A high-multiplying energy storage power supply multi-mode fast charging device
By using a heat dissipation component consisting of a semiconductor cooling chip and an electric fan in the fast charging device, the problem of low heat dissipation efficiency in the prior art is solved, rapid heat dissipation of the circuit board is achieved, and stable operation of the device is ensured.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ACT IND
- Filing Date
- 2025-06-16
- Publication Date
- 2026-07-14
AI Technical Summary
Existing fast charging devices have problems with their heat dissipation structures, such as fans that are prone to dust accumulation and are difficult to clean, leading to reduced heat dissipation efficiency, or honeycomb holes that allow for slow heat dissipation, resulting in low heat dissipation efficiency.
The heat dissipation assembly consists of a semiconductor cooling chip and an electric fan. The semiconductor cooling chip uses N-type and P-type semiconductor materials to form an electrical couple to absorb and release heat. It is soldered to the circuit board with a copper rod and combined with heat dissipation fins and an electric fan for efficient heat dissipation.
It achieves rapid heat dissipation of the circuit board, avoiding malfunctions caused by heat dissipation problems, and has the advantages of high efficiency and practicality.
Smart Images

Figure CN224503771U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of fast charging device technology, and in particular to a high-rate energy storage power supply multi-mode fast charging device. Background Technology
[0002] Currently, fast charging devices typically employ two methods to dissipate heat generated by the internal circuit board. One method uses a built-in fan and metal heat sink for heat dissipation. However, after prolonged use, the fan easily accumulates dust, and because it is built-in, it is inconvenient for users to remove it for cleaning, resulting in reduced heat dissipation efficiency. The other method uses multiple heat dissipation honeycomb holes on the outer casing. However, using honeycomb holes to dissipate heat generated by the internal circuit board has the disadvantage of slow heat dissipation and low heat dissipation efficiency. Therefore, the heat dissipation structure of existing fast charging devices needs to be improved. Utility Model Content
[0003] This utility model aims to provide a high-rate energy storage power supply multi-mode fast charging device to solve the problems mentioned in the background art. One method is to use a built-in fan and metal heat sink for heat dissipation, but after long-term use, the fan is prone to dust accumulation, and because the fan is built-in, it is inconvenient for users to disassemble and clean it, resulting in a decrease in heat dissipation efficiency. Another method is to use multiple heat dissipation honeycomb holes on the outer shell, but the method of using honeycomb holes to dissipate the heat generated by the internal circuit board has the problem of slow heat dissipation and low heat dissipation efficiency.
[0004] The technical solution adopted by this utility model to solve the technical problem is as follows: A high-rate energy storage power supply multi-mode fast charging device includes a shell, an input plug, an output plug, a circuit board, and a heat dissipation component; the circuit board is fixedly disposed inside the shell, the input plug is located at one end of the shell and electrically connected to the circuit board, the output plug is located at the other end of the shell and electrically connected to the circuit board, the heat dissipation component is fixedly disposed on the top of the shell and electrically connected to the circuit board, the heat dissipation component includes an electric fan, heat dissipation fins, and a semiconductor cooling chip, the heat dissipation fins are fixedly connected to the bottom of the electric fan, the semiconductor cooling chip is fixedly connected to the bottom of the heat dissipation fins, and several copper rods are welded to the bottom of the semiconductor cooling chip, and the several copper rods at the bottom of the semiconductor cooling chip are all embedded inside the shell and welded to the circuit board.
[0005] In some embodiments, the input plug is electrically connected to the circuit board via a first line, the output plug is electrically connected to the circuit board via a second line, and the heat dissipation component is electrically connected to the circuit board via a third line.
[0006] In some embodiments, the heat sink fins are screwed to the electric fan, and the semiconductor cooling chip is welded to the heat sink fins.
[0007] In some embodiments, connecting pieces are fixedly provided on both sides of the heat dissipation fins, and the connecting pieces on both sides of the heat dissipation fins are connected to the top screws of the housing.
[0008] In some embodiments, a power indicator light is fixedly provided on the side of the housing, and the power indicator light is electrically connected to the circuit board.
[0009] In some embodiments, a heat dissipation indicator light is fixedly provided on the side of the housing, and the heat dissipation indicator light is electrically connected to the heat dissipation component.
[0010] In some embodiments, a power switch is fixedly disposed on the top of the housing, and the power switch is electrically connected to the heat dissipation assembly.
