Waterproof and pressure-resistant circuit board with composite sealing structure

Abstract

The utility model belongs to circuit board technical field especially waterproof pressure -withstanding circuit board of composite sealing structure, the hole of four corners of circuit board main part is equipped with circuit board locking screw, and the end of circuit board locking screw is screwed in the screw hole of the surface of support platform, the outside of circuit board main part is provided with resin sealing filler piece for sealing, through the support platform of the inner surface of support plate integrated moulding circuit board main part, cooperate circuit board locking screw and realize accurate positioning and fastening, ensure that the assembly gap of circuit board and support plate is even, provide stable foundation for the injection moulding of subsequent resin sealing filler piece. The clamping piece between support plate and resin sealing filler piece increases the contact area and mechanical bite force of both, effectively prevents water vapor from penetrating along the contact surface, combined with the full wrapping characteristics of resin material, forms the composite waterproof structure of "mechanical fixing + material sealing", significantly improves the overall sealing reliability.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically relating to a waterproof and pressure-resistant circuit board with a composite sealing structure. Background Technology

[0002] In fields such as industrial control, underwater exploration, and outdoor communication, circuit boards need to work in complex environments that are humid, dusty, or even under high pressure for extended periods. Their waterproof and pressure-resistant properties directly determine the reliability and lifespan of the equipment.

[0003] Existing circuit board sealing and protection methods mostly adopt single potting seal or shell encapsulation: single potting seal can achieve basic waterproofing, but the bonding strength between the potting material and the circuit board and shell is insufficient. When subjected to external force or changes in environmental pressure, gaps are easily formed, leading to seal failure. Although shell encapsulation can improve structural strength, moisture can easily accumulate in the assembly gap between the shell and the circuit board. In addition, traditional shells lack targeted pressure resistance design, and are prone to deformation and damage to internal circuits under high pressure.

[0004] Meanwhile, heat dissipation in sealed structures remains a persistent challenge in the industry. To ensure waterproofing, existing sealed structures often employ a fully enclosed design, making it difficult to effectively dissipate the heat generated during circuit board operation. Prolonged high temperatures accelerate the aging of electronic components and reduce equipment operational stability. Furthermore, traditional sealed structures rely heavily on direct screw fastening for component connections, lacking auxiliary positioning and snap-fit ​​structures. This makes component misalignment during assembly prone to occur, affecting sealing accuracy and pressure resistance, and failing to meet the demands for high reliability and long lifespan of circuit boards in complex environments. Utility Model Content

[0005] This utility model addresses the shortcomings of existing technologies by providing a waterproof and pressure-resistant circuit board with a composite sealing structure. The specific technical solution is as follows:

[0006] A waterproof and pressure-resistant circuit board with a composite sealing structure includes a circuit board body. A protective support plate is provided on the exterior of the circuit board body. Four corners on the inner surface of the support plate are integrally formed with support platforms for supporting the four corners of the circuit board body. Circuit board locking screws are installed in holes at the four corners of the circuit board body, and the ends of the locking screws are screwed into screw holes on the surface of the support platforms. A heat-conducting mechanism is provided on the lower surface of the circuit board body. A resin sealing filler is provided on the exterior of the circuit board body for sealing. A snap-fit ​​component is provided between the support plate and the resin sealing filler. A pressure-limiting ring is installed at the upper end of the support plate for limiting pressure on the upper part of the resin sealing filler. A pressure-limiting locking screw is installed in a hole in the pressure-limiting ring, and the pressure-limiting locking screw is screwed into a screw hole at the upper end of the support plate.

[0007] Preferably, the heat-conducting mechanism includes a thermally conductive silicone plate bonded to the lower surface of the circuit board body, a thermally conductive aluminum plate disposed below the thermally conductive silicone plate, an aluminum plate locking screw installed in a hole opened on the edge of the thermally conductive aluminum plate, and the end of the aluminum plate locking screw screw screws screwed into a screw hole opened on the lower surface of the support plate, a thermally conductive cup stamped on the thermally conductive aluminum plate, and the end of the thermally conductive cup is bonded to the lower surface of the thermally conductive silicone plate.

