[0013] In addition, the adjustment plate is provided with a sliding groove extending along the X direction, and the clamp mechanism is slidably and adjustablely connected to the sliding groove.

[0014] In this invention, the connecting plate is provided with extension rods at both ends for connecting with the support plate, and the support plate and the extension rods are slidably and adjustablely fixedly connected.

[0015] In this utility model, the PCB bonding device further includes a driving mechanism, which includes an X-axis moving module, a Y-axis moving module, a lifting module, and a rotating module. The Y-axis moving module is connected to the output end of the X-axis moving module, the lifting module is connected to the output end of the Y-axis moving module, the rotating module is connected to the output end of the lifting module, and the support plate is connected to the output end of the rotating module.

[0016] The PCB bonding equipment further includes a loading and positioning mechanism, which includes a positioning frame connected to the base and a loading and positioning camera that is movably and adjustable on the positioning frame. The loading and positioning camera is located above the trajectory of the working platform moving along the X direction.

[0017] In this invention, the binding and pressing mechanism includes a fixed frame and a binding and positioning camera that is movably and adjustable on the fixed frame. The binding and positioning camera is located above the trajectory of the working platform moving along the X direction.

[0018] Compared with the prior art, the advantages of this utility model are as follows: The PCB bonding equipment of this utility model fixes and supports the PCB by setting an adjustment plate, and then the position of the adjustment plate can be manually adjusted to adjust the alignment between the PCB and the glass module, realizing semi-automatic rework of display products, with low cost and high work efficiency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments are briefly introduced below. The drawings described below are only the corresponding drawings of some embodiments of this utility model.

[0020] Figure 1 This is a schematic diagram of a preferred embodiment of the PCB bonding device of this utility model.

[0021] Figure 2 This is a schematic diagram of the drive mechanism and working platform of the PCB bonding device of this utility model.

[0022] Figure 3 This is a schematic diagram of the working platform of the PCB bonding device of this utility model.

[0023] Figure 4 This is a schematic diagram of the adjustment board of the PCB bonding device of this utility model.

[0024] Figure 5 This is a schematic diagram of the bonding and pressing mechanism of the PCB bonding device of this utility model. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0026] The directional terms mentioned in this utility model, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top" and "bottom", are only for reference to the orientation of the accompanying drawings. The directional terms used are for the purpose of explaining and understanding this utility model, and are not intended to limit this utility model.

[0027] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, a connection can be a detachable connection or a connection of an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] The number of parts requiring repair on returned display products is usually small. Existing PCB bonding equipment for repair, which uses camera positioning and fully automated control mechanisms, is obviously very expensive for small-scale repairs. This is especially true for small and medium-sized manufacturers, where the large investment in such equipment severely restricts the economic viability of the repair process.

[0029] The following is a preferred embodiment of a PCB bonding device provided by this utility model that can solve the above-mentioned technical problems.

[0030] Please refer to Figure 1 and Figure 2 ,in Figure 1 This is a schematic diagram of a preferred embodiment of the PCB bonding device of this utility model. Figure 2 This is a schematic diagram of the drive mechanism and working platform of the PCB bonding device of this utility model.

[0031] In the diagram, units with similar structures are represented by the same labels.

[0032] This embodiment provides a PCB bonding device for bonding a PCB 22 to a glass module 21. The glass module 21 is a semi-finished display screen that integrates a liquid crystal display panel with components such as a driving circuit and a backlight.

[0033] In this embodiment, the PCB bonding device includes: a base, a bonding and pressing mechanism 11, and a working platform 12. Since the base obstructs the bonding and pressing mechanism 11 and the working platform 12, Figure 1 To clearly demonstrate the structure of the bonding and pressing mechanism 11 and the working platform 12, therefore... Figure 1 The base is omitted. The work platform 12 is movably mounted on the base, and the binding and pressing mechanism 11 is fixedly connected to the base and located above the work platform 12.

[0034] Please refer to Figure 3 In this embodiment, the working platform 12 includes a connecting plate 121, a support plate 122, and an adjustment plate 123.

