Electromagnetic-thermal-stress synergistically optimized power module packaging device

Abstract

The utility model discloses a kind of electromagnetic-heat-stress synergic optimization power module packaging device, belong to power module electromagnetic compatibility and thermal management technical field, including cover plate and five-face metal shell body. Cover plate is PCB board, by solder mask layer, first insulating layer, first shielding metal layer, second insulating layer, second shielding metal layer, third insulating layer, solderable metal layer sequentially laminated from top to bottom. Solderable metal layer is laid in the edge of PCB board. The solderable metal layer of PCB board is fixed by high-frequency induction soldering and the milling groove of the end face of metal base, and constitutes fully-enclosed electromagnetic shielding cavity;Cover plate uses high-thermal-conductivity ceramic substrate, and heat dissipation via hole is arranged between metal layer, and the end face of five-face metal shell is connected by heat dissipation via hole, to realize efficient thermal management. The utility model has the advantages of excellent electromagnetic shielding performance, high heat dissipation efficiency, strong assembly reliability, compact structure and the like, and can be applied to communication base station, aerospace and other fields with strict requirements on electromagnetic environment.

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