Domain controller and vehicle

Abstract

The application provides a domain controller and a vehicle. The domain controller comprises a cooling assembly, a first heat dissipation component and a second heat dissipation component. The cooling assembly comprises a frame and a cover plate. The cover plate is sealingly connected to the frame. The cover plate and the frame have a cooling flow channel therebetween. The cooling flow channel provides a flow channel for a cooling medium. The first heat dissipation component and the second heat dissipation component are located on two sides of the cooling assembly in a first direction and are respectively opposite to the position of the cooling flow channel. The domain controller and the vehicle provided by the application can solve the high-power heat dissipation requirement, reduce the manufacturing difficulty and make the domain controller have a smaller size.

Description

Technical Field

[0001] This application relates to the field of vehicle heat dissipation technology, and more particularly to a domain controller and a vehicle. Background Technology

[0002] With the development of vehicles, the demand for heat dissipation is increasing, and existing technologies often use double-layer radiators to meet this requirement. A double-layer radiator has an upper and a lower cold plate, both of which have internal water flow channels for heat dissipation. These channels are connected by a water transfer device. The inclusion of water flow channels on both the upper and lower cold plates increases the structural complexity. This structure also leads to limited vehicle space and makes it difficult to arrange structural components. Utility Model Content

[0003] This application provides a domain controller and a vehicle that can reduce manufacturing difficulty and make the domain controller have a smaller size while solving the high power consumption heat dissipation requirements.

[0004] To achieve the above objectives, in a first aspect, this application provides a domain controller, which includes a cooling assembly, a first heat sink, and a second heat sink; wherein the cooling assembly includes a frame and a cover plate, the cover plate is sealed to the frame, and a cooling channel is provided between the cover plate and the frame, the cooling channel providing a flow passage for the cooling medium, and the first heat sink and the second heat sink are located on both sides of the cooling assembly in a first direction and are respectively opposite to the cooling channel.

[0005] In some embodiments of this application, the domain controller further includes:

[0006] A first housing is sealed to a cooling assembly, and a first heat-dissipating component is located between the first housing and the cooling assembly; and / or

[0007] The second housing is sealed to the cooling assembly, and the second heat-dissipating component is located between the second housing and the cooling assembly.

[0008] In some embodiments of this application, the cooling channel includes:

[0009] A first sub-channel is used to dissipate heat from at least one of the first and second heat-dissipating components; and

[0010] The second sub-channel dissipates heat for at least one of the first and second heat-dissipating components.

[0011] In some embodiments of this application, a first sub-channel and a second sub-channel are arranged in layers in a first direction. The first sub-channel is used to dissipate heat from a first component to be cooled, and the second sub-channel is used to dissipate heat from a second component to be cooled.

[0012] In some embodiments of this application, the first sub-channel and the second sub-channel are disposed on the same layer in a second direction intersecting the first direction, and the first sub-channel and the second sub-channel simultaneously dissipate heat for the first heat-dissipating component and the second heat-dissipating component.

[0013] In some embodiments of this application, the first sub-channel is connected to the second sub-channel.

[0014] In some embodiments of this application, the cooling assembly further includes:

[0015] The cooling medium inlet is connected to one of the first and second sub-channels;

[0016] The cooling medium outlet is connected to another of the first and second sub-channels.

[0017] In some embodiments of this application, the domain controller further includes:

[0018] A first heat spreader assembly is located between the cover plate and the first heat-dissipating component; and / or

[0019] The second heat spreader assembly is located between the frame and the second heat dissipation component.

[0020] In some embodiments of this application, the domain controller further includes:

[0021] A first heat-conducting element is connected between the cover plate and the first heat-dissipating plate assembly; and / or

[0022] A second heat-conducting component is connected between the frame and the second heat spreader assembly; and / or

[0023] A third heat-conducting component is connected between the first heat spreader assembly and the first heat-dissipating component; and / or

[0024] The fourth heat-conducting component is connected between the second heat spreader assembly and the second heat-dissipating component.

[0025] In some embodiments of this application, the first heat sink includes a first chip, which is located on one side of the cover plate; and / or

[0026] The second heat-dissipating component includes a second chip, which is located on the side of the frame away from the cover plate.

[0027] In some embodiments of this application, the cooling assembly further includes a plurality of heat sinks disposed within a cooling channel; wherein one end of the plurality of heat sinks is connected to the frame and the other end is connected to the cover plate; the plurality of heat sinks are configured to conduct heat to the cooling medium and dissipate heat.