[0035] A support plate 122 is fixedly connected to one end of a connecting plate 121. The support plate 122 is used to fix and support the glass module 21. An adjustment plate 123 is slidably and rotatably disposed on the other end surface of the connecting plate 121. The adjustment plate 123 is used to fix and support the PCB 22. By sliding and rotating the adjustment plate 123, the PCB 22 is aligned with the glass module 21 so that the bonding pressing mechanism 11 can press and bind the PCB 22 and the glass module 21 together.

[0036] Please refer to Figure 3 In this embodiment, both ends of the adjusting plate 123 are connected to the connecting plate 121 via Y-direction tension springs 126, and both sides of the adjusting plate 123 between its two ends are connected to the connecting plate 121 via X-direction tension springs 125. This allows the adjusting plate 123 to be stably positioned on the surface of the connecting plate 121, while applying external force can overcome the elastic force of the X-direction tension springs 125 and Y-direction tension springs 126 to drive the adjusting plate 123 to slide or rotate and adjust its position.

[0037] In addition, the connecting plate 121 is also provided with a Y-direction fixing block 127 and an X-direction fixing block 128. A Y-direction adjusting rod 129 is threadedly connected to the Y-direction fixing block 127. One end of the Y-direction adjusting rod 129 contacts the side of the adjusting plate 123. A pressure block 12B is provided on the side of the adjusting plate 123. The pressure block 12B is located between the two X-direction fixing blocks 128. An X-direction adjusting rod 12A is threadedly connected to the X-direction fixing block 128. One end of the X-direction adjusting rod 12A contacts the side of the pressure block 12B. The pressing adjustment direction of the Y-direction adjusting rod 129 is perpendicular to the pressing adjustment direction of the X-direction adjusting rod 12A. In this way, the adjusting plate 123 can be driven to slide or rotate to adjust its position by turning the Y-direction adjusting rod 129 and the X-direction adjusting rod 12A.

[0038] Among them, the Y-axis adjusting rod 129 and the X-axis adjusting rod 12A are similar to the structure of a micrometer, and have components such as a micrometer screw, a fixed sleeve, and a micrometer cylinder, so as to achieve precise adjustment of the adjusting plate 123.

[0039] Please refer to Figure 4 In this embodiment, the adjusting plate 123 is made of aluminum, and the connecting plate 121 is made of iron. A plurality of magnet blocks 1232 are provided on the side of the adjusting plate 123 near the connecting plate 121. This restricts the movement of the adjusting plate 123 in the direction perpendicular to the connecting plate 121, ensuring the stability of the fit between the adjusting plate 123 and the connecting plate 121.

[0040] Please refer to Figure 3In this embodiment, one side of the support plate 122 is provided with a suction groove 1221 for adsorbing and securing the glass module 21. The suction groove 1221 is a straight strip or a bent straight strip. Multiple suction grooves 1221 are arranged on one side of the support plate 122 to form multiple annular adsorption structures, which can be used to adsorb glass modules 21 of various sizes and specifications, and has high compatibility. The adjustment plate 123 is provided with a clamping mechanism 12C for pressing and securing the PCB 22.

[0041] The clamping mechanism 12C can be a hinge clamping mechanism or a screw clamping mechanism, etc. For example, a screw clamping mechanism has a screw threaded to one end of the clamping rod. By turning the screw, it can be brought closer to or away from the PCB to achieve clamping or loosening of the PCB.

[0042] In addition, the adjustment plate 123 is provided with a slide groove 1231 extending along the X direction, and the clamping mechanism 12C is slidably and adjustablely connected to the slide groove 1231 so that the clamping mechanism 12C can clamp the PCB at different positions.

[0043] In this embodiment, an X-axis positioning plate 1241 and a Y-axis positioning plate 1242 are adjustablely positioned on the support plate 122. The X-axis positioning plate 1241 and the Y-axis positioning plate 1242 are used for side positioning with the glass module 21. The support plate 122 may be provided with multiple threaded holes, and the X-axis positioning plate 1241 and the Y-axis positioning plate 1242 are provided with elongated holes. Screws pass through the elongated holes and connect to the threaded holes on the support plate 122, so that the positions of the X-axis positioning plate 1241 and the Y-axis positioning plate 1242 on the support plate 122 are adjustable.

