A circuit board suitable for high-precision instruments

Abstract

This utility model relates to the field of circuit board technology, specifically a circuit board adapted for high-precision instruments. It includes a high-precision instrument circuit board body, with two heat-conducting bases on the surface of the circuit board body. Each heat-conducting base has a heat-conducting groove inside, and a connecting seat is fixedly connected to one side of each heat-conducting base. The advantages of this utility model are: through the cooperation of the high-precision instrument circuit board body, the heat-conducting bases, the heat-conducting grooves, the connecting seat, the air inlet groove, the miniature cooling fan, and the air outlet, when the high-precision instrument circuit board body is working, the miniature cooling fan allows air to enter the interior of the heat-conducting groove from the air inlet groove, thereby dissipating the heat generated by the high-precision instrument circuit board body absorbed by the heat-conducting bases through the air outlet. This significantly improves the heat dissipation capacity of the high-precision instrument circuit board body and extends its service life.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board adapted to high-precision instruments. Background Technology

[0002] High-precision instrument circuit boards are printed circuit boards with high manufacturing precision and complexity. They are widely used in fields requiring high performance, high reliability, and complex designs, such as aerospace, medical equipment, and communication systems. With the continuous advancement of technology and the increasing miniaturization and intelligence of electronic devices, the market demand for high-precision instrument circuit boards continues to grow and will play an important role in more fields, with broad market prospects.

[0003] However, the circuit board substrates commonly used in existing high-precision instrument circuit boards, such as copper-clad epoxy glass cloth substrates or phenolic resin glass cloth substrates, while possessing good electrical and processing properties, have relatively poor heat dissipation performance. These substrates have low thermal conductivity, making it difficult to effectively dissipate heat to the surrounding environment. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to provide a circuit board adapted to high-precision instruments to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of this utility model provides a circuit board adapted for high-precision instruments, including a high-precision instrument circuit board body. Two heat-conducting bases are disposed on the surface of the high-precision instrument circuit board body. A heat-conducting groove is formed inside the heat-conducting base. A connecting seat is fixedly connected to one side of the heat-conducting base, and a groove communicating with the heat-conducting groove is formed inside the connecting seat. An air inlet groove is formed on the top of the connecting seat. A miniature cooling fan is disposed inside the groove of the connecting seat. An air outlet is formed on one side of the heat-conducting base. The technical effect achieved by the above solution is that the miniature cooling fan drives air from the air inlet groove into the connecting seat and the heat-conducting groove. Simultaneously, the heat-conducting base guides the heat generated by the high-precision instrument circuit board. Then, the air carries away the heat as it passes through the heat-conducting groove and is discharged from the air outlet, thereby greatly improving the heat dissipation capacity of the high-precision instrument circuit board body and extending its service life.

[0007] Preferably, in any of the above solutions, a bonding groove is formed on the surface of the high-precision instrument circuit board body, a bonding part adapted to the bonding groove is fixedly connected to one side of the bonding heat-conducting base, a plug-in plate is fixedly connected to one side of the bonding part, a plug-in groove adapted to the plug-in plate is formed on one side of the bonding groove, and the plug-in groove is located below the mounting hole of the high-precision instrument circuit board body. The technical effect achieved by the above solution is that by inserting the bonding part into the interior of the bonding groove, the plug-in plate can enter the interior of the plug-in groove. When the high-precision instrument circuit board body is installed, the bonding heat-conducting base can be installed simultaneously. At the same time, when the bonding part is located inside the bonding groove, the contact area with the high-precision instrument circuit board body can be increased.

[0008] Preferably, in any of the above solutions, the bonding heat-conducting base, the bonding part, and the plug-in plate are made of materials with good thermal conductivity. The two bonding heat-conducting bases are symmetrically distributed on the surface of the high-precision instrument circuit board body. The bonding part has a groove inside that communicates with the heat-conducting groove. The technical effect achieved by the above solution is that when the bonding part is located inside the bonding groove, it can increase the contact area with the high-precision instrument circuit board body, conduct the heat generated by the high-precision instrument circuit board body, and facilitate subsequent heat dissipation.

