Flip cover baseless module structure

The flip-top, baseless modular structure solves the problems of complex wiring and insufficient dust and water resistance of fire protection modules, thus simplifying construction and improving safety.

CN224503724UActive Publication Date: 2026-07-14SICHUAN JINGYIWEI TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SICHUAN JINGYIWEI TECH CO LTD
Filing Date
2025-08-18
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

Existing fire protection modules have complex wiring operations, insufficient dust and water resistance, inconvenient construction and maintenance, and pose risks of poor contact and short circuits.

Method used

It adopts a flip-top, baseless modular structure, including a top cover, circuit board, and bottom box. The flip-top structure enables the flipping function, and the combination of sealing and snap-fit ​​design simplifies the installation of the module and protects the internal circuit.

Benefits of technology

It simplifies wiring operations, reduces construction costs, improves dust and water resistance, reduces the risk of short circuits, and enhances the stability and safety of the module.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of flip cover type baseless module structure, including upper cover, circuit board, bottom box and wiring terminal. Wiring terminal is set on circuit board, circuit board is installed in bottom box, upper cover buckle installation is installed in bottom box top. The upper cover includes upper cover main body and the flip cover structure connected with upper cover main body, the flip cover structure is connected with upper cover main body softness by turning over groove, to realize the turning function of flip cover structure on upper cover main body. The utility model simplifies wiring operation by flip cover design, improves dustproof waterproof performance in combination with multilayer sealing element and buckle structure, optimizes internal layout to enhance stability and reliability, to reduce construction and maintenance difficulty, improve use safety, suitable for fire-fighting equipment field.
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Description

Technical Field

[0001] This utility model belongs to the field of fire protection equipment structure technology, specifically, it relates to a flip-top type baseless modular structure. Background Technology

[0002] Fire alarm modules are core components in automatic fire alarm systems, responsible for signal transmission and equipment control. They are primarily used for activating various fire-fighting equipment and providing signal feedback. Most existing fire alarm modules employ plug-in or sliding mounting structures, both requiring a base. The base must first be fixed to the wall or in the module box before wiring is done on the base's contact springs. Power supply and signal transmission are achieved through contact between the base's springs and the module body. This design is cumbersome, inefficient in production and construction, and the springs are prone to aging and poor contact after prolonged use, affecting module performance. Some fire alarm modules use direct wiring, with terminals exposed at both ends for external power supply and signal transmission. This design leaves the terminals exposed, making them susceptible to water, dust, and rodent damage, and unsuitable for use in humid environments. A very small number are designed with a detachable cover for direct wiring, encapsulating the circuitry and terminals within the cover. Installation and wiring are performed by removing the cover and then reinstalling it. This method is cumbersome, and removing the cover for wiring can easily expose the internal circuit board, posing a risk of short circuits and damage.

[0003] Therefore, it is necessary to design a flip-type baseless modular structure to simplify the module manufacturing process and construction difficulty, while also providing dustproof, waterproof and rodent-proof functions, protecting the module circuit and reducing the risk of module damage. Utility Model Content

[0004] The purpose of this utility model is to provide a flip-top type baseless module structure, which mainly solves the problems of existing fire protection modules such as complicated wiring operations, insufficient dust and water resistance, and inconvenient construction and maintenance.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] The flip-top type baseless modular structure includes an upper cover, a circuit board, a bottom box, and wiring terminals; the wiring terminals are disposed on the circuit board, the circuit board is installed inside the bottom box, and the upper cover is snapped onto the top of the bottom box;

[0007] The upper cover includes an upper cover body and a flip cover structure connected to the upper cover body. The flip cover structure is flexibly connected to the upper cover body through a flip groove to realize the flip function of the flip cover structure on the upper cover body.

[0008] Furthermore, in this utility model, the flip cover structure is a semi-flip cover, that is, the flip cover structure is a flip cover connected to one side of the upper cover body; the flip cover is flexibly connected by a flip groove opened on one side of the upper cover body.