[0044] Please refer to Figure 3 In this embodiment, the connecting plate 121 has extension rods 1211 at both ends for connecting to the support plate 122, and the support plate 122 is slidably and adjustablely fixedly connected to the extension rods 1211. This makes the distance between the support plate 122 and the adjusting plate 123 adjustable to accommodate different spacings between the glass module 21 and the PCB 22.

[0045] Please refer to Figure 2In this embodiment, the PCB bonding device further includes a drive mechanism 14, which includes an X-axis moving module 141, a Y-axis moving module 142, a lifting module 143, and a rotating module 144. The Y-axis moving module 142 is connected to the output end of the X-axis moving module 141, the lifting module 143 is connected to the output end of the Y-axis moving module 142, the rotating module 144 is connected to the output end of the lifting module 143, and the support plate 122 is connected to the output end of the rotating module 144. The drive mechanism 14 drives the support plate 122 to move or rotate, aligning the part of the glass module 21 that needs to be pressed and bonded with the upper pressure block 111. Then, by controlling the sliding and rotation of the adjustment plate 123, the PCB 22 and the glass module 21 can be aligned, allowing the bonding and bonding mechanism 11 to perform the bonding and bonding operation.

[0046] The PCB bonding equipment also includes a loading and positioning mechanism 13, which includes a positioning frame 131 connected to the base and a loading and positioning camera 132 that is movably and adjustable on the positioning frame 131. The loading and positioning camera 132 is located above the trajectory of the working platform 12 moving along the X direction.

[0047] The drive mechanism 14 drives the work platform 12 to move below the loading and positioning mechanism 13. At this time, there is no interference from the binding pressing mechanism 11, which makes it easy to load the glass module 21 onto the work platform 12. At the same time, the loading and positioning camera 132 takes a picture of the glass module 21. The controller controls the drive mechanism 14 to work based on the picture information to adjust the position of the work platform 12.

[0048] Please refer to Figure 5 In this embodiment, the binding and pressing mechanism 11 includes an upper pressing block 111, a lower pressing block 112, a fixed frame 113, and a binding and positioning camera 114 that is movably and adjustablely mounted on the fixed frame 113.

[0049] The bonding positioning camera 114 is located above the trajectory of the work platform 12 moving along the X direction. The loading positioning camera 132 performs preliminary photographic positioning of the entire glass module, while the bonding positioning camera 114 performs more precise photographic positioning of the parts between the glass module 21 and the PCB 22 that need to be pressed and bonded.

[0050] The upper pressure block 111 and the lower pressure block 112 are positioned opposite each other, and the part that needs to be pressed and bound between the glass module 21 and the PCB 22 is located between the upper pressure block 111 and the lower pressure block 112. After the binding and positioning camera 114 takes pictures and positions the PCB 22 and the glass module 21 is aligned by sliding and rotating the adjustment plate 123, the upper pressure block 111 descends and cooperates with the lower pressure block 112 to press and bind the glass module 21 and the PCB 22.

[0051] The working principle of this utility model is as follows: First, the drive mechanism 14 drives the work platform 12 to move below the loading and positioning mechanism 13. Then, a robot or operator loads the glass module 21 onto the work platform 12. At the same time, the loading and positioning camera 132 takes a picture of the glass module 21. The controller uses the picture information to control the drive mechanism 14 to adjust the position of the work platform 12.

[0052] It should be noted that several PCBs 22 are connected to the glass module 21. Only some of the PCBs 22 and the glass module 21 need to be reworked. The PCBs 22 that need to be reworked also have one end that is properly connected to the glass module 21, while the other end needs to be reworked.

[0053] Then, the drive mechanism 14 drives the work platform 12 to move below the bonding and pressing mechanism 11. The bonding and positioning camera 114 takes detailed pictures of the parts between the glass module 21 and the PCB 22 that need to be bonded. The controller uses the picture information to control the drive mechanism 14 to further adjust the position of the work platform 12 so that the parts of the glass module 21 that need to be bonded are aligned with the upper pressing block 111. Then, the operator drives the adjustment plate 123 to slide and rotate by turning the Y-axis adjustment rod 129 and the X-axis adjustment rod 12A, thereby aligning the PCB 22 with the glass module 21. Finally, the upper pressing block 111 of the bonding and pressing mechanism 11 is controlled to descend and cooperate with the lower pressing block 112 to bond the glass module 21 and the PCB 22.