[0028] In some embodiments of this application, the domain controller further includes a first seal and a second seal; the first housing is sealed to the frame via the first seal; and the second housing is sealed to the frame via the second seal.

[0029] In some embodiments of this application, the first sealant and the second sealant are sealant.

[0030] In some embodiments of this application, the frame or the first housing has a first sealing groove, and the first seal is located in the first sealing groove; the frame or the second housing has a second sealing groove, and the second seal is located in the second sealing groove.

[0031] In some embodiments of this application, the first housing includes a first protrusion, which is received in a first sealing groove and sealed to the frame via a first seal; the second housing includes a second protrusion, which is received in a second sealing groove and connected to a second seal.

[0032] In some embodiments of this application, the first housing is connected to the frame via a connector, which is located inside the frame and is shielded by the second housing.

[0033] Secondly, this application also provides a vehicle that includes the domain controller described above.

[0034] This application provides a domain controller and a vehicle. The domain controller includes a cooling assembly, a first heat-dissipating component, and a second heat-dissipating component. The cooling assembly includes a frame and a cover plate, with the cover plate sealed to the frame. A cooling channel is provided between the cover plate and the frame, serving as a flow path for the cooling medium. The first and second heat-dissipating components are located on opposite sides of the cooling assembly in a first direction and are respectively opposite to the cooling channel. By creating a cooling channel on the frame and sealing it with the cover plate, this application can simultaneously dissipate heat from the first and second heat-dissipating components located on opposite sides of the cooling assembly in the first direction, eliminating the need for a double-layer cooling plate. This simplifies the domain controller's structure and reduces its size in the first direction, meeting high-power heat dissipation requirements while reducing manufacturing complexity and allowing for a smaller overall size.

[0035] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0038] Figure 1 An exploded view of a domain controller provided for some exemplary embodiments of this application.

[0039] Figure 2 for Figure 1 The diagram shows the assembled cooling assembly (with a second heat sink) and the first housing of the domain controller.

[0040] Figure 3 for Figure 1 The diagram shows the assembled cooling assembly (with a second heat sink) and the second housing of the domain controller.

[0041] Figure 4 for Figure 1 The diagram shows a top view of the domain controller.

[0042] Figure 5 for Figure 1 The diagram shows the thermal conductivity of the cooling components of the domain controller.

[0043] Figure 6 for Figure 1 The diagram shows a top view of the assembled cooling assembly of the domain controller.

[0044] Figure 7 for Figure 1 The image shows a bottom view of the assembled cooling assembly of the domain controller.

[0045] Figure 8 This is a partial schematic diagram of the sealed stack of a domain controller provided in an embodiment of this application.

[0046] Figure 9 This is a schematic diagram of the assembly of the cooling component of the domain controller and the concealed connector of the first housing provided in an embodiment of this application.

[0047] Figure 10 This is a schematic diagram of a vehicle module provided in an embodiment of this application.

[0048] Explanation of reference numerals in the attached figures:

[0049] 1000, Vehicle; 100, Domain Controller; 10, Cooling Component; 20, First Heat-Dissipating Component; 30, Second Heat-Dissipating Component; 40, First Housing; 50, Second Housing;

[0050] 61. First heat spreader assembly; 62. Second heat spreader assembly; 71. First heat conduction component; 72. Second heat conduction component; 73. Third heat conduction component; 74. Fourth heat conduction component;

[0051] 11. Frame; 12. Cover plate; 13. Cooling channel; 131. First sub-channel; 132. Second sub-channel; 133. Cooling medium; 14. Cooling medium inlet; 15. Cooling medium outlet; 16. Heat sink;

[0052] 21. First circuit board; 22. First chip; 31. Second circuit board; 32. Second chip;

[0053] 101. First seal; 102. Second seal; 103. First sealing groove; 104. Second sealing groove; 105. First protrusion; 106. Second protrusion; 107. Connector; 108. First connector; 109. Second connector; Z, first direction; X, second direction. Detailed Implementation

[0054] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0055] Please see Figures 1 to 9 This application provides a domain controller 100, which includes a cooling assembly 10, a first heat sink 20, and a second heat sink 30. The cooling assembly 10 includes a frame 11 and a cover plate 12. The cover plate 12 is sealed to the frame 11, and a cooling channel 13 is provided between the cover plate 12 and the frame 11. The cooling channel 13 provides a flow path for a cooling medium 133. The first heat sink 20 and the second heat sink 30 are located on opposite sides of the cooling assembly 10 in a first direction and are respectively positioned opposite to the cooling channel 13. Here, "positionally opposite" means that the orthographic projections of the first heat sink 20 and the second heat sink 30 on the plane of the cooling assembly 10 at least partially fall on the cooling channel 13 or at least partially fall within the orthographic projection range of the cooling channel 13 on the plane of the cooling assembly 10.