[0009] Furthermore, in this utility model, the flip structure is a double flip structure, that is, the flip structure consists of two flips connected on both sides of the upper cover body; the flips are flexibly connected by flip grooves opened on both sides of the upper cover body.

[0010] Furthermore, in this utility model, the flip cover is provided with a sealing element on the side facing the bottom box. The sealing element is provided along the other three edges of the side of the flip cover that is not connected to the flip groove, and the height of the sealing element on the side parallel to the flip groove is greater than the height of the other two sides.

[0011] Furthermore, in this utility model, a square sealing element is provided around the edge of the upper cover body on the side facing the bottom box, and a circuit board pressure strip and a light guide column are provided in the area of ​​the square sealing element; the bottom of the light guide column is connected to the upper cover body, and the front wall of the connection is recessed downward to form a light-emitting area.

[0012] Furthermore, in this utility model, the bottom box facing the top cover has a circuit board mounting cavity directly opposite the main body of the top cover. The center of the circuit board mounting cavity is recessed downward to form an independent circuit board mounting position and empty areas on the left and right sides. The front end of the circuit board mounting position is provided with a wire inlet, and the front end of the empty area is provided with a fixing cavity. The fixing cavity is provided with a fixing hole. The circuit board mounting position is provided with a circuit board limiting buckle. The front side wall of the empty area is provided with a U-shaped clip. The outer edge of the front side wall of the wire inlet is recessed inward to form a groove so as to open the flip cover.

[0013] Furthermore, in this utility model, the sealing element located on the side parallel to the flip groove is provided with multiple first latches at the connection between it and the flip cover; correspondingly, the inner edge of the front side wall of the inlet is provided with a first buckle at the position corresponding to the first latch; the square sealing element is provided with a number of second latches on one side opposite to the flip groove, and correspondingly, the inner edge of the upper wall of the bottom box is provided with a second buckle adapted to the second latches; the square sealing element is provided with a number of third latches on one side adjacent to the flip groove, and correspondingly, the rear side wall of the fixing cavity is provided with a third buckle adapted to the third latches.

[0014] Furthermore, in this utility model, the gap between the rear sidewall of the fixing cavity and the U-shaped clip forms a fixing groove that matches the thickness of the square sealing element on the main body of the upper cover.

[0015] Furthermore, in this utility model, the upper cover is made of flexible material, including PP and PE materials, and is integrally molded by injection molding.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] (1) In this utility model, the elasticity and tensile properties of PP plastic are cleverly used to set up a flip groove to divide the top cover into a main body and a flip cover. Its width is adapted to the flip angle of the flip cover, which can ensure that the flip cover is firmly connected to the main body of the top cover while easily opening it for module installation and wiring without breakage.

[0018] (2) In this utility model, after the upper cover is installed, the circuit board, wiring terminals and fixing holes are all allocated in independent areas, which are physically isolated. Whether it is module wiring or screw fixing, the internal circuit will not be affected, ensuring the safety of the internal circuit. The wiring is simple, and the construction difficulty and construction cost are low.

[0019] (3) In this utility model, the sealing element and fixing groove on the lower back of the top cover are cleverly combined to separate the wiring terminals and the internal circuit for physical isolation, which facilitates wiring operation and protects the internal circuit. After the top cover is closed, the flip cover can protect the wiring terminals inside the bottom box, which can play a good role in waterproofing, dustproofing and rodent prevention.

[0020] (4) The entire structure of this utility model consists of only two parts: the top cover and the bottom box. Compared with the traditional design, the base is reduced, which greatly simplifies the structure and production process and reduces the production cost of the module. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this utility model.

[0022] Figure 2 This is a cross-sectional structural diagram of Embodiment 1 of this utility model.

[0023] Figure 3 This is a schematic diagram of the inner structure of the upper cover in Embodiment 1 of this utility model.

[0024] Figure 4 This is a side view of the upper cover in Embodiment 1 of this utility model.