[0011] Compared with the prior art, the beneficial effects of this utility model are:
[0012] In this invention, the user can activate the heat dissipation assembly to cool the circuit board. During this process, a thermoelectric cooler operates, using a thermoelectric cooler composed of N-type and P-type semiconductor materials forming a thermocouple. When direct current passes through these materials, one end absorbs heat (cold end), while the other end releases heat (hot end). The bottom of the thermoelectric cooler is the cold end, and the top is the hot end. During operation, the cold end of the thermoelectric cooler is welded to the circuit board via several copper rods embedded inside the casing. These copper rods absorb heat from the circuit board. After absorbing heat, the hot end of the thermoelectric cooler releases the heat to the heat dissipation fins. The heat dissipation fins diffuse the received heat, and an electric fan further dissipates the heat, promoting rapid heat dissipation and enabling the heat dissipation assembly to efficiently cool the circuit board inside the casing. In this invention, the heat dissipation component can quickly dissipate heat from the circuit board inside the casing, ensuring that the circuit board will not malfunction due to heat dissipation problems during operation, which has the advantages of high efficiency and practicality. Attached Figure Description
[0013] Figure 1 A schematic diagram of the overall structure of a high-rate energy storage power supply multi-mode fast charging device;
[0014] Figure 2 This is a schematic diagram of the structure of a high-rate energy storage power supply multi-mode fast charging device with the outer shell in a split state;
[0015] Figure 3 A schematic diagram of the split structure of a high-rate energy storage power supply multi-mode fast charging device;
[0016] Figure 4 This is a schematic diagram of the heat dissipation component.
[0017] Explanation of reference numerals in the attached figures:
[0018] 100. High-rate energy storage power supply multi-mode fast charging device; 10. Housing; 20. Input plug; 201. First circuit; 30. Output plug; 301. Second circuit; 40. Circuit board; 401. Power indicator light; 50. Heat dissipation component; 501. Electric fan; 502. Heat dissipation fins; 503. Semiconductor cooling chip; 5031. Copper rod; 504. Third circuit; 505. Connecting piece; 506. Heat dissipation indicator light; 507. Power switch. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.
[0020] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.
[0021] Please refer to the following: Figures 1 to 4 As shown, Figure 1 A schematic diagram of the overall structure of a high-rate energy storage power supply multi-mode fast charging device 100; Figure 2 A schematic diagram of the structure of the multi-mode fast charging device 100 for high-rate energy storage power supply with the outer shell 10 in a split state; Figure 3 A schematic diagram of the split structure of a high-rate energy storage power supply multi-mode fast charging device 100; Figure 4 This is a schematic diagram of the heat dissipation component 50.
[0022] This utility model provides the following technical solution: a high-rate energy storage power supply multi-mode fast charging device 100, including a housing 10, an input plug 20, an output plug 30, a circuit board 40, and a heat dissipation component 50; the circuit board 40 is fixedly disposed inside the housing 10, the input plug 20 is located at one end of the housing 10 and electrically connected to the circuit board 40, the output plug 30 is located at the other end of the housing 10 and electrically connected to the circuit board 40, the heat dissipation component 50 is fixedly disposed on the top of the housing 10 and electrically connected to the circuit board 40, the heat dissipation component 50 includes an electric fan 501, heat dissipation fins 502, and a semiconductor cooling chip 503, the heat dissipation fins 502 are fixedly connected to the bottom of the electric fan 501, the semiconductor cooling chip 503 is fixedly connected to the bottom of the heat dissipation fins 502, and a plurality of copper rods 5031 are welded to the bottom of the semiconductor cooling chip 503, and the plurality of copper rods 5031 at the bottom of the semiconductor cooling chip 503 are all embedded inside the housing 10 and welded to the circuit board 40.
[0023] This embodiment provides a high-rate energy storage power supply multi-mode fast charging device 100. When using this fast charging device, the input plug 20 is inserted into a household power outlet, and the output plug 30 is inserted into the charging port of the object being charged. The circuit board 40 controls the power output to quickly charge the object. The circuit board 40 generates significant heat during operation. The user can activate the heat dissipation component 50 to cool the circuit board 40. While the heat dissipation component 50 is cooling the circuit board 40, a thermoelectric cooler 503 operates. The thermoelectric cooler 503 uses N-type and P-type semiconductor materials to form a thermocouple pair. When direct current passes through these two semiconductor materials, one end absorbs heat (i.e., the cold end), while the other end releases heat (i.e., the hot end). The bottom of the thermoelectric cooler 503 is the cold end, and the top is the hot end. When the thermoelectric cooler 503 is operating, the cold end at the bottom of the thermoelectric cooler 503 is connected to several copper... Rods 5031 are embedded inside the housing 10 and soldered to the circuit board 40. This allows several copper rods 5031 at the cold end of the bottom of the thermoelectric cooler 503 to absorb heat from the circuit board 40. After absorbing heat at the cold end of the thermoelectric cooler 503, the heat is released from the hot end of the thermoelectric cooler 503 and transferred to the heat dissipation fins 502. The heat dissipation fins 502 can diffuse the received heat to dissipate heat, and an electric fan 501 further dissipates the heat on the heat dissipation fins 502, promoting rapid heat dissipation. This allows the heat dissipation assembly 50 to efficiently dissipate heat from the circuit board 40 inside the housing 10. In this invention, the heat dissipation assembly 50 can quickly dissipate heat from the circuit board 40 inside the housing 10, ensuring that the circuit board 40 will not malfunction due to heat dissipation problems during operation. This design is both efficient and practical.