[0056] This application forms a "sandwich"-like structure of "first heat-dissipating component 20 - cooling assembly 10 - second heat-dissipating component 30" by opening a cooling channel 13 on the frame 11 and sealing the cooling channel 13 with a cover plate 12. This structure can simultaneously dissipate heat from the first heat-dissipating component 20 and the second heat-dissipating component 30, which are located on both sides of the cooling assembly 10 in the first direction Z and are respectively opposite to the cooling channel 13. There is no need to set up a double-layer cold plate. The domain controller 100 has a simple structure and a reduced size in the first direction Z. This not only meets the high power consumption heat dissipation requirements, but also reduces the manufacturing difficulty and allows the domain controller 100 to have a smaller size.

[0057] In some embodiments of this application, the domain controller 100 is an intelligent driving domain controller.

[0058] In some embodiments of this application, the domain controller 100 further includes a first housing 40, which is sealed to the cooling assembly 10, and the first heat-dissipating component 20 is located between the first housing 40 and the cooling assembly 10.

[0059] In some embodiments of this application, the domain controller 100 further includes a second housing 50, which is sealed to the cooling assembly 10, and the second heat-dissipating component 30 is located between the second housing 50 and the cooling assembly 10.

[0060] This application uses a first housing 40 to be sealed to the cooling assembly 10 and a second housing 50 to be sealed to the cooling assembly 10, which can protect the first heat-dissipating component 20 and the second heat-dissipating component 30 respectively, preventing external moisture and other substances from entering the domain controller 100 and causing damage or short circuits to the first heat-dissipating component 20 and the second heat-dissipating component 30.

[0061] In some embodiments of this application, the cooling channel 13 includes a first sub-channel 131 and a second sub-channel 132. The first sub-channel 131 is used to dissipate heat from at least one of the first heat-dissipating component 20 and the second heat-dissipating component 30, and the second sub-channel 132 dissipates heat from at least one of the first heat-dissipating component 20 and the second heat-dissipating component 30.

[0062] In some embodiments of this application, the first sub-channel 131 and the second sub-channel 132 are arranged in layers along the first direction Z. The first sub-channel 131 is used to dissipate heat from the first heat-dissipating component 20, and the second sub-channel 132 is used to dissipate heat from the second heat-dissipating component 30. By arranging the first sub-channel 131 and the second sub-channel 132 in layers along the first direction Z, this application can precisely dissipate heat from the first heat-dissipating component 20 and the second heat-dissipating component 30 according to actual needs. Here, "layered arrangement" means that the first sub-channel 131 is formed by recessing from the first surface of the frame 11 into the interior of the frame 11, and the second sub-channel 132 is formed by recessing from the second surface of the frame 11 into the interior of the frame 11. The first sub-channel 131 and the second sub-channel 132 are separated by a portion of the frame 11. The first surface and the second surface are arranged opposite to each other along the first contour Z.

[0063] Please see Figure 1 In some embodiments of this application, the first sub-channel 131 and the second sub-channel 132 are arranged in the same layer on a second direction X intersecting the first direction Z. The first sub-channel 131 and the second sub-channel 132 simultaneously dissipate heat from the first heat-dissipating component 20 and the second heat-dissipating component 30. By arranging the first sub-channel 131 and the second sub-channel 132 in the same layer on the second direction X, this application achieves a larger heat dissipation area and better heat dissipation effect. Here, "arranged in the same layer" means that both the first sub-channel 131 and the second sub-channel 132 are recessed from the first surface or the second surface of the frame 11 into the interior of the frame 11.

[0064] In some embodiments of this application, the first sub-channel 131 is connected to the second sub-channel 132. By connecting the first sub-channel 131 and the second sub-channel 132, this application allows the cooling medium to circulate.