[0009] Preferably, in any of the above solutions, a plurality of heat sinks are fixedly connected to the inner wall of the heat conduction groove, and the plurality of heat sinks are equidistantly distributed inside the heat conduction groove. The heat sinks are arc-shaped. The technical effect achieved by adopting the above solution is that the heat sinks can increase the contact area with the air, thereby making the heat dissipation effect better.

[0010] Preferably, the surface of the heat sink is provided with a plurality of through holes, the through holes penetrating the heat sink, and the plurality of through holes are equidistantly distributed on the surface of the heat sink. The technical effect achieved by adopting the above solution is that the through holes can increase the contact area between the air and the heat sink when the air is inside the heat conduction groove, thereby making the heat dissipation effect better.

[0011] Preferably, the inner wall of the air inlet slot is fixedly equipped with a filter screen, and the filter screen is located directly above the miniature heat dissipation fan. The technical effect achieved by adopting the above solution is that the air is filtered by the filter screen, thereby reducing the accumulation of dust inside the heat conduction slot.

[0012] Preferably, in any of the above solutions, the bottom of the connector has a slot, the inner wall of the slot is fitted with a frame, a miniature cooling fan is fixedly installed in the middle of the frame, the frame is U-shaped, two mounting plates are fixedly connected to the bottom of the frame, and the bottom of the connector has a mounting groove that matches the mounting plates. The technical effect achieved by the above solution is that the frame can be easily disassembled through the mounting plates and mounting groove, thereby allowing the miniature cooling fan to be disassembled for convenient subsequent maintenance and replacement.

[0013] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0014] 1. This circuit board, adapted for high-precision instruments, utilizes the cooperation between the high-precision instrument circuit board body, the heat-conducting base, the heat-conducting groove, the connector, the air inlet groove, the miniature cooling fan, and the air outlet. When the high-precision instrument circuit board body is working, the miniature cooling fan allows air to enter the interior of the heat-conducting groove from the air inlet groove, thereby dissipating the heat generated by the high-precision instrument circuit board body absorbed by the heat-conducting base through the air outlet. This significantly improves the heat dissipation capacity of the high-precision instrument circuit board body and extends its service life.

[0015] 2. This circuit board, adapted for high-precision instruments, allows for easy disassembly of the two heat-conducting bases through the cooperation between the two bases, the bonding part, the plug-in plate, and the plug-in slot, facilitating replacement and cleaning. The operation is simple and convenient. Attached Figure Description

[0016] Figure 1 This is a first-view structural schematic diagram of Embodiment 1 of the present utility model;

[0017] Figure 2 This is a second-view structural schematic diagram of Embodiment 1 of the present invention;

[0018] Figure 3 This is a third-view structural diagram of Embodiment 1 of the present utility model;

[0019] Figure 4 This is Embodiment 1 of the present utility model. Figure 3 A schematic diagram of the structure at point A;

[0020] Figure 5 This is a schematic diagram of the fourth perspective structure of Embodiment 1 of this utility model.

[0021] The components are: 1-High-precision instrument circuit board body, 2-Housing heat-conducting base, 3-Heat-conducting groove, 4-Connecting seat, 5-Air inlet groove, 6-Miniature cooling fan, 7-Air outlet, 8-Housing groove, 9-Housing part, 10-Plug-in board, 11-Plug-in groove, 12-Heat sink, 13-Through hole, 14-Filter screen, 15-Slot, 16-Frame, 17-Mounting plate. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0023] Example 1: As Figures 1 to 5 As shown, a circuit board adapted for high-precision instruments includes a high-precision instrument circuit board body 1. Two heat-conducting bases 2 are disposed on the surface of the high-precision instrument circuit board body 1. Heat-conducting grooves 3 are formed inside the heat-conducting bases 2. A connecting seat 4 is fixedly connected to one side of the heat-conducting base 2, and a groove communicating with the heat-conducting grooves 3 is formed inside the connecting seat 4. An air inlet slot 5 is formed on the top of the connecting seat 4. A miniature cooling fan 6 is disposed inside the groove of the connecting seat 4. An air outlet 7 is formed on one side of the heat-conducting base 2. The miniature cooling fan 6 drives air from the air inlet slot 5 into the connecting seat 4 and the heat-conducting grooves 3. Simultaneously, the heat-conducting bases 2 guide the heat generated by the high-precision instrument circuit board 1. Then, as the air passes through the heat-conducting grooves 3, the heat is carried away and discharged from the air outlet 7, thereby greatly improving the heat dissipation capacity of the high-precision instrument circuit board body 1 and extending its service life.