[0025] Figure 5 This is a schematic diagram of the inner structure of the bottom box in Embodiment 1 of this utility model.

[0026] Figure 6 This is a schematic diagram of the overall structure of Embodiment 2 of this utility model.

[0027] Figure 7 This is a schematic diagram of the circuit board structure in Embodiment 2 of this utility model.

[0028] The names corresponding to the reference numerals in the attached figures are as follows:

[0029] 1-Top cover; 2-Circuit board; 3-Base box; 4-Terminal; 5-Top cover body; 6-Flip cover; 7-Flip groove; 8-Seal; 9-Square seal; 10-Circuit board pressure strip; 11-Light guide column; 12-Circuit board mounting cavity; 13-Circuit board mounting position; 14-Empty area; 15-Cable inlet; 16-Fixing cavity; 17-Fixing hole; 18-Groove; 19-First bayonet; 20-First buckle; 21-Second bayonet; 22-Second buckle; 23-Circuit board limiting buckle; 24-U-shaped clip; 25-Third bayonet; 26-Third buckle; 27-Fixing groove. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of the present invention include, but are not limited to, the following embodiments.

[0031] Example 1

[0032] This utility model discloses a flip-top, baseless modular structure, which achieves the goals of simplifying the construction process, enhancing sealing performance, and improving module stability through optimized design. Figures 1 to 5 As shown, the semi-flip-top modular structure of this utility model includes an upper cover 1, a circuit board 2, a base box 3, and wiring terminals 4. The wiring terminals 4 are fixedly mounted on the circuit board 2, which is fixed inside the base box 3 by a limiting structure. The upper cover 1 is snapped onto the top of the base box 3 to achieve encapsulation and protection of the internal components. The upper cover 1 consists of an upper cover body 5 and a flip cover 6 connected to one side of the upper cover body 5. The flip cover 6 achieves a flexible connection through a flip groove 7 on one side of the upper cover body 5, thereby supporting the flip function of the flip cover 6 on the upper cover body 5. A sealing element 8 is provided on the side of the flip cover 6 facing the base box 3. The sealing element 8 is provided along the three edges of the flip cover 6 that are not connected to the flip groove 7, and the height of the sealing element 8 on the side parallel to the flip groove 7 is greater than the height of the other two sides to enhance the sealing effect. The upper cover is made of flexible materials such as PP or PE and is integrally molded by injection molding.

[0033] The flip cover 6 is designed to allow users to perform wiring operations without completely disassembling the top cover 1, avoiding the cumbersome steps of multiple disassemblies and reassemblies required in traditional plug-in or sliding structures, thus reducing construction difficulty. The sealing element 8 of the flip cover 6 has multiple first latches 19 at its connection point. Correspondingly, the inner edge of the front sidewall of the cable inlet 15 of the base box 3 has a first buckle 20 that matches the first latches 19 to secure the flip cover 6. When the flip cover 6 is closed, the first latches 19 and the first buckles 20 engage to ensure a tight connection between the flip cover 6 and the base box 3, further enhancing the module's dustproof and waterproof performance. Furthermore, the outer edge of the front sidewall of the cable inlet 15 is recessed inward to form a groove 18, facilitating the user to open the flip cover 6 for wiring operations.

[0034] A square sealing element 9 is provided around the edge of the upper cover body 5 facing the bottom box 3. A circuit board pressure strip 10 and a light guide post 11 are located within the area of ​​the square sealing element 9. The bottom of the light guide post 11 is connected to the upper cover body 5, and the front wall of the connection point is recessed downwards to form a light-emitting area for indicating the module status. The design of the square sealing element 9 ensures the airtightness between the upper cover body 5 and the bottom box 3, while the circuit board pressure strip 10 is used to fix the circuit board 2 and prevent it from shifting within the bottom box 3. The bottom of the light guide post 11 is connected to the upper cover body, and the wall thickness at the connection point is one-third of the thickness of the upper cover body to ensure good light emission.