[0065] In some embodiments of this application, the cooling assembly 10 further includes a cooling medium inlet 14 and a cooling medium outlet 15. The cooling medium inlet 14 is connected to one of the first sub-channel 131 and the second sub-channel 132, and the cooling medium outlet 15 is connected to the other of the first sub-channel 131 and the second sub-channel 132. The cooling medium inlet 14 is the channel through which the cooling medium enters the cooling channel 13, and the cooling medium outlet 15 is the channel through which the cooling medium flows out of the cooling channel 13. Cooling medium with a lower temperature can flow into the cooling channel 13 from the cooling medium inlet 14, and cooling medium with a higher temperature can flow out of the cooling channel 13 from the cooling medium outlet 15, thereby efficiently dissipating heat from the first heat-dissipating component 20 and the second heat-dissipating component 30.

[0066] In some embodiments of this application, the domain controller 100 further includes a first heat spreader assembly 61 and a second heat spreader assembly 62. The first heat spreader assembly 61 is located between the cover plate 12 and the first heat-dissipating component 20, and the second heat spreader assembly 62 is located between the frame 11 and the second heat-dissipating component 30. The first heat spreader assembly 61 and the second heat spreader assembly 62 are efficient two-phase flow heat-conducting elements, mainly used to solve heat dissipation problems in high heat flux density scenarios. The core function of the first heat spreader assembly 61 and the second heat spreader assembly 62 is to quickly distribute heat through the phase change (evaporation-condensation cycle) of the internal working fluid, achieving ultra-high lateral heat conduction capacity and temperature uniformity. By setting the first heat spreader assembly 61 and the second heat spreader assembly 62, this application can uniformize the heat from the first heat-dissipating component 20 and / or the second heat-dissipating component 30, increase the heat dissipation area, and quickly transfer the heat from the first heat-dissipating component 20 and / or the second heat-dissipating component 30 to the cooling medium 133. The cooling medium 133 can quickly remove the heat, improving the heat dissipation effect.

[0067] In other embodiments, the domain controller 100 may also include only one of the first vapor chamber assembly 61 and the second vapor chamber assembly 62.

[0068] In some embodiments of this application, the domain controller 100 further includes at least one of a first heat-conducting element 71, a second heat-conducting element 72, a third heat-conducting element 73, and a fourth heat-conducting element 74. The first heat-conducting element 71 is connected between the cover plate 12 and the first heat spreader assembly 61. The second heat-conducting element 72 is connected between the frame 11 and the second heat spreader assembly 62. The third heat-conducting element 73 is connected between the first heat spreader assembly 61 and the first heat-dissipating component 20. The fourth heat-conducting element 74 is connected between the second heat spreader assembly 62 and the second heat-dissipating component 30.

[0069] This application efficiently transfers heat by setting at least one of the first heat-conducting element 71, the second heat-conducting element 72, the third heat-conducting element 73, and the fourth heat-conducting element 74, so as to quickly transfer the heat from the first heat-dissipating element 20 and / or the second heat-dissipating element 30 to the cooling medium 133. The cooling medium 133 can quickly remove the heat, further improving the heat dissipation effect.

[0070] In this embodiment, the domain controller 100 further includes a first heat-conducting element 71, a second heat-conducting element 72, a third heat-conducting element 73, and a fourth heat-conducting element 74.

[0071] In some embodiments of this application, the first thermal conductive element 71, the second thermal conductive element 72, the third thermal conductive element 73, and the fourth thermal conductive element 74 may be thermal conductive gel or thermal conductive silicone, etc.

[0072] In some embodiments of this application, the first heat-dissipating component 20 includes a first chip 22, and the cooling component 10 dissipates heat from the first chip 22.

[0073] In some embodiments of this application, the first heat sink 20 further includes a first circuit board 21, which is electrically connected to the first chip 22, and the first chip 22 is located between the first circuit board 21 and the cover plate 12.

[0074] In some embodiments of this application, the second heat-dissipating component 30 includes a second chip 32, and the cooling component 10 dissipates heat from the second chip 32.

[0075] In some embodiments of this application, the second heat sink 30 further includes a second circuit board 31, which is electrically connected to the second chip 32, and the second chip 32 is located between the second circuit board 31 and the frame 11.

[0076] In some embodiments of this application, the first circuit board 21 and the second circuit board 31 are connected to each other for power and signal communication through the first connector 108 and the second connector 109.

[0077] In this embodiment, both the first connector 108 and the second connector 109 are board-to-board connectors (BTB connectors), which can provide a reliable electrical connection and allow the transmission of signals, power or data between one board and another.

[0078] In some embodiments of this application, the first chip 22 and the second chip 32 are mainly used in cloud computing data centers, including central processing units (CPU), graphics processing units (GPU), memory, storage controllers, solid-state drives, etc., requiring high performance, high stability and high reliability.

