Display module edge structure
By setting clearance openings on the main body of the binding paper to avoid direct contact with the flexible circuit board, and combining polyester film and pressure-sensitive adhesive materials, the IC bonding MURA problem caused by traditional binding paper is solved, improving the display quality and stability of the display module and extending its service life.
CN224503666UActive Publication Date: 2026-07-14TRULY SEMICON
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TRULY SEMICON
- Filing Date
- 2025-06-12
- Publication Date
- 2026-07-14
Smart Images
Figure CN224503666U_ABST
Abstract
The utility model discloses display module edge covering technical field. The utility model discloses still relate to a display module edge covering structure. Include: the edge covering paper main part for carrying out the edge covering to display module, is equipped with the edge covering paper main part and avoids the mouth, and the mouth is used for avoiding the flexible circuit board binding position and the flexible circuit board bending position of display module, the binding position and the bending position of the flexible circuit board of the mouth correspond, and the edge covering paper main part does not connect with the binding position and the bending position of the flexible circuit board in the edge covering process, effectively reduced the edge covering paper main part in the assembly process and pressed or pulled the binding position and the bending position of the flexible circuit board, thereby reduced the IC binding MURA of the force of the edge covering paper, because reduced the stress of the bending position of the flexible circuit board, IC binding MURA problem is improved obviously, and then the display quality and stability of whole display module are improved.
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