[0008] Preferably, the heat-conducting cups are evenly spaced, and the resin sealing filler is molded and wrapped around the outside of the circuit board body, the thermally conductive silicone plate, and the heat-conducting cups.

[0009] Preferably, the snap-fit ​​component includes a sealing groove formed on the inner surface of the upper part of the tray. The resin sealing filler is filled into the sealing groove to form a sealing ring during injection molding. The sealing groove and the sealing ring are both annular structures and are provided in four parts.

[0010] Preferably, the snap-fit ​​component further includes a snap-fit ​​groove on the upper part of the tray, and the resin sealing filler is filled into the snap-fit ​​groove to form a snap-fit ​​ring during injection molding.

[0011] Preferably, the lower edge of the tray is integrally formed with mounting ears for installation.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. Enhanced Waterproof Sealing Performance: The circuit board body is supported by a one-piece molded support platform on the inner surface of the support plate. Precise positioning and fastening are achieved with the circuit board locking screws, ensuring uniform assembly gaps between the circuit board and the support plate. This provides a stable foundation for the subsequent injection molding of resin sealant components. The snap-fit ​​connector between the support plate and the resin sealant components increases the contact area and mechanical interlocking force, effectively preventing moisture penetration along the contact surface. Combined with the full-encapsulation characteristics of the resin material, a composite waterproof structure of "mechanical fixation + material sealing" is formed, significantly improving overall sealing reliability.

[0014] 2. Enhanced pressure resistance and deformation resistance: The pressure-limiting ring at the top of the support plate is rigidly connected to the support plate via pressure-limiting locking screws, which can form uniform pressure from top to bottom on the resin sealing filler, preventing the resin material from bulging or cracking due to excessive local stress under high pressure. The support design of the support platform for the corners of the circuit board disperses the direct effect of external pressure on the main body of the circuit board. Combined with the overall structural strength of the support plate, the device can withstand higher environmental pressures and is suitable for high-pressure scenarios such as deep-sea exploration and high-pressure pipeline monitoring.

[0015] 3. Optimized heat dissipation efficiency: The heat-conducting mechanism on the lower surface of the circuit board breaks through the heat dissipation barrier of traditional fully sealed structures. This allows the heat generated during circuit board operation to be quickly transferred to the tray and external environment via the heat conduction path, solving the problem of heat accumulation caused by the low thermal conductivity of resin materials. This design, while ensuring sealing performance, reduces the operating temperature of the circuit board, slows down the aging of electronic components, and improves the long-term stability of the equipment.

[0016] 4. Enhanced structural stability and ease of assembly: The combination of the support platform and locking screws enables modular assembly of the circuit board and the support plate, reducing positioning errors during assembly. The synergistic effect of the snap-fit ​​components and the pressure-limiting ring further strengthens the overall connection of each component, avoiding loosening problems caused by vibration or impact in traditional structures. The overall structural design balances assembly efficiency and connection strength, facilitating standardized operations during mass production and reducing manufacturing and maintenance costs. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0018] Figure 2 This is a three-dimensional schematic diagram of the present invention.

[0019] Figure 3 This is a partial cross-sectional structural diagram of the present invention;

[0020] Figure 4 This is a schematic diagram of the disassembled structure of the parts of this utility model;

[0021] Figure 5 for Figure 3 A magnified structural diagram of point A in the middle.

[0022] Reference numerals: 1. Support plate; 2. Support platform; 3. Circuit board body; 4. Circuit board locking screw; 5. Thermally conductive silicone plate; 6. Thermally conductive aluminum plate; 7. Thermally conductive cup; 8. Aluminum plate locking screw; 9. Resin sealing filler; 10. Pressure limiting ring; 11. Pressure limiting locking screw; 12. Sealing groove; 13. Sealing ring; 14. Slot; 15. Snap ring; 16. Mounting ear. Detailed Implementation

[0023] The technical solution of this utility model will now be described with reference to the accompanying drawings and embodiments.