[0035] The square seal 9 has several second latches 21 on one side of its opposite side, and the inner edge of the upper wall of the base box 3 has second buckles 22 that fit the second latches 21. The square seal 9 has several third latches 25 on one side of its adjacent flip groove 7, and correspondingly, the rear wall of the fixing cavity 16 of the base box 3 has third buckles 26 that fit the third latches 25. The design of these latches and buckles not only ensures a firm connection between the upper cover 1 and the base box 3, but also facilitates quick disassembly and assembly, improving maintenance efficiency. The gap between the rear wall of the fixing cavity 16 and the U-shaped clip 24 forms a fixing groove 27 that matches the thickness of the square seal 9 on the upper cover body 5, further enhancing the overall stability of the module.

[0036] The bottom box 3, facing the top cover 1, has a circuit board mounting cavity 12 located opposite the main body 5 of the top cover. The center of the circuit board mounting cavity 12 is recessed downwards, forming an independent circuit board mounting position 13 and two empty areas 14 on the left and right sides. The front end of the circuit board mounting position 13 has a cable inlet 15, and the front end of the empty areas 14 has a fixing cavity 16 with fixing holes 17 for fixing modules. The front sidewall of the empty area 14 has U-shaped clips 24 for quick installation and removal of modules in conjunction with fixing slots 27. The circuit board mounting position 13 has a circuit board limiting clip 23 for fixing the circuit board 2 and preventing it from loosening during use. This spatial layout design separates the circuit board mounting position 13 from the empty areas 14, improving the overall stability of the module and making the installation of internal components more compact and reliable.

[0037] In use, circuit board 2 is installed on circuit board mounting position 13. After the upper cover 1 is closed, the sealing element 8 on the lower back of the upper cover body 5 enters the fixing groove 27. At this time, the first latch 19 locks with the first buckle 20, and the second latch 21 locks with the second buckle 22. At the same time, the circuit board pressure strip 10 presses the circuit board 2 firmly. The sealing element 8 and the fixing groove 27 cooperate to physically separate the internal circuit and the wiring terminal 4. In use, first open the flip cover 6 and pull out the wire from the wire inlet 15 of the bottom box 3. Then, use a screw to pass through the fixing hole 17 of the bottom box. Finally, connect the wire to the wiring terminal 2, close the flip cover 6, and lock the third latch 25 and the third buckle 26 to complete the installation and fixing of the entire module.

[0038] In practical applications, such as fire alarm systems, the semi-flip-top modular structure of this invention can meet the needs of use in humid environments. Through the flip-top design and multi-layered sealing structure, the module significantly simplifies wiring operations and reduces construction costs. The design of the seal 8 and the snap-fit ​​enhances the module's dustproof and waterproof performance, enabling it to withstand harsh environments. By reducing direct contact with internal components, the module reduces the risk of short circuits and damage, improving safety. The rational spatial layout and fixing method ensure the stability of the internal components while making the overall structure more compact and reliable.

[0039] Example 2

[0040] like Figure 6 , Figure 7 As shown, unlike Embodiment 1, the flip structure in this embodiment is a double flip structure, with two flip covers 6 positioned above and below the upper cover body 5, connected and flipped via a flip groove 7 on the front of the upper cover body 5. If the double flip module is used in a power monitoring module, in the double flip module, wiring terminals are located at both ends of the circuit board, corresponding to the open positions of the two flip covers.

[0041] In summary, this utility model, through its flip-top design, multi-layered sealing structure, and reasonable spatial layout, solves the problems of complex wiring operations, insufficient dust and water resistance, and inconvenient construction and maintenance of existing fire protection modules, providing new ideas and technical references for the design of similar products.

[0042] The above embodiments are merely one of the preferred embodiments of this utility model and should not be used to limit the scope of protection of this utility model. Any modifications or refinements made to the main design concept and spirit of this utility model that are not of substantial significance, but solve the same technical problem as this utility model, should be included within the scope of protection of this utility model.