[0079] In some embodiments of this application, the cooling assembly 10 further includes a plurality of heat sinks 16 disposed within the cooling channel 13; wherein one end of the plurality of heat sinks 16 is connected to the frame 11 and the other end is connected to the cover plate 12. By providing a plurality of heat sinks 16 within the cooling channel 13, this application can accelerate the transfer of heat from the first heat sink 20 to the cooling medium, and the heat sinks 16 themselves also have a certain heat dissipation function, thereby further increasing the heat dissipation efficiency of the domain controller 100.

[0080] In this embodiment, the heat sink 16 is cylindrical. In other embodiments, the shape of the heat sink 16 can be designed according to actual conditions.

[0081] In some embodiments of this application, the domain controller 100 further includes a first seal 101 and a second seal 102; the first housing 40 is sealed to the frame 11 via the first seal 101; the second housing 50 is sealed to the frame 11 via the second seal 102. This application achieves sealed connections between the first housing 40 and the second housing 50 and the frame 11 via the first seal 101 and the second seal 102, respectively, thus achieving a double-layer seal and a better sealing effect.

[0082] In some embodiments of this application, the first sealing element 101 and the second sealing element 102 are sealant. This application uses sealant to achieve a sealed connection between the first housing 40 and the second housing 50 and the frame 11, respectively, thus achieving both sealing and fixed connection between the first housing 40 and the second housing 50 and the frame 11.

[0083] In some embodiments of this application, the frame 11 or the first housing 40 has a first sealing groove 103, and the first sealing element 101 is located within the first sealing groove 103; the frame 11 or the second housing 50 has a second sealing groove 104, and the second sealing element 102 is located within the second sealing groove 104. By setting the first sealing groove 103 and the second sealing groove 104, and placing the first sealing element 101 and the second sealing element within the first sealing groove 103 and the second sealing groove 104 respectively, this application can not only reduce the size of the domain controller 100 in the first direction Z, but also increase the contact area between the first housing 40 and the second housing 50 and the frame 11, resulting in a better sealing effect.

[0084] In this embodiment, the first sealing groove 103 and the second sealing groove 104 are both formed in the frame 11 and extend from two opposite surfaces of the frame 11 in the first direction Z into the interior of the frame 11.

[0085] In this embodiment, both the first sealing groove 103 and the second sealing groove 104 are annular. Here, "annular" in this application refers to a closed inner and outer boundary with a hollow area, and is not limited to a circular shape. In this embodiment, both the first sealing groove 103 and the second sealing groove 104 are polygonal annular.

[0086] In some embodiments of this application, the first housing 40 includes a first protrusion 105, which is received in the first sealing groove 103 and sealed to the frame 11 via the first sealing member 101; the second housing 50 includes a second protrusion 106, which is received in the second sealing groove 104 and connected to the second sealing member 102. By providing the first protrusion 105 and the second protrusion 106, this application can increase the contact area between the sealant and the first housing 40 and the second housing 50 and the frame 11, thereby enhancing the bonding strength and further improving the sealing effect.

[0087] In this embodiment, the first protrusion 105 is arranged in a ring within the first sealing groove 103, and the second protrusion 106 is arranged in a ring within the second sealing groove 104.

[0088] In some embodiments of this application, the first housing 40 is connected to the frame 11 via a connector 107, which is embedded within the frame 11. By placing the connector 107, which connects the first housing 40 and the frame 11, within the frame 11 and concealing it by the second housing 50, the connector 107 is hidden, which is not only aesthetically pleasing but also serves to prevent tampering and provides a seal.

[0089] In this embodiment, the connector 107 is a screw.

[0090] During the assembly of the domain controller 100, the first heat sink 20 is first secured to the upper layer of the frame 11 of the cooling assembly 10 via a connector 107 (e.g., screws). Then, sealant is applied to the first sealing groove 103. The frame 11 has screw holes, and the connector 107 (e.g., screws) is embedded and secured from inside the frame 11, locking the first housing 40 and the frame 11 together. High-temperature baking is then performed to fully cure and bond the sealant in the first sealing groove 103. Similarly, the assembly formed by the baked first sealing groove 103, the first housing 40, and the frame 11 is removed. Sealant is applied to the second sealing groove 104, and the second housing 50 is secured. Simultaneously, high-temperature baking is performed to fully cure and bond the sealant in the second sealing groove 104, thus completing the assembly.

[0091] Secondly, please refer to Figure 10 This application also provides a vehicle 1000, which includes the domain controller 100 as described above.