[0054] This completes the process of pressing and bonding the glass module 21 and PCB 22 using the PCB bonding device of this preferred embodiment.

[0055] The PCB bonding device of this preferred embodiment uses an adjustment plate to fix and support the PCB. The position of the adjustment plate can be manually adjusted to align the PCB with the glass module, realizing semi-automatic rework of the display product. It is low in cost and high in work efficiency.

[0056] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. A PCB bonding device, characterized in that, The PCB bonding device is used to bond a PCB to a glass module. The PCB bonding device includes a base, a bonding and pressing mechanism, and a working platform. The working platform is movably mounted on the base, and the bonding and pressing mechanism is fixedly connected to the base and located above the working platform. The working platform includes a connecting plate, a support plate, and an adjustment plate. The support plate is fixedly connected to one end of the connecting plate and is used to fix and support the glass module. The adjustment plate is slidably and rotatably disposed on the other end surface of the connecting plate and is used to fix and support the PCB. The sliding and rotation of the adjustment plate aligns the PCB with the glass module so that the bonding and pressing mechanism can press and bind the PCB with the glass module.

2. The PCB bonding device according to claim 1, characterized in that, Both ends of the adjusting plate are connected to the connecting plate by Y-direction tension springs, and both ends of the side surface between the two ends of the adjusting plate are connected to the connecting plate by X-direction tension springs. The connecting plate is also provided with a Y-direction fixing block and an X-direction fixing block. A Y-direction adjusting rod is threadedly connected to the Y-direction fixing block. One end of the Y-direction adjusting rod contacts the side of the adjusting plate. A pressure block is provided on the side of the adjusting plate. The pressure block is located between the two X-direction fixing blocks. An X-direction adjusting rod is threadedly connected to the X-direction fixing block. One end of the X-direction adjusting rod contacts the side of the pressure block. The pressing adjustment direction of the Y-direction adjusting rod is perpendicular to the pressing adjustment direction of the X-direction adjusting rod.

3. The PCB bonding device according to claim 1, characterized in that, The adjustment plate is made of aluminum, the connecting plate is made of iron, and a plurality of magnets are provided on the side of the adjustment plate near the connecting plate.

4. The PCB bonding device according to claim 1, characterized in that, One side of the support plate is provided with suction grooves for holding the glass module. The suction grooves are straight strips or bent straight strips. Multiple suction grooves are arranged to form multiple annular adsorption structures on one side of the support plate. The adjustment plate is provided with a clamping mechanism for pressing the PCB.

5. The PCB bonding device according to claim 4, characterized in that, The support plate is equipped with an X-axis positioning plate and a Y-axis positioning plate, which are adjustable in position.

6. The PCB bonding device according to claim 4, characterized in that, The adjustment plate is provided with a sliding groove extending along the X direction, and the clamp mechanism is slidably and adjustablely connected to the sliding groove.

7. The PCB bonding device according to claim 1, characterized in that, The connecting plate has extension rods at both ends for connecting to the support plate, and the support plate is slidably and adjustablely fixedly connected to the extension rods.

8. The PCB bonding device according to claim 1, characterized in that, The PCB bonding device further includes a drive mechanism, which includes an X-axis moving module, a Y-axis moving module, a lifting module, and a rotating module. The Y-axis moving module is connected to the output end of the X-axis moving module, the lifting module is connected to the output end of the Y-axis moving module, the rotating module is connected to the output end of the lifting module, and the support plate is connected to the output end of the rotating module.

9. The PCB bonding device according to claim 8, characterized in that, The PCB bonding equipment also includes a loading and positioning mechanism, which includes a positioning frame connected to the base and a loading and positioning camera that is movably and adjustable on the positioning frame. The loading and positioning camera is located above the trajectory of the working platform moving along the X direction.

10. The PCB bonding device according to claim 1, characterized in that, The binding and pressing mechanism includes a fixed frame and a binding and positioning camera that is movably and adjustable on the fixed frame. The binding and positioning camera is located above the trajectory of the working platform moving along the X direction.

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