[0024] In some embodiments, the input plug 20 is electrically connected to the circuit board 40 via the first line 201, the output plug 30 is electrically connected to the circuit board 40 via the second line 301, and the heat dissipation component 50 is electrically connected to the circuit board 40 via the third line 504.
[0025] In specific implementation: the input plug 20 is electrically connected to the circuit board 40 through the first line 201 so that the input plug 20 can power the circuit board 40; the output plug 30 is electrically connected to the circuit board 40 through the second line 301 so that the circuit board 40 can power the output plug 30; the heat dissipation component 50 is electrically connected to the circuit board 40 through the third line 504 so that the circuit board 40 can power the heat dissipation component 50.
[0026] In some embodiments, the heat sink 502 is screwed to the electric fan 501, and the semiconductor cooling chip 503 is welded to the heat sink 502.
[0027] In specific implementation: the heat sink fins 502 and the electric fan 501 are connected by screws to ensure a secure installation between the heat sink fins 502 and the electric fan 501; the thermoelectric cooler 503 and the heat sink fins 502 are welded together to ensure a secure contact connection between the thermoelectric cooler 503 and the heat sink fins 502.
[0028] In some embodiments, connecting pieces 505 are fixedly provided on both sides of the heat dissipation fins 502, and the connecting pieces 505 on both sides of the heat dissipation fins 502 are connected to the top screws of the housing 10.
[0029] In specific implementation: when the heat dissipation component 50 is installed on the top of the housing 10, it is connected to the top of the housing 10 by the connecting pieces 505 on both sides of the heat dissipation fins 502 through screws, so that the heat dissipation component 50 is securely installed on the top of the housing 10.
[0030] In some embodiments, a power indicator light 401 is fixedly provided on the side of the housing 10, and the power indicator light 401 is electrically connected to the circuit board 40.
[0031] In practice: When the input plug 20 is inserted into a household power socket to supply power to the circuit board 40, the power indicator 401 will be lit by the circuit board 40. The user can know whether the fast charging device is powered by observing whether the power indicator 401 is lit.
[0032] In some embodiments, a heat dissipation indicator light 506 is fixedly provided on the side of the housing 10, and the heat dissipation indicator light 506 is electrically connected to the heat dissipation assembly 50.
[0033] In practice: when the heat dissipation component 50 is powered on and turned on by the circuit board 40, the heat dissipation indicator light 506 will be lit up by the heat dissipation component 50. The user can know whether the heat dissipation component 50 has started running by observing whether the heat dissipation indicator light 506 is lit up.
[0034] In some embodiments, a switch 507 is fixedly disposed on the top of the housing 10, and the switch 507 is electrically connected to the heat dissipation assembly 50.
[0035] In practice: the switch 507 is used by the user to press to control the start and stop of the heat dissipation component 50, so that the user can easily control the start and stop of the heat dissipation component 50.
[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0037] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A high-rate energy storage power supply multi-mode fast charging device, characterized in that, The device includes a housing, an input plug, an output plug, a circuit board, and a heat dissipation assembly. The circuit board is fixedly disposed inside the housing. The input plug is located at one end of the housing and electrically connected to the circuit board. The output plug is located at the other end of the housing and electrically connected to the circuit board. The heat dissipation assembly is fixedly disposed on the top of the housing and electrically connected to the circuit board. The heat dissipation assembly includes an electric fan, heat dissipation fins, and a thermoelectric cooler. The heat dissipation fins are fixedly connected to the bottom of the electric fan. The thermoelectric cooler is fixedly connected to the bottom of the heat dissipation fins. Several copper rods are welded to the bottom of the thermoelectric cooler. The copper rods at the bottom of the thermoelectric cooler are embedded inside the housing and welded to the circuit board.
2. The high-rate energy storage power supply multi-mode fast charging device according to claim 1, characterized in that, The input plug is electrically connected to the circuit board via a first line, the output plug is electrically connected to the circuit board via a second line, and the heat dissipation component is electrically connected to the circuit board via a third line.
3. The high-rate energy storage power supply multi-mode fast charging device according to claim 1, characterized in that, The heat sink fins are screwed to the electric fan, and the semiconductor cooling chip is welded to the heat sink fins.
4. The high-rate energy storage power supply multi-mode fast charging device according to claim 1, characterized in that, Connecting pieces are fixedly provided on both sides of the heat dissipation fins, and the connecting pieces on both sides of the heat dissipation fins are connected to the top screws of the outer casing.
5. The high-rate energy storage power supply multi-mode fast charging device according to claim 1, characterized in that, A power indicator light is fixedly installed on the side of the housing, and the power indicator light is electrically connected to the circuit board.
6. The high-rate energy storage power supply multi-mode fast charging device according to claim 1, characterized in that, A heat dissipation indicator light is fixedly installed on the side of the housing, and the heat dissipation indicator light is electrically connected to the heat dissipation component.
7. The high-rate energy storage power supply multi-mode fast charging device according to claim 1, characterized in that, A power switch is fixedly installed on the top of the housing, and the power switch is electrically connected to the heat dissipation component.