[0024] Please see Figure 1-5This embodiment provides the following technical solution: a waterproof and pressure-resistant circuit board with a composite sealing structure, including a circuit board body 3, a support plate 1 for protection on the outside of the circuit board body 3, a support platform 2 integrally formed at the four corners of the inner surface of the support plate 1 for supporting the four corners of the circuit board body 3, circuit board locking screws 4 installed in the holes opened at the four corners of the circuit board body 3, and the ends of the circuit board locking screws 4 screwed into the screw holes opened on the surface of the support platform 2, a heat conduction mechanism is provided on the lower surface of the circuit board body 3, a resin sealing filler 9 for sealing is provided on the outside of the circuit board body 3, a snap-fit ​​is provided between the support plate 1 and the resin sealing filler 9, a pressure limiting ring 10 for limiting the pressure on the upper part of the resin sealing filler 9 is installed at the upper end of the support plate 1, a pressure limiting locking screw 11 is installed in the hole opened in the pressure limiting ring 10, and the pressure limiting locking screw 11 screwed into the screw hole opened at the upper end of the support plate 1.

[0025] In this embodiment, when the circuit board body 3 is installed inside the tray 1 by the circuit board locking screw 4, the four corners of the circuit board body 3 are supported by four trays 2 integrally formed on the inner surface of the tray 1. At the same time, the ends of the circuit board locking screw 4 are screwed into the screw holes opened on the surface of the tray 2, which facilitates the stable fixation of the circuit board body 3 and the tray 1. Meanwhile, a heat conduction mechanism is provided on the lower surface of the circuit board body 3, which facilitates the heat of the circuit board body 3 to diffuse outward through the heat conduction structure when the resin sealing filler 9 is poured and molded on the outside of the circuit board body 3, avoiding the problem of heat dissipation when the resin sealing filler 9 is completely wrapped outside the circuit board body 3. The snap-fit ​​device provided between the tray 1 and the resin sealing filler 9 increases the reliability of the connection between the tray 1 and the resin sealing filler 9. The pressure limiting ring 10 provided on the upper part of the tray 1 is locked by the pressure limiting locking screw 11. The locked pressure limiting ring 10 is used to limit the pressure at the upper end of the resin sealing filler 9.

[0026] Specifically, the heat conduction mechanism includes a thermally conductive silicone plate 5 bonded to the lower surface of the circuit board body 3, a thermally conductive aluminum plate 6 disposed below the thermally conductive silicone plate 5, an aluminum plate locking screw 8 installed in a hole opened on the edge of the thermally conductive aluminum plate 6, and the end of the aluminum plate locking screw 8 screwed into a screw hole opened on the lower surface of the support plate 1, a thermally conductive cup 7 stamped on the thermally conductive aluminum plate 6, and the end of the thermally conductive cup 7 bonded to the lower surface of the thermally conductive silicone plate 5, the thermally conductive cups 7 being evenly distributed, and the resin sealing filler 9 being injected and molded and then wrapped around the outside of the circuit board body 3, the thermally conductive silicone plate 5 and the thermally conductive cups 7.

[0027] In this embodiment, a heat-conducting mechanism consisting of a thermally conductive silicone plate 5, a thermally conductive aluminum plate 6, a thermally conductive cup 7, and an aluminum plate locking screw 8 is used. The thermally conductive silicone plate 5, which is bonded to the lower surface of the circuit board body 3, and the thermally conductive cup 7, which is stamped on the thermally conductive aluminum plate 6, facilitate the transfer of heat from the circuit board body 3 to the surface of the thermally conductive aluminum plate 6 through the thermally conductive silicone plate 5 and the thermally conductive cup 7 for heat dissipation. This solves the problem that the circuit board body 3 is difficult to dissipate heat when completely wrapped with resin sealing filler 9.