[0092] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0093] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0094] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0095] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Although the descriptions of each embodiment in this application have different focuses, and the parts not described in detail in a certain embodiment can be referred to the relevant embodiments in other embodiments, any modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the content of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A domain controller, characterized in that, Includes a cooling assembly, a first heat-dissipating component, and a second heat-dissipating component; The cooling assembly includes a frame and a cover plate. The cover plate is sealed to the frame and has a cooling channel between the cover plate and the frame. The cooling channel provides a flow path for the cooling medium. The first heat-dissipating component and the second heat-dissipating component are located on both sides of the cooling assembly in a first direction and are respectively opposite to the cooling channel.

2. The domain controller as described in claim 1, characterized in that, The domain controller also includes: A first housing is sealed to the cooling assembly, and the first heat-dissipating component is located between the first housing and the cooling assembly; and / or The second housing is sealed to the cooling assembly, and the second heat-dissipating component is located between the second housing and the cooling assembly.

3. The domain controller as described in claim 1, characterized in that, The cooling channel includes: A first sub-channel is used to dissipate heat from at least one of the first heat-dissipating component and the second heat-dissipating component; and The second sub-channel dissipates heat for at least one of the first heat-dissipating component and the second heat-dissipating component.

4. The domain controller as described in claim 3, characterized in that, The first sub-flow channel and the second sub-flow channel are arranged in layers in a first direction; The first sub-channel is used to dissipate heat from the first component to be cooled; and The second sub-channel is used to dissipate heat from the second component to be cooled.

5. The domain controller as described in claim 3, characterized in that, The first sub-flow channel and the second sub-flow channel are arranged in the same layer in a second direction that intersects with the first direction; The first sub-channel and the second sub-channel simultaneously dissipate heat for the first heat-dissipating component and the second heat-dissipating component.

6. The domain controller as described in claim 3, characterized in that, The first sub-channel is connected to the second sub-channel.

7. The domain controller as claimed in claim 6, characterized in that, The cooling assembly also includes: The cooling medium inlet is connected to one of the first sub-channel and the second sub-channel; The cooling medium outlet is connected to another of the first and second sub-channels.

8. The domain controller as described in any one of claims 1-7, characterized in that, The domain controller also includes: A first heat spreader assembly is located between the cover plate and the first heat-dissipating component; and / or The second heat spreader assembly is located between the frame and the second heat dissipation component.

9. The domain controller as described in claim 8, characterized in that, The domain controller also includes: A first heat-conducting element is connected between the cover plate and the first heat-dissipating plate assembly; and / or A second heat-conducting component is connected between the frame and the second heat spreader assembly; and / or A third heat-conducting component is connected between the first heat spreader assembly and the first heat-dissipating component; and / or The fourth heat-conducting component is connected between the second heat spreader assembly and the second heat-dissipating component.

10. The domain controller as described in any one of claims 1-7, characterized in that, The first heat-dissipating component includes a first chip, which is located on one side of the cover plate; and / or The second heat-dissipating component includes a second chip, which is located on the side of the frame away from the cover plate.

11. The domain controller as described in any one of claims 1-7, characterized in that, The cooling assembly also includes: Multiple heat dissipation components are disposed within the cooling channel; In this embodiment, one end of each of the multiple heat sinks is connected to the frame, and the other end is connected to the cover plate; the multiple heat sinks are configured to conduct heat to the cooling medium and dissipate heat.

12. The domain controller as claimed in claim 2, characterized in that, The domain controller further includes a first seal and a second seal; The first housing is sealed to the frame via the first seal; and The second housing is sealed to the frame via the second seal.

13. The domain controller as claimed in claim 12, characterized in that, The first seal and the second seal are sealant.

14. The domain controller as claimed in claim 12, characterized in that, The frame or the first housing has a first sealing groove, and the first sealing element is located in the first sealing groove; The frame or second housing has a second sealing groove, and the second seal is located in the second sealing groove.

15. The domain controller as claimed in claim 14, characterized in that, The first housing includes a first protrusion, which is received in the first sealing groove and is sealed to the frame through the first sealing member; The second housing includes a second protrusion, which is received within the second sealing groove and connected to the second seal.

16. The domain controller as claimed in any one of claims 2 and 12-15, characterized in that, The first housing is connected to the frame via a connector; The connector is located within the frame and is shielded by the second housing.

17. A vehicle, characterized in that, include: The domain controller as described in any one of claims 1-16.

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