[0024] As an optional technical solution of this utility model, a bonding groove 8 is formed on the surface of the high-precision instrument circuit board body 1. A bonding part 9 adapted to the bonding groove 8 is fixedly connected to one side of the bonding heat conduction base 2. A plug-in plate 10 is fixedly connected to one side of the bonding part 9. A plug-in groove 11 adapted to the plug-in plate 10 is formed on one side of the bonding groove 8. The plug-in groove 11 is located below the mounting hole of the high-precision instrument circuit board body 1. By inserting the bonding part 9 into the interior of the bonding groove 8, the plug-in plate 10 can enter the interior of the plug-in groove 11. When the high-precision instrument circuit board body 1 is installed, the bonding heat conduction base 2 can be installed simultaneously. At the same time, when the bonding part 9 is located inside the bonding groove 8, it can increase the contact area with the high-precision instrument circuit board body 1.

[0025] As an optional technical solution of this utility model, the heat-conducting base 2, the bonding part 9 and the plug plate 10 are made of materials with good thermal conductivity. The two heat-conducting bases 2 are symmetrically distributed on the surface of the high-precision instrument circuit board body 1. The bonding part 9 has a groove inside that communicates with the heat-conducting groove 3. When the bonding part 9 is located inside the bonding groove 8, it can increase the contact area with the high-precision instrument circuit board body 1, conduct the heat generated by the high-precision instrument circuit board body 1, and facilitate subsequent heat dissipation.

[0026] As an optional technical solution of this utility model, a number of heat sinks 12 are fixedly connected to the inner wall of the heat conduction groove 3. The heat sinks 12 are equidistantly distributed inside the heat conduction groove 3. The heat sinks 12 are arc-shaped. The heat sinks 12 can increase the contact area with the wind, thereby making the heat dissipation effect better.

[0027] As an optional technical solution of this utility model, a plurality of through holes 13 are provided on the surface of the heat sink 12. The through holes 13 penetrate the heat sink 12 and are equidistantly distributed on the surface of the heat sink 12. The through holes 13 can increase the contact area between the air and the heat sink 12 when the air is inside the heat conduction groove 3, thereby making the heat dissipation effect better.

[0028] As an optional technical solution of this utility model, a filter screen 14 is fixedly installed on the inner wall of the air inlet slot 5, and the filter screen 14 is located directly above the miniature heat dissipation fan 6. The air is filtered by the filter screen 14, thereby reducing the accumulation of dust inside the heat conduction slot 3.

[0029] As an optional technical solution of this utility model, the bottom of the connecting seat 4 is provided with a slot 15, and a frame 16 is inserted into the inner wall of the slot 15. A miniature cooling fan 6 is fixedly installed in the middle of the frame 16. The frame 16 is U-shaped, and two mounting plates 17 are fixedly connected to the bottom of the frame 16. The bottom of the connecting seat 4 is provided with a mounting groove that matches the mounting plate 17. The frame 16 can be easily disassembled through the mounting plate 17 and the mounting groove, so that the miniature cooling fan 6 can be disassembled for subsequent maintenance and replacement.

[0030] A circuit board adapted for high-precision instruments operates on the following principle: a miniature cooling fan 6 drives air from the air inlet 5 into the interior of the connector 4 and the heat conduction groove 3. At the same time, the heat conduction base 2 guides the heat generated by the high-precision instrument circuit board 1. Then, as the air passes through the interior of the heat conduction groove 3, it carries away the heat and exhausts it from the air outlet 7. This greatly improves the heat dissipation capacity of the high-precision instrument circuit board body 1 and extends its service life.