[0028] Specifically, the snap-fit ​​component includes a sealing groove 12 opened on the upper inner surface of the tray 1. When the resin sealing filler 9 is injected and molded, it is filled into the sealing groove 12 to form a sealing ring 13. The sealing groove 12 and the sealing ring 13 are both annular structures and are provided in four. The snap-fit ​​component also includes a snap groove 14 opened on the upper part of the tray 1. When the resin sealing filler 9 is injected and molded, it is filled into the snap groove 14 to form a snap ring 15.

[0029] In this embodiment, a snap-fit ​​device consisting of a sealing groove 12, a sealing ring 13, a slot 14, and a retaining ring 15 is used. When the resin sealing filler 9 is injected and molded, it fills the sealing groove 12 to form the sealing ring 13, and when the resin sealing filler 9 is injected and molded, it fills the slot 14 to form the retaining ring 15. This facilitates increasing the contact area between the resin sealing filler 9 and the tray 1, and improves the reliability of the resin sealing filler 9 being injected and molded in the tray 1.

[0030] Specifically, the lower edge of the tray 1 is integrally formed with mounting ears 16 for installation.

[0031] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A waterproof and pressure-resistant circuit board with a composite sealing structure, comprising a circuit board body (3), characterized in that: The circuit board body (3) is provided with a protective support plate (1) on its exterior. The four corners of the inner surface of the support plate (1) are integrally formed with support platforms (2) for supporting the four corners of the circuit board body (3). Circuit board locking screws (4) are installed in the holes opened at the four corners of the circuit board body (3), and the ends of the circuit board locking screws (4) are screwed into the screw holes opened on the surface of the support platform (2). The lower surface of the circuit board body (3) is provided with a heat conduction mechanism. The exterior of the circuit board body (3) is provided with a resin sealing filler (9) for sealing. A snap-fit ​​is provided between the support plate (1) and the resin sealing filler (9). A pressure limiting ring (10) for limiting the pressure on the upper part of the resin sealing filler (9) is installed on the upper end of the support plate (1). A pressure limiting locking screw (11) is installed in the hole opened on the pressure limiting ring (10), and the pressure limiting locking screw (11) is screwed into the screw hole opened on the upper end of the support plate (1).

2. The waterproof and pressure-resistant circuit board with a composite sealing structure according to claim 1, characterized in that: The heat-conducting mechanism includes a heat-conducting silicone plate (5) bonded to the lower surface of the circuit board body (3), a heat-conducting aluminum plate (6) is provided below the heat-conducting silicone plate (5), an aluminum plate locking screw (8) is installed in a hole opened on the edge of the heat-conducting aluminum plate (6), and the end of the aluminum plate locking screw (8) is screwed into a screw hole opened on the lower surface of the support plate (1). A heat-conducting cup (7) is stamped on the heat-conducting aluminum plate (6), and the end of the heat-conducting cup (7) is bonded to the lower surface of the heat-conducting silicone plate (5).

3. The waterproof and pressure-resistant circuit board with a composite sealing structure according to claim 2, characterized in that: The heat-conducting cups (7) are evenly spaced, and the resin sealing filler (9) is cast and molded to wrap around the outside of the circuit board body (3), the thermally conductive silicone plate (5) and the heat-conducting cups (7).

4. The waterproof and pressure-resistant circuit board with a composite sealing structure according to claim 1, characterized in that: The snap-fit ​​component includes a sealing groove (12) opened on the upper inner surface of the tray (1). When the resin sealing filler (9) is injected and molded, it is filled into the sealing groove (12) to form a sealing ring (13). There are four sealing grooves (12) and four sealing rings (13) with annular structure.

5. The waterproof and pressure-resistant circuit board with a composite sealing structure according to claim 4, characterized in that: The snap-fit ​​component also includes a snap-fit ​​groove (14) on the upper part of the tray (1), and the resin sealing filler (9) is filled into the snap-fit ​​groove (14) to form a snap-fit ​​ring (15) during injection molding.

6. The waterproof and pressure-resistant circuit board with a composite sealing structure according to claim 1, characterized in that: The lower edge of the tray (1) is integrally formed with mounting ears (16) for installation.

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