Claims

1. A flip-top type baseless modular structure, characterized in that, It includes a top cover (1), a circuit board (2), a bottom box (3), and a terminal block (4); the terminal block (4) is disposed on the circuit board (2), the circuit board (2) is installed inside the bottom box (3), and the top cover (1) is fastened to the top of the bottom box (3); The upper cover (1) includes an upper cover body (5) and a flip cover structure connected to the upper cover body (5). The flip cover structure is flexibly connected to the upper cover body (5) through a flip groove (7) to realize the flip function of the flip cover structure on the upper cover body (5).

2. The flip-type baseless module structure according to claim 1, characterized in that, The flip-top structure is a semi-flip-top form, that is, the flip-top structure is a flip-top (6) connected to one side of the upper cover body (5); the flip-top (6) is flexibly connected by a flip groove (7) opened on one side of the upper cover body (5).

3. The flip-top type baseless module structure according to claim 1, characterized in that, The flip structure is a double flip structure, that is, the flip structure consists of two flips (6) connected on both sides of the upper cover body (5); the flips (6) are flexibly connected by flip grooves (7) opened on both sides of the upper cover body (5).

4. The flip-top type baseless module structure according to claim 2 or 3, characterized in that, The flip cover (6) is provided with a sealing element (8) on the side facing the bottom box (3). The sealing element (8) is provided along the other three edges of the flip cover (6) that are not connected to the flip groove (7). The height of the sealing element (8) on the side parallel to the flip groove (7) is greater than the height of the other two sides.

5. The flip-top type baseless module structure according to claim 4, characterized in that, The upper cover body (5) facing the bottom box (3) has a square sealing element (9) around the edge of the upper cover body (5). The square sealing element (9) has a circuit board pressure strip (10) and a light guide column (11) in the area of ​​the square sealing element (9). The bottom of the light guide column (11) is connected to the upper cover body (5), and the front wall of the connection is recessed downward to form a light-emitting area.

6. The flip-top type baseless module structure according to claim 5, characterized in that, The bottom box (3) facing the top cover (1) has a circuit board mounting cavity (12) on the side facing the top cover (5). The center of the circuit board mounting cavity (12) is recessed downward to form an independent circuit board mounting position (13) and empty areas (14) on the left and right sides. The circuit board mounting position (13) has a wire inlet (15) at the front end. The empty area (14) has a fixing cavity (16) at the front end. The fixing cavity (16) has a fixing hole (17). The circuit board mounting position (13) has a circuit board limiting buckle (23). The front side wall of the empty area (14) is set with a U-shaped clip (24). The outer edge of the front side wall of the wire inlet (15) is recessed inward to form a groove (18) so as to open the flip cover.

7. The flip-top type baseless module structure according to claim 6, characterized in that, The sealing element (8) located on the side parallel to the flip groove (7) is provided with multiple first bayonet slots (19) at the connection between it and the flip cover (6); correspondingly, the inner edge of the front side wall of the inlet (15) is provided with a first buckle (20) at the position corresponding to the first bayonet slot (19); the square sealing element (9) is provided with a number of second bayonet slots (21) on one side opposite to the flip groove (7); correspondingly, the inner edge of the upper wall of the bottom box (3) is provided with a second buckle (22) that matches the second bayonet slot (21); the square sealing element (9) is provided with a number of third bayonet slots (25) on one side adjacent to the flip groove (7); correspondingly, the rear side wall of the fixing cavity (16) is provided with a third buckle (26) that matches the third bayonet slot (25).

8. The flip-type baseless module structure according to claim 7, characterized in that, The gap between the rear side wall of the fixed cavity (16) and the U-shaped clip (24) forms a fixed groove (27) that matches the thickness of the square seal (9) on the main body of the upper cover (5).

9. The flip-top type baseless module structure according to claim 8, characterized in that, The top cover is made of flexible materials, including PP and PE, and is integrally molded by injection molding.