[0031] In summary, this circuit board adapted for high-precision instruments, through the cooperation between the high-precision instrument circuit board body 1, the heat-conducting base 2, the heat-conducting groove 3, the connecting seat 4, the air inlet groove 5, the miniature cooling fan 6, and the air outlet 7, allows air to enter the interior of the heat-conducting groove 3 through the air inlet groove 5 when the high-precision instrument circuit board body 1 is working. This dissipates the heat generated by the high-precision instrument circuit board body 1 absorbed by the heat-conducting base 2 through the air outlet 7, thereby greatly improving the heat dissipation capacity of the high-precision instrument circuit board body 1 and extending its service life. Furthermore, the cooperation between the two heat-conducting bases 2, the bonding part 9, the plug-in plate 10, and the plug-in groove 11 allows for easy disassembly of the two heat-conducting bases 2, facilitating replacement and cleaning operations. The operation is simple and convenient.

[0032] Example 2: A circuit board adapted to high-precision instruments. In this example, a filter screen 14 is provided on one side of the air inlet slot 5, which can further prevent dust from accumulating inside the heat conduction slot 3.

Claims

1. A circuit board adapted for high-precision instruments, comprising a high-precision instrument circuit board body (1), characterized in that: The surface of the high-precision instrument circuit board body (1) is provided with two heat-conducting bases (2). The heat-conducting bases (2) are provided with heat-conducting grooves (3) inside. A connecting seat (4) is fixedly connected to one side of the heat-conducting bases (2). The connecting seat (4) is provided with a groove communicating with the heat-conducting grooves (3) inside. An air inlet groove (5) is provided on the top of the connecting seat (4). A miniature heat dissipation fan (6) is provided inside the groove of the connecting seat (4). An air outlet (7) is provided on one side of the heat-conducting bases (2).

2. The circuit board adapted for high-precision instruments according to claim 1, characterized in that: The surface of the high-precision instrument circuit board body (1) is provided with a bonding groove (8). A bonding part (9) adapted to the bonding groove (8) is fixedly connected to one side of the bonding heat conduction base (2). A plug-in plate (10) is fixedly connected to one side of the bonding part (9). A plug-in groove (11) adapted to the plug-in plate (10) is provided on one side of the bonding groove (8), and the plug-in groove (11) is located below the mounting hole of the high-precision instrument circuit board body (1).

3. The circuit board adapted for high-precision instruments according to claim 2, characterized in that: The heat-conducting base (2), the bonding part (9) and the plug plate (10) are made of materials with good thermal conductivity. The two heat-conducting bases (2) are symmetrically distributed on the surface of the high-precision instrument circuit board body (1). The bonding part (9) has a groove inside that communicates with the heat-conducting groove (3).

4. The circuit board adapted for high-precision instruments according to claim 3, characterized in that: The inner wall of the heat conduction groove (3) is fixedly connected with a number of heat sinks (12), and the heat sinks (12) are equidistantly distributed inside the heat conduction groove (3). The heat sinks (12) are arc-shaped.

5. The circuit board adapted for high-precision instruments according to claim 4, characterized in that: The surface of the heat sink (12) is provided with a plurality of through holes (13), the through holes (13) penetrate the heat sink (12), and the plurality of through holes (13) are equidistantly distributed on the surface of the heat sink (12).

6. The circuit board adapted for high-precision instruments according to claim 5, characterized in that: The inner wall of the air inlet slot (5) is fixedly equipped with a filter screen (14), and the filter screen (14) is located directly above the miniature heat dissipation fan (6).

7. A circuit board adapted for high-precision instruments according to claim 6, characterized in that: The bottom of the connector (4) is provided with a slot (15), and a frame (16) is inserted into the inner wall of the slot (15). A miniature cooling fan (6) is fixedly installed in the middle of the frame (16). The frame (16) is U-shaped. Two mounting plates (17) are fixedly connected to the bottom of the frame (16). The bottom of the connector (4) is provided with a mounting groove that matches the mounting plate (17).

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